CN111283345A - Solder ball structure, solder and manufacturing method - Google Patents
Solder ball structure, solder and manufacturing method Download PDFInfo
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- CN111283345A CN111283345A CN202010256696.XA CN202010256696A CN111283345A CN 111283345 A CN111283345 A CN 111283345A CN 202010256696 A CN202010256696 A CN 202010256696A CN 111283345 A CN111283345 A CN 111283345A
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- Prior art keywords
- layer
- inner core
- solder
- core layer
- substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a solder ball structure, which comprises an inner core layer, a substrate layer arranged outside the inner core layer and a solder layer arranged outside the substrate layer, wherein the substrate layer is used for forming a substrate deposited on the surface of the inner core layer during welding, the inner core layer is an elastomer, the melting temperature of the inner core layer is T1, the melting temperature of the solder layer is T2, delta T is T1-T2, and delta T is more than or equal to 30 ℃. The invention has excellent anti-falling capability.
Description
Technical Field
The invention relates to the technical field of BGA welding, in particular to a solder ball structure, solder and a manufacturing method.
Background
The rapid development of integrated circuit fabrication and the growing market demand for faster, lighter, smaller, cheaper, high performance and low cost packaged electronic products has led to an increasing demand for BGA solder balls for flip chip technology.
The current BGA solder balls mainly include the following:
1. a single solder ball, which is a BGA solder ball formed from a single solder alloy, such as SAC305, Sn63Pb37, or the like. The solder balls are combined by the solder alloys with the same components, so that the condition of collapse can occur in the process of forming solder joints by reflow, so that the height of each solder joint is inconsistent, and the soldering performance is influenced.
2. Copper core balls, which are BGA solder balls with a core of copper balls and an outer cladding of solder alloy, for example, CN105873716A discloses a Cu core ball. The copper core ball solves the problem that a single solder ball collapses in multiple reflow fusion, but because the rigidity of the copper core is very high, the anti-falling capability of a welding point formed by the solder ball is poor.
Disclosure of Invention
The invention provides a solder ball structure, solder and a manufacturing method, which have excellent anti-falling capability.
The invention provides a solder ball structure, which comprises an inner core layer, a substrate layer arranged outside the inner core layer and a solder layer arranged outside the substrate layer, wherein the substrate layer is used for forming a substrate deposited on the surface of the inner core layer during welding, the inner core layer is an elastomer, the melting temperature of the inner core layer is T1, the melting temperature of the solder layer is T2, delta T is T1-T2, and delta T is more than or equal to 30 ℃.
Furthermore, a conducting layer and a barrier layer are arranged between the brazing filler metal layer and the substrate layer, the conducting layer is arranged in the inner layer of the barrier layer, the conducting layer is used for providing rigidity and conductivity during welding, and the barrier layer is used for spacing the conducting layer and the brazing filler metal layer.
Further, the composition of the substrate layer comprises a polymer material.
The invention also provides a solder, and the solder adopts the solder ball structure.
The invention provides a method for manufacturing a solder ball, which comprises the following steps:
providing a spherical inner core layer, wherein the inner core layer is an elastomer;
plating a base layer on the inner core layer, wherein the base layer is used for forming a base deposited on the surface of the inner core layer during welding;
plating a brazing filler metal layer on the substrate layer;
the melting temperature of the inner core layer is T1, the melting temperature of the solder layer is T2, delta T is T1-T2, and delta T is more than or equal to 30 ℃.
The invention provides a method for manufacturing a solder ball, which comprises the following steps:
providing a spherical inner core layer, wherein the inner core layer is an elastomer;
plating a base layer on the inner core layer, wherein the base layer is used for forming a base deposited on the surface of the inner core layer during welding; (ii) a
Plating a conductive layer on the substrate layer, wherein the conductive layer is used for providing rigidity and conductivity during welding;
plating a barrier layer on the conducting layer;
plating a brazing filler metal layer on the barrier layer, and isolating the brazing filler metal layer and the conducting layer through the barrier layer;
the melting temperature of the inner core layer is T1, the melting temperature of the solder layer is T2, delta T is T1-T2, and delta T is more than or equal to 30 ℃.
The solder ball structure provided by the invention adopts the elastomer inner core, and the melting temperature of the inner core is at least 30 ℃ higher than that of the solder layer. When the welding, the brazing filler metal layer melts, and the inner core layer does not melt, and the inner core can act as the spacer between chip and the circuit board, and the inner core elastomer can play the effect that the support solder joint does not collapse for the constant distance of chip and circuit board ensures the uniform height of each solder joint when the encapsulation, and when the product falls, the inner core can play the cushioning effect, and release solder ball stress compares in copper inner core solder ball and single solder ball, has excellent anti ability of falling.
Drawings
Fig. 1 shows a solder ball structure according to a first embodiment of the present invention.
Fig. 2 shows a solder ball structure according to a second embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention. It is to be understood that the drawings are provided solely for the purposes of reference and illustration and are not intended as a definition of the limits of the invention. The connection relationships shown in the drawings are for clarity of description only and do not limit the manner of connection.
In a solder ball structure according to a first embodiment of the present invention, as shown in fig. 1, the solder ball has an inner core layer 10, a base layer 20 disposed outside the inner core layer 10, and a solder layer 50 disposed outside the base layer.
The inner core layer 10 is an elastomer, the melting temperature of the inner core layer 10 is T1, the melting temperature of the solder layer 50 is T2, and the temperature is T1-T2, wherein the temperature is not less than 30 ℃.
Preferably, the diameter of the inner core layer 10 is 30-1000um, which meets the BGA soldering size requirement. Preferably, the elastomer includes a high molecular material such as a styrene cross-linked copolymer, a divinylbenzene cross-linked copolymer, a fluororubber, and the like. The solder layer 50 is selected according to different soldering conditions and requirements (such as soldering temperature, etc.), and elemental tin or binary alloys of tin (such as Sn63Pb37, Sn42Bi58, Sn52In48, etc.) or ternary alloys of tin (such as sn96.5ag3cu0.5, Sn50Pb47Ag3, etc.) and the like can be used.
The substrate layer 20 is used for forming a substrate deposited on the surface of the inner core layer during welding. The base layer 20 is a nickel layer, such as pure nickel or Ni-P or Ni-Pd, that can be deposited on the surface of various materials to provide a highly adherent base for the solder layer 50 for improved soldering.
A solder ball structure according to a second embodiment of the present invention, as shown in fig. 2, is different from the first embodiment in that: the solder layer 50 and the substrate layer 20 further include a conductive layer 30 and a barrier layer 40, and the conductive layer 30 is located in an inner layer of the barrier layer 40.
The conductive layer 30 is used for providing certain rigidity and conductivity during welding, the inner core layer 10 is an elastic body, the Young modulus of the elastic body is smaller than that of a copper inner core, the conductive layer 30 with certain rigidity and guidance is added, rigid support can be provided beneficially, heat conducting performance can be increased properly, and high-melting-point conductive metals such as gold, silver, copper and the like are selected as the conductive layer 30.
The barrier layer 40 is used to space the conductive layer 30 and the solder layer 50, and the barrier layer 40 is preferably a nickel layer. The interdiffusion of atoms occurs between the interfaces of dissimilar materials, and slow migration of atoms occurs even in the solid state, so that if the solder layer 50 is in direct contact with the conductive layer 30, intermetallic compounds are formed between the interfaces of the solder layer and the conductive layer, excessive intermetallic compound formation greatly affects the material properties, and nickel has relatively lower solubility in tin and slower diffusion rate, so that the interface diffusion between the inner layer and the solder layer 50 can be prevented from affecting the solder-bonding properties.
The following specific examples and comparative examples are given.
The above examples and comparative examples were soldered to BGA pads using the same flux, ball pushing tests were performed, shear strengths of various solder ball solders were tested (10 data per set, averaged), and board level drop tests were performed according to JEDEC specifications (JESD22-B111 hand-held electronic device board level drop test method).
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. The solder ball structure is characterized by comprising an inner core layer, a substrate layer arranged outside the inner core layer and a solder layer arranged outside the substrate layer, wherein the substrate layer is used for forming a substrate deposited on the surface of the inner core layer during welding, the inner core layer is an elastomer, the melting temperature of the inner core layer is T1, the melting temperature of the solder layer is T2, the delta T is T1-T2, and the delta T is not less than 30 ℃.
2. The solder ball structure of claim 1, further comprising a conductive layer and a barrier layer between the solder layer and the substrate layer, the conductive layer being located within the barrier layer, the conductive layer providing rigidity and conductivity during soldering, and the barrier layer spacing the conductive layer and the solder layer.
3. Solder ball structure according to claim 1 or 2, characterized in that the composition of the base layer comprises a polymeric material.
4. A solder, characterized in that the solder adopts a solder ball structure according to any one of claims 1 to 3.
5. A method for manufacturing solder balls is characterized by comprising the following steps:
providing a spherical inner core layer, wherein the inner core layer is an elastomer;
plating a base layer on the inner core layer, wherein the base layer is used for forming a base deposited on the surface of the inner core layer during welding;
plating a brazing filler metal layer on the substrate layer;
the melting temperature of the inner core layer is T1, the melting temperature of the solder layer is T2, delta T is T1-T2, and delta T is more than or equal to 30 ℃.
6. A method for manufacturing solder balls is characterized by comprising the following steps:
providing a spherical inner core layer, wherein the inner core layer is an elastomer;
plating a base layer on the inner core layer, wherein the base layer is used for forming a base deposited on the surface of the inner core layer during welding; (ii) a
Plating a conductive layer on the substrate layer, wherein the conductive layer is used for providing rigidity and conductivity during welding;
plating a barrier layer on the conducting layer;
plating a brazing filler metal layer on the barrier layer, and isolating the brazing filler metal layer and the conducting layer through the barrier layer;
the melting temperature of the inner core layer is T1, the melting temperature of the solder layer is T2, delta T is T1-T2, and delta T is more than or equal to 30 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010256696.XA CN111283345A (en) | 2020-04-02 | 2020-04-02 | Solder ball structure, solder and manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010256696.XA CN111283345A (en) | 2020-04-02 | 2020-04-02 | Solder ball structure, solder and manufacturing method |
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| CN111283345A true CN111283345A (en) | 2020-06-16 |
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| CN202010256696.XA Pending CN111283345A (en) | 2020-04-02 | 2020-04-02 | Solder ball structure, solder and manufacturing method |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007125610A (en) * | 2005-11-02 | 2007-05-24 | Akemichi Takizawa | Thermosetting plastic-made solder ball |
| CN101091224A (en) * | 2004-12-30 | 2007-12-19 | 东部Hitek株式会社 | Plastic conductive particles and manufacturing method thereof |
| CN102672365A (en) * | 2011-03-07 | 2012-09-19 | 三星半导体(中国)研究开发有限公司 | Solder ball and manufacturing method thereof |
| CN102867797A (en) * | 2011-07-07 | 2013-01-09 | 廖永丰 | Solder ball structure by electronic packaging |
| CN104916610A (en) * | 2014-03-10 | 2015-09-16 | 三星电机株式会社 | Solder ball and circuit board including the same |
| CN104937675A (en) * | 2013-02-28 | 2015-09-23 | 积水化学工业株式会社 | Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure |
| KR101979896B1 (en) * | 2018-07-20 | 2019-05-17 | 주식회사 엠시스 | Nonmetal cored solder ball, Manufacturing method thereof, and Electron package including therof |
| CN110325320A (en) * | 2017-02-28 | 2019-10-11 | 千住金属工业株式会社 | Welding material, soldering paste, foam solder and solder joints |
-
2020
- 2020-04-02 CN CN202010256696.XA patent/CN111283345A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101091224A (en) * | 2004-12-30 | 2007-12-19 | 东部Hitek株式会社 | Plastic conductive particles and manufacturing method thereof |
| JP2007125610A (en) * | 2005-11-02 | 2007-05-24 | Akemichi Takizawa | Thermosetting plastic-made solder ball |
| CN102672365A (en) * | 2011-03-07 | 2012-09-19 | 三星半导体(中国)研究开发有限公司 | Solder ball and manufacturing method thereof |
| CN102867797A (en) * | 2011-07-07 | 2013-01-09 | 廖永丰 | Solder ball structure by electronic packaging |
| CN104937675A (en) * | 2013-02-28 | 2015-09-23 | 积水化学工业株式会社 | Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure |
| CN104916610A (en) * | 2014-03-10 | 2015-09-16 | 三星电机株式会社 | Solder ball and circuit board including the same |
| CN110325320A (en) * | 2017-02-28 | 2019-10-11 | 千住金属工业株式会社 | Welding material, soldering paste, foam solder and solder joints |
| KR101979896B1 (en) * | 2018-07-20 | 2019-05-17 | 주식회사 엠시스 | Nonmetal cored solder ball, Manufacturing method thereof, and Electron package including therof |
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Application publication date: 20200616 |
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