CN111463164A - Etching equipment for chip processing - Google Patents
Etching equipment for chip processing Download PDFInfo
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- CN111463164A CN111463164A CN202010275343.4A CN202010275343A CN111463164A CN 111463164 A CN111463164 A CN 111463164A CN 202010275343 A CN202010275343 A CN 202010275343A CN 111463164 A CN111463164 A CN 111463164A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0421—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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Abstract
本发明公开了一种芯片加工用刻蚀设备,其结构包括底固箱、外固箱、上抵层、内控箱、控制面板,底固箱安装于外固箱底端,内控箱嵌入于外固箱内部,暴露出所需刻蚀的部位,其余部位由叠层所覆盖住,原本底端抵住物体上表面的顺贴面,让中部所抵触的部位有一个反扩的力,辅助整体的粘附力,能够在刻蚀的部位有所下移的同时,对其防护的部位侧面进行防护,通过抵块卡于主压板之间,上端的摆角支撑开主压板的承受力,主要承受外界的支点力,让其导头能够对其引向角进行往外扩,卡块将会辅助推开,能够在部位跟随刻蚀的高度下移时,将会通过上端的挤压力,将其挤出,下端有个反向的包裹力,在没有底端的释放力时,将会往回缩动。
The invention discloses an etching equipment for chip processing. Its structure includes a bottom solid box, an outer solid box, an upper contact layer, an inner control box and a control panel. Inside the box, the parts that need to be etched are exposed, and the rest of the parts are covered by the lamination. The adhesion force can protect the side of the protected part while the etched part is moved down. It is stuck between the main pressure plates through the abutting block, and the swing angle at the upper end supports the bearing force of the main pressure plate, which mainly bears The external fulcrum force enables the guide head to expand its leading angle outward, and the clamping block will assist to push open, and when the part can move down with the height of the etching, it will be pushed by the extrusion force of the upper end. When extruding, the lower end has a reverse wrapping force, and it will retract back when there is no release force at the bottom end.
Description
技术领域technical field
本发明属于芯片领域,更具体地说,尤其是涉及到一种芯片加工用刻蚀设备。The invention belongs to the field of chips, and more specifically relates to an etching device for chip processing.
背景技术Background technique
要对芯片加工进行刻蚀,由于较小有时候还需要刻蚀出图案,所以主要选择用干法刻蚀,需要图案刻蚀时,将光刻胶置于所需的形状上,让其余部位进行刻蚀留下所需的部位。To etch the chip, because it is small and sometimes needs to etch the pattern, the main choice is dry etching. When pattern etching is required, place the photoresist on the desired shape, and let the rest of the Etching is performed to leave the desired sites.
基于上述本发明人发现,现有的芯片刻蚀装置主要存在以下几点不足,比如:Based on the above findings of the present inventors, the existing chip etching devices mainly have the following deficiencies, such as:
其覆盖有光刻胶进行刻蚀时,在密封的室内进行刻蚀发生反应完毕后,盖于光刻胶底部的周边,会有些受到影响轻微融合,掀开光刻胶的同时,较容易损坏本体。When it is covered with photoresist for etching, after the etching reaction is completed in a sealed room, it is covered on the periphery of the bottom of the photoresist, which will be affected and slightly fused. When the photoresist is opened, it is easier to damage. ontology.
因此需要提出一种芯片加工用刻蚀设备。Therefore, it is necessary to propose an etching apparatus for chip processing.
发明内容SUMMARY OF THE INVENTION
为了解决上述技术其覆盖有光刻胶进行刻蚀时,在密封的室内进行刻蚀发生反应完毕后,盖于光刻胶底部的周边,会有些受到影响轻微融合,掀开光刻胶的同时,较容易损坏本体的问题。In order to solve the above-mentioned technology, when it is covered with photoresist for etching, after the etching reaction is completed in a sealed chamber, the periphery of the bottom of the photoresist is covered, which will be slightly affected and slightly fused. , it is easier to damage the body.
本发明一种芯片加工用刻蚀设备的目的与功效,由以下具体技术手段所达成:The purpose and effect of a chip processing etching device of the present invention are achieved by the following specific technical means:
其结构包括底固箱、外固箱、上抵层、内控箱、控制面板。Its structure includes a bottom solid box, an outer solid box, an upper layer, an inner control box and a control panel.
所述底固箱安装于外固箱底端,所述内控箱嵌入于外固箱内部,所述上抵层设于内控箱内部,所述控制面板安装于外固箱外表面。The bottom solid box is installed at the bottom end of the outer solid box, the inner control box is embedded inside the outer solid box, the upper contact layer is arranged inside the inner control box, and the control panel is installed on the outer surface of the outer solid box.
作为本发明的进一步改进,所述上抵层包括顺贴面、夹口、叠层,所述夹口嵌入于叠层内部,所述叠层外表面抵有顺贴面,所述顺贴面正视为梯形结构。As a further improvement of the present invention, the upper abutting layer includes a veneer, a clip, and a laminate, the clip is embedded inside the laminate, and the outer surface of the laminate is abutted with a veneer, and the veneer It is regarded as a trapezoidal structure.
作为本发明的进一步改进,所述顺贴面包括托面、胶托角、匀球、隔层,所述胶托角贴合于托面内表面,所述匀球嵌入于隔层内部,所述隔层与托面相连接,所述托面为弧形结构,所述匀球呈球体结构,所述胶托角为橡胶材质。As a further improvement of the present invention, the smooth surface includes a support surface, a rubber support angle, a uniform ball, and an interlayer, the rubber support angle is attached to the inner surface of the support surface, and the uniform ball is embedded in the interlayer, so The partition layer is connected with the support surface, the support surface is in an arc structure, the uniform ball is in a spherical structure, and the rubber support angle is made of rubber material.
作为本发明的进一步改进,所述托面包括中抵球、弧摆芯、后顶头,所述后顶头贴合于弧摆芯外表面,所述弧摆芯远离后顶头的一端与中抵球相连接,所述弧摆芯为弧形结构,所述后顶头一边为弧形另一端为尖角状。As a further improvement of the present invention, the support surface includes a center ball, an arc swing core, and a rear jack, the rear jack is attached to the outer surface of the arc swing core, and one end of the arc swing core away from the rear jack is connected to the center ball. connected to each other, the arc pendulum core is an arc structure, and one side of the rear plug is arc-shaped and the other end is a sharp angle.
作为本发明的进一步改进,所述中抵球包括外胶环、卡边头、膨芯,所述外胶环贴合于膨芯外表面,所述外胶环远离膨芯的一端与卡边头相连接,所述卡边头设有两个,所述外胶环为两头尖中间弧形结构,所述膨芯呈椭圆形结构。As a further improvement of the present invention, the middle impact ball includes an outer rubber ring, a clamping edge head and an expansion core, the outer rubber ring is attached to the outer surface of the expansion core, and the end of the outer rubber ring away from the expansion core and the clamping edge The heads are connected to each other, the clamping head is provided with two, the outer rubber ring is an arc structure in the middle of the two ends, and the expansion core is an elliptical structure.
作为本发明的进一步改进,所述夹口包括顺压边、主压板、摆角、抵块,所述顺压边与摆角为一体化结构,所述摆角与主压板相连接,所述抵块位于主压板之间,所述摆角设有两个且对称分布,所述顺压边设有两个。As a further improvement of the present invention, the clamping mouth includes a pressing edge, a main pressing plate, a swing angle, and an abutting block, the pressing edge and the swing angle are an integrated structure, the swing angle is connected with the main pressing plate, and the The abutting blocks are located between the main pressing plates, the swing angles are provided with two and are symmetrically distributed, and the pressing edges are provided with two.
作为本发明的进一步改进,所述顺压边包括后抵弧、引向角、导头,所述导头与后抵弧相连接,所述引向角抵在后抵弧外表面,所述导头设有两个且往下倾斜,所述后抵弧呈弧形结构。As a further improvement of the present invention, the pressing side includes a rear abutment arc, a leading angle, and a guide head, the guide head is connected with the rear abutment arc, the leading angle abuts on the outer surface of the rear abutment arc, and the The guide head is provided with two and inclined downward, and the rear contact arc has an arc structure.
作为本发明的进一步改进,所述后抵弧包括总弧角、弧胶条、卡块、固球,所述固球与弧胶条相连接,所述弧胶条嵌入于总弧角内部,所述卡块抵在总弧角内壁,所述固球为球体结构,所述弧胶条设有两个,所述卡块设有两个。As a further improvement of the present invention, the rear reaching arc includes a total arc angle, an arc rubber strip, a clamping block, and a fixing ball. The fixing ball is connected with the arc rubber strip, and the arc rubber strip is embedded in the total arc angle. The clamping block abuts on the inner wall of the total arc angle, the solid ball is a spherical structure, there are two arc rubber strips, and two clamping blocks are provided.
与现有技术相比,本发明具有如下有益效果:Compared with the prior art, the present invention has the following beneficial effects:
1.暴露出所需刻蚀的部位,其余部位由叠层所覆盖住,原本底端抵住物体上表面的顺贴面,将会通过夹口外推的力,让中部所抵触的部位有一个反扩的力,后端由匀球让整体的重心有一个匀分的作用,中端的中抵球固定力由卡边头匀分开,辅助整体的粘附力,能够在刻蚀的部位有所下移的同时,对其防护的部位侧面进行防护。1. The parts to be etched are exposed, and the rest are covered by the laminate. The original bottom end is pressed against the upper surface of the object, and will be pushed out by the force of the clamp, so that there is a For the anti-expansion force, the rear end is uniformly divided by the uniform ball to make the overall center of gravity have an even distribution, and the middle end of the ball is evenly divided by the card edge fixing force, which assists the overall adhesion and can be etched. While moving down, protect the side of the protected part.
2.通过抵块卡于主压板之间,上端的摆角支撑开主压板的承受力,主要承受外界的支点力,让其导头能够对其引向角进行往外扩,卡块将会辅助推开,使其后抵弧包裹住部位的同时,包裹住内部的所有零部件,起到回弹的作用,能够在部位跟随刻蚀的高度下移时,将会通过上端的挤压力,将其挤出,下端有个反向的包裹力,在没有底端的释放力时,将会往回缩动。2. By clamping the block between the main pressure plates, the swing angle at the upper end supports the bearing force of the main pressure plate, and mainly bears the external fulcrum force, so that the guide head can expand its leading angle outward, and the clamping block will assist. Push it open so that the back arc wraps the part, and at the same time wraps all the internal parts, which plays a role of rebound. When the part moves down with the height of the etching, it will pass the squeezing force of the upper end. Extrude it, the lower end has a reverse wrapping force, and it will retract back when there is no release force at the bottom end.
附图说明Description of drawings
图1为本发明一种芯片加工用刻蚀设备的结构示意图。FIG. 1 is a schematic structural diagram of an etching apparatus for chip processing according to the present invention.
图2为本发明一种上抵层的右视内部结构示意图。FIG. 2 is a schematic diagram of the internal structure of an upper contact layer of the present invention as viewed from the right side.
图3为本发明一种顺贴面的左视内部结构示意图。FIG. 3 is a left-view internal structure diagram of a veneer according to the present invention.
图4为本发明一种托面的正视内部结构示意图。FIG. 4 is a schematic view of the front view of the internal structure of a support surface of the present invention.
图5为本发明一种中抵球的正视内部结构示意图。FIG. 5 is a schematic diagram of the front view of the internal structure of a middle-reach ball according to the present invention.
图6为本发明一种夹口的正视内部结构示意图。FIG. 6 is a schematic view of the front view of the internal structure of a clip of the present invention.
图7为本发明一种顺压边的正视内部结构示意图。FIG. 7 is a schematic diagram of the front view of the internal structure of a pressing edge according to the present invention.
图8为本发明一种后抵弧的正视内部结构示意图。FIG. 8 is a schematic diagram of the front view of the internal structure of a rear reaching arc according to the present invention.
图中:底固箱-t011、外固箱-t022、上抵层-t033、内控箱-t044、控制面板-t055、顺贴面-g11、夹口-g22、叠层-g33、托面-w01、胶托角-w02、匀球-w03、隔层-w04、中抵球-x11、弧摆芯-x22、后顶头-x33、外胶环-z01、卡边头-z02、膨芯-z03、顺压边-s10、主压板-s20、摆角-s30、抵块-s40、后抵弧-m01、引向角-m02、导头-m03、总弧角-a11、弧胶条-a22、卡块-a33、固球-a44。In the picture: Bottom solid box-t011, outer solid box-t022, top layer-t033, inner control box-t044, control panel-t055, veneer-g11, clip-g22, laminated layer-g33, support surface- w01, rubber support angle-w02, uniform ball-w03, spacer-w04, middle ball-x11, arc swing core-x22, rear head-x33, outer rubber ring-z01, card edge head-z02, expansion core- z03, forward pressure edge-s10, main pressure plate-s20, swing angle-s30, contact block-s40, rear contact arc-m01, leading angle-m02, guide head-m03, total arc angle-a11, arc rubber strip- a22, block-a33, solid ball-a44.
具体实施方式Detailed ways
以下结合附图对本发明做进一步描述:The present invention will be further described below in conjunction with the accompanying drawings:
实施例1:Example 1:
如附图1至附图5所示:As shown in accompanying drawings 1 to 5:
本发明提供一种芯片加工用刻蚀设备,其结构包括底固箱t011、外固箱t022、上抵层t033、内控箱t044、控制面板t055。The invention provides an etching equipment for chip processing, the structure of which includes a bottom solid box t011, an outer solid box t022, an upper contact layer t033, an inner control box t044, and a control panel t055.
所述底固箱t011安装于外固箱t022底端,所述内控箱t044嵌入于外固箱t022内部,所述上抵层t033设于内控箱t044内部,所述控制面板t055安装于外固箱t022外表面。The bottom solid box t011 is installed at the bottom end of the outer solid box t022, the inner control box t044 is embedded in the outer solid box t022, the upper contact layer t033 is arranged inside the inner control box t044, and the control panel t055 is installed in the outer solid box t055. Outer surface of box t022.
其中,所述上抵层t033包括顺贴面g11、夹口g22、叠层g33,所述夹口g22嵌入于叠层g33内部,所述叠层g33外表面抵有顺贴面g11,所述顺贴面g11正视为梯形结构,所述夹口g22让中部所抵触的部位有一个反扩的力,顺贴面g11对所抵触的部位起到贴附的作用。Wherein, the upper abutting layer t033 includes a veneer g11, a clip opening g22, and a laminated layer g33, the clip opening g22 is embedded in the interior of the laminated layer g33, and the outer surface of the laminated layer g33 is abutted with a smooth veneer surface g11. The veneer g11 is regarded as a trapezoidal structure, and the jaw g22 has a counter-expansion force on the part against which the middle part is in conflict, and the veneer g11 plays a role of sticking to the conflicting part.
其中,所述顺贴面g11包括托面w01、胶托角w02、匀球w03、隔层w04,所述胶托角w02贴合于托面w01内表面,所述匀球w03嵌入于隔层w04内部,所述隔层w04与托面w01相连接,所述托面w01为弧形结构,所述匀球w03呈球体结构,所述胶托角w02为橡胶材质,所述托面w01大面积的托于物体表面,匀球w03匀分开外层的力,胶托角w02置于受力部位之间,起到均衡的作用。Wherein, the veneer surface g11 includes a support surface w01, a rubber support angle w02, a uniform ball w03, and an interlayer w04, the rubber support angle w02 is attached to the inner surface of the support surface w01, and the uniform ball w03 is embedded in the interlayer Inside w04, the partition layer w04 is connected with the support surface w01, the support surface w01 is an arc structure, the uniform ball w03 is a spherical structure, the rubber support angle w02 is made of rubber, and the support surface w01 is large The area is supported on the surface of the object, the uniform ball w03 evenly separates the force of the outer layer, and the rubber support angle w02 is placed between the stressed parts, which plays a balancing role.
其中,所述托面w01包括中抵球x11、弧摆芯x22、后顶头x33,所述后顶头x33贴合于弧摆芯x22外表面,所述弧摆芯x22远离后顶头x33的一端与中抵球x11相连接,所述弧摆芯x22为弧形结构,所述后顶头x33一边为弧形另一端为尖角状,所述中抵球x11固定于中端进行大面积的托附两侧的力,弧摆芯x22辅助周边托动力,后顶头x33让内部的部位有一个最大的限度。Wherein, the supporting surface w01 includes a middle ball x11, an arc swing core x22, and a rear plug x33, the rear plug x33 is attached to the outer surface of the arc swing core x22, and the end of the arc swing core x22 away from the rear plug x33 is connected to the The middle ball x11 is connected, the arc swing core x22 is an arc structure, the rear head x33 has an arc shape on one side and a sharp angle at the other end, and the middle ball x11 is fixed at the middle end for a large area of attachment The force on both sides, the arc swing core x22 assists the peripheral support force, and the rear head x33 allows the internal parts to have a maximum limit.
其中,所述中抵球x11包括外胶环z01、卡边头z02、膨芯z03,所述外胶环z01贴合于膨芯z03外表面,所述外胶环z01远离膨芯z03的一端与卡边头z02相连接,所述卡边头z02设有两个,所述外胶环z01为两头尖中间弧形结构,所述膨芯z03呈椭圆形结构,所述卡边头z02辅助整体的粘附力,外胶环z01大面积的粘附外物,膨芯z03置于中端,对外层起到膨胀开扩的作用。Wherein, the middle ball x11 includes an outer rubber ring z01, a clip head z02, and an expansion core z03, the outer rubber ring z01 is attached to the outer surface of the expansion core z03, and the outer rubber ring z01 is away from the end of the expansion core z03 It is connected with the card edge head z02, the card edge head z02 is provided with two, the outer rubber ring z01 is an arc structure in the middle of the two ends, the expansion core z03 is an elliptical structure, and the card edge head z02 assists The overall adhesion, the outer rubber ring z01 adheres to foreign objects in a large area, and the expansion core z03 is placed at the middle end to expand and expand the outer layer.
本实施例的具体使用方式与作用:The specific usage mode and function of this embodiment:
本发明中,将所需刻蚀的芯片放置于内控箱t044内部,从而通过上方的上抵层t033对其进行覆盖,暴露出所需刻蚀的部位,其余部位由叠层g33所覆盖住,在叠层g33覆盖的周边,有所被刻蚀后,原本底端抵住物体上表面的顺贴面g11,将会通过夹口g22外推的力,让其顺贴面g11有下移的力,在顺贴面g11下托的同时,托面w01将会抵在叠层g33所覆盖部位的侧方面,后端由匀球w03让整体的重心有一个匀分的作用,由托面w01抵住物体的侧边并且持续跟随刻蚀的高度活动,由中端的中抵球x11起到固定的作用,两侧的弧摆芯x22做移动拉扯的贴附效果,中端的中抵球x11固定力由卡边头z02匀分开,使其能够边移动边固定,内部的外胶环z01将会进行形变,对内部的膨芯z03进行挤压,来释放与缩紧开外侧的力,对物体侧面进行移动贴附。In the present invention, the chip to be etched is placed inside the internal control box t044, so that it is covered by the upper contact layer t033 above, exposing the part to be etched, and the remaining parts are covered by the laminated layer g33, After the perimeter covered by the laminated layer g33 has been etched, the veneer g11 whose bottom end was originally pressed against the upper surface of the object will be pushed down by the force of the clamp g22, so that the veneer g11 will move downward. force, while the support surface g11 is under the support, the support surface w01 will touch the side of the part covered by the laminated layer g33, and the rear end is made by the uniform ball w03 to make the overall center of gravity have an even distribution, and the support surface w01 It is against the side of the object and continues to follow the height of the etching. The middle end ball x11 plays a fixed role, the arc pendulum core x22 on both sides does a moving and pulling attachment effect, and the middle end ball x11 is fixed The force is evenly divided by the card edge head z02, so that it can be fixed while moving, the inner outer rubber ring z01 will be deformed, and the inner expansion core z03 will be squeezed to release and tighten the outer force, and the object Mobile attachment on the side.
实施例2:Example 2:
如附图6至附图8所示:As shown in accompanying drawings 6 to 8:
其中,所述夹口g22包括顺压边s10、主压板s20、摆角s30、抵块s40,所述顺压边s10与摆角s30为一体化结构,所述摆角s30与主压板s20相连接,所述抵块s40位于主压板s20之间,所述摆角s30设有两个且对称分布,所述顺压边s10设有两个,所述主压板s20主要承受外界的支点力,摆角s30让弯角延伸的部位,有一定的倾向固定,抵块s40持续固定自身的状态,顺压边s10让所衔接部位有一个回夹的力。Wherein, the jaw g22 includes a pressure side s10, a main pressure plate s20, a swing angle s30, and a stop block s40. The pressure side s10 and the swing angle s30 are an integrated structure, and the swing angle s30 is in phase with the main pressure plate s20. connection, the abutting blocks s40 are located between the main pressing plates s20, the swing angles s30 are provided with two and are symmetrically distributed, the pressing edges s10 are provided with two, and the main pressing plates s20 mainly bear the external fulcrum force, The swing angle s30 makes the part where the corner extends have a certain tendency to be fixed, the abutting block s40 continues to fix itself, and the pressing edge s10 makes the connected part have a clamping force.
其中,所述顺压边s10包括后抵弧m01、引向角m02、导头m03,所述导头m03与后抵弧m01相连接,所述引向角m02抵在后抵弧m01外表面,所述导头m03设有两个且往下倾斜,所述后抵弧m01呈弧形结构,所述引向角m02引导整体的大致方向,导头m03卡于辅助引导的位置,起到固定后力的作用,后抵弧m01包裹住内部的所有零部件,起到回弹的作用。Wherein, the pressing side s10 includes a rear abutment arc m01, a leading angle m02, and a guide head m03, the guide head m03 is connected with the rear abutment arc m01, and the guide angle m02 abuts on the outer surface of the rear abutment arc m01 , the guide head m03 is provided with two and is inclined downward, the rear reaching arc m01 is in an arc structure, the guide angle m02 guides the general direction of the whole, and the guide head m03 is stuck in the position of the auxiliary guide to play With the effect of fixing the back force, the back contact arc m01 wraps all the internal parts and plays the role of rebound.
其中,所述后抵弧m01包括总弧角a11、弧胶条a22、卡块a33、固球a44,所述固球a44与弧胶条a22相连接,所述弧胶条a22嵌入于总弧角a11内部,所述卡块a33抵在总弧角a11内壁,所述固球a44为球体结构,所述弧胶条a22设有两个,所述卡块a33设有两个,所述卡块a33让所堆叠的部位有一个引导的弧度,弧胶条a22自身的弧度来固定出外层的形态。Wherein, the rear contact arc m01 includes a total arc angle a11, an arc rubber strip a22, a clamping block a33, and a fixing ball a44, the fixing ball a44 is connected with the arc rubber strip a22, and the arc rubber strip a22 is embedded in the total arc Inside the corner a11, the clamping block a33 abuts against the inner wall of the total arc angle a11, the fixing ball a44 is a spherical structure, there are two arc rubber strips a22, two clamping blocks a33 are provided, and the clamping The block a33 allows the stacked part to have a guiding radian, and the radian of the arc rubber strip a22 itself fixes the shape of the outer layer.
本实施例的具体使用方式与作用:The specific usage mode and function of this embodiment:
本发明中,在顺贴面g11要跟随高度移动时,其抵块s40是固定于顺贴面g11上的,通过抵块s40卡于主压板s20之间,上端的摆角s30支撑开主压板s20的承受力,让其有一个范围内的摆动力,与抵块s40最为接触的是顺压边s10,其顺压边s10内部的引向角m02将会引导开整体的倾向,让其导头m03能够对其引向角m02进行往外扩,使其能够反向的包裹住抵块s40,后端的后抵弧m01将会辅助反向的力,让弧胶条a22支撑开总弧角a11的弯曲方向,卡块a33将会辅助推开,使其后抵弧m01包裹住部位的同时,也尽量推向抵块s40,使其在失去阻力时,能够有个回缩的力。In the present invention, when the veneer g11 is to move with the height, the abutting block s40 is fixed on the veneer g11, and the abutting block s40 is clamped between the main pressing plates s20, and the swing angle s30 at the upper end supports the main pressing plate The bearing force of s20 allows it to have a swinging force within a range. The most contact with the abutting block s40 is the pressing side s10, and the guiding angle m02 inside the pressing side s10 will guide the overall tendency, allowing it to guide. The head m03 can expand its leading angle m02 outward, so that it can wrap the abutment block s40 in the reverse direction, and the rear abutment arc m01 at the rear end will assist the reverse force, allowing the arc rubber strip a22 to support the total arc angle a11 In the bending direction, the block a33 will assist to push open, so that while the rear contact arc m01 wraps the part, it will also push the block s40 as far as possible, so that it can have a retracting force when it loses resistance.
利用本发明所述技术方案,或本领域的技术人员在本发明技术方案的启发下,设计出类似的技术方案,而达到上述技术效果的,均是落入本发明的保护范围。Utilizing the technical solutions of the present invention, or those skilled in the art design similar technical solutions under the inspiration of the technical solutions of the present invention, and achieve the above technical effects, all fall within the protection scope of the present invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010275343.4A CN111463164A (en) | 2020-04-09 | 2020-04-09 | Etching equipment for chip processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010275343.4A CN111463164A (en) | 2020-04-09 | 2020-04-09 | Etching equipment for chip processing |
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| CN111463164A true CN111463164A (en) | 2020-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010275343.4A Withdrawn CN111463164A (en) | 2020-04-09 | 2020-04-09 | Etching equipment for chip processing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836496A (en) * | 2020-08-06 | 2020-10-27 | 陈斌 | Thing networking equipment rack |
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2020
- 2020-04-09 CN CN202010275343.4A patent/CN111463164A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836496A (en) * | 2020-08-06 | 2020-10-27 | 陈斌 | Thing networking equipment rack |
| CN111836496B (en) * | 2020-08-06 | 2021-09-17 | 企商在线(北京)网络股份有限公司 | Thing networking equipment rack |
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Application publication date: 20200728 |
