CN111442239B - LED headlight structure of vehicle - Google Patents

LED headlight structure of vehicle Download PDF

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Publication number
CN111442239B
CN111442239B CN202010256894.6A CN202010256894A CN111442239B CN 111442239 B CN111442239 B CN 111442239B CN 202010256894 A CN202010256894 A CN 202010256894A CN 111442239 B CN111442239 B CN 111442239B
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CN
China
Prior art keywords
heat conductor
heat
seat
cavity
conductor
Prior art date
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Active
Application number
CN202010256894.6A
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Chinese (zh)
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CN111442239A (en
Inventor
陈东桥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changshu Linzhi Electronics Co ltd
Original Assignee
Changshu Linzhi Electronics Co ltd
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Priority to CN202010256894.6A priority Critical patent/CN111442239B/en
Publication of CN111442239A publication Critical patent/CN111442239A/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32Optical layout thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/42Forced cooling
    • F21S45/43Forced cooling using gas
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/47Passive cooling, e.g. using fins, thermal conductive elements or openings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V27/00Cable-stowing arrangements structurally associated with lighting devices, e.g. reels 
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2102/00Exterior vehicle lighting devices for illuminating purposes
    • F21W2102/10Arrangement or contour of the emitted light
    • F21W2102/13Arrangement or contour of the emitted light for high-beam region or low-beam region
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A vehicle LED headlight structure belongs to the technical field of vehicle components. The LED lamp comprises a radiating seat, a heat conductor, a radiating fan, a lamp bowl and an LED chip, wherein a radiating cavity is formed on one downward side of the radiating seat, radiating seat radiating holes penetrating through the radiating cavity from the upper part of the radiating seat are formed at intervals around the radiating seat, a vehicle-mounted power supply lead wire hole communicated with the radiating cavity is formed on the side part of the radiating seat, the radiating fan is arranged in the radiating cavity, and the LED chip is arranged on the upper part of the heat conductor, and the LED lamp is characterized in that: the heat dissipation seat is characterized in that a heat conductor inserting and fixing mechanism is further formed in the middle area of the surface of one upward-facing side of the heat dissipation seat, the lower portion of the heat conductor is fixedly inserted and fixed with the heat conductor inserting and fixing mechanism, the lamp bowl is fixedly arranged with the heat conductor inserting and fixing mechanism and shields the upper portion of the heat conductor, and the heat conductor is a flat copper plate with a rectangular cross section. The heat dissipation effect is good, and the service life of the LED chip is prolonged; the reflection efficiency of the light source in the lamp bowl is improved, and the aggregation effect is improved; saving the cost.

Description

LED headlight structure of vehicle
Technical Field
The invention belongs to the technical field of vehicle components, and particularly relates to a vehicle LED headlight structure.
Background
As known in the art, since LEDs are semiconductor electrical components, if the temperature is high and effective forced physical cooling is not obtained, the light efficiency is significantly reduced, and thus the search for technical measures for effectively cooling the LED headlight of a vehicle has positive significance.
At present, two main heat dissipation modes for LED headlight structures exist: firstly, water circulation is utilized to dissipate heat; and secondly, radiating by adopting a fan. Typical examples of the former are "a car headlight radiator based on micropump cycle principle" recommended by CN109780505A, and "a flue type radiating LED car headlight" provided by CN108916809a, etc.; typical examples of the latter are CN202938202U (spiral heat-dissipating Led automotive headlight), CN207471434U (an H-type intelligent Led automotive headlight lighting system), CN207407269U (an H1-type intelligent Led automotive headlight lighting system), CN207438466U (a new automotive headlight), CN207438464U (a closed heat-dissipating automotive headlight), CN207438477U (a closed heat-dissipating automotive headlight), CN207935972U (an automotive headlight assembly and its Led headlight bulb), and the like. Since the latter is simpler in structure than the former and there is no need to worry about leakage of the cooling medium, the latter has a significantly wider application range than the former, that is, the current vehicle LED headlight structure is generally cooled by wind, that is, cooled by a fan. But there are the following general disadvantages: firstly, the heat conductor and the heat dissipation seat (also called as a 'heat radiator') are formed into an integral structure, so that the materials of the heat conductor and the heat dissipation seat are the same from the aspects of resource saving, convenient manufacturing and cost reduction, and the heat conduction effect of the same materials is indiscriminate, so that the heat conductor is just expected to have excellent heat conduction efficiency in the actual use process, so that the heat generated by the LED chip (also called as an 'LED lamp bead') taking the heat conductor as a carrier is quickly transferred to the heat dissipation seat, which is very beneficial to prolonging the service life of the LED headlight of the vehicle; secondly, because the heat conductor is generally designed to have a structure tending to a column shape or a D-shape in cross section due to the constraint of the long-term structural design concept, the reflection efficiency of the LED chip as a light source in the reflector (also referred to as a "lamp shade") is affected to some extent, typically, the aggregation effect is affected. In view of the foregoing, there is a need for reasonable improvements, and the technical solutions described below are created in this context.
Disclosure of Invention
The invention aims to provide a vehicle LED headlight structure which is beneficial to remarkably improving the heat conduction efficiency of a heat conductor and the reflectivity of an LED chip in a reflector.
The invention is characterized in that a heat conductor inserting and fixing mechanism is also formed in the middle area of the surface of one side of the heat radiating seat facing upwards, the lower part of the heat conductor is inserted and fixed with the heat conductor inserting and fixing mechanism, the lamp bowl is fixed with the heat conductor inserting and fixing mechanism and shields the upper part of the heat conductor, and the heat conductor is a flat copper plate with a rectangular cross section.
In a specific embodiment of the present invention, the heat conductor plugging and fixing mechanism includes an additional heat dissipation column, a heat conductor left limit seat and a heat conductor right limit seat, the additional heat dissipation column is formed in a middle area of a side surface of the heat dissipation seat facing upward, additional heat dissipation column heat dissipation holes are formed in the additional heat dissipation column and are spaced around the periphery of the additional heat dissipation column, the additional heat dissipation column heat dissipation holes penetrate from an upper portion to a lower portion of the additional heat dissipation column and are communicated with the heat dissipation cavity, a heat conductor lower portion supporting and limiting cavity is formed in a central position of the additional heat dissipation column, the heat conductor left limit seat and the heat conductor right limit seat extend upwards in a state of being corresponding to each other left and right to form an upper surface of the additional heat dissipation column, a space between the heat conductor left limit seat and the heat conductor right limit seat is formed as a heat conductor lower portion plugging cavity, the heat conductor lower portion plugging cavity corresponds to the heat conductor lower portion supporting and limiting cavity and is communicated with the heat conductor lower portion supporting and limiting cavity, the heat conductor lower portion is sequentially inserted into the heat conductor lower portion plugging cavity and the heat conductor lower portion supporting and limiting cavity, and the heat conductor upper portion is fixedly connected with the heat conductor bowl.
In another specific embodiment of the present invention, a left heat conductor defining seat wire hole is formed in the left heat conductor defining seat, a right heat conductor defining seat wire hole is formed in the right heat conductor defining seat, and an upper portion of the left heat conductor defining seat wire Kong Zidao extends downward and communicates with the heat dissipation chamber after passing through the additional heat dissipation post and the heat dissipation seat in sequence, and an upper portion of the right heat conductor defining seat wire Kong Zidao extends downward and communicates with the heat dissipation chamber after passing through the additional heat dissipation post and the heat dissipation seat in sequence.
In a further specific embodiment of the invention, the width of the heat conductor lower insert cavity and the heat conductor lower support limit cavity is adapted to the thickness of the heat conductor.
In yet another specific embodiment of the present invention, the cross-sectional shape of the left thermally conductive body-defining seat and the right thermally conductive body-defining seat is semicircular.
In a further specific embodiment of the present invention, a heat conductor fixing screw hole is formed at a side portion of the additional heat dissipation column, the heat conductor fixing screw hole is communicated with the heat conductor lower portion supporting and limiting cavity, and a heat conductor fixing screw for fixing the lower portion of the heat conductor is disposed on the heat conductor fixing screw hole.
In a further specific embodiment of the present invention, a lamp bowl fixing sleeve is fixedly sleeved on the outer wall of the additional heat dissipation column, and the lower part of the lamp bowl is fixed with the lamp bowl fixing sleeve.
In a further specific embodiment of the invention, a flange edge of the fixing sleeve is formed at the upper part of the lamp bowl, a lamp bowl fixing flange ring is formed at the lower part of the lamp bowl, the lamp bowl fixing flange ring is fixed with the flange edge of the fixing sleeve through flange ring screws, and a lamp bowl panel is arranged at the upper part of the lamp bowl and is transparent.
In still another specific embodiment of the present invention, the number of the LED chips is one pair and each is disposed on the left and right sides of the upper portion of the heat conductor through a chip substrate, and the chip substrate is fixed to the heat conductor by a chip substrate fixing screw.
In still another specific embodiment of the present invention, a heat conductor fixing screw insertion hole is formed at a position corresponding to the heat conductor fixing screw hole at a lower portion of the heat conductor, the heat conductor fixing screw is inserted into the heat conductor fixing screw insertion hole, and the heat conductor fixing screw insertion hole is a blind hole.
According to one of the technical effects of the technical scheme provided by the invention, the heat conductor and the heat radiating seat are creatively formed into a split structure, so that a copper plate with higher heat conduction efficiency can be adopted as the heat conductor, the heat radiating effect can be exerted extremely, and the service life of the LED chip can be prolonged obviously; secondly, the heat conductor is formed into a flat structure with a rectangular cross section, so that compared with a cylinder in the prior art, the reflection efficiency of the light source in the lamp bowl is improved, and the aggregation effect is improved; thirdly, the heat conductor is made of copper with relatively high price, and the heat dissipation base is made of traditional cheap materials, so that a reasonable balance point is found between resource saving and product cost.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present invention.
Fig. 2 is a detailed structural view of the heat sink, the heat conductor, and the heat dissipation fan shown in fig. 1.
Fig. 3 is a schematic diagram of another embodiment of the present invention.
Fig. 4 is a detailed structural view of the heat sink, the heat conductor, and the heat dissipation fan shown in fig. 3.
Fig. 5 is a schematic view of the heat sink shown in fig. 3.
Detailed Description
In order to make the technical spirit and advantages of the present invention more clearly understood, the applicant will now make a detailed description by way of example, but the description of the examples is not intended to limit the scope of the invention, and any equivalent transformation made merely in form, not essentially, according to the inventive concept should be regarded as the scope of the technical solution of the present invention.
In the following description, all concepts related to the directions or azimuths of up, down, left, right, front and rear are in the position state shown in fig. 1, and thus, the present invention should not be construed as being particularly limited to the technical solutions provided by the present invention.
Example 1:
Referring to fig. 1 and 2, a heat dissipation seat 1, a heat conductor 2, a heat dissipation fan 3, a lamp bowl 4 and an LED chip 5 are shown, wherein a heat dissipation cavity 11 with a non-closed bottom is formed on one side of the heat dissipation seat 1 facing downwards, heat dissipation seat heat dissipation holes 12 penetrating from the upper part of the heat dissipation seat 1 to the heat dissipation cavity 11 are formed around the heat dissipation seat 1 at intervals, a vehicle-mounted power supply lead wire hole 13 communicated with the heat dissipation cavity 11 is formed on the side part of the heat dissipation seat 1, and as a preferred scheme, heat dissipation seat grooves 15 can be formed around the outer wall of the heat dissipation seat 1 at intervals in a longitudinal state, the heat dissipation fan 3 is arranged in the heat dissipation cavity 11, and the LED chip 5 is arranged on the upper part of the heat conductor 2.
The technical key points of the technical scheme provided by the invention are as follows: a heat conductor inserting and fixing mechanism 14 is further formed in the middle area of the surface of the heat dissipation seat 1 facing upwards, the lower part of the heat conductor 2 is inserted and fixed with the heat conductor inserting and fixing mechanism 14, the lamp bowl 4 is fixed with the heat conductor inserting and fixing mechanism 14 and shields the upper part of the heat conductor 2, and the heat conductor 2 is a flat copper plate (namely a flat copper plate strip) with a rectangular cross section. In this embodiment, the copper plate is pure copper with a copper mass percentage of 99.7% or more.
As shown in fig. 1 and 2, a stepped cavity 111 is formed at the lower portion of the heat dissipation cavity 11, and the aforementioned heat dissipation fan 3 is preferably positioned in the stepped cavity 111 in a fitting manner. The material of the heat sink 1 is preferably aluminum alloy or other equivalent material.
With continued reference to fig. 1 and 2, the preferred, but not absolute, construction of the aforementioned thermal conductor attachment mechanism 14 is as follows: the LED heat sink comprises an additional heat dissipation post 141, a heat conductor left limiting seat 142 and a heat conductor right limiting seat 143, wherein the additional heat dissipation post 141 is formed in the middle area of the surface of the heat dissipation post 1 facing upwards, additional heat dissipation post heat dissipation holes 1411 are formed on the additional heat dissipation post 141 at intervals around the periphery of the additional heat dissipation post 141, the additional heat dissipation post heat dissipation holes 1411 penetrate from the upper part to the lower part of the additional heat dissipation post 141 and are communicated with the heat dissipation cavity 11, a heat conductor lower part supporting limiting cavity 1412 is formed in the center position of the additional heat dissipation post 141, the heat conductor left limiting seat 142 and the heat conductor right limiting seat 143 extend upwards to form the upper surface of the additional heat dissipation post 141 in a state of being corresponding to each other left and right, namely, the heat conductor left limiting seat 142 and the heat conductor right limiting seat 143 are directly formed on the upper surface of the additional heat dissipation post 141, the space between the heat conductor left limiting seat 142 and the heat conductor right limiting seat 143 is formed as a heat conductor lower part cavity 144 which penetrates from the upper part to the lower part and is communicated with the heat dissipation cavity 11, a heat conductor lower part supporting limiting cavity 1412 is opened at the center position of the additional heat dissipation post 141, and the heat conductor lower part is fixedly connected with the heat conductor lower cavity 1412 and the heat conductor lower cavity 4 is inserted into the upper cavity 2 in turn in the upper part of the heat dissipation post cavity connecting with the upper cavity 4.
A left heat conductor defining seat wire hole 1421 is formed in the left heat conductor defining seat 142, and a right heat conductor defining seat wire hole 1431 is formed in the right heat conductor defining seat 143, the left heat conductor defining seat wire hole 1421 extends downward from an upper portion of the left heat conductor defining seat 142 and communicates with the heat dissipation chamber 11 after passing through the additional heat dissipation post 141 and the heat dissipation seat 1 in order, and the right heat conductor defining seat wire hole 1431 extends downward from an upper portion of the right heat conductor defining seat 143 and communicates with the heat dissipation chamber 11 after passing through the additional heat dissipation post 141 and the heat dissipation seat 1 in order.
In this embodiment, the widths of the lower insert cavity 144 and the lower support and limit cavity 1412 are adapted to the thickness of the heat conductor 2, so as to meet the requirement of inserting and matching the heat conductor 2.
In the present embodiment, the left and right heat conductor defining seats 142 and 143 have semicircular cross-sectional shapes.
A heat conductor fixing screw hole 1413 is formed in a side portion of the additional heat radiation column 141, the heat conductor fixing screw hole 1413 communicates with the heat conductor lower portion supporting and limiting chamber 1412, and a heat conductor fixing screw 14131 for fixing a lower portion of the heat conductor 2 is disposed in the heat conductor fixing screw hole 1413.
As shown in fig. 1, a lamp bowl fixing sleeve 1414 is fixed to the outer wall of the additional heat radiation column 141, and the lower part of the lamp bowl 4 is fixed to the lamp bowl fixing sleeve 1414.
With continued reference to fig. 1, a flange 14141 of the lamp bowl is formed at an upper portion of the lamp bowl fixing sleeve 1414, a flange 41 of the lamp bowl is formed at a lower portion of the lamp bowl 4, the flange 41 is fixed to the flange 14141 of the lamp bowl by a flange screw 411, a panel 42 of the lamp bowl is provided at an upper portion of the lamp bowl 4, and the panel 42 of the lamp bowl is transparent, for example, transparent plastic, transparent organic glass, transparent glass, or the like.
In the present embodiment, the LED chips 5 are provided in a pair in number and are disposed on the left and right sides of the upper portion of the heat conductor 2 through chip boards 51, and the chip boards 51 are fixed to the heat conductor 2 by chip board fixing screws 511.
A heat conductor fixing screw insertion hole 21 is formed at a position corresponding to the heat conductor fixing screw hole 1413 in a lower portion of the heat conductor 2, the heat conductor fixing screw 14131 is inserted into the heat conductor fixing screw insertion hole 21, and the heat conductor fixing screw insertion hole 21 is a blind hole.
A plurality of, for example, four in-vehicle power supply lines 6 (shown in fig. 1) are LED from the in-vehicle power supply lead wire holes 13 and are electrically connected to the LED chips 5 and to the radiator fan 3, respectively, and also shown in fig. 1 are drivers 61 connected to the in-vehicle power supply lines 6. When the vehicle is in a normal working state, such as a night driving state, and the vehicle LED headlight needs to be turned on, a driver operates corresponding parts in the vehicle, at the moment, the radiator fan 3 is in a working state, the LED chip 5 is in a bright starting state, heat generated by the LED chip 5 is conducted by the heat conductor and is transferred to the left heat conductor limiting seat-142 and the right heat conductor limiting seat 143, the heat is LED into the radiator cavity 11 by the radiator fan 3 through the additional radiator column 141 and the additional radiator column radiating hole 1411 and is discharged outside, and meanwhile, the heat is LED into the radiator cavity 11 by the radiator seat 1 and the radiator seat radiating hole 12 thereof and is discharged outside by the radiator fan 3.
Example 2:
Referring to fig. 3 to 5, the heat dissipation seat 1 and the heat conductor inserting and fixing mechanism 14 are divided into two halves along the longitudinal axis from the middle to form two halves with the same size, and two symmetrical heat dissipation seat flaps with the same size are connected into a whole by the heat dissipation seat fixing connection screw 16, so as to form the heat dissipation seat 1. In order to facilitate the connection of the two heat dissipation seat flaps, a fixing and connecting screw hole 17 is respectively formed on the two heat dissipation seat flaps and at the corresponding position, and the fixing and connecting screw hole 17 corresponds to the upper part of the step cavity 111 so as to prevent the heat dissipation seat fixing and connecting screw 16 from being interfered by the heat dissipation fan 3 when being screwed into the fixing and connecting screw hole 17. When the two half-valve structures are folded, i.e. combined, a gap matched with the thickness of the heat conductor 2 is still kept between the left heat conductor limiting seat 142 and the right heat conductor limiting seat 143. Since the final result of the structure of this embodiment, i.e., the expression in the use state, is the same as that of embodiment 1, it is merely convenient in terms of processing, and thus if the structure of embodiment 2 is adopted, it should be regarded as not departing from the scope of the technical solution provided by the present invention. The remainder is the same as described for example 1.
In summary, the technical scheme provided by the invention overcomes the defects in the prior art, successfully completes the task of the invention, and faithfully honors the technical effects carried by the applicant in the technical effect column above.

Claims (7)

1. A vehicle LED headlight structure comprises a heat radiation seat (1), a heat conductor (2), a heat radiation fan (3), a lamp bowl (4) and an LED chip (5), wherein a heat radiation cavity (11) is formed on one downward side of the heat radiation seat (1), heat radiation holes (12) penetrating through the heat radiation cavity (11) from the upper part of the heat radiation seat (1) are arranged around the heat radiation seat (1) at intervals, a vehicle-mounted power supply lead wire hole (13) communicated with the heat radiation cavity (11) is formed on the side part of the heat radiation seat (1), the heat radiation fan (3) is arranged in the heat radiation cavity (11), the LED chip (5) is arranged on the upper part of the heat conductor (2), The method is characterized in that: a heat conductor inserting and fixing mechanism (14) is further formed in the middle area of the surface of one side, facing upwards, of the heat radiating seat (1), the lower part of the heat conductor (2) is fixedly inserted and fixed with the heat conductor inserting and fixing mechanism (14), the lamp bowl (4) is fixed with the heat conductor inserting and fixing mechanism (14) and shields the upper part of the heat conductor (2), and the heat conductor (2) is a flat copper plate with a rectangular cross section; The heat conductor inserting and fixing mechanism (14) comprises an additional heat radiation column (141), a heat conductor left limiting seat (142) and a heat conductor right limiting seat (143), wherein the additional heat radiation column (141) is formed in the middle area of one side surface of the heat radiation seat (1) facing upwards, additional heat radiation column heat radiation holes (1411) are formed in the additional heat radiation column (141) and are spaced around the periphery of the additional heat radiation column (141), the additional heat radiation column heat radiation holes (1411) penetrate from the upper part to the lower part of the additional heat radiation column (141) and are communicated with the heat radiation cavity (11), a heat conductor lower supporting and limiting cavity (1412) is formed in the central position of the additional heat radiation column (141), The heat conductor left limiting seat (142) and the heat conductor right limiting seat (143) extend upwards to form the upper surface of the additional heat dissipation column (141) in a state of being left and right corresponding to each other, a space between the heat conductor left limiting seat (142) and the heat conductor right limiting seat (143) is formed into a heat conductor lower inserting cavity (144), the heat conductor lower inserting cavity (144) corresponds to and is communicated with the heat conductor lower supporting limiting cavity (1412), the lower part of the heat conductor (2) is sequentially inserted into the heat conductor lower inserting cavity (144) and the heat conductor lower supporting limiting cavity (1412), and the upper part and the LED chip (5) extend out of the heat conductor lower inserting cavity (144), the lamp bowl (4) is fixed with the additional heat dissipation column (141); A left heat conductor limiting seat wire hole (1421) is formed in the left heat conductor limiting seat (142), a right heat conductor limiting seat wire hole (1431) is formed in the right heat conductor limiting seat (143), the left heat conductor limiting seat wire hole (1421) extends downwards from the upper part of the left heat conductor limiting seat (142) and is communicated with the heat dissipation cavity (11) after sequentially passing through the additional heat dissipation column (141) and the heat dissipation seat (1), and the right heat conductor limiting seat wire hole (1431) extends downwards from the upper part of the right heat conductor limiting seat (143) and is communicated with the heat dissipation cavity (11) after sequentially passing through the additional heat dissipation column (141) and the heat dissipation seat (1); the widths of the lower inserting cavity (144) of the heat conductor and the lower supporting and limiting cavity (1412) of the heat conductor are matched with the thickness of the heat conductor (2).
2. The vehicle LED headlight structure according to claim 1, wherein: the cross section of the left limiting seat (142) of the heat conductor and the right limiting seat (143) of the heat conductor is semicircular.
3. The vehicle LED headlight structure according to claim 1, wherein: a heat conductor fixing screw hole (1413) is formed in the side part of the additional heat radiation column (141), the heat conductor fixing screw hole (1413) is communicated with the heat conductor lower part supporting and limiting cavity (1412), and a heat conductor fixing screw (14131) for fixing the lower part of the heat conductor (2) is arranged on the heat conductor fixing screw hole (1413).
4. The vehicle LED headlight structure according to claim 1, wherein: a lamp bowl fixing sleeve (1414) is fixedly sleeved on the outer wall of the additional heat dissipation column (141), and the lower part of the lamp bowl (4) is fixed with the lamp bowl fixing sleeve (1414).
5. The vehicle LED headlight structure of claim 4, wherein: a flange edge (14141) of the fixing sleeve is formed at the upper part of the lamp bowl fixing sleeve (1414), a lamp bowl fixing flange ring (41) is formed at the lower part of the lamp bowl (4), the lamp bowl fixing flange ring (41) is fixed with the flange edge (14141) of the fixing sleeve through flange ring screws (411), a lamp bowl panel (42) is arranged at the upper part of the lamp bowl (4), and the lamp bowl panel (42) is transparent.
6. The vehicle LED headlight structure according to claim 1, wherein: the number of the LED chips (5) is one, the LED chips are respectively arranged on the left side and the right side of the upper part of the heat conductor (2) through a chip substrate (51), and the chip substrate (51) is fixed with the heat conductor (2) through a chip substrate fixing screw (511).
7. A vehicular LED headlight structure according to claim 3, wherein: a heat conductor fixing screw detection hole (21) is formed at the lower part of the heat conductor (2) and at a position corresponding to the heat conductor fixing screw hole (1413), the heat conductor fixing screw (14131) is detected into the heat conductor fixing screw detection hole (21), and the heat conductor fixing screw detection hole (21) is a blind hole.
CN202010256894.6A 2020-04-03 2020-04-03 LED headlight structure of vehicle Active CN111442239B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010256894.6A CN111442239B (en) 2020-04-03 2020-04-03 LED headlight structure of vehicle

Applications Claiming Priority (1)

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CN202010256894.6A CN111442239B (en) 2020-04-03 2020-04-03 LED headlight structure of vehicle

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CN107489958A (en) * 2017-08-07 2017-12-19 常熟林芝电子技术有限公司 LED lamp for car structure
CN207635273U (en) * 2017-12-14 2018-07-20 江西江铃汽车集团旅居车有限公司 A kind of headlight for vehicles radiator
CN211716477U (en) * 2020-04-03 2020-10-20 常熟市吉伊照明电器厂 Vehicle LED headlight structure

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Publication number Priority date Publication date Assignee Title
CN107489958A (en) * 2017-08-07 2017-12-19 常熟林芝电子技术有限公司 LED lamp for car structure
CN207635273U (en) * 2017-12-14 2018-07-20 江西江铃汽车集团旅居车有限公司 A kind of headlight for vehicles radiator
CN211716477U (en) * 2020-04-03 2020-10-20 常熟市吉伊照明电器厂 Vehicle LED headlight structure

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