CN111215555A

CN111215555A - Pin bending device of IC chip pin processing machine

Info

Publication number: CN111215555A
Application number: CN202010099864.9A
Authority: CN
Inventors: 徐佳辉; 项家铭; 黄佳明
Original assignee: Hangzhou Dayi Technology Co Ltd
Current assignee: Hangzhou Dayi Technology Co Ltd
Priority date: 2020-02-18
Filing date: 2020-02-18
Publication date: 2020-06-02

Abstract

The invention relates to the technical field of electronic component processing. A pin bending device of an IC chip pin processing machine comprises a small-amplitude bending mechanism, a folding mechanism and an edge cutting mechanism; the small-amplitude bending mechanism, the folding mechanism and the edge cutting mechanism are sequentially arranged in parallel, and the folding mechanism is provided with two groups; the small-amplitude bending mechanism is used for bending the pins of the IC chip upwards by a small amplitude, the folding mechanism is used for folding the pins in sequence, and the edge cutting mechanism is used for cutting the connecting ribs and the redundant rim charge. According to the invention, by arranging the small-amplitude bending mechanism and the folding mechanism, two parts of the pins can be folded, the complicated shape bending can be completed, the problems of different bending amplitudes and uneven distribution of a plurality of parallel pins are avoided, and the flatness of the pins is improved.

Description

Pin bending device of IC chip pin processing machine

Technical Field

The invention relates to the technical field of electronic component processing, in particular to a pin bending device of an IC chip pin processing machine.

Background

Before the IC chip leaves the factory, the pins of the IC chip need to be cut, twisted, bent and other processing processes, how to better realize the feeding of the IC chip, how to clamp the IC chip and perform the cutting and bending of the pins, how to discharge the processed capacitor, and because the specific conditions of each enterprise are different, how to design one set of electronic component processing equipment which meets the self conditions of the enterprise, thereby improving the production efficiency and the yield, and being the technical problem which needs to be solved by a structure development engineer.

The invention discloses a patent with the publication number of CN109954823A and the patent name of automatic pin shearing and bending equipment, which comprises a coil feeding platform, a coil feeding power assembly, a single IC chip cutting assembly, a clamping jaw air cylinder assembly, a pin shearing and bending positioning assembly, a pin shearing assembly and a bending assembly, wherein the coil feeding platform, the coil feeding power assembly, the single IC chip cutting assembly, the clamping jaw air cylinder assembly, the pin shearing and bending positioning assembly, the pin shearing assembly and the bending assembly are arranged on a workbench; the pin shearing assembly and the bending assembly are arranged at two ends above the positioning platform; the clamping jaw air cylinder assembly is used for grabbing the cut single IC chip to the positioning platform, the pin cutting and bending positioning assembly is used for positioning the cut single IC chip, and the pin cutting assembly and the bending assembly are used for respectively cutting and bending two ends of the cut single IC chip. The large-batch production of this patent accords with each pin length IC chip that the in-service use needs, but the bending process of chip is comparatively simple.

Disclosure of Invention

The invention aims to solve the problems of uneven pin bending and poor bending quality of complex shapes in the pin processing of IC chips in the prior art, and provides a pin bending device of an IC chip pin processing machine, which can bend greatly, is suitable for complex shapes and has flat pins.

For the purpose of the invention, the following technical scheme is adopted for realizing the purpose: a pin bending device of an IC chip pin processing machine comprises a small-amplitude bending mechanism, a folding mechanism and an edge cutting mechanism; the small-amplitude bending mechanism, the folding mechanism and the edge cutting mechanism are sequentially arranged in parallel, and the folding mechanism is provided with two groups; the small-amplitude bending mechanism is used for bending the pins of the IC chip upwards by a small amplitude, the folding mechanism is used for folding the pins in sequence, and the edge cutting mechanism is used for cutting the connecting ribs and the redundant rim charge.

Preferably, the small-amplitude bending mechanism comprises a vertical seat, a fixed block, a lifting block, a top plate, a pressing column and a first air cylinder; the vertical seat is fixedly arranged on the rack, the fixed block is arranged at the top of the vertical seat, and the bottom surface of the end part of the fixed block is provided with an arch part; the lifting block is movably connected to the vertical seat through a slide rail, the top plate is installed on the lifting block, the upper end of the top plate is also provided with a convex edge, and the fixed block and the top plate are staggered; the pressing column is connected to the top plate through a spring and is positioned on the side of the top plate; the first cylinder is arranged on the vertical seat, and the telescopic end of the first cylinder is connected with the lifting block.

Preferably, the folding mechanism comprises a base, a swivel base, a bending block and a second air cylinder; the base is fixed below the rack, the swivel base is fixed above the rack, the fixed end of the second cylinder is hinged on the base, the telescopic end of the second cylinder is hinged with the bending block, balls are arranged on two sides of the bending block, the bending part of the bending block is arc-shaped, and a groove is formed in the arc surface; the bending part of the second bending block of the other group of folding mechanisms is planar; the rotating seat is provided with two concentric arc-shaped grooves, the edge of the rotating seat is provided with a fan-shaped notch, and two balls of the bending block are matched in the arc-shaped grooves.

The apparatus of claim, wherein the edge-cutting mechanism comprises a third cylinder, a bevel cutter, a moving groove, and a material-dropping cylinder; the third cylinder is obliquely arranged on the rack, the beveling knife is movably matched in the moving groove, the beveling knife is connected with the telescopic end of the third cylinder, the blanking barrel is arranged on the rack, and the blanking barrel is aligned to the cutting part of the beveling knife.

Preferably, when the device acts, the first cylinder drives the lifting block to extend upwards, the pressing column presses the pins firstly, and then the top plate continues to rise to act together with the fixing block to bend the pins to a smaller extent; the pins are folded in two steps, the pins are bent by the second bending block through ninety degrees from top to bottom, the pins are bent by the bending block through ninety degrees from top to bottom, the pins are folded, specifically, the second cylinder is contracted to enable the bending block to move along the arc-shaped groove, and the ends of the bending block press the pins to be forced to be bent; and finally, cutting redundant leftover materials, and driving the beveling cutter to extend out by a third cylinder to cut.

An IC chip pin processing machine comprises a rack, and a feeding device, a material passing device, a material moving device, a pin cutting device, a pin bending device and a bending device which are arranged on the rack; the feeding device is connected with the material passing device, the material moving device is positioned above the material passing device, the pin cutting device, the pin bending device and the bending device are arranged on the side of the material passing device, and the pin cutting device, the pin bending device and the bending device are sequentially arranged along the machining direction; the pin bending device adopts the pin bending device of the IC chip pin processing machine in the technical scheme.

Preferably, the feeding device is used for conveying a material belt loaded with the IC chips and separating the chips individually; the feeding device is used for feeding the IC chips among all stations; the material moving device is used for driving an IC chip in the material passing device, the pin cutting device is used for cutting pins at one end of the IC chip, and the pin bending device of the IC chip pin processing machine is used for bending one end of the IC chip; the bending device is used for bending the other end of the IC chip by the terminal and bending the IC chip to form the IC chip.

The pin bending device of the IC chip pin processing machine adopting the technical scheme has the advantages that: the small-amplitude bending mechanism and the folding mechanism are arranged, so that two parts of the pin can be folded, the complicated shape bending can be completed, the large-amplitude bending process is divided into two steps for avoiding cracking, the bending block with different profiles and the second bending block are arranged for bending, and the bending quality is high; through the process of bending first and then cutting, the problems that a plurality of pins which are parallel to each other are different in bending amplitude and uneven are solved, and the flatness of the pins is improved.

The bending pin cutter adopting the technical scheme has the advantages that: 1. the material passing device is provided with the multi-section combined material rail, the shape of the material rail is suitable for a specific process, the process of the IC chip is divided into a plurality of steps, the pin folding process with a complex shape can be completed, and the forming effect is good; the whole operation is completed on one material rail, the processing efficiency is high, and the IC chip does not need to be moved again; when the pin is bent and cut, the chip body is pressed through the pressing block and the pressing assembly, so that the chip body is prevented from shaking, and the production precision is improved. 2. The pin bending device can fold two parts of a pin by arranging a small-amplitude bending mechanism and a folding mechanism, can finish complicated shape bending, can be folded in two steps for avoiding cracking in a large-amplitude bending process, and is high in bending quality by arranging bending blocks with different profiles and a second bending block for bending; through the process of bending first and then cutting, the problems that a plurality of pins which are parallel to each other are different in bending amplitude and uneven are solved, and the flatness of the pins is improved.

Drawings

Fig. 1 is an exploded view of a chip pin processing machine according to an embodiment of the invention C.

Fig. 2 is an exploded view of the charging device.

Fig. 3 is an exploded view of the charging device.

Fig. 4 is a front view structural diagram of different material rails.

Fig. 5 is an exploded view of an embodiment of the present invention.

Fig. 6 is an exploded view of the transfer device.

Fig. 7 is an exploded view of the clubfoot device.

Fig. 8 is an exploded view of the bending apparatus.

FIG. 9 is a schematic diagram of an IC chip before and after processing.

Detailed Description

As shown in fig. 1, an IC chip pin processing machine comprises a frame 1, and a feeding device 2, a material passing device 3, a material moving device 4, a pin cutting device 5, a pin bending device 6 and a bending device 7 which are mounted on the frame 1; the feeding device 2 is connected with the material passing device 3, the material moving device 4 is located above the material passing device 3, the pin cutting device 5, the pin bending device 6 and the bending device 7 are installed on the side of the material passing device 3, and the pin cutting device 5, the pin bending device 6 and the bending device 7 are sequentially arranged along the machining direction.

The feeding device 2 is used for conveying a material belt loaded with IC chips to feed and separating the chips individually; the feeding device 3 is used for feeding the IC chips among all stations; the material moving device 4 is used for driving the IC chip in the material passing device 3, the pin cutting device 5 is used for cutting pins at one end of the IC chip, and the pin bending device 6 is used for bending one end of the IC chip; the bending device 7 is used for bending the other end of the IC chip by a terminal and bending the IC chip to form the IC chip. The pin cutting device 5 is a pin bending device of an IC chip pin processing machine.

As shown in fig. 9, the IC chip comprises two chip bodies 100 and two leads 200 at two ends, the two chip bodies 100 are connected to each other, and the IC chip has three bending portions, namely a first bending portion 300, a second bending portion 400 and a third bending portion 500. IC chip pin processing requires processing of the original IC chip a in fig. 9 into the state of diagram b.

As shown in fig. 2, the loading device 2 includes a base 21, a conveyor belt assembly 22, a material receiving plate 23, a lifting plate 24, a lifting cylinder 25 and a driving rod 26; the base 21 is fixedly arranged on the frame, the conveyer belt assembly 22 is arranged on the base 21, and the conveyer belt assembly 22 drives the belt through a motor to drive the chip material belt arranged on the belt to move; the material receiving plate 23 is arranged at the end part of the base 21, and the material receiving plate 23 is connected with the discharge end of the conveying belt assembly 22; the base 21 is provided with a barrier strip 212, the side of the base 21 is provided with a sliding groove seat 211, the lifting plate 24 is movably matched in the sliding groove seat 211, and the top end of the lifting plate 24 is provided with a corresponding groove which is adapted to the contour of the IC chip; the lifting cylinder 25 is fixedly arranged on the base 21, the telescopic end of the lifting cylinder 25 is connected with one end of the driving rod 26 in a groove pair mode, the other end of the driving rod 26 is provided with a ball, and the middle of the driving rod 26 is provided with a circular hole which is hinged on the base 21; the middle of the lifting plate 24 is provided with a rectangular hole, and the ball is positioned in the rectangular hole.

When the loading device 2 works, the conveyer belt assembly 22 drives the material belt of the IC chip to move, the lifting cylinder 25 drives the driving rod 26 to rotate, the lifting plate 24 is lifted, the IC chip is separated from the material belt by the upper end surface of the lifting plate 24, and the separated chip is placed on the material receiving plate 23.

As shown in fig. 3, the material passing device 3 includes a base 31, a material rail 32, a cover plate 33, a pressing block 34, a pressing assembly 35 and a discharging inclined rail 36; the base 31 is fixedly arranged on the frame, the material rail 32 is arranged on the base 31, and the material rail 32 is composed of a plurality of sections of material rails with different shapes and is suitable for different procedures; a plurality of stations are arranged on the material rail 32, and are a first cutting station 301, a prepressing station 302, a first bending station 303, a second bending station 304, a second cutting station 305 and a bending station 306 respectively; the cover plate 33 is fixed on the material rail 32, and the pressing block 34 is connected on the cover plate 33; the pressing block 34 corresponds to the second bending station 304 station, a spring is arranged between the pressing block 34 and the cover plate 33, and the spring lifts the pressing block 34 upwards; the pressing assembly 35 is mounted on the frame, corresponds to the second cutting station 305, and comprises a pressing cylinder 351, a lifting plate 352 and a pressing head 353; the lifting plate 352 is installed on the telescopic end of the pressing cylinder 351, a flange is arranged on the side of the top of the lifting plate 352, the pressure head 353 is positioned below the flange of the lifting plate 352, and the pressure head 353 is connected to the cover plate 33 at the second cutting station 305 through a spring; the discharge ramp 36 is mounted at an incline at the discharge end of the rail 32.

As shown in fig. 4, the material rail 32 includes a first material rail 331, a second material rail 332, a third material rail 333 and a fourth material rail 334; the first material rail 331 is provided with two horizontal pin placing parts 3312, the middle part of the first material rail 331 is provided with a vertical groove-shaped material pushing groove 3311, and the first material rail 331 is also provided with a chip placing part 3313; the second material rail 332 is provided with a triangular bending part 3321, and a pin at one end is pressed on an inclined part of the triangular bending part 3321 to realize bending; two deep grooves 3331 are formed in the third material rail 333, and the deep grooves 3331 are used for the bent pins to move through; a groove is formed in the middle of the fourth material rail 334, and the bent chip is placed in the groove.

When the material passing device 3 works, the IC chip is placed on the material rail 32, moves in the material rail 32 connected in sequence, and completes corresponding operations in sequence at the first cutting station 301, the pre-pressing station 302, the first bending station 303, the second bending station 304, the second cutting station 305 and the bending station 306, and the IC chip slides out at the tail end of the material rail 32 through the discharging inclined rail 36.

The material passing device 3 solves the problems that the IC chip bending and pin shearing processes are complex, and the circulating material passing is difficult to unify; by arranging the multi-section combined type material rail 32, the shape of the material rail is suitable for a specific process, the process of the IC chip is divided into a plurality of process steps, the pin folding process with a complex shape can be completed, and the forming effect is good; one material rail 32 completes all operations, the processing efficiency is high, and the IC chip does not need to be moved again; when the pin is bent and cut, the chip body is pressed through the pressing block 34 and the pressing assembly 35, so that the chip body is prevented from shaking, and the production precision is improved.

As shown in fig. 5, the material moving device 4 includes a support 41, a longitudinal moving cylinder 42, a transverse moving cylinder 43, an intermediate plate 44, a driving insert 45, a mounting rod 46 and a second pressing assembly 47; the longitudinal moving cylinder 42 is arranged on the support 41, the middle plate 44 is movably connected on the support 41 through a sliding rail, and the telescopic end of the longitudinal moving cylinder 42 is connected with the middle plate 44; the mounting rod 46 is movably connected to the middle plate 44 through a sliding rail, the transverse moving cylinder 43 is mounted on the middle plate 44, and the telescopic end of the transverse moving cylinder 43 is connected with the mounting rod 46; a plurality of uniform driving cuttings 45 are arranged, and rectangular grooves are formed in the lower end portions of the driving cuttings 45; the second pressing assembly 47 is disposed on the support 41.

When the material moving device 4 works, the longitudinal moving cylinder 42 and the transverse moving cylinder 43 act together to enable the working track of the driving cutting 45 to be rectangular, the driving cutting 45 descends and is sleeved on the chip to gradually push the chip to move.

As shown in fig. 6, the foot cutting device 5 comprises a support plate 51, a chute 52, a cutting cylinder 53, a cutter 54 and a backing plate 55; the sliding groove 52 is arranged on the side of the support plate 51, the backing plate 55 is fixedly arranged on the sliding groove 52, the cutter 54 is matched in the sliding groove 52, the lower end of the cutter 54 is provided with a cutting edge, and the cutting edge is tightly attached to the backing plate 55; the cutting cylinder 53 is arranged on the support plate 51, and the telescopic end of the cutting cylinder 53 is connected with the cutter 54.

As shown in fig. 7, the pin bending device of the IC chip pin processing machine includes a small-width bending mechanism 61, a folding mechanism 62 and an edge cutting mechanism 63; the small-amplitude bending mechanism 61, the folding mechanism 62 and the edge cutting mechanism 63 are sequentially arranged side by side, and two groups of folding mechanisms 62 are arranged; the small-amplitude bending mechanism 61 is used for bending the pins of the IC chip upwards by a small amplitude, the folding mechanism 62 is used for sequentially folding the pins, and the edge cutting mechanism 63 is used for cutting the connecting ribs and the redundant rim charge.

The small-amplitude bending mechanism 61 comprises a vertical seat 611, a fixed block 612, a lifting block 613, a top plate 614, a pressing column 615 and a first air cylinder 616; the vertical seat 611 is fixedly arranged on the frame, the fixed block 612 is arranged at the top of the vertical seat 611, and the bottom surface of the end part of the fixed block 612 is provided with an arch part 6121; the lifting block 613 is movably connected to the vertical base 611 through a slide rail, the top plate 614 is mounted on the lifting block 613, the upper end of the top plate 614 is also provided with a rib 6141, and the fixed block 612 and the top plate 614 are staggered; the pressing column 615 is connected to the top plate 614 through a spring, and the pressing column 615 is located on the side of the top plate 614; the first cylinder 616 is installed on the vertical base 611, and the telescopic end of the first cylinder 616 is connected with the lifting block 613.

The folding mechanism 62 comprises a base 621, a rotary seat 622, a bending block 623 and a second air cylinder 624; the base 621 is fixed below the rack, the rotating seat 622 is fixed above the rack, the fixed end of the second air cylinder 624 is hinged on the base 621, the telescopic end of the second air cylinder 624 is hinged with the bending block 623, two sides of the bending block 623 are provided with balls 6231, the bending part of the bending block 623 has a certain arc shape, and a groove is formed in the arc surface; the bending part of the second bending block 625 of the other group of folding mechanisms 62 is planar, and the two groups of folding mechanisms 62 are provided with the bending blocks 623 and the second bending block 625 with different shapes so as to better adapt to the distributed bending process; the rotating seat 622 is provided with two concentric arc-shaped grooves 6221, the edge of the rotating seat 622 is provided with a fan-shaped notch 6222, and the two balls of the bending block 623 are matched in the arc-shaped grooves 6221.

The edge cutting mechanism 63 comprises a third cylinder 631, a beveling knife 632, a moving tank 633 and a blanking cylinder 634; the third cylinder 631 is obliquely installed on the frame, the oblique cutting knife 632 is movably engaged in the moving groove 633, the oblique cutting knife 632 is connected with the telescopic end of the third cylinder 631, the blanking cylinder 634 is installed on the frame, and the blanking cylinder 634 is aligned with the blade of the oblique cutting knife 632.

When the pin bending device of the IC chip pin processing machine works, firstly, small-amplitude bending is carried out, the first air cylinder 616 drives the lifting block 613 to extend upwards, the pressing column 615 presses the pins firstly, then the top plate 614 continuously rises to jointly act with the fixing block 612, and the pins are bent to a small amplitude; then, the pins are folded in two steps, the pins are bent by ninety degrees from top to bottom by the second bending block 625, the pins are bent by ninety degrees from top to bottom by the bending block 623, the folding is realized, specifically, the second cylinder 624 contracts, so that the bending block 623 moves along the arc-shaped groove 6221, and the ends of the bending block 623 press the pins to be bent forcibly; finally, redundant leftover materials are cut, and the inclined cutter 632 is driven by the third cylinder 631 to stretch out for cutting.

The pin bending device solves the problems of uneven pin bending and poor bending quality of complex shapes, two parts of the pin can be folded by arranging the small-amplitude bending mechanism 61 and the folding mechanism 62, more complex shape bending can be completed, and for a large-amplitude bending process, in order to avoid cracking, the pin can be folded by two steps, and the pin bending device is provided with the bending block 623 and the second bending block 625 with different profiles for bending, so that the bending quality is high; through the process of bending first and then cutting, the problems that a plurality of pins which are parallel to each other are different in bending amplitude and uneven are solved, and the flatness of the pins is improved.

As shown in fig. 8, the bending device 7 includes a first right-angle bending mechanism 71, a second right-angle bending mechanism 72, a cutting mechanism 73, and a chip body bending mechanism 74; the first right-angle bending mechanism 71, the second right-angle bending mechanism 72 and the chip body bending mechanism 74 are identical in principle, and components in contact with the chip are arranged into three specific shapes to respectively complete first right-angle bending, second right-angle bending and chip body bending. The first right-angle bending mechanism 71 and the second right-angle bending mechanism 72 are provided with a clamping assembly 75 for clamping a chip.

When the bending device 7 is in operation, the first right-angle bending mechanism 71 bends the end pins of the chip by ninety degrees, the second right-angle bending mechanism 72 bends the pins by ninety degrees again, the cutting mechanism 73 cuts the ends of the pins, and finally the body of the IC chip is bent.

When the IC chip pin processing machine works, the IC chip pin processing machine sequentially carries out processing through the following steps:

chip feeding: the conveyor belt assembly 22 drives the material belt of the IC chip to move, the lifting cylinder 25 drives the driving rod 26 to rotate, the lifting plate 24 is lifted, the IC chip is separated from the material belt by the upper end face of the lifting plate 24, the separated chip is placed on the material receiving plate 23 to enter the material passing device 3 and is driven by the material moving device 4;

(II) bending and cutting pins at one end of the chip: firstly, the first air cylinder 616 drives the lifting block 613 to extend upwards, the pressing column 615 presses the pins firstly, and then the top plate 614 continuously rises to cooperate with the fixing block 612 to bend the pins to a smaller extent; then, the pins are folded in two steps, the pins are bent by ninety degrees from top to bottom by the second bending block 625, the pins are bent by ninety degrees from top to bottom by the bending block 623, the folding is realized, specifically, the second cylinder 624 contracts, so that the bending block 623 moves along the arc-shaped groove 6221, and the ends of the bending block 623 press the pins to be bent forcibly; finally, cutting the redundant leftover materials, wherein the third cylinder 631 drives the inclined cutter 632 to extend out for cutting;

(III) bending and cutting the pin at the other end of the chip: firstly, bending pins at the end part of a chip by ninety degrees by a first right-angle bending mechanism 71, then bending the pins by ninety degrees again by a second right-angle bending mechanism 72, and then cutting the tail ends of the pins by a cutting mechanism 73;

(IV) bending the chip body: the chip body on one side is fixed to the feeding device 3, and the chip body on the other side is bent by the chip body bending mechanism 74.

Claims

1. A pin bending device of an IC chip pin processing machine is characterized by comprising a small-amplitude bending mechanism (61), a folding mechanism (62) and an edge cutting mechanism (63); the small-amplitude bending mechanism (61), the folding mechanism (62) and the edge cutting mechanism (63) are sequentially arranged side by side, and two groups of folding mechanisms (62) are arranged; the small-amplitude bending mechanism (61) is used for bending the pins of the IC chip upwards by a small amplitude, the folding mechanism (62) is used for sequentially folding the pins, and the edge cutting mechanism (63) is used for cutting the connecting ribs and the redundant rim charge;

the small-amplitude bending mechanism (61) comprises a vertical seat (611), a fixed block (612), a lifting block (613), a top plate (614), a pressing column (615) and a first air cylinder (616); the vertical seat (611) is fixedly arranged on the rack, the fixed block (612) is arranged at the top of the vertical seat (611), and the bottom surface of the end part of the fixed block (612) is provided with an arch part (6121); the lifting block (613) is movably connected to the vertical base (611) through a sliding rail, the top plate (614) is installed on the lifting block (613), the upper end of the top plate (614) is also provided with a rib (6141), and the fixed block (612) and the top plate (614) are staggered; the pressing column (615) is connected to the top plate (614) through a spring, and the pressing column (615) is located on the side of the top plate (614); the first air cylinder (616) is arranged on the vertical seat (611), and the telescopic end of the first air cylinder (616) is connected with the lifting block (613).

2. The pin bending apparatus for an IC chip pin processing machine as claimed in claim 1, wherein said folding mechanism (62) comprises a base (621), a rotatable base (622), a bending block (623) and a second cylinder (624); the base (621) is fixed below the rack, the rotating seat (622) is fixed above the rack, the fixed end of the second air cylinder (624) is hinged to the base (621), the telescopic end of the second air cylinder (624) is hinged to the bending block (623), balls (6231) are arranged on two sides of the bending block (623), the bending part of the bending block (623) is arc-shaped, and a groove is formed in the arc surface; the bending part of the second bending block (625) of the other group of folding mechanisms (62) is planar; the rotating seat (622) is provided with two concentric arc-shaped grooves (6221), the edge of the rotating seat (622) is provided with a fan-shaped notch (6222), and two balls of the bending block (623) are matched in the arc-shaped grooves (6221).

3. The pin bending device of an IC chip pin processing machine according to claim 1 or 2, wherein the edge cutting mechanism (63) comprises a third cylinder (631), a beveling knife (632), a moving tank (633) and a blanking cylinder (634); the third cylinder (631) is obliquely arranged on the frame, the oblique cutting knife (632) is movably matched in the moving groove (633), the oblique cutting knife (632) is connected with the telescopic end of the third cylinder (631), the charging barrel (634) is arranged on the frame, and the charging barrel (634) is aligned with the blade part of the oblique cutting knife (632).

4. The pin bending device of an IC chip pin processing machine according to claim 1, 2 or 3, wherein when the pin bending device is operated, the first air cylinder (616) drives the lifting block (613) to extend upwards, the pressing column (615) presses the pin first, and then the top plate (614) continues to rise to cooperate with the fixing block (612) to bend the pin to a smaller extent; then the pins are folded in two steps, the pins are bent by ninety degrees from top to bottom by the second bending block (625), the pins are bent by ninety degrees from top to bottom by the bending block (623), the folding is realized, specifically, the pins are contracted by the second cylinder (624), the bending block (623) moves along the arc-shaped groove (6221), and the ends of the bending block (623) press the pins to be forced to bend; finally, redundant leftover materials are cut, and the inclined cutter (632) is driven by the third cylinder (631) to stretch out for cutting.

5. The IC chip pin processing machine is characterized by comprising a rack (1), and a feeding device (2), a material passing device (3), a material moving device (4), a pin cutting device (5), a pin bending device (6) and a bending device (7) which are arranged on the rack (1); the bending foot device (6) is according to any of claims 1-4.

6. The IC chip pin processing machine according to claim 5, wherein the loading device (2) is used for conveying a material belt loaded with IC chips and separating the chips individually; the feeding device (3) is used for feeding the IC chips among all stations; the material moving device (4) is used for driving the IC chip in the material passing device (3), the pin cutting device (5) is used for cutting pins at one end of the IC chip, and the pin bending device of the IC chip pin processing machine is used for bending one end of the IC chip; the bending device (7) is used for bending the other end of the IC chip by a terminal and bending the IC chip to form the IC chip.