CN111275154A - Full-die-cutting ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof - Google Patents

Full-die-cutting ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof Download PDF

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Publication number
CN111275154A
CN111275154A CN202010050631.XA CN202010050631A CN111275154A CN 111275154 A CN111275154 A CN 111275154A CN 202010050631 A CN202010050631 A CN 202010050631A CN 111275154 A CN111275154 A CN 111275154A
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antenna
layer
die cutting
die
cutting
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CN111275154B (en
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黄光伟
黄金良
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Aerials (AREA)

Abstract

The invention provides a full-die-cut ultrahigh frequency electronic tag antenna, and processing equipment and a processing technology thereof, wherein the full-die-cut ultrahigh frequency electronic tag antenna comprises an antenna body and is characterized in that: the antenna body is provided with chip binding positioning points formed by a die cutting mode and chip binding points formed by the die cutting mode. The invention solves the problem of how to avoid using an etching process to produce the chip binding point and the chip binding positioning point of the ultrahigh frequency electronic tag antenna in the prior art.

Description

Full-die-cutting ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof
Technical Field
The invention relates to the technical field of electronic tags, in particular to a full-die-cut ultrahigh frequency electronic tag antenna and processing equipment and a processing technology thereof.
Background
At present, the chip binding point and the chip binding positioning point of the ultrahigh frequency electronic tag antenna are still produced by adopting an etching process, and the etching process needs chemical substances such as hydrochloric acid and the like, so that the environment is greatly influenced, and the problem that how to avoid producing the chip binding point and the chip binding positioning point of the ultrahigh frequency electronic tag antenna by adopting the etching process is urgently to be solved is solved.
In addition, how to completely avoid the problem of using the etching process in the production process of the ultrahigh frequency electronic tag antenna also becomes a problem to be solved urgently
Disclosure of Invention
The invention aims to provide a full-die-cut ultrahigh frequency electronic tag antenna, and processing equipment and a processing technology thereof, and mainly solves the problems in the prior art that: how to avoid applying the etching process to produce the chip binding point and the chip binding point of the ultrahigh frequency electronic tag antenna is called the problem to be solved urgently, and the second problem is: the problem of how to completely avoid the application of an etching process in the production process of the ultrahigh frequency electronic tag antenna is solved, and the full-die-cut ultrahigh frequency electronic tag antenna, the processing equipment and the processing process are provided.
In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a hyperfrequency electronic tags antenna of full cross cutting, includes the antenna body, its characterized in that: the antenna body is provided with chip binding positioning points formed by a die cutting mode and chip binding points formed by the die cutting mode.
Further, the peripheral edge of the antenna body is formed by die cutting.
Further, the antenna body is also provided with an antenna hole formed in a die cutting mode.
Further, the chip binding points are two, the antenna hole is one, and a gap formed between the chip binding points is communicated with the antenna hole and the outside of the antenna.
Further, the die cutting mode is flat pressing die cutting and/or circular knife die cutting; the antenna comprises an antenna body and is characterized in that a first base material layer or a first base material layer and a second base material layer are further pasted on one side of the antenna layer of the antenna body, the first base material layer is a mylar, and the second base material layer is a mylar or paper.
The utility model provides a processing equipment of hyperfrequency electronic tags antenna of full cross cutting, is including being used for the cross cutting chip to bind the first die cutting mechanism of setpoint and chip binding point, its characterized in that: the first die cutting mechanism consists of a flat-press die cutting mechanism, and the flat-press die cutting mechanism is a flat-press die cutting machine comprising at least one die cutting tool for flat-press die cutting of chip binding positioning points and chip binding points;
or the first die-cutting mechanism consists of a circular knife die-cutting mechanism, and the circular knife die-cutting mechanism is a circular knife die-cutting machine comprising at least one rolling cutter for die-cutting a chip binding positioning point and a chip binding point by a circular knife;
or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat-pressing die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting cutter used for flat-pressing die cutting chip binding positioning points or chip binding points and at least one hob cutter used for circular cutter die cutting chip binding points or chip binding positioning points.
Further, the processing equipment further comprises a second die cutting mechanism for die cutting the peripheral edge of the antenna body, wherein the second die cutting mechanism is a flat pressing die cutting machine for flat pressing the peripheral edge of the antenna body or a circular knife die cutting machine for circular knife die cutting the peripheral edge of the antenna body.
Further, the first die cutting mechanism for die cutting the chip binding positioning points and the chip binding points and the second die cutting mechanism for die cutting the peripheral edge of the antenna body are combined into a flat press die cutting machine or a circular knife die cutting machine.
Further, the processing equipment further comprises an antenna hole processing mechanism for die-cutting the antenna hole, wherein the antenna hole processing mechanism is a flat-pressing die-cutting machine and an antenna hole waste collecting device for flat-pressing the die-cutting antenna hole, or the antenna hole processing mechanism is a circular knife die-cutting machine and an antenna hole waste collecting device for circular knife die-cutting the antenna hole.
Furthermore, the processing equipment further comprises a first unreeling mechanism for unreeling the antenna layer to be processed or the antenna layer to be processed which is compounded with the first substrate layer, a coating mechanism for coating an adhesive on one side of the antenna layer to be processed or one side of the first substrate layer which is not adhered with the antenna layer, a second unreeling mechanism for unreeling the second substrate layer, a compounding mechanism for compounding the second substrate layer and the antenna layer to be processed or a part of the antenna layer to be processed which is compounded with the second substrate layer and the antenna layer to be processed which is compounded with the first substrate layer, a waste discharging and reeling mechanism for reeling the processed waste antenna or reeling the processed waste antenna and the waste first substrate layer, a third unreeling mechanism for unreeling the isolation layer on the antenna layer, and a finished product reeling mechanism for reeling the processed antenna layer, the isolation layer and the finished product;
the antenna layer of the composite second base material layer or the antenna layer of the composite second base material layer output by the composite mechanism enter the input port of the first die-cutting mechanism and then enter the input port of the second die-cutting mechanism from the output port of the first die-cutting mechanism, and the output port of the second die-cutting mechanism is processed by flat-pressing die-cutting and/or circular knife die-cutting and then compounded with the antenna layer of the second base material layer Or the antenna layer is output after flat pressing die cutting and/or circular knife die cutting and is compounded with the first substrate layer and the second substrate layer, wherein the waste antenna after flat pressing die cutting and/or circular knife die cutting or the waste antenna after flat pressing die cutting and/or circular knife die cutting and the waste material first substrate layer correspond to an input port of a waste discharging and winding mechanism, the antenna layer and the second substrate layer enter a corresponding third unwinding mechanism after flat pressing die cutting and/or circular knife die cutting, an isolation layer is laminated on the antenna layer or the first substrate layer through the third unwinding mechanism, and the antenna layer compounded with the second substrate layer and superposed with the isolation layer or the antenna layer compounded with the second substrate layer and the first substrate layer and superposed with the isolation layer enters an input port of a finished product winding mechanism;
or the unreeling of the first unreeling mechanism is used for unreeling an antenna layer to be processed or an antenna layer to be processed of a composite first base material layer to correspondingly enter an input port of the coating mechanism, an antenna layer after being coated output by the coating mechanism or an antenna layer of the composite first base material layer after being coated enter an input port of the corresponding antenna hole processing mechanism, an antenna layer after an antenna hole is punched or an antenna layer after the antenna hole is punched output by the antenna hole processing mechanism enter an input port of the corresponding composite mechanism, meanwhile, a second base material layer unreeled by the second unreeling mechanism also enters an input port of the corresponding composite mechanism, an antenna layer of a composite second base material layer output by the composite mechanism or an antenna layer of the composite second base material layer and an antenna layer of the first base material layer enter an input port of the second die-cutting mechanism and then enter an input port of the first die-cutting mechanism from an output port of the second die-cutting mechanism, and an antenna layer after being processed by flat pressing and/or circular knife die cutting and compounded by Outputting the antenna layer which is processed by flat pressing die cutting and/or circular knife die cutting and compounded with the first substrate layer and the second substrate layer, wherein the waste antenna after the flat pressing die cutting and/or circular knife die cutting or the waste antenna after the flat pressing die cutting and/or circular knife die cutting and the waste material first substrate layer correspond to an input port of a waste discharging and winding mechanism, the antenna layer and the second substrate layer enter a corresponding third unwinding mechanism after the flat pressing die cutting and/or circular knife die cutting, and after an isolation layer is laminated on the antenna layer or the first substrate layer through the third unwinding mechanism, the antenna layer which is compounded with the second substrate layer and is superposed with the isolation layer or the antenna layer which is compounded with the second substrate layer and the first substrate layer and is superposed with the isolation layer enters an input port of a finished product winding mechanism;
or the unreeling of the first unreeling mechanism is used for unreeling an antenna layer to be processed or an antenna layer to be processed of a composite first substrate layer and correspondingly enters an input port of the coating mechanism, an antenna layer after the coating of the coating mechanism or an antenna layer of the composite first substrate layer after the coating enters an input port of the corresponding antenna hole processing mechanism, an antenna layer after an antenna hole output by the antenna hole processing mechanism is punched or an antenna layer after the antenna hole is punched enters an input port of the corresponding composite mechanism, meanwhile, a second substrate layer unreeled by the second unreeling mechanism also enters an input port of the corresponding composite mechanism, an antenna layer of a composite second substrate layer or an antenna layer of the composite second substrate layer and an antenna layer of the first substrate layer output by the composite mechanism enters an input port of a flat-pressing die-cutting machine or a circular knife die-cutting machine which is combined by the first die-cutting mechanism and the second die-cutting mechanism, and then the output port of the flat-pressing die-cutting machine or the circular knife is used for processing and compounding The antenna layer of the second substrate layer or the antenna layer which is processed by flat-pressing die cutting and/or circular knife die cutting and is compounded with the first substrate layer and the second substrate layer is output, wherein the waste antenna after the flat-pressing die cutting and/or circular knife die cutting or the waste antenna after the flat-pressing die cutting and/or circular knife die cutting and the waste first substrate layer correspond to an input port of a waste discharging and winding mechanism, the antenna layer and the second substrate layer enter a corresponding third unwinding mechanism after the flat-pressing die cutting and/or circular knife die cutting, after an isolation layer is laminated on the antenna layer or the first substrate layer through the third unwinding mechanism, the antenna layer which is compounded with the second substrate layer and is superposed with the isolation layer or the antenna layer which is compounded with the second substrate layer and is superposed with the first substrate layer and is superposed with the antenna layer, and the antenna layer which is compounded with.
Further, the number of the chip binding points is two, and the first die cutting mechanism is divided into a flat die cutting machine for performing flat press die cutting on one of the chip binding points or a circular knife die cutting machine for performing circular knife die cutting, and a flat die cutting machine for performing flat press die cutting on the other of the chip binding points and the chip binding points or a circular knife die cutting machine for performing circular knife die cutting;
the antenna layer of the composite second base material layer or the antenna layer of the composite second base material layer and the antenna layer of the first base material layer output by the composite mechanism enters the input port of the first die-cutting mechanism, namely the antenna layer of the composite second base material layer or the antenna layer of the composite second base material layer and the antenna layer of the first base material layer output by the composite mechanism firstly enters a flat-pressing die-cutting machine for performing flat-pressing die cutting on one chip binding point or a circular knife die-cutting machine for performing circular knife die cutting, and then enters the flat-pressing die-cutting machine for performing flat-pressing die cutting on the other chip binding point and the chip binding positioning point or the circular knife die-cutting machine for performing circular knife die; or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism firstly enters a flat-pressing die-cutting machine for performing flat-pressing die cutting on the other chip binding point and the chip binding point or a circular knife die-cutting machine for performing circular knife die cutting, and then enters the flat-pressing die-cutting machine for performing flat-pressing die cutting on one of the chip binding points or the circular knife die-cutting machine for performing circular knife die cutting.
Further, the compound mechanism is also provided with a heating drum for heating the adhesive; the composite mechanism comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer of the first substrate layer.
Furthermore, the processing equipment also comprises a drying mechanism for drying the antenna layer coated with the adhesive by the coating mechanism or a drying mechanism for drying the antenna layer of the composite first substrate layer coated with the adhesive by the coating mechanism, and the drying mechanism corresponds to the output port of the coating mechanism and the input port of the antenna hole processing mechanism.
A processing technology of full-die-cut ultrahigh frequency electronic tag antenna is characterized by comprising the following steps: the production steps of the processing technology comprise that flat pressing die cutting and/or circular knife die cutting are carried out on the antenna of the antenna layer or the antenna of the antenna layer compounded with the first substrate layer through the first die cutting mechanism to form a chip binding point and/or a chip binding positioning point.
A processing technology of full-die-cut ultrahigh frequency electronic tag antenna is characterized by comprising the following production steps:
firstly, an antenna layer to be processed or an antenna layer compounded with a first base material layer is unreeled by a first unreeling mechanism and is coated with an adhesive on one side of the antenna layer to be processed or one side of the first base material layer, which is not adhered with the antenna layer, in the antenna layer compounded with the first base material layer by a coating mechanism;
secondly, the antenna layer after being coated or the antenna layer after being coated and compounded with the first base material layer is subjected to antenna hole punching through an antenna hole machining mechanism, and waste material antennas generated after punching or waste material antennas generated after punching and the waste material first base material layer enter an antenna hole waste material collecting device;
combining the antenna layer with the punched antenna hole or the antenna layer of the composite first substrate layer with the punched antenna hole with a second substrate layer of a second unwinding mechanism through a composite mechanism, namely bonding the second substrate layer with the antenna layer or the first substrate layer through a bonding agent;
step four, the antenna layer after the second substrate layer is compounded is subjected to flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer through the first die cutting mechanism to form a chip binding point and a chip binding positioning point, then the antenna at the periphery of the antenna body of the antenna layer is subjected to flat pressing die cutting and/or circular knife die cutting through the second die cutting mechanism to form the outer contour of the antenna body, and then the preliminarily formed antenna body and the residual waste material antenna are formed on the second substrate layer;
or the antenna layer after the second substrate layer and the first substrate layer are compounded is subjected to flat pressing die cutting and/or circular knife die cutting simultaneously by the first die cutting mechanism to form a chip binding point and a chip binding positioning point, then the antenna and the first substrate layer at the periphery of the antenna layer antenna body of the first substrate layer are subjected to die cutting and/or roller cutting by the second die cutting mechanism to form the outline of the antenna body, and then the preliminarily molded antenna body of the first substrate layer, the residual waste material antenna and the corresponding residual waste material first substrate layer are formed on the second substrate layer;
or the antenna layer after the second substrate layer is compounded is subjected to flat pressing die cutting and/or circular knife die cutting on the antennas at the edges of the periphery of the antenna body of the antenna layer by the second die cutting mechanism to form the outer contour of the antenna body, then is subjected to flat pressing die cutting and/or circular knife die cutting by the first die cutting mechanism to form chip binding points and chip binding positioning points, and then is subjected to primary forming on the second substrate layer;
or compounding a second substrate layer and the antenna layer of the first substrate layer, performing flat-pressing die cutting and/or circular knife die cutting on the antenna and the first substrate layer corresponding to the peripheral edge of the antenna body of the antenna layer by using a second die cutting mechanism to form the outline of the antenna body, simultaneously performing flat-pressing die cutting and/or circular knife die cutting on the antenna and the first substrate layer of the antenna layer by using a first die cutting mechanism to form a chip binding point and a chip binding positioning point, and then forming the preliminarily formed antenna body of the compounded first substrate layer, the residual waste antennas and the corresponding residual waste first substrate layer on the second substrate layer;
fifthly, rolling and discharging the residual waste antenna or the residual waste antenna and the corresponding residual waste first substrate layer through a waste discharging and rolling mechanism;
after the waste discharge, unwinding the isolation layer through a third unwinding mechanism to cover the isolation layer on the antenna of the primarily molded antenna body or the first substrate layer;
and step seven, the antenna body covered with the isolation layer is rolled by a finished product rolling mechanism to form a die-cut ultrahigh frequency electronic tag antenna finished product.
Further, the antenna hole machining mechanism punches the antenna hole in the antenna layer and adopts a flat pressing die cutting process or a circular knife die cutting process.
Further, the coating mechanism is used for coating the adhesive on the antenna layer or the first substrate layer and contains a diluting solvent.
Further, add one between step one and step two, utilize stoving mechanism to dry the antenna layer of coating paste agent or the antenna layer of compound first substrate layer, then send the antenna layer after will drying or the antenna layer of compound first substrate layer to antenna hole processing mechanism and carry out the antenna hole and punch.
Further, the temperature range of the drying mechanism is 40-160 ℃.
Further, the combining mechanism in the third step is further provided with a heating drum, and the heating drum synchronously heats the adhesive on the antenna layer in the process that the antenna layer after the antenna hole is punched or the antenna layer of the first base material layer is combined with the second base material layer unreeled by the second unreeling mechanism through the combining mechanism.
Further, the temperature range of the heating drum is 50 to 200 degrees celsius.
Further, the first die cutting mechanism performs one-time flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer and the first substrate layer of the composite first substrate layer to form a chip binding point and a chip binding positioning point;
or the first die cutting mechanism carries out two or more times of flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer compounded with the first substrate layer and the first substrate layer to form a chip binding point and a chip binding positioning point.
In view of the technical characteristics, the invention has the following beneficial effects:
1. according to the full-die-cut ultrahigh frequency electronic tag antenna, the die cutting forming mode such as flat pressing die cutting and/or circular knife die cutting is adopted for the chip binding points and the chip binding points, so that the full-die-cut ultrahigh frequency electronic tag antenna can be separated from an etching process, and the influence and/or pollution of chemical substances generated by the etching process on the environment can be effectively reduced.
2. According to the full-die-cut ultrahigh frequency electronic tag antenna, a die cutting mode such as flat pressing die cutting and/or circular knife die cutting can be adopted for punching the antenna hole, so that the full-die-cut ultrahigh frequency electronic tag antenna can be separated from an etching process, and the influence and/or pollution of chemical substances generated by the etching process on the environment can be effectively reduced.
3. According to the full-die-cut ultrahigh frequency electronic tag antenna, the die cutting mode such as flat pressing die cutting and/or circular knife die cutting can be adopted for the peripheral edge part of the antenna body, so that the full-die-cut ultrahigh frequency electronic tag antenna can be separated from the etching process, and the influence and/or pollution of chemical substances generated by the etching process to the environment can be effectively reduced.
4. In the processing equipment for the full-die-cutting ultrahigh frequency electronic tag antenna, the chip binding points, the chip binding positioning points and the positions and the processing sequence of the processing equipment at the peripheral edge part of the antenna body can be interchanged, and the processing effects of the chip binding points, the chip binding positioning points and the peripheral edge part of the antenna body are not influenced.
5. The processing technology of the full-die-cut ultrahigh frequency electronic tag antenna comprises the processing mode of die-cutting and forming the chip binding points and the chip binding positioning points, is included in the protection scope of the invention, can help the ultrahigh frequency electronic tag antenna to realize full-die-cutting processing, does not need any etching technology, and can bring the environmental pollution of the ultrahigh frequency electronic tag antenna production to the lowest point, even is basically harmless.
Drawings
Fig. 1 is a schematic structural diagram of an all-die-cut uhf rfid antenna in example 1.
Fig. 2 is a schematic structural diagram of a processing device of the fully die-cut uhf rfid antenna in example 1.
Fig. 3 is a schematic cross-sectional view of an all-die-cut uhf rfid antenna (without the first substrate layer) in example 1.
Fig. 4 is a schematic cross-sectional view of an all-die-cut uhf rfid antenna (including a first substrate layer) in example 1.
In the figure: 1 is a first unwinding mechanism; 2 is a coating mechanism; 3 is; 4, an antenna hole processing mechanism; 5 is an antenna hole waste collecting device; 6 is a composite mechanism; 7, a second unwinding mechanism; 8 is a circular knife die-cutting machine which is used for carrying out circular knife die-cutting on one of the chip binding points in the first die-cutting mechanism; 9 is a circular knife die cutting machine which is used for performing circular knife die cutting on the other chip binding point and the chip binding point in the first die cutting mechanism; 10 is a second die-cutting mechanism; 11 is a waste discharge winding mechanism; 12 is a third unwinding mechanism; 13 is a finished product winding mechanism; 14, binding a positioning point for the chip; 15 is a chip binding point; 16 is an antenna hole; 17 is an antenna body; 18 is an aluminum foil; 19 is an adhesive applied by the applying mechanism; 20 is paper as a second base material layer, and 21 is a PET layer as a first base material layer; 22 is an adhesive for pre-compounding the PET layer and the aluminum foil.
Detailed Description
The invention will be further illustrated with reference to specific embodiments. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
Referring to fig. 1 and 2, in embodiment 1, an all-die-cut ultrahigh frequency electronic tag antenna includes an antenna body 17, and is characterized in that: the antenna body 17 is provided with chip binding sites 14 formed by die cutting and chip binding sites 15 formed by die cutting.
The chip binding positioning points 14 and the chip binding points 15 of the ultrahigh frequency electronic tag antenna are manufactured in a die cutting mode, so that the etching process can be avoided in the process of producing the chip binding positioning points 14 and the chip binding points 15, and the pollution of chemical substances to the environment can be effectively reduced; in addition, the chip binding positioning points 14 and the chip binding points 15 formed in the die cutting mode are smooth and smooth in the peripheral edges, uneven edge shapes cannot exist, and the quality of the ultrahigh frequency electronic tag antenna is improved.
The peripheral edge of the antenna body 17 is formed by die cutting.
The antenna body 17 is further provided with an antenna hole 16 formed by die cutting.
That is to say, each part on the ultrahigh frequency electronic tag antenna can be carried out by adopting a die cutting mode, the whole ultrahigh frequency electronic tag antenna can be produced by adopting the die cutting mode, the etching process is completely separated, the pollution to the environment is minimized, and even no chemical pollution is caused.
The die cutting mode can adopt flat pressing die cutting and/or circular knife die cutting, which is also called as rolling cutting; die cutting may also be used.
In this embodiment 1, there are two chip attachment points 15, one antenna hole 16, and a gap formed between the chip attachment points 15 communicates between the antenna hole 16 and the outside of the antenna.
A first substrate layer, or a first substrate layer and a second substrate layer, is further bonded to one side of the antenna layer of the antenna body 17, the first substrate layer is a mylar, the second substrate layer is a mylar or paper, and the mylar is preferably a PET layer; the antenna of the antenna layer may be a metal foil, such as an aluminum foil, a copper foil, etc., and in this embodiment 1, the antenna of the antenna layer is preferably an aluminum foil.
The utility model provides a processing equipment of full cross cutting's hyperfrequency electronic tags antenna, is including the first die-cutting mechanism that is used for cross cutting chip to bind setpoint 14 and chip to bind setpoint 15 which characterized in that: the first die cutting mechanism consists of a flat-press die cutting mechanism, and the flat-press die cutting mechanism is a flat-press die cutting machine comprising at least one die cutting tool for flat-press die cutting of chip binding positioning points 14 and chip binding points 15;
or the first die-cutting mechanism consists of a circular knife die-cutting mechanism, and the circular knife die-cutting mechanism is a circular knife die-cutting machine comprising at least one rolling cutting tool for die-cutting the chip binding positioning points 14 and the chip binding points 15 by the circular knife;
or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat-pressing die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting cutter used for flat-pressing die cutting chip binding positioning points 14 or chip binding points 15 and at least one hob cutter used for circular cutter die cutting chip binding points 15 or chip binding positioning points 14.
The processing equipment further comprises a second die-cutting mechanism 10 for die-cutting the peripheral edge of the antenna body 17, wherein the second die-cutting mechanism 10 is a flat-pressing die-cutting machine for flat-pressing and die-cutting the peripheral edge of the antenna body 17, or a circular knife die-cutting machine for circular knife die-cutting the peripheral edge of the antenna body 17.
The processing equipment further comprises an antenna hole processing mechanism 4 used for die cutting of the antenna hole 16, wherein the antenna hole processing mechanism 4 is a flat-pressing die cutting machine and an antenna hole waste collecting device 5 used for flat-pressing die cutting of the antenna hole 16, or the antenna hole processing mechanism 4 is a circular knife die cutting machine and an antenna hole waste collecting device 5 used for circular knife die cutting of the antenna hole 16. When antenna hole 16 punches to the antenna layer of antenna layer or compound first substrate layer of antenna hole processing agency 4, be the antenna layer cross cutting that directly runs through antenna layer or compound first substrate layer, the waste material antenna or the waste material antenna and the first substrate layer of waste material of the corresponding antenna hole after punching get into in the lump or fall into garbage collection device 5, garbage collection device 5 preferred sets up the garbage collection box in antenna hole processing agency 4 bottom.
That is to say, the first die cutting mechanism, the second die cutting mechanism 10 and the antenna hole processing mechanism 4 can select the flat-pressing die cutting mechanism and/or the circular cutter die cutting mechanism according to actual needs to realize the die cutting process, so as to meet the requirements of the fully die-cut ultrahigh frequency electronic tag antenna on the die cutting process, in particular the requirements of the chip binding positioning points 14, the chip binding points 15, the peripheral edge of the antenna body 17 and the antenna holes 16 on the die cutting process.
The processing equipment also comprises a first unreeling mechanism 1 used for unreeling the antenna layer to be processed or the antenna layer to be processed of the composite first substrate layer, a coating mechanism 2 for coating adhesive on one side of the antenna layer to be processed or one side of the first substrate layer without the antenna layer, a second unreeling mechanism 7 for unreeling the second substrate layer, a composite mechanism 6 for compositing the second substrate layer and the antenna layer to be processed/a part of the antenna layer after processing or compositing the second substrate layer and the antenna layer to be processed which is composited with the first substrate layer, a waste discharge winding mechanism 11 for winding the processed waste antenna or winding the processed waste antenna and the first waste substrate layer, a third unreeling mechanism 12 for unreeling the isolation layer on the antenna layer, and a finished product reeling mechanism 13 for reeling the processed antenna layer, the substrate layer and the isolation layer together;
there is not first substrate layer in the hyperfrequency electronic tags antenna course of working of full cross cutting, coating mechanism coats the adhesive in one side of antenna layer when directly adopting antenna layer to add man-hour, bind setpoint 14 and chip binding point 15 to the chip when first die cutting mechanism and carry out the cross cutting, second die cutting mechanism 10 carries out the cross cutting to the edge all around of antenna body 17, antenna hole processing agency 4 all can carry out the cross cutting simultaneously with first substrate layer and antenna layer when carrying out the cross cutting to antenna hole 16, but do not carry out the cross cutting to the second substrate layer. The adhesive is used to combine the antenna layer and the second substrate layer by the combining mechanism 7, that is, the antenna layer and the second substrate layer are bonded together by the adhesive. The finished product of the fully die-cut ultrahigh frequency electronic tag antenna produced under the precondition is formed by sequentially bonding an antenna layer (namely, an aluminum foil 18) and a second substrate layer (namely, paper 20) from top to bottom through a bonding agent 19 of a coating mechanism 2, and is shown in detail in figure 3.
When the fully die-cut ultrahigh frequency electronic tag antenna is processed, the first substrate layer can be optionally added, or the first substrate layer can be omitted. Preferably adopt first substrate layer, first substrate layer is used for supporting the antenna on the antenna layer, in antenna layer course of working, first substrate layer carries out guard action to the antenna, coating mechanism 2 did not paste one side coating adhesive on antenna layer at first substrate layer this moment, bind setpoint 14 and chip binding point 15 and carry out the cross cutting to the chip when first die-cutting mechanism, second die-cutting mechanism 10 carries out the cross cutting to antenna body 17's all edges all around, antenna hole processing agency 4 all can carry out the cross cutting simultaneously with first substrate layer and antenna layer when carrying out the cross cutting to antenna hole 16, but do not carry out the cross cutting to the second substrate layer. The adhesive is used for compounding the first base material layer and the second base material layer together through a compounding mechanism, namely the first base material layer and the second base material layer are bonded together through the adhesive.
In this embodiment 1, the full-die-cut ultrahigh frequency electronic tag antenna uses the antenna layer to be processed of the composite first substrate layer as an example (if there is no composite first substrate layer, the antenna layer to be processed can directly replace the antenna layer to be processed of the composite first substrate layer), and the connection relationship among the devices is as follows: the antenna layer to be processed of the unreeled composite first base material layer of the first unreeling mechanism 1 correspondingly enters the input port of the coating mechanism 2, the antenna layer of the coated composite first base material layer output by the coating mechanism 2 (at the moment, an adhesive is coated on one side surface of the first base material layer which is not adhered with the antenna layer) enters the input port of the corresponding antenna hole processing mechanism 4, the antenna layer of the composite first base material layer punched by the antenna hole 16 output by the antenna hole processing mechanism 4 enters the input port of the corresponding composite mechanism 6, meanwhile, the second base material layer unreeled by the second unreeling mechanism 7 also enters the input port of the corresponding composite mechanism 6, the composite second base material layer output by the composite mechanism 6 and the antenna layer of the first base material layer enter the input port of the first die-cutting mechanism (at the moment, the first base material layer and the second base material layer are adhered and compounded by the adhesive) and then enter the input port of the second die-cutting mechanism, the output port of the second die-cutting mechanism 10 outputs the antenna layer which is processed by flat-pressing die-cutting and/or circular knife die-cutting and is combined with the first substrate layer and the second substrate layer, wherein the waste material antenna and the waste material first substrate layer which are processed by flat-pressing die-cutting and/or circular knife die-cutting correspond to the input port of the waste discharging and winding mechanism 11, the antenna layer and the second substrate layer which are processed by flat-pressing die-cutting and/or circular knife die-cutting enter the corresponding third unwinding mechanism 12, after the third unwinding mechanism 12 stacks one isolation layer on the antenna layer or the first substrate layer, the antenna layer which is combined with the second substrate layer and the first substrate layer and stacks the isolation layer enters the input port of the finished product winding mechanism 13. The finished product of the fully die-cut ultrahigh frequency electronic tag antenna formed at this time is formed by sequentially laminating an antenna layer (namely, the aluminum foil 18) and an antenna layer from top to bottom, wherein the first substrate layer (namely, the PET layer 21, the lamination here means that the PET layer 21 is laminated with the aluminum foil 18 in advance through the adhesive 22 for laminating and adhering the PET layer 21 and the aluminum foil 18 in advance, and then the antenna layer laminated with the first substrate layer is put and rolled into the coating mechanism 2 through the first unwinding mechanism 1, and the first substrate layer (namely, the PET layer 21) is laminated and compounded with a second substrate layer (namely, the paper 20) through the adhesive 19 of the coating mechanism, and the detailed view is shown in fig. 4.
The position and processing sequence of the first and second die-cutting mechanisms 10 can be interchanged.
As an alternative: the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism 6 enter the input port of the second die-cutting mechanism 10, and then enter the input port of the first die-cutting mechanism through the output port of the second die-cutting mechanism 10, the output port of the first die-cutting mechanism outputs the antenna layer which is processed by flat-pressing die-cutting and/or circular-knife die-cutting and is composited with the second substrate layer or the antenna layer which is processed by flat-pressing die-cutting and/or circular-knife die-cutting and is composited with the first substrate layer, wherein the waste antenna after the processing of flat-pressing die-cutting and/or circular-knife die-cutting or the waste antenna after the processing of flat-pressing die-cutting and/or circular-knife die-cutting and the waste antenna after the processing of circular-.
The composite mechanism 6 is also provided with a heating drum for heating the adhesive, the adhesive is heated to facilitate the adhesion between the second substrate layer and one side surface of the first substrate layer which is not adhered with the antenna layer, and the composite adhesion function of the second substrate layer and the first substrate layer can be better realized through the composite mechanism; the compound mechanism 6 comprises a rubber roller for compounding and pasting the second substrate layer and the compound first substrate layer.
The processing equipment further comprises a drying mechanism 3 for drying the antenna layer coated with the adhesive by the coating mechanism 2 or a drying mechanism 3 for drying the antenna layer of the composite first substrate layer coated with the adhesive by the coating mechanism 2, wherein the drying mechanism 3 corresponds to an output port of the coating mechanism 2 and an input port of the antenna hole processing mechanism 4.
When the antenna layer of compound first substrate layer after 2 stoving of stoving mechanism punches in antenna hole processing agency 4, the adhesive can not cause the influence to punching, the operation of punching of the antenna hole of being convenient for.
The production steps of the full-die-cut ultrahigh frequency electronic tag antenna are as follows:
firstly, an antenna layer of a composite first base material layer unreeled by a first unreeling mechanism 1 is coated with an adhesive on one side, which is not adhered with the antenna layer, of the first base material layer in the antenna layer of the composite first base material layer through a coating mechanism 2;
secondly, drying the antenna layer coated with the adhesive and compounded with the first substrate layer by using a drying mechanism 3, and then conveying the dried antenna layer compounded with the first substrate layer to an antenna hole machining mechanism 4 for punching an antenna hole 16;
thirdly, the dried antenna layer of the composite first substrate layer is subjected to antenna hole 16 punching through the antenna hole processing mechanism 4, and waste material antennas generated after punching or waste material antennas generated after punching and the waste material first substrate layer enter the antenna hole waste material collecting device 5;
fourthly, the antenna layer of the composite first base material layer with the punched antenna hole 16 is composited with a second base material layer of a second unreeling mechanism 7 through a compositing mechanism 6, namely, the second base material layer is bonded with the first base material layer through an adhesive;
step five, after the antenna layer compounded with the second substrate layer and the first substrate layer is subjected to flat pressing die cutting and/or circular knife die cutting simultaneously by the first die cutting mechanism to form a chip binding point 15 and a chip binding positioning point 14, then the antenna and the first substrate layer at the periphery of the antenna layer antenna body 17 compounded with the first substrate layer are subjected to die cutting and/or roll cutting by the second die cutting mechanism 10 to form the outline of the antenna body 17, and then the antenna body 17 of the preliminarily molded compounded first substrate layer, the residual waste material antenna and the corresponding residual waste material first substrate layer are formed on the second substrate layer;
an alternative to this step is the exchange of the positions and processing sequences of the first and second die-cutting means 10: or compounding the antenna layer of the second substrate layer and the first substrate layer, firstly carrying out flat pressing die cutting and/or circular knife die cutting on the antenna and the first substrate layer corresponding to the peripheral edge of the antenna body 17 of the antenna layer by the second die cutting mechanism 10 to form the outline of the antenna body 17, then simultaneously carrying out flat pressing die cutting and/or circular knife die cutting on the antenna and the first substrate layer of the antenna layer by the first die cutting mechanism to form a chip binding point 15 and a chip binding positioning point 14, and then forming the preliminarily molded antenna body 17 of the compounded first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer on the second substrate layer;
sixthly, winding and discharging the residual waste antenna and the corresponding residual waste first substrate layer through the waste discharging and winding mechanism 11;
seventhly, after waste discharge, unwinding the isolation layer through a third unwinding mechanism 12 to cover the isolation layer on the first substrate layer of the preliminarily molded antenna body 17;
and step eight, covering the antenna body 17 of the isolation layer, and rolling the antenna body by the finished product rolling mechanism 13 to form a die-cut ultrahigh frequency electronic tag antenna finished product.
In the above steps, the coating mechanism 2 is used for coating the adhesive on the antenna layer or the first substrate layer, and the adhesive contains a diluting solvent, and the diluting solvent can dilute the adhesive, so that the requirement of full-die-cutting ultrahigh frequency electronic tag antenna processing is met.
The temperature range of the drying mechanism 3 is 40-160 ℃, which helps the adhesive to be dried, and is convenient for punching the antenna hole 16 of the antenna layer.
The compound mechanism 6 is also provided with a heating drum, and the heating drum synchronously heats the adhesive on the antenna layer in the process that the antenna layer of the compound first base material layer punched in the antenna hole 16 is compounded with the second base material layer unreeled by the second unreeling mechanism 7 through the compound mechanism 6. The temperature range of heating drum is 50 degrees centigrade to 200 degrees centigrade, heats the antenna layer after the antenna hole punches, and the bonding agent that has coated (the actual coating of bonding agent is on first substrate layer) heats and melts on the antenna layer of compound first substrate layer this moment, and the antenna layer of the compound first substrate layer of being convenient for utilizes bonding between the bonding agent after melting and the second substrate layer, and the composite mechanism 7 of being convenient for carries out compound pasting between first substrate layer and the second substrate layer.
The antenna hole processing mechanism 4 is used for punching the antenna hole 16 in the antenna layer by adopting a flat pressing die cutting process or a circular knife die cutting process.
Referring to fig. 2, in a fifth production step of the processing technology of the fully die-cut ultrahigh frequency electronic tag antenna in this embodiment 1, the first die-cutting mechanism is divided into a flat-pressing die-cutting machine for performing flat-pressing die-cutting on one of the chip binding points 15 or a circular knife die-cutting machine 8 for performing circular knife die-cutting, and a flat-pressing die-cutting machine for performing flat-pressing die-cutting on the other of the chip binding points 15 and the chip binding positioning points 14 or a circular knife die-cutting machine 9 for performing circular knife die-cutting; in this embodiment 1, the first die cutting mechanism is divided into a circular knife die cutting machine 8 for performing circular knife die cutting on one of the chip binding points 15, and a circular knife die cutting machine 9 for performing circular knife die cutting on the other chip binding point 15 and the chip binding positioning point 14.
The circular knife die-cutting machine 8 for performing circular knife die-cutting on one of the chip binding points 15, the circular knife die-cutting machine 9 for performing circular knife die-cutting on the other chip binding point 15 and the chip binding positioning point 14, and the second die-cutting mechanism 10 for performing circular knife die-cutting on the antenna on the peripheral edge of the antenna body 17 of the antenna layer to form the outer contour of the antenna body 17 are adjustable and interchangeable at will, and the positions and the processing sequence of the three can be adjusted and interchanged at will, so that the processing on the outer contour of the chip binding positioning point 14, the chip binding point 15 and the antenna body 17 can be realized.
Embodiment 2, embodiment 2 is substantially the same as embodiment 1, except that: in the fifth production step of the processing technology of the fully die-cut ultrahigh frequency electronic tag antenna in embodiment 2, the first die-cutting mechanism is a die-cutting machine that performs platen die cutting and/or circular knife die cutting on the chip binding points 15 and the chip binding positioning points 14 at the same time, that is, the first die-cutting mechanism performs platen die cutting and/or circular knife die cutting on the chip binding points 15 and the chip binding positioning points 14 at one time, for example, the platen die-cutting machine is replaced by a circular knife die-cutting machine, and similar operations are performed to perform disposable platen die cutting on the antenna layer to form the chip binding points 15 and the chip binding positioning points 14, that is, the die-cutting tool of the platen die-cutting machine performs disposable die cutting on the chip binding points 15 and the chip binding positioning points 14 on the antenna layer, for example, the thickness of the blade of the die-cutting tool is controlled, so that the die-cutting tool can form a tool mold according to the shape requirements of, further, the purpose of one-time die cutting and forming of the chip binding points 15 and the chip binding positioning points 14 is achieved, for example, the die cutting of the chip binding points 15 and the chip binding positioning points 14 is achieved by parallel or certain inclined angles of the blades, and the die cutting device is particularly suitable for the situation that the distance between the chip binding points 15 and the chip binding positioning points 14 and/or between the adjacent chip binding points 15 and/or between the adjacent chip binding positioning points 14 is small. And then the second die cutting mechanism 10 performs flat pressing die cutting and/or circular knife die cutting on the antennas at the peripheral edge of the antenna body 17 of the antenna layer to form the outer contour of the antenna body 17.
The positions and the processing sequence of the first die cutting mechanism and the second die cutting mechanism can be interchanged.
Compared with the specific embodiment 1, the embodiment 2 has higher processing efficiency, and the chip binding points 15 and the chip binding points 14 are formed by one-time die cutting, so that the accuracy is higher.
Embodiment 3, embodiment 3 is substantially the same as embodiment 1, except that: in a fifth production step of the processing technology of the full-die-cut ultrahigh frequency electronic tag antenna in the specific embodiment 3, the first die cutting mechanism for die-cutting the chip binding and positioning points 14 and the chip binding and positioning points 15 and the second die cutting mechanism 10 for die-cutting the peripheral edge of the antenna body 17 are combined into a flat press die-cutting machine or a circular knife die-cutting machine.
That is, the first die cutting mechanism and the second die cutting mechanism 10 are combined into a flat press die cutting machine or a circular knife die cutting machine, and can complete the operation of forming the outer contour of the antenna body 17 by performing the flat press die cutting and/or the circular knife die cutting on the chip binding points 15, the flat press die cutting and/or the circular knife die cutting of the chip binding points 14 and the antennas at the peripheral edges of the antenna body 17 of the antenna layer at one time, for example, the flat press die cutting machine is replaced by the circular knife die cutting machine, and the similar operation is performed to perform the operation of performing the flat press die cutting on the antenna layer at one time to form the chip binding points 15, the chip binding points 14 and the outer contour of the antenna body 17, that is, the die cutting tool of the flat press die cutting machine performs the one-time die cutting on the chip binding points 15, the chip binding points 14 and the outer contour of the antenna body 17 on, the die cutting tool can form a tool die according to the shape requirements of the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17, and further achieve the purpose of performing one-time die cutting forming on the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17, for example, the die cutting of the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17 is achieved by the fact that adjacent blades are parallel or the blades have a certain inclination angle, and the die cutting tool is particularly suitable for the situation that the distance between the chip binding points 15 and the chip binding positioning points 14 and/or between the adjacent chip binding points 15 and/or between the adjacent chip binding positioning points 14 is small.
At this time, the second substrate layer and the antenna layer of the first substrate layer output by the combining mechanism 6 in the sixth step enter an input port of a flat-pressing die-cutting machine or a circular knife die-cutting machine combined by the first die-cutting mechanism and the second die-cutting mechanism 10, and then the antenna layer which is processed by the flat-pressing die-cutting and/or the circular knife die-cutting and combined with the first substrate layer and the second substrate layer is output by an output port of the flat-pressing die-cutting machine or the circular knife die-cutting machine, wherein the waste material antenna and the waste material first substrate layer processed by the flat-pressing die-cutting and/or the circular knife die-cutting correspond to an input port of the waste discharging and.
Compared with the specific embodiments 1 and 2, the embodiment 3 has higher processing efficiency, and the chip binding points 15, the chip binding positioning points 14, and the outer contour of the antenna body 17 are formed by one-time die cutting, so that the accuracy is higher.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (22)

1. The utility model provides a cut hyperfrequency electronic tags antenna entirely, includes antenna body (17), its characterized in that: the antenna body (17) is provided with chip binding positioning points (14) formed by a die cutting mode and chip binding points (15) formed by the die cutting mode.
2. The fully die-cut uhf rfid antenna of claim 1, wherein: the peripheral edge of the antenna body (17) is formed by die cutting.
3. The fully die-cut uhf rfid antenna of claim 2, wherein: the antenna body (17) is also provided with an antenna hole (16) formed by die cutting.
4. The fully die-cut UHF RFID tag antenna of claim 3, wherein: the chip binding points (15) are two, the antenna hole (16) is one, and a gap formed between the chip binding points (15) is communicated with the antenna hole (16) and the outside of the antenna.
5. The fully die-cut UHF RFID tag antenna of claim 4, wherein: the die cutting mode is flat pressing die cutting and/or circular knife die cutting; a first base material layer or a first base material layer and a second base material layer are further pasted on one side of the antenna layer of the antenna body (17), the first base material layer is a mylar, and the second base material layer is a mylar or paper.
6. The utility model provides a processing equipment of full cross cutting's hyperfrequency electronic tags antenna, is including being used for cross cutting chip to bind setpoint (14) and chip to bind the first die cutting mechanism of setpoint (15), its characterized in that: the first die cutting mechanism consists of a flat-press die cutting mechanism, and the flat-press die cutting mechanism is a flat-press die cutting machine comprising at least one die cutting tool for flat-press die cutting of chip binding positioning points (14) and chip binding points (15);
or the first die-cutting mechanism is composed of a circular knife die-cutting mechanism, and the circular knife die-cutting mechanism is a circular knife die-cutting machine comprising at least one rolling cutting tool for die-cutting a chip binding positioning point (14) and a chip binding point (15) by a circular knife;
or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat-pressing die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting cutter used for flat-pressing die cutting chip binding positioning points (14) or chip binding points (15) and at least one hob cutter used for circular cutter die cutting chip binding points (15) or chip binding positioning points (14).
7. The fully die-cut UHF RFID tag antenna of claim 6, wherein: the processing equipment further comprises a second die cutting mechanism (10) used for die cutting the peripheral edge of the antenna body (17), wherein the second die cutting mechanism (10) is a flat-pressing die cutting machine used for flat-pressing the peripheral edge of the antenna body (17) or a circular knife die cutting machine used for circular knife die cutting the peripheral edge of the antenna body (17).
8. The fully die-cut uhf rfid antenna of claim 7, wherein: the first die cutting mechanism used for die cutting the chip binding positioning points (14) and the chip binding points (15) and the second die cutting mechanism (10) used for die cutting the peripheral edges of the antenna body (17) are combined into a flat-pressing die cutting machine or a circular knife die cutting machine.
9. An all die cut UHF RFID tag antenna as claimed in any one of claims 6 to 8, wherein: the processing equipment further comprises an antenna hole processing mechanism (4) used for die cutting of the antenna hole (16), wherein the antenna hole processing mechanism (4) is a flat-pressing die cutting machine and an antenna hole (16) waste collecting device (5) used for flat-pressing die cutting of the antenna hole (16), or the antenna hole processing mechanism (4) is a circular knife die cutting machine and an antenna hole (16) waste collecting device (5) used for circular knife die cutting of the antenna hole (16).
10. The fully die-cut uhf electronic tag antenna of claim 9, wherein: the processing equipment also comprises a first unreeling mechanism (1) used for unreeling the antenna layer to be processed or the antenna layer to be processed of the composite first substrate layer, a coating mechanism (2) for coating adhesive on one side of the antenna layer to be processed or one side of the first substrate layer which is not adhered with the antenna layer, a second unreeling mechanism (7) for unreeling the second substrate layer, a composite mechanism (6) for compounding the second substrate layer and the antenna layer to be processed/part of the antenna layer to be processed or compounding the second substrate layer and the antenna layer to be processed of the composite first substrate layer, a waste discharge winding mechanism (11) for winding the processed waste antenna or winding the processed waste antenna and the first waste substrate layer, a third unreeling mechanism (12) for unreeling the isolation layer on the antenna layer, and a finished product reeling mechanism (13) for reeling the processed antenna layer, the substrate layer and the isolation layer together;
the antenna layer to be processed of the antenna layer to be processed or the antenna layer to be processed of the composite first base material layer output by the coating mechanism (2) correspondingly enters the input port of the coating mechanism (2), the antenna layer after coating or the antenna layer after coating of the composite first base material layer output by the coating mechanism (2) enters the input port of the corresponding antenna hole processing mechanism (4), the antenna layer after punching of the antenna hole (16) output by the antenna hole processing mechanism (4) or the antenna layer after punching of the composite first base material layer of the antenna hole (16) enters the input port of the corresponding composite mechanism (6), meanwhile, the second base material layer unwound by the second unwinding mechanism (7) also enters the input port of the corresponding composite mechanism (6), the antenna layer of the composite second base material layer output by the composite mechanism (6) or the antenna layer of the composite second base material layer and the antenna layer of the first base material layer enter the input port of the first die-cutting mechanism, then the antenna layer enters an input port of a second die cutting mechanism (10) from an output port of the first die cutting mechanism, the antenna layer which is processed by flat pressing die cutting and/or circular knife die cutting and compounded with a second base material layer or the antenna layer which is processed by flat pressing die cutting and/or circular knife die cutting and compounded with a first base material layer and a second base material layer is output from an output port of the second die cutting mechanism (10), wherein the waste antenna layer or the waste antenna after the flat pressing die cutting and/or circular knife die cutting and/or the waste antenna after the flat pressing die cutting and/or circular knife die cutting and the waste first base material layer correspond to an input port of a waste discharging and winding mechanism (11), the antenna layer and the second base material layer after the flat pressing die cutting and/circular knife die cutting are processed enter a third unwinding mechanism (12) corresponding to an isolation layer, an isolation layer is laminated on the antenna layer or the first base material layer through the third unwinding mechanism (12), and the antenna The layer enters an input port of a finished product winding mechanism (13);
or the antenna layer to be processed of the antenna layer to be processed or the antenna layer to be processed of the composite first base material layer which is output by the coating mechanism (2) correspondingly enters the input port of the coating mechanism (2), the antenna layer after coating or the antenna layer of the composite first base material layer after coating which is output by the coating mechanism (2) enters the input port of the corresponding antenna hole processing mechanism (4), the antenna layer after punching of the antenna hole (16) which is output by the antenna hole processing mechanism (4) or the antenna layer of the composite first base material layer after punching of the antenna hole (16) enters the input port of the corresponding composite mechanism (6), meanwhile, the second base material layer which is unreeled by the second unreeling mechanism (7) also enters the input port of the corresponding composite mechanism (6), the antenna layer of the composite second base material layer or the antenna layer of the composite second base material layer and the antenna layer of the first base material layer which are output by the composite mechanism (6) enters the input port of the second, then the antenna layer or the composite second substrate layer and the first substrate layer which are overlapped are fed into an input port of a first die cutting mechanism from an output port of a second die cutting mechanism (10), the output port of the first die cutting mechanism outputs the antenna layer which is processed by flat pressing die cutting and/or circular knife die cutting and is composited with a second substrate layer or the antenna layer which is processed by flat pressing die cutting and/or circular knife die cutting and is composited with the first substrate layer and the second substrate layer, wherein a waste antenna or a waste antenna processed by flat pressing die cutting and/or circular knife die cutting and/or a waste first substrate layer which are processed by flat pressing die cutting and/or circular knife die cutting and a waste material first substrate layer which are processed by flat pressing die cutting and/or circular knife die cutting correspond to an input port of a waste discharging and winding mechanism (11), the antenna layer and the second substrate layer which are processed by flat pressing die cutting and/or circular knife die cutting enter a corresponding third unwinding mechanism (12), an isolation layer is overlapped on the antenna layer or the first substrate layer through a third unwinding mechanism (12) The finished product is fed into an input port of a finished product winding mechanism (13);
or the antenna layer to be processed of the antenna layer to be processed or the antenna layer to be processed of the composite first base material layer which is output by the coating mechanism (2) correspondingly enters the input port of the coating mechanism (2), the antenna layer after coating or the antenna layer of the composite first base material layer after coating which is output by the coating mechanism (2) enters the input port of the corresponding antenna hole processing mechanism (4), the antenna layer after punching of the antenna hole (16) or the antenna layer of the composite first base material layer after punching of the antenna hole (16) which is output by the antenna hole processing mechanism (4) enters the input port of the corresponding composite mechanism (6), meanwhile, the second base material layer which is output by the second unwinding mechanism (7) also enters the input port of the corresponding composite mechanism (6), the antenna layer of the composite second base material layer or the composite second base material layer and the antenna layer of the first base material layer enter the die cutting mechanism (10) and are combined into a flat-pressing input port or a circular knife die cutting machine, then the antenna layer which is processed by flat pressing die cutting and/or circular knife die cutting and is compounded with the second substrate layer or the antenna layer which is processed by flat pressing die cutting and/or circular knife die cutting and is compounded with the first substrate layer and the second substrate layer is output through an output port of the flat pressing die cutting machine or the circular knife die cutting machine, wherein the waste antenna after flat pressing die cutting and/or circular knife die cutting or the waste antenna after flat pressing die cutting and/or circular knife die cutting and the waste first substrate layer correspond to the input port of the waste discharging and winding mechanism (11), the antenna layer and the second substrate layer after flat pressing die cutting and/or circular knife die cutting enter the corresponding third unwinding mechanism (12), and an isolation layer is laminated on the antenna layer or the first substrate layer through the third unwinding mechanism (12), and the antenna layer which is compounded with the second base material layer and is superposed with the isolation layer or the antenna layer which is compounded with the second base material layer and is superposed with the isolation layer and the first base material layer enters the input port of the finished product winding mechanism (13).
11. The fully die-cut uhf rfid antenna of claim 10, wherein: the first die cutting mechanism is divided into a flat press die cutting machine for performing flat press die cutting on one of the chip binding points (15) or a circular knife die cutting machine (8) for performing circular knife die cutting, and a flat press die cutting machine for performing flat press die cutting on the other chip binding point (15) and the chip binding point (14) or a circular knife die cutting machine (9) for performing circular knife die cutting;
the antenna layer of the composite second base material layer or the antenna layer of the composite second base material layer and the antenna layer of the first base material layer output by the composite mechanism (6) enters the input port of the first die-cutting mechanism, namely the antenna layer of the composite second base material layer or the antenna layer of the composite second base material layer and the antenna layer of the first base material layer output by the composite mechanism (6) firstly enters a flat-pressing die-cutting machine for performing flat-pressing die-cutting on one chip binding point (15) or a circular knife die-cutting machine for performing circular knife die-cutting, and then enters the flat-pressing die-cutting machine for performing flat-pressing die-cutting on the other chip binding point (15) and the chip binding positioning point (14) or the circular knife die-cutting machine for performing; or the antenna layer of the composite second substrate layer and the first substrate layer output by the composite mechanism (6) firstly enters a flat pressing die-cutting machine for carrying out flat pressing die cutting on another chip binding point (15) and a chip binding positioning point (14) or a circular knife die-cutting machine for carrying out circular knife die cutting, and then enters the flat pressing die-cutting machine for carrying out flat pressing die cutting on one chip binding point (15) or the circular knife die-cutting machine for carrying out circular knife die cutting.
12. A fully die-cut uhf rfid antenna as claimed in claim 10 or 11, wherein: the compound mechanism (6) is also provided with a heating drum for heating the adhesive; the composite mechanism (6) comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer of the first substrate layer.
13. The fully die-cut uhf electronic tag antenna of claim 12, wherein: the processing equipment further comprises a drying mechanism (3) used for drying the antenna layer coated with the adhesive by the coating mechanism (2) or a drying mechanism (3) used for drying the antenna layer coated with the adhesive by the coating mechanism (2) and compounded with the first substrate layer, wherein the drying mechanism (3) corresponds to an output port of the coating mechanism (2) and an input port of the antenna hole processing mechanism (4).
14. A processing technology of full-die-cut ultrahigh frequency electronic tag antenna is characterized by comprising the following steps: the production steps of the processing technology comprise that flat pressing die cutting and/or circular knife die cutting are carried out on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer through the first die cutting mechanism to form chip binding points (15) and/or chip binding positioning points (14).
15. A processing technology of full-die-cut ultrahigh frequency electronic tag antenna is characterized by comprising the following production steps:
firstly, a first unreeling mechanism (1) unreels an antenna layer to be processed or an antenna layer compounded with a first base material layer and carries out adhesive coating on one side of the antenna layer to be processed or one side, which is not adhered with the antenna layer, of the first base material layer in the antenna layer compounded with the first base material layer through a coating mechanism (2);
secondly, the antenna layer after being coated or the antenna layer after being coated and compounded with the first base material layer is subjected to antenna hole (16) punching through an antenna hole processing mechanism (4), and waste material antennas generated after punching or waste material antennas generated after punching and the waste material first base material layer enter an antenna hole (16) and a waste material collecting device (5);
thirdly, combining the antenna layer with the punched antenna hole (16) or the antenna layer of the composite first base material layer with the punched antenna hole (16) with the second base material layer of the second unreeling mechanism (7) through the composite mechanism (6), namely, bonding the second base material layer with the antenna layer or the first base material layer through an adhesive;
fourthly, performing flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer by the first die cutting mechanism to form a chip binding point (15) and a chip binding positioning point (14) on the antenna layer after the second substrate layer is compounded, performing flat pressing die cutting and/or circular knife die cutting on the antenna at the periphery of the antenna body (17) of the antenna layer by the second die cutting mechanism (10) to form the outer contour of the antenna body (17), and then forming the preliminarily formed antenna body (17) and the residual waste material antenna on the second substrate layer;
or the antenna layer after the second substrate layer and the first substrate layer are compounded is subjected to flat pressing die cutting and/or circular knife die cutting simultaneously by the first die cutting mechanism to form a chip binding point (15) and a chip binding positioning point (14), then the antenna and the first substrate layer at the periphery of the antenna layer antenna body (17) of the first substrate layer are subjected to die cutting and/or roll cutting by the second die cutting mechanism (10) to form the outer contour of the antenna body (17), and then the preliminarily molded antenna body (17) of the first substrate layer is formed on the second substrate layer, and the residual waste antenna and the corresponding residual waste first substrate layer are formed;
or the antenna layer after the second substrate layer is compounded is subjected to flat-pressing die cutting and/or circular knife die cutting on the antennas at the peripheral edge of the antenna body (17) of the antenna layer by the second die cutting mechanism (10) to form the outer contour of the antenna body (17), then is subjected to flat-pressing die cutting and/or circular knife die cutting on the antennas of the antenna layer by the first die cutting mechanism to form a chip binding point (15) and a chip binding positioning point (14), and then is subjected to primary forming on the second substrate layer to form the antenna body (17) and the residual waste material antennas;
or compounding the second substrate layer and the antenna layer of the first substrate layer, firstly carrying out flat pressing die cutting and/or circular knife die cutting on the antenna and the first substrate layer corresponding to the peripheral edge of the antenna body (17) of the antenna layer by using a second die cutting mechanism (10) to form the outline of the antenna body (17), then simultaneously carrying out flat pressing die cutting and/or circular knife die cutting on the antenna and the first substrate layer of the antenna layer by using the first die cutting mechanism to form a chip binding point (15) and a chip binding positioning point (14), and then forming the preliminarily molded antenna body (17) of the compounded first substrate layer on the second substrate layer, as well as the residual waste antenna and the corresponding residual waste first substrate layer;
fifthly, the residual waste material antenna or the residual waste material antenna and the corresponding residual waste material first substrate layer are coiled and discharged through a waste discharge coiling mechanism (11);
after the waste discharge, unwinding the isolation layer through a third unwinding mechanism (12) to cover the isolation layer on the antenna of the preliminarily molded antenna body (17) or on the first substrate layer;
and step seven, the antenna body (17) covered by the isolation layer is rolled by a finished product rolling mechanism (13) to form a die-cut ultrahigh frequency electronic tag antenna finished product.
16. The process of claim 15, wherein the step of die-cutting the UHF RFID tag antenna comprises the steps of: the antenna hole machining mechanism (4) punches the antenna hole (16) in the antenna layer and adopts a flat pressing die cutting process or a circular knife die cutting process.
17. The process of claim 16, wherein the step of processing the full-die cut UHF RFID tag antenna comprises the steps of: the coating mechanism (2) is used for coating the adhesive on the antenna layer or the first substrate layer and contains a diluting solvent.
18. The process for manufacturing a full-mold ultrahigh frequency electronic tag antenna according to claim 17, wherein the process comprises the following steps: and additionally arranging one step between the first step and the second step, drying the antenna layer coated with the adhesive or the antenna layer compounded with the first base material layer by using a drying mechanism (3), and then conveying the dried antenna layer or the antenna layer compounded with the first base material layer to an antenna hole machining mechanism (4) to punch the antenna hole (16).
19. The process of claim 18, wherein the step of processing the full-die cut UHF RFID tag antenna comprises the steps of: the temperature range of the drying mechanism (3) is 40-160 ℃.
20. The process of claim 19, wherein the step of die-cutting the UHF RFID tag antenna comprises the steps of: and the combining mechanism (6) in the third step is also provided with a heating drum, and the heating drum synchronously heats the adhesive on the antenna layer in the process that the antenna layer after the antenna hole (16) is punched or the antenna layer of the first base material layer is combined with the second base material layer unreeled by the second unreeling mechanism (7) through the combining mechanism (6).
21. The process of claim 20, wherein the step of die-cutting the UHF RFID tag antenna comprises the steps of: the temperature range of the heating drum is 50 to 200 ℃.
22. The process of any one of claims 14 to 21, wherein the step of die-cutting comprises the steps of: the first die-cutting mechanism performs one-time flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer and the first substrate layer compounded with the first substrate layer to form a chip binding point (15) and a chip binding positioning point (14);
or the first die cutting mechanism carries out two or more times of flat pressing die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer compounded with the first substrate layer and the first substrate layer to form a chip binding point (15) and a chip binding positioning point (14).
CN202010050631.XA 2020-01-17 2020-01-17 Full-die-cut ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof Active CN111275154B (en)

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CN111816998A (en) * 2020-06-15 2020-10-23 上海优比科电子科技有限公司 Forming method of high-frequency/ultrahigh-frequency die-cut antenna
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CN205486217U (en) * 2016-01-08 2016-08-17 深圳市远望谷信息技术股份有限公司 UHFRFID flexibility prevents tearing open electronic tags
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CN102272780A (en) * 2008-11-25 2011-12-07 艾利丹尼森公司 Method of making rfid devices
CN103367896A (en) * 2013-07-08 2013-10-23 温州格洛博电子有限公司 Environmental-friendly radio frequency antenna die cutting processing technique
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CN111816998A (en) * 2020-06-15 2020-10-23 上海优比科电子科技有限公司 Forming method of high-frequency/ultrahigh-frequency die-cut antenna
CN112850260A (en) * 2021-01-04 2021-05-28 深圳名彩智能卡有限公司 Labeler for producing RFID (radio frequency identification) labels
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