CN111252310A - Blotter placer is used in chip processing ejection of compact - Google Patents
Blotter placer is used in chip processing ejection of compact Download PDFInfo
- Publication number
- CN111252310A CN111252310A CN202010050393.2A CN202010050393A CN111252310A CN 111252310 A CN111252310 A CN 111252310A CN 202010050393 A CN202010050393 A CN 202010050393A CN 111252310 A CN111252310 A CN 111252310A
- Authority
- CN
- China
- Prior art keywords
- wall
- plate
- sliding
- cushion pad
- discharging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
- B65B61/20—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for adding cards, coupons or other inserts to package contents
- B65B61/22—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for adding cards, coupons or other inserts to package contents for placing protecting sheets, plugs, or wads over contents, e.g. cotton-wool in bottles of pills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B5/00—Packaging individual articles in containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, jars
- B65B5/10—Filling containers or receptacles progressively or in stages by introducing successive articles, or layers of articles
Abstract
The invention discloses a cushion pad placing device for chip processing and discharging, and belongs to the field of chip processing and discharging. The cushion pad placing device for chip processing and discharging comprises a fixed block and a bottom plate, wherein the fixed block is fixedly connected to the outer wall of the top of the bottom plate, a sliding groove is formed in the fixed block, and a cushion pad body is connected in the sliding groove; the top of the fixed block is connected with a baffle, a rack plate is connected in the baffle in a sliding manner, and the bottom of the rack plate is provided with a pressing plate; the disc is provided with a gear tooth meshed with the rack plate; the outer wall of the second fixing plate is also connected with a stepping motor; the inner wall of the bottom of the sliding groove is connected with a sliding block in a sliding mode, and an arc surface matched with the cushion body is arranged on the sliding block; the invention can avoid the chips from being stacked together to cause abrasion and scratch, enables the chips to be better used, improves the practical effect of the chips, does not need manual operation, improves the working efficiency and has convenient operation.
Description
Technical Field
The invention relates to the technical field of chip processing and discharging, in particular to a cushion pad placing device for chip processing and discharging.
Background
Chips, also known as microcircuits, microchips, integrated circuits, and the like, refer to silicon chips containing integrated circuits, are small in size, are often part of computers or other electronic devices, are used in various industries at present, and many substitute chips need to be installed and replaced after the service life of the chips is reached. However, each chip is still required to be powered on and burned after being welded to the PCB, and related programs are burned to the MCU in the chip, the chips in the prior art are usually directly dropped into the discharging frame after being burned, but the chips dropped into the discharging frame are easily scratched due to abrasion when being stacked together, thereby damaging the chips and affecting the using effect of the chips.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides a cushion pad placing device for chip processing and discharging.
In order to achieve the purpose, the invention adopts the following technical scheme:
the cushion pad placing device for chip processing and discharging comprises a fixed block and a bottom plate, wherein the fixed block is fixedly connected to the outer wall of the top of the bottom plate, a sliding groove is formed in the fixed block, a cushion pad body is connected in the sliding groove, and a collecting box corresponding to the sliding groove is arranged on the outer wall of the top of the bottom plate;
the top of the fixed block is connected with a baffle, a rack plate is connected in the baffle in a sliding manner, a pressing plate is arranged at the bottom of the rack plate, and the pressing plate abuts against the cushion body;
the outer wall of the top of the baffle is also respectively connected with two first fixing plates and two second fixing plates, a disc is rotatably connected between the two second fixing plates, and the disc is provided with a gear tooth meshed with the rack plate;
the outer wall of the second fixing plate is also connected with a stepping motor, and the disc is connected to the output end of the stepping motor;
the inner wall of the bottom of the sliding groove is connected with a sliding block in a sliding mode, and an arc surface matched with the cushion body is arranged on the sliding block.
Preferably, a gear is rotatably connected between the two first fixing plates, a handle is connected to the outer wall of the gear through a rotating shaft, and the gear is meshed with the rack plate.
Preferably, the outer wall of the rack plate is connected with a convex block, and the outer wall of the top of the baffle plate is connected with a fixed sleeve connected with the convex block in a sliding manner.
Preferably, the fixed block is further provided with a groove, one end, arranged in the groove, of the sliding block is connected with a sliding plate, and a spring is connected between the outer wall of the sliding plate and the inner wall of the groove.
Preferably, the outer wall of the fixed block is further connected with a connecting piece, a supporting rod is connected between the connecting piece and the bottom plate, and the bottom plate is further provided with a threaded hole.
Preferably, the outer wall of the fixed block is also provided with a feed inlet communicated with the chute.
Compared with the prior art, the invention provides a cushion pad placing device for chip processing and discharging, which has the following beneficial effects:
1. the buffer pad placing device for processing and discharging the chip is used, firstly, the bottom plate is placed at a proper position, so that the chip discharged after burning can fall into a collecting box on the bottom plate, then the buffer pad body is placed into the feeding hole through the sliding groove, the placed buffer pad body can fall in the sliding groove under the action of the sliding block and cannot fall down, then the stepping motor is started to drive the disc between the second fixing plates to rotate out, so that the gear teeth are meshed with the rack plate, the rack plate moves downwards, only one gear tooth is arranged, so that the rack plate can only move for a certain distance at each time, one buffer pad body is driven to push the sliding block, the sliding block moves, the buffer pad body falls into the collecting box, the sliding block can drive the sliding plate to move in the groove, and after the gear teeth are meshed with the rack plate, the spring can drive the sliding block to automatically reset, thereby supporting the next cushion body, avoiding continuous falling and being convenient for use.
The parts which are not involved in the device are the same as or can be realized by adopting the prior art, the invention can avoid the chips from being stacked together to cause abrasion and scratch, so that the chips can be better used, the practical effect of the chips is improved, meanwhile, manual operation is not needed, the working efficiency is improved, and the operation is convenient.
Drawings
Fig. 1 is a schematic structural diagram of a cushion pad placement device for chip processing and discharging according to the present invention;
FIG. 2 is a first schematic sectional structural diagram of a cushion pad placement device for chip processing and discharging according to the present invention;
FIG. 3 is a schematic sectional view of a second structural diagram of a device for placing a cushion pad for discharging and processing a chip according to the present invention;
FIG. 4 is a schematic structural diagram of a back side of a cushion pad placement device for chip processing and discharging according to the present invention;
FIG. 5 is a schematic structural view of a portion A in FIG. 2 of the cushion pad placement device for discharging in chip processing according to the present invention;
fig. 6 is a schematic structural diagram of a portion B in fig. 3 of a cushion pad placement device for chip processing and discharging according to the present invention.
In the figure: 1. a fixed block; 101. a chute; 102. a cushion body; 103. connecting sheets; 104. a slider; 105. a slide plate; 106. a spring; 107. a feed inlet; 2. a base plate; 201. a threaded hole; 202. a support bar; 3. a baffle plate; 301. fixing a sleeve; 4. a first fixing plate; 401. a gear; 402. a handle; 5. a second fixing plate; 501. a stepping motor; 502. a disc; 503. gear teeth; 6. a rack plate; 601. a bump; 602. pressing a plate; 7. and a collection box.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example (b):
referring to fig. 1-6, the cushion pad placing device for chip processing and discharging comprises a fixed block 1 and a bottom plate 2, wherein the fixed block 1 is fixedly connected to the outer wall of the top of the bottom plate 2, a sliding groove 101 is formed in the fixed block 1, a cushion pad body 102 is connected in the sliding groove 101, and a collecting box 7 corresponding to the sliding groove 101 is arranged on the outer wall of the top of the bottom plate 2;
the top of the fixed block 1 is connected with a baffle 3, a rack plate 6 is slidably connected in the baffle 3, the bottom of the rack plate 6 is provided with a pressing plate 602, and the pressing plate 602 abuts against the cushion pad body 102;
the outer wall of the top of the baffle 3 is also respectively connected with two first fixing plates 4 and two second fixing plates 5, a disc 502 is rotatably connected between the two second fixing plates 5, and the disc 502 is provided with a gear tooth 503 engaged with the rack plate 6;
the outer wall of the second fixing plate 5 is also connected with a stepping motor 501, and a disc 502 is connected to the output end of the stepping motor 501;
the inner wall of the bottom of the sliding groove 101 is connected with a sliding block 104 in a sliding manner, and the sliding block 104 is provided with an arc surface matched with the cushion pad body 102; the arc surface may facilitate the engagement of the cushion body 102 and the slide 104.
A gear 401 is rotatably connected between the two first fixing plates 4, the outer wall of the gear 401 is connected with a handle 402 through a rotating shaft, and the gear 401 is meshed with the rack plate 6; the handle 402 is rotated to drive the gear 401 to rotate, so that the gear 401 drives the rack plate 6 to ascend, the cushion body 102 can be put into the chute 101 through the feed port 107, and then the handle 402 is loosened to press the pressing plate 602 against the cushion body 102.
The outer wall of the rack plate 6 is connected with a convex block 601, and the outer wall of the top of the baffle plate 3 is connected with a fixed sleeve 301 which is connected with the convex block 601 in a sliding way; the retainer sleeve 301 allows the cam 601 to slide more smoothly, thereby allowing the rack plate 6 to move more smoothly.
The fixed block 1 is further provided with a groove, one end of the sliding block 104, which is arranged in the groove, is connected with a sliding plate 105, and a spring 106 is connected between the outer wall of the sliding plate 105 and the inner wall of the groove.
The outer wall of the fixed block 1 is also connected with a connecting piece 103, a supporting rod 202 is connected between the connecting piece 103 and the bottom plate 2, and the bottom plate 2 is also provided with a threaded hole 201; the bottom plate 2 can be conveniently fixed through the threaded hole 201.
The outer wall of the fixed block 1 is also provided with a feeding hole 107 communicated with the chute 101; the cushion body 102 can be conveniently inserted into the chute 101 through the feed opening 107.
When the device is used, firstly, the bottom plate 2 is placed at a proper position, so that a burned discharged chip can fall into the collecting box 7 on the bottom plate 2, then the cushion body 102 is placed into the chute 101 through the feed inlet 107, the cushion body 102 placed falls into the chute 101 under the action of the slide block 104 and cannot fall down, then the stepping motor 501 is started to drive the disc 502 between the second fixing plates 5 to rotate out, so that the gear teeth 503 are meshed with the rack plate 6, so that the rack plate 6 moves downwards, because only one gear tooth 503 is arranged, the rack plate 6 can only move for a certain distance each time, one cushion body 102 is driven to push the slide block 104, so that the slide block 104 moves, the cushion body 102 falls into the collecting box 7, the slide block 104 drives the slide plate 105 to move in the groove, when the gear teeth 503 are meshed with the rack plate 6, the spring 106 will drive it to automatically reset to abut against the next cushion body 102, so as to avoid continuous falling and facilitate use.
Preferably, the cushion pad placing device for processing and discharging chips of the present invention may further include a monitoring device for monitoring whether the cushion pad body 102 is abnormal when falling into the collection box 7. The monitoring device includes a weight sensor (not shown), a controller (not shown), and a switch (not shown). The weight sensor is disposed on the slider 104. The weight sensor is used for testing the weight of the cushion body 102 in the chute 101 and sending a monitored weight value to the controller. The switch is disposed at the feed port 107. The cushion body 102 can be activated to open and close each time the cushion body 102 is inserted into the chute 101 through the inlet 107. The weight sensor and the switch are respectively connected with the controller.
Each time the switch is triggered, the sensor will test the weight of the cushion body 102 in the test chute 101, and the resulting weight value is sent to the controller, which records the weight as a comparison weight Δ T. Then, when the cushion body 102 falls to the collection box 7 each time, the sensor tests the real-time weight T of the cushion body 102 in the test chute 101, and then the obtained real-time weight T is sent to the controller, and the real-time weight T of the controller is compared with the comparison weight Δ T. It is possible to judge whether or not an abnormality occurs when the sub cushion body 102 falls to the collection box 7 based on the result of the comparison. And if the judgment result shows that the abnormality does not occur according to the comparison result, the control chip takes the current real-time weight T as the comparison weight delta T and obtains the next real-time weight T again. If it is determined according to the comparison result that an abnormality occurs, for example, when the comparison result is smaller than a predetermined value, the number of the cushion bodies 102 falling this time is smaller than 1, the cushion bodies 102 may be jammed, and at this time, the cushion placing device for chip processing discharging needs to be stopped or suspended, and the cushion placing device for chip processing discharging needs to be started after the jammed cushion bodies 102 are taken out. When the comparison result is greater than the predetermined value, it indicates that two or more secondary cushion bodies 102 may be dropped at the same time, so as to take away the multi-dropped cushion bodies 102 and avoid the empty cushion bodies 102. Wherein the predetermined value may be the weight of one cushion body 102 or the sum of one cushion body 102 plus the weight of the chip falling thereon, allowing for error.
In addition, a weight sensor can be arranged in the collecting box 7, the weight tested by the sensor in the collecting box 7 can be transmitted to the controller, the controller can compare the weight tested by the sensor in the collecting box 7 with the weight tested on the sliding block 104, so that whether the cushion body 102 normally falls into the collecting box 7 can be judged more accurately, and whether each cushion body 102 normally buffers for a chip can be monitored through the change of data received by the sensor in the collecting box.
Whether the buffer pad body 102 is abnormal or not in the working process can be better monitored by arranging the monitoring device, so that the abnormity can be timely processed, and the working efficiency of the buffer pad placing device for chip processing and discharging is improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The cushion pad placing device for chip processing and discharging comprises a fixed block (1) and a bottom plate (2), and is characterized in that the fixed block (1) is fixedly connected to the outer wall of the top of the bottom plate (2), a sliding groove (101) is formed in the fixed block (1), a cushion pad body (102) is connected in the sliding groove (101), and a collecting box (7) corresponding to the sliding groove (101) is arranged on the outer wall of the top of the bottom plate (2);
the top of the fixed block (1) is connected with a baffle (3), a rack plate (6) is connected in the baffle (3) in a sliding mode, a pressing plate (602) is arranged at the bottom of the rack plate (6), and the pressing plate (602) abuts against the cushion pad body (102);
the outer wall of the top of the baffle (3) is also respectively connected with two first fixing plates (4) and two second fixing plates (5), a disc (502) is rotatably connected between the two second fixing plates (5), and the disc (502) is provided with a gear tooth (503) meshed with the rack plate (6);
the outer wall of the second fixing plate (5) is also connected with a stepping motor (501), and the disc (502) is connected to the output end of the stepping motor (501);
the inner wall of the bottom of the sliding groove (101) is connected with a sliding block (104) in a sliding mode, and an arc surface matched with the cushion body (102) is arranged on the sliding block (104).
2. The cushion pad placing device for chip processing and discharging of claim 1, wherein a gear (401) is rotatably connected between the two first fixing plates (4), a handle (402) is connected to the outer wall of the gear (401) through a rotating shaft, and the gear (401) is engaged with the rack plate (6).
3. The cushion pad placing device for chip processing and discharging as claimed in claim 2, wherein the outer wall of the rack plate (6) is connected with a projection (601), and the outer wall of the top of the baffle plate (3) is connected with a fixing sleeve (301) connected with the projection (601) in a sliding manner.
4. The cushion pad placing device for chip processing and discharging as claimed in claim 1, wherein the fixing block (1) is further provided with a groove, one end of the sliding block (104) placed in the groove is connected with a sliding plate (105), and a spring (106) is connected between the outer wall of the sliding plate (105) and the inner wall of the groove.
5. The cushion pad placing device for chip processing and discharging according to claim 1, wherein the outer wall of the fixing block (1) is further connected with a connecting piece (103), a supporting rod (202) is connected between the connecting piece (103) and the bottom plate (2), and the bottom plate (2) is further provided with a threaded hole (201).
6. The cushion pad placing device for chip processing and discharging as claimed in claim 5, wherein the outer wall of the fixing block (1) is further provided with a feeding hole (107) communicated with the chute (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010050393.2A CN111252310A (en) | 2020-01-17 | 2020-01-17 | Blotter placer is used in chip processing ejection of compact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010050393.2A CN111252310A (en) | 2020-01-17 | 2020-01-17 | Blotter placer is used in chip processing ejection of compact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111252310A true CN111252310A (en) | 2020-06-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010050393.2A Withdrawn CN111252310A (en) | 2020-01-17 | 2020-01-17 | Blotter placer is used in chip processing ejection of compact |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111252310A (en) |
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| NL8006144A (en) * | 1980-11-11 | 1982-06-01 | Moba Holding Barneveld Bv | Item supporting and release machine - has opposite hinging flaps swung apart to allow e.g. cardboard box blanks to drop through |
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| JP2000255523A (en) * | 1999-03-12 | 2000-09-19 | Ishii Ind Co Ltd | Article packaging apparatus |
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| CN102264602A (en) * | 2008-12-31 | 2011-11-30 | 施托奥皮克汉斯赖兴埃克有限公司 | Apparatus for dispensing and inserting packaging material in containers and method therefore |
| CN203612289U (en) * | 2013-05-29 | 2014-05-28 | 广东一鼎科技有限公司 | Device sleeving wrap angle materials on edges of object |
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| WO2017203169A1 (en) * | 2016-05-27 | 2017-11-30 | Gp System | Device and method for packing a cushioning element in a carton |
| CN109335708A (en) * | 2018-11-08 | 2019-02-15 | 华联机械集团有限公司 | It is a kind of for store sponge and can automatic blanking outbound device |
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2020
- 2020-01-17 CN CN202010050393.2A patent/CN111252310A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8006144A (en) * | 1980-11-11 | 1982-06-01 | Moba Holding Barneveld Bv | Item supporting and release machine - has opposite hinging flaps swung apart to allow e.g. cardboard box blanks to drop through |
| JPS63171714A (en) * | 1987-01-07 | 1988-07-15 | Ando Electric Co Ltd | Separate sendout device for case |
| EP0654668A1 (en) * | 1993-11-22 | 1995-05-24 | Fuji Photo Film Co., Ltd. | Chemical analysis element cartridge |
| JP3253809B2 (en) * | 1994-09-07 | 2002-02-04 | 富士写真フイルム株式会社 | Dry analytical film cartridge, method of assembling the same, and assembling jig |
| US5829631A (en) * | 1995-01-24 | 1998-11-03 | Algonquin Industries, Inc. | Apparatus for dispensing tickets, cards and the like from a stack |
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| EP1135318B1 (en) * | 1999-09-30 | 2003-12-10 | Japan Cash Machine Co., Ltd. | Bill stacker with an observation window |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200609 |