CN111343781A

CN111343781A - ESD event processing method, ESD event processing circuit and related product

Info

Publication number: CN111343781A
Application number: CN202010152486.6A
Authority: CN
Inventors: 谭伟东
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-03-06
Filing date: 2020-03-06
Publication date: 2020-06-26
Anticipated expiration: 2040-03-06
Also published as: CN111343781B

Abstract

The embodiment of the application discloses ESD event processing method, ESD event processing circuit and related products, are applied to electronic equipment, and this electronic equipment includes ESD event processing circuit, ESD event processing circuit includes mainboard and FPC platelet, be provided with treater and first connector on the mainboard, be provided with the second connector on the FPC platelet, first connector is connected the second connector, the treater includes general function input/output port GPIO, GPIO passes through PCB and walks the line connection first connector, GPIO with between the first connector PCB walks the first end that the line still connects target capacitance, target capacitance's second end ground connection is handled. By adopting the embodiment of the application, the sub-modules which are interfered can be quickly responded and processed, and the effect that the electronic equipment can automatically and quickly recover the abnormity is achieved.

Description

ESD event processing method, ESD event processing circuit and related product

Technical Field

The present application relates to the field of electronic device technologies, and in particular, to an ESD event processing method, an ESD event processing circuit, and a related product.

Background

With the rapid development of the semiconductor industry, electronic devices (such as mobile phones, tablet computers, and the like) are becoming miniaturized, multifunctional, and intelligent, and semiconductors, large-scale and ultra-large-scale integrated circuits, and high-density integrated circuits have become indispensable devices in the electronic industry and have been widely used in various electronic devices. These high-integration circuit elements may be interfered by Electro-Static discharge (ESD), which may cause a circuit to fail to turn over, resulting in locking, resetting, and data loss of the electronic device, which may affect normal operation of the device, and reduce reliability of the device. At present, electronic equipment cannot actively identify when encountering an ESD event, so that active reporting cannot be realized.

Disclosure of Invention

The embodiment of the application provides an ESD event processing method, an ESD event processing circuit and a related product, which can actively identify an ESD event and realize active reporting.

In a first aspect, an embodiment of the present application provides an ESD event processing circuit, ESD event processing circuit includes mainboard and FPC platelet, be provided with treater and first connector on the mainboard, be provided with the second connector on the FPC platelet, first connector is connected the second connector, the treater includes general function input/output port GPIO, GPIO passes through PCB and walks the line connection first connector, GPIO with between the first connector PCB is walked the first end that the line still connects target capacitance, target capacitance's second end ground connection is handled.

In a second aspect, an embodiment of the present application provides an electronic device, which includes the ESD event processing circuit according to the first aspect.

In a third aspect, an embodiment of the present application provides an ESD event processing method, which is applied to an electronic device, where the electronic device includes an ESD event processing circuit, the ESD event processing circuit includes a motherboard and a platelet, the motherboard is provided with a processor and a first connector, the platelet is provided with a second connector, the first connector is connected to the second connector, the processor includes a general purpose input/output (GPIO), the GPIO is connected to the first connector through a PCB trace, the PCB trace between the GPIO and the first connector is further connected to a first end of a target capacitor, and a second end of the target capacitor is grounded, where the method includes:

receiving an interrupt signal through a GPIO of the processor, wherein the interrupt function of the GPIO is preset to be in an edge triggering mode;

responding to the interrupt signal, and detecting whether a target function module of the electronic equipment is abnormal or not when the interrupt signal is identified to come from an ESD event, wherein the target function module is at least one function module in the electronic equipment;

and when the target function module is abnormal, restoring the target function module.

In a fourth aspect, an embodiment of the present application provides an ESD event processing apparatus applied to an electronic device, where the electronic device includes an ESD event processing circuit, the ESD event processing circuit includes a main board and a small board, the main board is provided with a processor and a first connector, the small board is provided with a second connector, the first connector is connected to the second connector, the processor includes a general purpose input/output (GPIO), the GPIO is connected to the first connector through a PCB trace, the GPIO and the PCB trace between the first connector are further connected to a first end of a target capacitor, a second end of the target capacitor is grounded, and the ESD event processing apparatus includes: a receiving unit, a detecting unit and a recovery processing unit, wherein,

the receiving unit is used for receiving an interrupt signal through a GPIO of the processor, and the interrupt function of the GPIO is preset to be in an edge triggering mode;

the detection unit is used for responding to the interrupt signal, and detecting whether a target function module of the electronic equipment is abnormal or not when the interrupt signal is identified to come from an ESD event, wherein the target function module is at least one function module in the electronic equipment;

and the recovery processing unit is used for performing recovery processing on the target function module when the target function module is abnormal.

In a fifth aspect, an embodiment of the present application provides an electronic device, including a processor, a memory, a communication interface, and the ESD event processing circuit according to the first aspect, and one or more programs, where the one or more programs are stored in the memory and configured to be executed by the processor, and the programs include instructions for executing the steps in the third aspect of the embodiment of the present application.

In a sixth aspect, the present application provides a computer-readable storage medium, where the computer-readable storage medium stores a computer program for electronic data exchange, where the computer program makes a computer perform part or all of the steps as described in the third aspect of the present application.

In a seventh aspect, this application provides a computer program product, where the computer program product includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to cause a computer to perform some or all of the steps as described in the third aspect of this application. The computer program product may be a software installation package.

It can be seen that the ESD event processing method, the ESD event processing circuit and the related product described in the embodiments of the present application are applied to an electronic device, the electronic device includes an ESD event processing circuit, the ESD event processing circuit includes a main board and a small board, the main board is provided with a processor and a first connector, the small board is provided with a second connector, the first connector is connected to the second connector, the processor includes a general purpose input/output port GPIO, the GPIO is connected to the first connector through a PCB trace, the PCB trace between the GPIO and the first connector is further connected to a first end of a target capacitor, a second end of the target capacitor is grounded, because the GPIO set by the processor can detect in time whether an ESD event occurs that interferes with the normal operation of the electronic device, therefore, the processor can quickly respond and process the interfered sub-modules, and the effect that the electronic equipment can automatically and quickly recover the abnormity is achieved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1A is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

fig. 1B is a schematic structural diagram of another electronic device provided in the embodiment of the present application;

fig. 1C is a schematic flowchart of an ESD event processing method according to an embodiment of the present application;

fig. 2 is a schematic flowchart of another ESD event handling method according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of another electronic device provided in an embodiment of the present application;

fig. 4 is a block diagram illustrating functional units of an ESD event processing apparatus according to an embodiment of the present disclosure.

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The electronic device related to the embodiments of the present application may include various handheld devices, vehicle-mounted devices, wearable devices (smart watches, smart bracelets, wireless headsets, augmented reality/virtual reality devices, smart glasses), computing devices or other processing devices connected to wireless modems, and various forms of User Equipment (UE), Mobile Stations (MS), terminal devices (terminal device), and the like, which have wireless communication functions.

In specific implementation, circuit elements with high integration of electronic equipment may be interfered by electrostatic field and electrostatic discharge (ESD), which causes a circuit to be turned over and fail, resulting in locking, resetting, and data loss of the electronic equipment, which affects normal operation of the equipment, and reduces reliability of the equipment.

The flip failure means that some logic circuits flip the originally memorized 0 or 1 state in normal operation. Such failures typically manifest as loss of information or temporary changes in function, no significant hard damage occurs, and the device automatically reverts to normal operation after an ESD event or upon re-entry of information or restart.

The root cause of the flip failure is the electromagnetic radiation of the ESD, specifically, the electrical noise (radiation electromagnetic field) due to the ESD spike current. Electrical noise (sometimes referred to as electrostatic noise) can enter the electronic device through coupling pathways such as conduction or radiation. Within the near field region of ESD, it depends mainly on capacitive or inductive coupling of the ESD source and receiver impedances. In the far field region, it depends on electromagnetic field coupling.

Taking a mobile phone as an example, currently, a mobile phone system cannot actively identify when encountering an ESD event, and only when some modules of the system are abnormal, the mobile phone system can report CPU judgment and perform recovery processing, the whole processing flow is relatively slow, and if the modules which are abnormal due to the ESD event do not have the capability of reporting CPU, the mobile phone system cannot automatically recover the ESD event, and needs manual intervention by a user, and in severe cases, the mobile phone needs to be restarted by the user to reset, so that user experience is seriously affected, therefore, the embodiment of the present application provides an ESD event processing method, which is applied to an electronic device, the electronic device includes an ESD event processing circuit, the ESD event processing circuit includes a main board and a small board, the main board is provided with a processor and a first connector, the small board is provided with a second connector, the first connector is connected with the second connector, and the processor includes a general function GPIO input/output port, the GPIO is connected with the first connector through a PCB (printed Circuit Board) wire, the PCB wire between the GPIO and the first connector is also connected with a first end of a target capacitor, and a second end of the target capacitor is grounded, and the method comprises the following steps:

Because the GPIO that the treater set up can in time detect whether the ESD incident that disturbs electronic equipment normal work takes place to, make the treater can respond fast and handle the submodule piece that is disturbed, reach electronic equipment and can resume unusual effect fast by oneself.

The following describes embodiments of the present application in detail.

Referring to fig. 1A, fig. 1A is a schematic structural diagram of an electronic device disclosed in an embodiment of the present application, the electronic device 100 includes a storage and processing circuit 110, and a sensor 170 connected to the storage and processing circuit 110, the sensor 170 includes a camera, where:

the electronic device 100 may include control circuitry, which may include storage and processing circuitry 110. The storage and processing circuitry 110 may be a memory, such as a hard drive memory, a non-volatile memory (e.g., flash memory or other electronically programmable read-only memory used to form a solid state drive, etc.), a volatile memory (e.g., static or dynamic random access memory, etc.), etc., and the embodiments of the present application are not limited thereto. Processing circuitry in storage and processing circuitry 110 may be used to control the operation of electronic device 100. The processing circuitry may be implemented based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, display driver integrated circuits, and the like.

The storage and processing circuitry 110 may be used to run software in the electronic device 100, such as an Internet browsing application, a Voice Over Internet Protocol (VOIP) telephone call application, an email application, a media playing application, operating system functions, and so forth. Such software may be used to perform control operations such as, for example, camera-based image capture, ambient light measurement based on an ambient light sensor, proximity sensor measurement based on a proximity sensor, information display functionality based on status indicators such as status indicator lights of light emitting diodes, touch event detection based on a touch sensor, functionality associated with displaying information on multiple (e.g., layered) display screens, operations associated with performing wireless communication functionality, operations associated with collecting and generating audio signals, control operations associated with collecting and processing button press event data, and other functions in the electronic device 100, to name a few.

The electronic device 100 may include input-output circuitry 150. The input-output circuit 150 may be used to enable the electronic device 100 to input and output data, i.e., to allow the electronic device 100 to receive data from an external device and also to allow the electronic device 100 to output data from the electronic device 100 to the external device. The input-output circuit 150 may further include a sensor 170. Sensor 170 may include an ambient light sensor, a proximity sensor based on light and capacitance, a fingerprint identification module, a touch sensor (e.g., based on an optical touch sensor and/or a capacitive touch sensor, where the touch sensor may be part of a touch display screen, or may be used independently as a touch sensor structure), an acceleration sensor, a camera, and other sensors, etc., the camera may be a front-facing camera or a rear-facing camera, the fingerprint identification module may be integrated below the display screen for collecting fingerprint images, the fingerprint identification module may be at least one of: optical fingerprint identification module, or ultrasonic fingerprint identification module etc. do not do the restriction here.

Input-output circuit 150 may also include one or more display screens, such as display screen 130. The display 130 may include one or a combination of liquid crystal display, organic light emitting diode display, electronic ink display, plasma display, display using other display technologies. The display screen 130 may include an array of touch sensors (i.e., the display screen 130 may be a touch display screen). The touch sensor may be a capacitive touch sensor formed by a transparent touch sensor electrode (e.g., an Indium Tin Oxide (ITO) electrode) array, or may be a touch sensor formed using other touch technologies, such as acoustic wave touch, pressure sensitive touch, resistive touch, optical touch, and the like, and the embodiments of the present application are not limited thereto.

The electronic device 100 may also include an audio component 140. The audio component 140 may be used to provide audio input and output functionality for the electronic device 100. The audio components 140 in the electronic device 100 may include a speaker, a microphone, a buzzer, a tone generator, and other components for generating and detecting sound.

The communication circuit 120 may be used to provide the electronic device 100 with the capability to communicate with external devices. The communication circuit 120 may include analog and digital input-output interface circuits, and wireless communication circuits based on radio frequency signals and/or optical signals. The wireless communication circuitry in communication circuitry 120 may include radio-frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches, filters, and antennas. For example, the wireless Communication circuitry in Communication circuitry 120 may include circuitry to support Near Field Communication (NFC) by transmitting and receiving Near Field coupled electromagnetic signals. For example, the communication circuit 120 may include a near field communication antenna and a near field communication transceiver. The communications circuitry 120 may also include a cellular telephone transceiver and antenna, a wireless local area network transceiver circuitry and antenna, and so forth.

The electronic device 100 may further include a battery, power management circuitry, and other input-output units 160. The input-output unit 160 may include buttons, joysticks, click wheels, scroll wheels, touch pads, keypads, keyboards, cameras, light emitting diodes and other status indicators, and the like.

A user may input commands through input-output circuitry 150 to control the operation of electronic device 100, and may use output data of input-output circuitry 150 to enable receipt of status information and other outputs from electronic device 100.

Further, as shown in fig. 1B, the electronic device 100 shown in fig. 1B may include an ESD event processing circuit 20, where the ESD event processing circuit 20 includes a main board 21 and an FPC platelet 22, the main board 21 is provided with a processor 211 and a first connector 212, the FPC platelet 22 is provided with a second connector 221, the first connector 212 is connected to the second connector 221, the processor 211 includes a general function input/GPIO output port 2111, the GPIO2111 is connected to the first connector 212 through a PCB trace 23, the PCB trace 23 between the GPIO2111 and the first connector 212 is further connected to a first end 241 of a target capacitor 24, and a second end 242 of the target capacitor 24 is grounded.

In one possible example, the FPC platelet is at least one of: FPC of display screen, the FPC who is used for connecting the USB socket and the FPC of antenna platelet.

In one possible example, the target capacitance is less than or equal to 100pF in size.

In one possible example, the length of the PCB trace is greater than or equal to 5 cm.

Further, the second connector 221 may be used to connect the FPC trace 222.

In the specific implementation, a GPIO with an interrupt function can be selected from a CPU of the electronic equipment, a wiring is led out, a small capacitor is connected in parallel to the ground, the other end (242) of the wiring is suspended (grounded), and the wiring can be distributed on an FPC (flexible printed circuit) platelet connected with the inside of the electronic equipment, such as an FPC (flexible printed circuit) of a display screen, an FPC connected with a USB (universal serial bus) socket, an FPC of an antenna platelet and the like.

In the specific implementation, the radiation field principle of static electricity is as follows: the electrostatic radiation field is a radiation magnetic field generated by electrostatic current, and the magnetic fields generated by contact discharge and air discharge are different. According to the test, a human body-metal model is adopted, and the waveform and the spectrogram of an electrostatic radiation field during contact discharge are analyzed, so that the conclusion can be obtained that the waveform of the radiation field is a typical decaying ringing signal, the oscillation duration is about 500ns, the peak field intensity is 150V/m, the spectrogram contains frequency components of 0-250 MHz, and the central frequency is about 40 MHz.

In addition, the following conclusion can be reached by analyzing the waveform and the spectrogram of the electrostatic radiation field during air discharge: the air discharge radiation field waveform of the human body-metal model is similar to that of contact discharge, the waveforms are attenuated ringing signal waveforms, the positive peak field intensity is 200V/m, the frequency spectrum is distributed in 0-130 MHz, the central frequency is about 28MHz, and a plurality of frequency doubling radiation fields exist.

In the embodiment of the application, according to the radiation field principle of electrostatic discharge, a section of PCB long wiring (greater than or equal to 5cm) is utilized to generate the effect similar to an antenna, the interference energy radiated by the electrostatic discharge is received, the long wiring is connected to the specific GPIO of the CPU, the CPU can detect the fluctuation of the level at the moment to generate an interrupt signal, and then the ESD event can be processed through software setting, so that when the electronic equipment is subjected to electrostatic interference, the normal use operation of a user is not influenced.

Referring to fig. 1C, fig. 1C is a schematic flow chart of an ESD event processing method provided in an embodiment of the present application, and as shown in the drawing, the ESD event processing method is applied to an electronic device shown in fig. 1A or fig. 1B, where the electronic device includes an ESD event processing circuit, the ESD event processing circuit includes a main board and a small board, the main board is provided with a processor and a first connector, the small board is provided with a second connector, the first connector is connected to the second connector, the processor includes a general purpose input/output (GPIO), the GPIO is connected to the first connector through a PCB trace, the PCB trace between the GPIO and the first connector is further connected to a first end of a target capacitor, and a second end of the target capacitor is grounded, and the ESD event processing method includes:

101. and receiving an interrupt signal through a GPIO of the processor, wherein the interrupt function of the GPIO is preset to be in an edge triggering mode.

In the embodiment of the application, the interrupt function of the GPIO is preset to be in an edge-triggered manner, so that an ESD event can be sensitively detected. When an ESD event occurs, the electronic device may receive an interrupt signal through a GPIO of the processor. The interrupt signal may be generated by level fluctuation caused by the ESD interference. The first connector and the second connector are both BTB connectors.

102. And responding to the interrupt signal, and detecting whether a target function module of the electronic equipment is abnormal or not when the interrupt signal is identified to come from an ESD event, wherein the target function module is at least one function module in the electronic equipment.

In a specific implementation, the electronic device may respond to an interrupt signal, identify the interrupt signal, and detect whether a target function module of the electronic device is abnormal when the interrupt signal is identified to be from an ESD event, where the target function module may be one or more modules, and the target function module may be at least one of the following: camera module, display screen module, USB socket module, antenna module, fingerprint identification module, iris identification module etc. do not limit herein.

103. And when the target function module is abnormal, restoring the target function module.

In specific implementation, when the target function module is abnormal, the electronic device can recover the target function module, so that the target function module can work normally.

In the specific implementation, taking a mobile phone as an example, through early-stage testing, the ESD more than 4KV is discharged through contact or air discharge to the mobile phone shell.

In one possible example, the interrupt signal carries a target signal strength value; the method can also comprise the following steps:

and when the target signal intensity value is larger than a preset threshold value, executing the step of detecting whether a target function module of the electronic equipment is abnormal or not.

Wherein, the preset threshold value can be set by the user or the default of the system. The interrupt signal may carry a target signal intensity value, where the target signal intensity value is used to reflect an interference intensity of the ESD event, and when the target signal intensity is greater than a preset threshold, it may be considered that the ESD event may affect the electronic device, and when the target signal intensity value is less than or equal to the preset threshold, it may be considered that the ESD event may not affect the electronic device or affect the electronic device very little, and then the electronic device may not be subjected to abnormal detection, which is beneficial to reducing power consumption of the device.

In one possible example, the step 102 of detecting whether the target function module of the electronic device is abnormal may include the following steps:

21. determining the target function module corresponding to the target signal strength value according to a mapping relation between a preset signal strength value and the function module;

22. and detecting whether the target function module is abnormal or not.

The electronic equipment can pre-store the mapping relation between the preset signal intensity value and the functional modules, namely different signal intensities, and then show that the ESD event interference intensities are different, the affected functional modules are different, and then the electronic equipment can determine the target functional module corresponding to the target signal intensity value according to the mapping relation between the preset signal intensity value and the functional modules, and detect whether the target functional module is abnormal or not, so that the abnormal module can be detected in a targeted manner, and the detection efficiency is favorably improved.

In one possible example, when the target function module is a plurality of function modules, the step 22 of detecting whether the target function module is abnormal may include the following steps:

221. determining the use frequency of each functional module in the plurality of functional modules to obtain a plurality of use frequencies;

222. determining a detection priority according to the plurality of using frequencies;

223. and carrying out abnormity detection on the plurality of functional modules according to the detection priority.

In the specific implementation, since the use frequencies of each function module are different, for example, the display module may be used for displaying, and the camera module may be used for photographing, the electronic device may determine the use frequency of each function module in the plurality of function modules to obtain a plurality of use frequencies, determine the detection priority according to the plurality of use frequencies, and perform anomaly detection on the plurality of function modules according to the detection priority, so that the function modules with high use frequencies can be preferentially detected to realize anomaly detection, and the function modules with high use frequencies can be preferentially recovered.

It can be seen that the ESD event processing method described in this embodiment of the present application is applied to an electronic device, the electronic device includes an ESD event processing circuit, the ESD event processing circuit includes a motherboard and a platelet, the motherboard is provided with a processor and a first connector, the platelet is provided with a second connector, the first connector is connected to the second connector, the processor includes a general purpose input/output (GPIO), the GPIO is connected to the first connector through a PCB trace, the PCB trace between the GPIO and the first connector is further connected to a first end of a target capacitor, and a second end of the target capacitor is grounded.

Referring to fig. 2, fig. 2 is a schematic flow chart of an ESD event processing method according to an embodiment of the present application, and as shown in the figure, the ESD event processing method is applied to an electronic device shown in fig. 1A or fig. 1B, where the electronic device includes an ESD event processing circuit, the ESD event processing circuit includes a main board and a small board, the main board is provided with a processor and a first connector, the small board is provided with a second connector, the first connector is connected to the second connector, the processor includes a general purpose input/output port GPIO, the GPIO is connected to the first connector through a PCB trace, the PCB trace between the GPIO and the first connector is further connected to a first end of a target capacitor, and a second end of the target capacitor is grounded, where the ESD event processing method includes:

201. and receiving an interrupt signal through a GPIO of the processor, wherein the interrupt function of the GPIO is preset to be in an edge triggering mode, and the interrupt signal carries a target signal strength value.

202. Responding to the interrupt signal, and when the interrupt signal is identified to come from an ESD event and the target signal strength value is greater than a preset threshold value, determining the target function module corresponding to the target signal strength value according to a mapping relation between a preset signal strength value and function modules, wherein the target function module is at least one function module in the electronic equipment.

203. And detecting whether the target function module is abnormal or not.

204. And when the target function module is abnormal, restoring the target function module.

For the detailed description of the steps 201 to 204, reference may be made to the corresponding steps of the ESD event processing method described in the above fig. 1C, which are not described herein again.

It can be seen that, in the ESD event processing method described in this embodiment of the application, since the GPIO set by the processor can detect in time whether an ESD event that interferes with the normal operation of the electronic device occurs, the processor can quickly respond and process the interfered sub-modules, and the electronic device can automatically and quickly recover from an abnormality.

In accordance with the foregoing embodiment, please refer to fig. 3, where fig. 3 is a schematic structural diagram of an electronic device provided in an embodiment of the present application, and as shown in the drawing, the electronic device includes a processor, an ESD event processing circuit, a memory, a communication interface, and one or more programs, the ESD event processing circuit includes a motherboard and a platelet, a processor and a first connector are disposed on the motherboard, a second connector is disposed on the platelet, the first connector is connected to the second connector, the processor includes a general purpose input/output GPIO, the GPIO is connected to the first connector through a PCB trace, the PCB trace between the GPIO and the first connector is further connected to a first end of a target capacitor, and a second end of the target capacitor is grounded, where the one or more programs are stored in the memory, and configured to be executed by the processor, in an embodiment of the present application, the program includes instructions for performing the steps of:

It can be seen that, the electronic device described in this embodiment of the application, the electronic device includes an ESD event processing circuit, the ESD event processing circuit includes a main board and a small board, a processor and a first connector are disposed on the main board, a second connector is disposed on the small board, the first connector is connected to the second connector, the processor includes a general purpose input/output (GPIO), the GPIO is connected to the first connector through a PCB trace, a PCB trace between the GPIO and the first connector is further connected to a first end of a target capacitor, and a second end of the target capacitor is grounded.

In one possible example, the interrupt signal carries a target signal strength value; the program further includes instructions for performing the steps of:

In one possible example, in the detecting whether the target function module of the electronic device is abnormal, the program includes instructions for performing the following steps:

determining the target function module corresponding to the target signal strength value according to a mapping relation between a preset signal strength value and the function module;

and detecting whether the target function module is abnormal or not.

The processor of the electronic device shown in fig. 3 and the processor of the ESD event processing circuit are the same processor or different processors.

The above description has introduced the solution of the embodiment of the present application mainly from the perspective of the method-side implementation process. It is understood that the electronic device comprises corresponding hardware structures and/or software modules for performing the respective functions in order to realize the above-mentioned functions. Those of skill in the art will readily appreciate that the present application is capable of hardware or a combination of hardware and computer software implementing the various illustrative elements and algorithm steps described in connection with the embodiments provided herein. Whether a function is performed as hardware or computer software drives hardware depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In the embodiment of the present application, the electronic device may be divided into the functional units according to the method example, for example, each functional unit may be divided corresponding to each function, or two or more functions may be integrated into one processing unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit. It should be noted that the division of the unit in the embodiment of the present application is schematic, and is only a logic function division, and there may be another division manner in actual implementation.

Fig. 4 is a block diagram showing functional units of an ESD event processing apparatus 400 according to an embodiment of the present application. This ESD event processing apparatus 400 is applied to electronic equipment, the electronic equipment includes ESD event processing circuit, ESD event processing circuit includes mainboard and platelet, be provided with treater and first connector on the mainboard, be provided with the second connector on the platelet, first connector connects the second connector, the treater includes general function input/output port GPIO, GPIO is walked the line through PCB and is connected first connector, GPIO with between the first connector PCB is walked the line and is still connected the first end of target capacitance, the second end ground connection of target capacitance is handled, ESD event processing apparatus includes: a receiving unit 401, a detecting unit 402, and a recovery processing unit 403, wherein,

the receiving unit 401 is configured to receive an interrupt signal through a GPIO of the processor, where an interrupt function of the GPIO is preset to be in an edge-triggered manner;

the detecting unit 402 is configured to detect whether a target function module of the electronic device is abnormal in response to the interrupt signal when the interrupt signal is identified to be from an ESD event, where the target function module is at least one function module in the electronic device;

the recovery processing unit 403 is configured to perform recovery processing on the target function module when the target function module is abnormal.

It can be seen that, the ESD event processing apparatus described in this embodiment of the present application is applied to an electronic device, the electronic device includes an ESD event processing circuit, the ESD event processing circuit includes a main board and a small board, a processor and a first connector are disposed on the main board, a second connector is disposed on the small board, the first connector is connected to the second connector, the processor includes a general purpose input/output (GPIO), the GPIO is connected to the first connector through a PCB trace, a PCB trace between the GPIO and the first connector is further connected to a first end of a target capacitor, and a second end of the target capacitor is grounded.

In one possible example, the interrupt signal carries a target signal strength value; the detecting unit 402 is specifically configured to:

In one possible example, in the aspect of detecting whether the target function module of the electronic device is abnormal, the detecting unit 402 is specifically configured to:

and detecting whether the target function module is abnormal or not.

Embodiments of the present application also provide a computer storage medium, where the computer storage medium stores a computer program for electronic data exchange, the computer program enabling a computer to execute part or all of the steps of any one of the methods described in the above method embodiments, and the computer includes an electronic device.

Embodiments of the present application also provide a computer program product comprising a non-transitory computer readable storage medium storing a computer program operable to cause a computer to perform some or all of the steps of any of the methods as described in the above method embodiments. The computer program product may be a software installation package, the computer comprising an electronic device.

It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present application is not limited by the order of acts described, as some steps may occur in other orders or concurrently depending on the application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and modules referred to are not necessarily required in this application.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the above-described embodiments of the apparatus are merely illustrative, and for example, the above-described division of the units is only one type of division of logical functions, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of some interfaces, devices or units, and may be an electric or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated unit may be stored in a computer readable memory if it is implemented in the form of a software functional unit and sold or used as a stand-alone product. Based on such understanding, the technical solution of the present application may be substantially implemented or a part of or all or part of the technical solution contributing to the prior art may be embodied in the form of a software product stored in a memory, and including several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the above-mentioned method of the embodiments of the present application. And the aforementioned memory comprises: a U-disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic or optical disk, and other various media capable of storing program codes.

Those skilled in the art will appreciate that all or part of the steps in the methods of the above embodiments may be implemented by associated hardware instructed by a program, which may be stored in a computer-readable memory, which may include: flash Memory disks, Read-Only memories (ROMs), Random Access Memories (RAMs), magnetic or optical disks, and the like.

The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. The ESD event processing circuit is characterized by comprising a main board and an FPC (flexible printed circuit) platelet, wherein a processor and a first connector are arranged on the main board, a second connector is arranged on the FPC platelet, the first connector is connected with the second connector, the processor comprises a general function input/output (GPIO), the GPIO is connected with the first connector through a PCB (printed circuit board) wire, the PCB wire between the GPIO and the first connector is further connected with a first end of a target capacitor, and a second end of the target capacitor is grounded.

2. An ESD event handling circuit according to claim 1, wherein the FPC platelet is at least one of: FPC of display screen, the FPC who is used for connecting the USB socket and the FPC of antenna platelet.

3. An ESD event handling circuit according to claim 1 or 2, wherein the target capacitance is less than or equal to 100pF in size.

4. The ESD event handling circuit of any of claims 1-3, wherein the length of the PCB trace is greater than or equal to 5 cm.

5. An electronic device, characterized in that the electronic device comprises an ESD event handling circuit according to any of claims 1-4.

6. An ESD event processing method is applied to an electronic device, the electronic device includes an ESD event processing circuit, the ESD event processing circuit includes a main board and a small board, a processor and a first connector are arranged on the main board, a second connector is arranged on the small board, the first connector is connected with the second connector, the processor includes a general purpose input/output (GPIO) port, the GPIO is connected with the first connector through a Printed Circuit Board (PCB) wire, the PCB wire between the GPIO and the first connector is further connected with a first end of a target capacitor, and a second end of the target capacitor is grounded, the method includes:

7. The method of claim 6, wherein the interrupt signal carries a target signal strength value; the method further comprises the following steps:

8. The method according to claim 6 or 7, wherein the detecting whether the target function module of the electronic device is abnormal comprises:

and detecting whether the target function module is abnormal or not.

9. The ESD event processing device is characterized in that the ESD event processing device is applied to electronic equipment, the electronic equipment comprises an ESD event processing circuit, the ESD event processing circuit comprises a main board and a small board, a processor and a first connector are arranged on the main board, a second connector is arranged on the small board, the first connector is connected with the second connector, the processor comprises a general function input/output port GPIO, the GPIO is connected with the first connector through a PCB (printed circuit board) wire, the PCB wire between the GPIO and the first connector is further connected with a first end of a target capacitor, and a second end of the target capacitor is grounded, and the ESD event processing device comprises: a receiving unit, a detecting unit and a recovery processing unit, wherein,

10. An electronic device comprising a processor, a memory and the ESD event processing circuit of any of claims 1-4, the memory for storing one or more programs and configured to be executed by the processor, the programs comprising instructions for performing the steps in the method of any of claims 6-8.

11. A computer-readable storage medium, characterized in that a computer program for electronic data exchange is stored, wherein the computer program causes a computer to perform the method according to any of the claims 6-8.