CN111415891A - Chip gland jig and technological method thereof - Google Patents
Chip gland jig and technological method thereof Download PDFInfo
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- CN111415891A CN111415891A CN202010311691.2A CN202010311691A CN111415891A CN 111415891 A CN111415891 A CN 111415891A CN 202010311691 A CN202010311691 A CN 202010311691A CN 111415891 A CN111415891 A CN 111415891A
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 210000004907 gland Anatomy 0.000 title claims abstract description 10
- 238000003825 pressing Methods 0.000 claims description 66
- 239000000758 substrate Substances 0.000 claims description 56
- 239000000853 adhesive Substances 0.000 claims description 31
- 230000001070 adhesive effect Effects 0.000 claims description 31
- 238000003491 array Methods 0.000 claims description 16
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a chip gland jig and a process method thereof, and belongs to the technical field of semiconductor jigs. It includes carrier (10), hourglass word board (20) and pressure word board (30) from bottom to top in proper order, set up base plate (40) between carrier (10) and hourglass word board (20), its chip paster region up, be equipped with a plurality of carrier mounting I (11), a plurality of carrier mounting II (12), a plurality of guide pin (13), a plurality of location long needle (16) and a plurality of vacuum hole array (18) on carrier (10), be equipped with a plurality of hourglass word board mounting I (21), a plurality of hourglass word board mounting II (22), a plurality of locating hole (26), a plurality of blind hole (23) and hourglass word hole array on hourglass word board (20), be equipped with a plurality of on pressure word board (30) and press word board mounting I (31), a plurality of and press word board mounting II (32), a plurality of locating hole (36) and lug array. The invention can control the sticking height of the chips to be consistent.
Description
Technical Field
The invention relates to a chip gland jig and a process method thereof, and belongs to the technical field of semiconductor jigs.
Background
In the semiconductor integrated circuit manufacturing process, it is necessary to attach a chip to a chip on a substrate or a lead frame, and to control the total height of the chip and the glue. The total height of the chip and the glue is influenced by uncertain factors such as the consistency and the temperature of the glue, so that the total height of the chip and the glue is inconsistent, the pasting height cannot be accurately controlled, particularly, the surface lines of some unconventional chips are irregular, a machine cannot judge the height, and the yield of products is reduced.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a chip capping jig capable of controlling the sticking height of chips to be consistent and a process method thereof.
The purpose of the invention is realized as follows:
the invention relates to a chip gland jig which sequentially comprises a carrier, a character-dropping plate and a character-pressing plate from bottom to top, wherein a base plate is arranged between the carrier and the character-dropping plate, a chip surface mounting area of the base plate faces upwards, and the shapes of the carrier, the character-dropping plate and the character-pressing plate are consistent with the shape of the base plate;
the carrier is provided with a plurality of carrier fixing pieces I, a plurality of carrier fixing pieces II, a plurality of guide pins, a plurality of positioning long needles and a plurality of vacuum hole arrays, the carrier fixing pieces I and the carrier fixing pieces II are respectively and uniformly arranged on the upper edge and the lower edge of the carrier to fix the character-dropping plate above the carrier, the positioning long needles are respectively arranged between the adjacent carrier fixing pieces I and between the adjacent carrier fixing pieces II to position the character-dropping plate and the character-pressing plate above the positioning long needles, the vacuum hole arrays are arranged on the inner periphery of the carrier and correspond to the arrays of the base plates, the guide pins are arranged on the diagonal lines of each vacuum hole array to position the base plates;
the character-leaking plate is provided with a plurality of character-leaking plate fixing pieces I, a plurality of character-leaking plate fixing pieces II, a plurality of positioning holes, a plurality of blind holes and a character-leaking hole array, the upper side and the lower side of the back surface of the character-leaking plate are respectively provided with an outer step and an inner step, and a containing interval for containing a substrate is formed, the character-leaking plate fixing pieces I and the character-leaking plate fixing pieces II are respectively and uniformly arranged on the outer steps of the character-leaking plate, the positioning holes are arranged on the outer steps of the character-leaking plate and correspond to the positions of the positioning long needles on the carrier, and the blind holes are arranged on the inner steps of the character-leaking plate, correspond to the positions of the guide pins on the carrier and are;
the character leaking hole arrays are arranged on the inner periphery of the character leaking plate, the character leaking holes in each character leaking hole array are also distributed according to the array and correspond to the chip mounting area of the substrate, and the size of each character leaking hole is larger than that of each chip and smaller than that of the chip mounting area on the substrate;
it presses word board mounting I, a plurality of to press to be equipped with on the word board, a plurality of presses word board mounting II, a plurality of locating hole and lug array, press word board mounting I, press word board mounting II evenly to set up respectively in the last edge and the lower edge of pressing the word board, the locating hole distributes on the diagonal line of pressing the word board, corresponds with the location long needle position on the carrier, the lug array sets up in the back of pressing the word board, and the lug in every lug array also arranges according to the array, and the thickness of all lugs is unanimous, and corresponds with the distribution in the hourglass word hole of hourglass word board, and its size is less than the bore size in hourglass word hole.
Optionally, carrier mounting I includes but not limited to magnet piece, buckle, and carrier mounting II includes but not limited to magnet piece, buckle, carrier mounting I sets up with carrier mounting II symmetries.
Optionally, the first Chinese character 'xi' board fixing piece includes but is not limited to the magnet piece, and the second Chinese character 'xi' board fixing piece includes but is not limited to the magnet piece, and the first Chinese character 'xi' board fixing piece sets up with the second symmetry of Chinese character 'xi' board fixing piece.
Optionally, the positioning long needle is disposed at two ends of a diagonal line of the carrier.
Optionally, the stencil fixing member i and the stencil fixing member ii of the stencil correspond to the carrier fixing member i and the carrier fixing member ii of the carrier.
Optionally, the cross section of the bump is circular, rectangular or polygonal.
Optionally, the pressing plate fixing piece I includes but is not limited to a magnet block, the pressing plate fixing piece II includes but is not limited to a magnet block, and the pressing plate fixing piece I and the pressing plate fixing piece II of the pressing plate are symmetrically arranged.
Optionally, the cross section of the word leaking hole is turtle-shaped, and the longitudinal section of the word leaking hole is trumpet-shaped.
The invention also provides a chip packaging method using the chip capping jig, which comprises the following process steps:
step one, using slowly flowing pasting glue to draw glue in a chip pasting area of a substrate on a glue spreader, and controlling the glue discharging amount of the pasting glue through the glue spreader;
placing the substrate above the carrier, positioning the substrate on the carrier by the chip surface mounting area of the substrate upwards through the guide pin, and then opening the vacuum equipment below the carrier to fix the substrate on the carrier;
step three, the character-dropping plate is placed above the base plate, the character-dropping plate is positioned through the positioning long needles on the carrier and the through holes on the character-dropping plate, meanwhile, the binding force of the carrier and the character-dropping plate is increased through the character-dropping plate fixing pieces I and II and the carrier fixing pieces I and II of the carrier, so that the character-dropping plate does not move on the carrier, and the character-dropping holes of the character-dropping plate expose the chip paster area of the base plate and the adhesive on the chip paster area;
placing the chips on the adhesive in the chip mounting area one by one through the character-missing holes of the character-missing plate by the mechanical arm;
placing the character pressing plate above the character leaking plate, aligning the convex block with the character leaking hole of the character leaking plate, positioning the character pressing plate and the character leaking plate through the positioning long needle on the carrier, the through hole of the character pressing plate and the through hole of the character leaking plate, increasing the binding force between the character pressing plate and the character leaking plate through the character pressing plate fixing part I, the character pressing plate fixing part II, the character leaking plate fixing part I and the character leaking plate fixing part II of the character pressing plate, pressing the convex block of the character pressing plate, attaching the chip to the substrate through the adhesive, and applying proper pressure after attaching to ensure that the sum of the thicknesses of the substrate, the chip and the adhesive is equal to the design height, namely the thickness of the substrate + the thickness of the chip + the thickness of the adhesive = the design height;
placing the chip gland jig and the substrate together in an oven for baking, and curing the adhesive;
and step seven, disassembling the chip gland jig and taking out the substrate with the chip attached.
Furthermore, the thickness of the bump is determined by the character pressing plate according to the sum of the thicknesses of the substrate, the chip and the adhesive required by the product.
Advantageous effects
The invention provides a chip capping jig which comprises a carrier, a character leaking plate and a character pressing plate, can control the sticking height of chips to be consistent, and improves the quality of chip mounting of a substrate and a lead frame. The process method solves the problem of chip mounting of some unconventional chips in the field of packaging.
Drawings
Fig. 1 is a structural diagram of a carrier of a chip capping jig according to the present invention;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is a structural diagram of a grid plate of the chip capping jig according to the present invention;
FIG. 4 is a side view of FIG. 3;
FIG. 5 is a view showing a connection structure of the carrier and the stencil and a partially enlarged view thereof;
fig. 6 is a structural diagram of a character pressing plate of the chip capping jig of the present invention;
FIG. 7 is a side view of FIG. 6;
FIG. 8 is a view showing a connection structure of the carrier and the platen and a partially enlarged view thereof;
in the figure:
Carrier fixing piece I11
Carrier fixing piece II 12
Positioning long needle 16
A plurality of vacuum hole arrays 18
Fixing piece I21 of grid plate
Bushing plate fixing part II 22
Word-missing hole 27
Pressing board fixing piece I31
Character pressing plate fixing piece II 32
And a chip 41.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. Spatially relative terms (such as "below …", "below", "lower", "above …", "upper", and the like) may be used for ease of illustration to describe one element or component's relationship to another element or component as illustrated in the figures. Spatially relative terms may also encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The invention relates to a chip capping jig which sequentially comprises a carrier 10, a grid plate 20 and a word pressing plate 30 from bottom to top, wherein a base plate 40 is arranged between the carrier 10 and the grid plate 20, as shown in figure 8. Generally, one carrier 10 corresponds to only one substrate 40. The carrier 10, the stencil 20 and the platen 30 are shaped to conform to the shape of the substrate 40, including but not limited to round, square, and elongated shapes, but with dimensions larger than those of the substrate 40.
As shown in fig. 1 and 2, a plurality of carrier fixing members i 11 are uniformly disposed on the upper edge of the carrier 10, and the carrier fixing members i 11 include, but are not limited to, magnet blocks and buckles. The lower edge of the carrier 10 is also uniformly provided with a plurality of carrier fixing pieces II 12, and the carrier fixing pieces II 12 include but are not limited to magnet blocks and buckles. Generally, the carrier fixing member i 11 at the upper edge of the carrier 10 is symmetrically arranged with the carrier fixing member ii 12 at the lower edge of the carrier 10. The carrier fixing piece I11 and the carrier fixing piece II 12 are used for fixing the stencil 20 above the carrier fixing pieces I11 and the carrier fixing pieces II 12.
Positioning long needles 16 are arranged between the adjacent carrier fixing pieces I11 and the adjacent carrier fixing pieces II 12 of the carrier 10 and used for positioning the Chinese character bushing 20 and the pressing block 30. Generally, the positioning pins 16 are disposed at two ends of the diagonal of the carrier 10. Specifically, the long needles 16 are positioned to be disposed at the upper left and lower right of the carrier 10, and may be disposed at the lower left and upper right of the carrier 10.
The carrier 10 is provided with an array of vacuum holes 18 on its inner periphery to ensure that the substrate 40 is flat by vacuum suction. As shown in fig. 1, the four illustrated vacuum hole arrays 18 are four arrays corresponding to the substrate 40. The vacuum hole array 18 in fig. 2 is not shown.
The carrier 10 is further provided with a plurality of guiding pins 13, the guiding pins 13 are disposed on the diagonal of each vacuum hole array 18 for positioning the substrate 40, and the guiding pins 13 are indicated by 3 guiding pins 13 in fig. 1 and respectively disposed at the upper right corners of the two right vacuum hole arrays 18 and the lower centers of the two middle vacuum hole arrays 18.
As shown in fig. 3, 4 and 5, the upper and lower sides of the back surface of the stencil 20 are respectively provided with two steps, namely an outer step 24 and an inner step 25, the upper and lower inner steps 25 are fastened with the substrate 40, and an accommodating space 29 is formed between the upper and lower inner steps 25 to reserve a space for fine adjustment of the height of the adhesive 42 on the substrate 40.
The upper edge outer step 24 of the nozzle plate 20 is evenly provided with a plurality of nozzle plate fixing pieces I21, and the nozzle plate fixing pieces I21 comprise but are not limited to magnet blocks. The outer step of the lower edge of the Chinese character 'tu' plate 20 is also evenly provided with a plurality of Chinese character 'tu' plate fixing pieces II 22, and the Chinese character 'tu' plate fixing pieces II 22 comprise but are not limited to magnet blocks. Generally, the stencil fixing member I21 and the stencil fixing member II 22 of the stencil 20 are symmetrically disposed. Preferably, the stencil fixing pieces i 21 and ii 22 of the stencil 20 correspond to the carrier fixing pieces i 11 and ii 12 of the carrier 10, and are used for increasing the combining force between the carrier 10 and the stencil 20.
The positioning holes 26 are distributed on the outer steps 24 of the stencil 20, corresponding to the positioning pins 16 of the carrier 10, and have an unlimited shape. In fig. 3, the upper left positioning hole 26 is circular, and the lower right positioning hole 26 is oval, so that different shapes can avoid installation errors.
The inner step 25 of the nozzle plate 20 is further provided with a plurality of blind holes 23 corresponding to the positions of the pilot pins 13 on the carrier 10, and the blind holes are matched with the pilot pins 13 for use, as shown in fig. 5.
The inner periphery of the character-leaking plate 20 is provided with a plurality of character-leaking hole arrays, four character-leaking hole arrays are shown in fig. 3, and the character-leaking holes 27 in each character-leaking hole array are also arranged in an array corresponding to the array of the substrate 40. The cross section of each word leaking hole 27 is turtle-shaped, and the longitudinal section is trumpet-shaped, as shown in fig. 4, so that a mechanical suction pen can conveniently place the chip 41, and the chip is prevented from being damaged. The size of the escape aperture 27 is larger than the size of the chip 41 and smaller than the chip-mount area on the substrate 40.
As shown in fig. 6, 7 and 8, a plurality of platen fixing members i 31 are uniformly disposed on the upper edge of the platen 30, and the platen fixing members i 31 include, but are not limited to, magnet blocks. The lower edge of the character pressing plate 30 is also uniformly provided with a plurality of character pressing plate fixing parts II 32, and the character pressing plate fixing parts II 32 comprise but are not limited to magnet blocks. Generally, the character pressing plate fixing member i 31 of the character pressing plate 30 and the character pressing plate fixing member ii 32 of the character pressing plate 30 are symmetrically disposed to increase the coupling force between the character pressing plate 30 and the escape plate 20, as shown in fig. 8.
The positioning holes 36 are distributed on the diagonal line of the character pressing plate 30 and are consistent with the positioning holes 26 of the character bushing 20 in position, and the shape is not limited.
The back of the character pressing plate 30 is provided with a bump array, four bump arrays are shown in fig. 6, the bumps 37 in each bump array are also arranged in an array, and the bumps 37 are made of teflon. All the bumps 37 have the same thickness and correspond to the distribution of the escape holes 27 of the escape plate 20. The cross section of the projection 37 is circular, rectangular or polygonal, and the size of the cross section is smaller than the caliber of the word-missing hole 27.
The chip surface mounting process method using the chip cover pressing jig comprises the following steps:
step one, drawing adhesive in a chip mounting area of a substrate 40 by using slowly flowing adhesive 42 on a gluing machine, and controlling the adhesive output of the adhesive 42 by the gluing machine;
step two, the substrate 40 is placed above the carrier 10, the chip mounting area of the substrate 40 faces upwards, the substrate 40 is positioned on the carrier 10 through the guide pin 13, and then the vacuum equipment below the carrier 10 is opened to fix the substrate 40 on the carrier 10, as shown in fig. 2;
step three, the stencil 20 is placed above the substrate 40, and is positioned by the positioning long needles 16 on the carrier 10 and the through holes 26 on the stencil 20, and meanwhile, the bonding force between the carrier 10 and the stencil 20 is increased by the stencil fixing pieces I21 and II 22 of the stencil 20 and the carrier fixing pieces I11 and II 12 of the carrier 10, so that the stencil 20 does not move on the carrier 10, and the stencil holes 27 of the stencil 20 expose the chip mounting area of the substrate 40 and the adhesive 42 thereon;
fourthly, the mechanical arm places the chips 41 on the adhesive 42 of the chip mounting area one by one through the character-missing holes 27 of the character-missing plate 20, as shown in fig. 5;
placing the character pressing plate 30 above the character leaking plate 20, and aligning the convex block 37 with the character leaking hole 27 of the character leaking plate 20;
the character pressing plate 30 and the character dropping plate 20 are positioned through the positioning long needles 16 on the carrier 10, the through holes 36 of the character pressing plate 30 and the through holes 26 of the character dropping plate 20, and then the character pressing plate fixing pieces I31 and II 32 of the character pressing plate 30, the character dropping plate fixing pieces I21 and II 22 of the character dropping plate 20 increase the binding force between the character pressing plate 30 and the character dropping plate 20.
The character pressing plate 30 is used for pressing the convex block 37, the chip 41 is attached to the substrate 40 through the adhesive 42, after the character pressing plate is attached, appropriate pressure is applied, the sum of the thicknesses of the substrate 40, the chip 41 and the adhesive 42 is equal to the design height, namely the thickness of the substrate 40 + the thickness of the chip 41 + the thickness of the adhesive 42 = the design height, and the accommodating section 29 of the character-missing plate 20 provides a correction space for the slightly redundant adhesive 42 so as to obtain a packaging product with the consistent chip attaching height.
The number-pressing plate 30 with the different thickness of the bump 37 is replaced according to the sum of the thickness of the adhesive 42 and the chip 41, as shown in fig. 8.
And sixthly, placing the chip capping jig and the substrate 40 together in an oven for baking, and curing the adhesive 42.
And step seven, disassembling the chip gland jig and taking out the substrate 40 with the chips attached.
The die capping jig can be used for the substrate 40 or lead frame of the BGA, L GA, QFP, QFN and other packages, and the thickness of the bump 37 of the word-pressing plate 30 is determined according to the sum of the thicknesses of the substrate 40, the die 41 and the adhesive 42 required by the product.
The above-mentioned embodiments are intended to explain the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The chip capping jig is characterized by sequentially comprising a carrier (10), a character-missing plate (20) and a character-pressing plate (30) from bottom to top, wherein a substrate (40) is arranged between the carrier (10) and the character-missing plate (20), a chip mounting area of the substrate (40) faces upwards, and the shapes of the carrier (10), the character-missing plate (20) and the character-pressing plate (30) are consistent with the shape of the substrate (40);
the carrier (10) is provided with a plurality of carrier fixing pieces I (11), a plurality of carrier fixing pieces II (12), a plurality of guide pins (13), a plurality of positioning long needles (16) and a plurality of vacuum hole arrays (18), the carrier fixing pieces I (11) and the carrier fixing pieces II (12) are respectively and uniformly arranged on the upper edge and the lower edge of the carrier (10) to fix the character-dropping plate (20) above the carrier, the positioning long needles (16) are respectively arranged between the adjacent carrier fixing pieces I (11) and between the adjacent carrier fixing pieces II (12) to position the character-dropping plate (20) and the character-pressing plate (30) above the carrier, the vacuum hole arrays (18) are arranged on the inner periphery of the carrier (10) and correspond to the arrays of the base plates (40), the guide pins (13) are arranged on the diagonal lines of each vacuum hole array (18) to position the base plates (40);
the Chinese character bushing plate (20) is provided with a plurality of Chinese character bushing plate fixing parts I (21), a plurality of Chinese character bushing plate fixing parts II (22), a plurality of positioning holes 26, a plurality of blind holes (23) and a Chinese character bushing hole array, the upper side and the lower side of the back surface of the Chinese character 'yu' plate (20) are respectively provided with an outer step (24) and an inner step (25), and an accommodating section (29) for accommodating the substrate (40) is formed, the bushing plate fixing piece I (21) and the bushing plate fixing piece II (22) are respectively and uniformly arranged on the outer steps (24) of the bushing plate (20), the positioning hole (26) is arranged on the outer steps (24) of the bushing plate (20), the blind holes (23) are arranged on the inner steps (25) of the Chinese character bushing (20) corresponding to the positions of the positioning long needles (16) on the carrier (10), the position of the guide pin (13) on the carrier (10) corresponds to the position of the guide pin (13), and the guide pin (13) is matched for use;
the character leaking hole arrays are arranged on the inner periphery of the character leaking plate (20), the character leaking holes (27) in each character leaking hole array are also distributed according to the array and correspond to the chip mounting area of the substrate (40), and the size of each character leaking hole (27) is larger than that of each chip (41) and smaller than that of the chip mounting area on the substrate (40);
it presses word board mounting I (31), a plurality of to press word board mounting II (32), a plurality of locating hole (36) and lug array to be equipped with a plurality of on word board (30), press word board mounting I (31), press word board mounting II (32) and evenly set up respectively in the last edge and the lower edge of pressing word board (30), locating hole (36) distribute on pressing the diagonal line of word board (30), correspond with location long needle (16) position on carrier (10), the lug array sets up in the back of pressing word board (30), and lug (37) in every lug array also arrange according to the array, and the thickness of all lugs (37) is unanimous, and corresponds with the distribution of the hourglass word hole (27) of hourglass word board (20), and its size is less than the bore size of hourglass word hole (27).
2. The die capping jig according to claim 1, wherein the carrier fixing member i (11) includes but is not limited to a magnet block and a buckle, the carrier fixing member ii (12) includes but is not limited to a magnet block and a buckle, and the carrier fixing member i (11) and the carrier fixing member ii (12) are symmetrically arranged.
3. The die capping jig according to claim 1, wherein the first stencil holder i (21) includes but is not limited to a magnet block, the second stencil holder ii (22) includes but is not limited to a magnet block, and the first stencil holder i (21) and the second stencil holder ii (22) are symmetrically disposed.
4. The die capping jig according to claim 1, wherein the positioning long pins (16) are disposed at both ends of a diagonal line of the carrier (10).
5. The die capping jig according to claim 1, wherein the stencil fixing member i (21) and the stencil fixing member ii (22) of the stencil (20) correspond to the carrier fixing member i (11) and the carrier fixing member ii (12) of the carrier (10).
6. The die capping jig according to claim 1, wherein the bumps (37) have a circular, rectangular or polygonal cross-section.
7. The die capping jig according to claim 1, wherein the platen fixing member i (31) includes but is not limited to a magnet block, the platen fixing member ii (32) includes but is not limited to a magnet block, and the platen fixing member i (31) and the platen fixing member ii (32) of the platen (30) are symmetrically arranged.
8. The chip capping jig according to claim 1, wherein the cross section of the hourglass-shaped hole (27) is turtle-shaped, and the longitudinal section of the hourglass-shaped hole is trumpet-shaped.
9. A chip packaging method using a chip capping jig comprises the following process steps:
firstly, drawing adhesive in a chip pasting area of a substrate (40) by using slowly-flowing adhesive (42) on a gluing machine, and controlling the adhesive output of the adhesive (42) through the gluing machine;
secondly, the substrate (40) is placed above the carrier (10), the chip mounting area of the substrate (40) faces upwards, the substrate (40) is positioned on the carrier (10) through the guide pin (13), and then the vacuum equipment below the carrier (10) is opened to fix the substrate (40) on the carrier (10);
thirdly, the grid plate (20) is placed above the base plate (40) and is positioned through the positioning long needles (16) on the carrier (10) and the through holes (26) on the grid plate (20), meanwhile, the bonding force of the carrier (10) and the grid plate (20) is increased through the grid plate fixing pieces I (21) and the grid plate fixing pieces II (22) of the grid plate (20) and the carrier fixing pieces I (11) and the carrier fixing pieces II (12) of the carrier (10), the grid plate (20) is enabled not to move on the carrier (10), and the grid holes (27) of the grid plate (20) are exposed out of the chip mounting area of the base plate (40) and the adhesive (42) on the grid plate;
placing the chips (41) on the adhesive (42) of the chip mounting area one by one through the character-missing holes (27) of the character-missing plate (20) by the mechanical arm;
step five, the character pressing plate (30) is placed above the character leaking plate (20), the convex block (37) is aligned with the character leaking hole (27) of the character leaking plate (20), the character pressing plate (30) and the character leaking plate (20) are positioned through a positioning long needle (16) on the carrier (10), a through hole (36) of the character pressing plate (30) and a through hole (26) of the character leaking plate (20), the binding force between the character pressing plate (30) and the character leaking plate (20) is increased through a character pressing plate fixing piece I (31) of the character pressing plate (30), a character pressing plate fixing piece II (32) of the character pressing plate (30), a character leaking plate fixing piece I (21) and a character leaking plate fixing piece II (22) of the character leaking plate (20), the character pressing plate (30) presses a convex block (37), a chip (41) is attached to the base plate (40) through an adhesive (42), after attachment, applying proper pressure to enable the sum of the thicknesses of the substrate (40), the chip (41) and the adhesive (42) to be equal to the design height;
sixthly, placing the chip gland jig and the substrate (40) in an oven for baking, and curing the adhesive (42);
and step seven, disassembling the chip gland jig and taking out the substrate (40) with the chips attached.
10. The chip packaging method according to claim 9, wherein the thickness of the bump (37) is determined by the thickness sum of the substrate (40), the chip (41) and the adhesive (42) required by the product of the character pressing plate (30).
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116364563A (en) * | 2023-03-17 | 2023-06-30 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
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| CN108987294A (en) * | 2018-06-21 | 2018-12-11 | 上海飞骧电子科技有限公司 | Solve the problems, such as the passive device GaAs brush coating method of encapsulation excessive glue |
| CN110416134A (en) * | 2019-09-02 | 2019-11-05 | 星科金朋半导体（江阴）有限公司 | A kind of the warpage preventing jig and its application method of substrate |
| CN211507582U (en) * | 2020-04-20 | 2020-09-15 | 星科金朋半导体（江阴）有限公司 | Chip gland tool |
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2020
- 2020-04-20 CN CN202010311691.2A patent/CN111415891B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108987294A (en) * | 2018-06-21 | 2018-12-11 | 上海飞骧电子科技有限公司 | Solve the problems, such as the passive device GaAs brush coating method of encapsulation excessive glue |
| CN110416134A (en) * | 2019-09-02 | 2019-11-05 | 星科金朋半导体（江阴）有限公司 | A kind of the warpage preventing jig and its application method of substrate |
| CN211507582U (en) * | 2020-04-20 | 2020-09-15 | 星科金朋半导体（江阴）有限公司 | Chip gland tool |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116364563A (en) * | 2023-03-17 | 2023-06-30 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
| CN116364563B (en) * | 2023-03-17 | 2023-10-24 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
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