CN111191763A - A fast customized full-function modular combined RFID compound machine and its workflow - Google Patents
A fast customized full-function modular combined RFID compound machine and its workflow Download PDFInfo
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- CN111191763A CN111191763A CN202010163566.1A CN202010163566A CN111191763A CN 111191763 A CN111191763 A CN 111191763A CN 202010163566 A CN202010163566 A CN 202010163566A CN 111191763 A CN111191763 A CN 111191763A
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
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Abstract
The invention discloses a rapid customization full-function module combined RFID compound machine and a working process thereof, and aims to solve the problem that the conventional mechanical equipment cannot manufacture a customized RFID electronic tag. This product includes the frame, the frame is at least three-layer, all installs the automation that links to each other through the conveyer belt module each other in each layer frame and rectifies to receive and unreel module, traction module, rubber coating module, cross cutting module and decide and change a module, still installs folding module, chip detection module, defective products sign module and branch strip module that link to each other through the conveyer belt module each other in the frame. People can install different modules in the frame according to own user demand, and through the cooperation of each part, the finished product can realize the encapsulation of upper and lower layer printed matter rubber coating chip, upper and lower layer printed matter area glued chip etc. satisfies people's different user demands, and each module can the independent assortment, is applicable to different technological requirements.
Description
Technical Field
The invention relates to the field of label production and packaging, in particular to a rapid customized full-function module combined RFID compound machine.
Background
The RFID (Radio Frequency Identification) is an abbreviation of Radio Frequency Identification, and the principle is that non-contact data communication is carried out between a reader and a label to achieve the aim of identifying a target. The RFID electronic tag is widely applied, and the typical applications include animal wafers, automobile wafer burglar alarms, entrance guard control, parking lot control, production line automation and material management.
The customization of the RFID electronic tag is a development trend, and the existing mechanical equipment cannot manufacture the customized RFID electronic tag according to different process requirements, so that troubles are brought to the use of people.
Disclosure of Invention
An embodiment of the present invention provides a rapid customized full-function module combined RFID compound machine, so as to solve the problems in the background art.
In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions:
the utility model provides a quick customization full function module combination formula RFID compounding machine, which comprises a frame, the frame is at least three-layer, all installs the automatic deviation rectification who links to each other through the conveyer belt module each other in every layer frame and receive and unreel the module, traction module, rubber coating module, cross cutting module and decide and change the module of pasting, still install the folding module that links to each other through the conveyer belt module each other in the frame, chip detection module, defective products identification module and branch strip module, people only need put different raw materialss in the frame of different layers, can realize automatic encapsulation, satisfy different demands.
As a further scheme of the embodiment of the invention: the rack is made of stainless steel materials, raw materials are easy to obtain, processing is convenient, and the service life is long.
As a further scheme of the embodiment of the invention: and each layer of rack is provided with a manual axial deviation rectifying winding and unwinding module which can wind different waste materials.
As a further scheme of the embodiment of the invention: the model of the die cutting module is dz200 of Xin Fengda company, the model of the gluing module is JT02 of Huano company, the die cutting module is easily obtained in the market, and the using effect is good.
As a further scheme of the embodiment of the invention: still install external module of rectifying in the frame, can rectify once more, ensure that the finished accuracy is good.
As a further scheme of the embodiment of the invention: the conveyer belt module includes conveyer belt, frame and motor, and motor and conveyer belt are all installed on the frame and motor drive conveyer belt work.
As a further scheme of the embodiment of the invention: the gluing module comprises a main body, a gluing roller and a gluing motor, wherein the gluing roller and the gluing motor are both arranged on the main body, and the output end of the gluing motor is connected with the gluing roller.
The work flow of the rapid customization full-function module combined type RFID compound machine specifically comprises the following steps:
step one, gluing chips of upper and lower layers of printed matters for packaging: the lower layer of printing material is coated with glue and cut and pasted with a module through an automatic deviation rectifying winding and unwinding module, a traction module and a gluing module, a chip is compounded with the lower layer of printing material after passing through the automatic deviation rectifying winding and unwinding module, the traction module and the cutting and pasting module, the upper layer of printing material is compounded with the lower layer of printing material after passing through the automatic deviation rectifying winding and unwinding module, the traction module, the gluing module and the die cutting module to obtain a semi-finished product, the semi-finished product is subjected to die cutting through the die cutting module, a chip detection module detects a chip, a defective product identification module sprays the code and strips are divided through a strip dividing module, and then the;
step two, packaging the upper and lower layers of printed products with adhesive chips: the lower layer of printing material is compounded with the lower layer of printing material after passing through the automatic deviation rectifying winding and unwinding module, the die cutting module, the cutting transfer module and the die cutting module, the double faced adhesive tape is compounded with the lower layer of printing material after passing through the automatic deviation rectifying winding and unwinding module, the traction module and the cutting transfer module, the upper layer of printing material is compounded with the upper layer of printing material after passing through the automatic deviation rectifying winding and unwinding module, the traction module and the die cutting module, the double faced adhesive tape is subjected to die cutting by the die cutting module, the chip detection module detects chips, the defective product identification module codes and the strip dividing module divides the strips, and then the semi-finished product is rolled;
step three, packaging and folding the upper and lower layer printed matter gluing chips: the lower layer of printing material is compounded with the lower layer of printing material after passing through the automatic deviation rectifying winding and unwinding module, the traction module and the cutting transferring module, and the upper layer of printing material is compounded with the lower layer of printing material after passing through the automatic deviation rectifying winding and unwinding module, the traction module, the gluing module, the die cutting module, the folding module, the chip detection module, the defective product identification module, the code spraying module, the strip dividing module and the winding module to obtain a semi-finished product;
step four, gluing the upper and lower layers of printed matters, and packaging the printed matters by a lining paper chip: the lower printing material is compounded with the upper printing material after passing through an automatic deviation rectifying winding and unwinding module, a traction module, a gluing module, a cutting transfer module and a die cutting module, a lining paper is compounded with the lower printing material after passing through the automatic deviation rectifying winding and unwinding module, the die cutting module and the cutting transfer module, double-faced adhesive tape is compounded with the lining paper and die cutting module after passing through the die cutting module, double-faced adhesive tape covering paper is wound by the automatic deviation rectifying winding and unwinding module, a chip is compounded with the lower printing material after passing through the automatic deviation rectifying winding and unwinding module, the traction module, the gluing module and the die cutting module, the upper printing material is compounded with the lower printing material after passing through the automatic deviation rectifying winding and unwinding module, the traction module, the gluing module and the die cutting module to obtain a semi-finished product, the semi-finished product is die-cut by the die cutting module, a chip detection module detects the chip, a defective, and then rolling up.
Compared with the prior art, the embodiment of the invention has the beneficial effects that:
this product reasonable in design, easy operation, people can be according to the user demand of oneself with different module mounting in the frame, and through the cooperation of each part, the encapsulation of upper and lower floor printed matter rubber coating chip, upper and lower floor printed matter area rubber coating chip etc. can be realized to the finished product, satisfies people's different user demands, and each module can the independent assortment, is applicable to different technological requirements, and application prospect is wide.
Drawings
Fig. 1 is a schematic structural diagram of a rapid customized full-function module combined RFID compound machine.
Fig. 2 is a schematic structural diagram of a manual axial deviation rectifying winding and unwinding module in a rapid customized full-function module combined RFID compound machine.
Fig. 3 is a front view of an automatic deviation rectifying winding and unwinding module in a rapid customized full-function module combined RFID compound machine.
Fig. 4 is a side view of an automatic deviation rectifying winding and unwinding module in a rapid customized full-function module combined RFID compound machine.
FIG. 5 is a front view of an external deskew module in a rapid customization full function module combination RFID compound machine.
FIG. 6 is a side view of an external deskew module in a rapid customization full function module combination RFID compound machine.
FIG. 7 is a schematic diagram of the die cut module configuration in a rapid custom full function modular combination RFID compound machine.
Fig. 8 is a schematic structural diagram of a cutting and transferring module in a rapid customized full-function module combined RFID compound machine.
Fig. 9 is a front view of a tractor module in a rapid customization full function module combination RFID compounding machine.
Fig. 10 is a side view of a tractor module in a rapid customization full function modular combination RFID compounding machine.
Fig. 11 is a schematic diagram of a glue module in a rapid customization full function module combined RFID compound machine.
Fig. 12 is a front view of a folding module in a rapid customization full function module combination RFID compounding machine.
Fig. 13 is a side view of a folding module in a rapid customization full function module combination RFID compounding machine.
Fig. 14 is a schematic diagram of a conveyor module in a rapid customization full function modular combined RFID compounding machine.
Fig. 15 is a front view of a striping module in a rapid customization full function module combination RFID compound machine.
Fig. 16 is a side view of a striping module in a rapid customization full function module combination RFID compound.
Wherein: the automatic deviation rectifying and unwinding device comprises a machine frame 1, a manual axial deviation rectifying and unwinding module 2, an automatic deviation rectifying and unwinding module 3, an external deviation rectifying module 4, a die cutting module 5, a cutting and transferring module 6, a traction module 7, a gluing module 8, a folding module 9, a chip detection module 10, a defective product identification module 12, a conveying belt module 13 and a strip dividing module 14.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Example 1
The utility model provides a quick customization full function module combination formula RFID compounding machine, which comprises a frame 1, frame 1 is at least three-layer, all install the automation that links to each other through conveyer belt module 13 on every layer frame 1 and rectify and receive unreel module 3, traction module 7, rubber coating module 8, cross cutting module 5 and decide and change a module 6, still install folding module 9 that links to each other through conveyer belt module 13 each other on frame 1, chip detection module 10, defective products sign module 12 and branch strip module 14, people only need put different raw materialss on the frame 1 of different layers, can realize automatic encapsulation, satisfy different demands.
In order to ensure the service life, the rack 1 is made of stainless steel materials, and the raw materials are easy to obtain and convenient to process.
Furthermore, each layer of the rack 1 is provided with a manual axial deviation rectifying winding and unwinding module 2, so that different waste materials can be wound.
Further, the conveyor belt module 13 includes a conveyor belt, a frame and a motor, wherein the motor and the conveyor belt are both installed on the frame and the motor drives the conveyor belt to work.
The work flow of the rapid customization full-function module combined type RFID compound machine specifically comprises the following steps:
step one, gluing chips of upper and lower layers of printed matters for packaging: the lower layer printing material is subjected to gluing and cutting and transferring module 6 through the automatic deviation rectifying reeling and unreeling module 3, the traction module 7 and the cutting and transferring module 6, and then is compounded with the lower layer printing material, the upper layer printing material is subjected to gluing and die cutting 5 through the automatic deviation rectifying reeling and unreeling module 3, the traction module 7 and the gluing module 8, and then is compounded with the lower layer printing material to obtain a semi-finished product, and the semi-finished product is subjected to die cutting through the die cutting module 5 (outer frame waste is rolled up by the manual axial deviation rectifying reeling and unreeling module 2), a chip detection module 10 detects a chip, a defective product identification module 12 sprays codes and a slitting module 14 slits, and then is rolled up;
step two, packaging the upper and lower layers of printed products with adhesive chips: the lower layer of printing material is subjected to automatic deviation rectifying winding and unwinding module 3, die cutting module 5, cutting transfer module 6 and die cutting module 5, double faced adhesive tape is compounded with the lower layer of printing material (upper layer of double faced adhesive tape cover paper is coiled by manual axial deviation rectifying winding and unwinding module 2) after passing through automatic deviation rectifying winding and unwinding module 3 (lower layer of double faced adhesive tape cover paper is coiled by manual axial deviation rectifying winding and unwinding module 2) and die cutting module 5, a chip is compounded with the lower layer of printing material after passing through automatic deviation rectifying winding and unwinding module 3, traction module 7 and cutting transfer module 6, the upper layer of printing material is compounded with the upper layer of printing material after passing through automatic deviation rectifying winding and unwinding module 3 (lower layer of double faced adhesive tape cover paper is coiled by manual axial deviation rectifying winding and unwinding module 2) and traction module 7 to obtain a semi-finished product, and the semi-finished product is die cut by module 5 (waste material is coiled by manual axial deviation rectifying winding and unwinding module 2), The chip detection module 10 detects the chips, the defective product identification module 12 codes the chips, the striping module 14 strips the chips, and then the chips are wound;
step three, packaging and folding the upper and lower layer printed matter gluing chips: the lower layer printing material is coated with glue and cut and pasted on the module 6 after passing through the automatic deviation rectifying winding and unwinding module 3, the traction module 7 and the cut and pasted on the module 6, and then is compounded with the lower layer printing material, the upper layer printing material is coated with glue and cut on the lower layer printing material after passing through the automatic deviation rectifying winding and unwinding module 3, the traction module 7, the gluing module 8 and the die cutting module 5, and then is compounded with the lower layer printing material to obtain a semi-finished product, the semi-finished product is die-cut by the die cutting module 5 (outer frame waste is rolled by the manual axial deviation rectifying winding and unwinding module 2), the folding module 9 is folded, the chip detection module 10 detects a chip, the defective product identification module 12 sprays a code and the strip dividing module 14 divides strips, and then is rolled;
step four, gluing the upper and lower layers of printed matters, and packaging the printed matters by a lining paper chip: lower printing material is subjected to automatic deviation rectifying, winding and unwinding module 3, traction module 7, gluing module 8, cutting, transferring and pasting module 6 and die cutting module 5, and then compounded with upper printing material, lining paper is subjected to automatic deviation rectifying, winding and unwinding module 3, die cutting module 5 and cutting, transferring and pasting module 6, and then compounded with lower printing material, double-faced adhesive tape is subjected to manual axial deviation rectifying, winding and unwinding module 2, die cutting module 5 is compounded with lining paper, die cutting module 5 is subjected to die cutting, double-faced adhesive tape covering paper is wound by automatic deviation rectifying, winding and unwinding module 3, a chip is subjected to automatic deviation rectifying, winding and unwinding module 3, traction module 7 and cutting, transferring and pasting module 6, and then compounded with lower printing material, upper printing material is subjected to automatic deviation rectifying, winding and unwinding module 3, traction module 7, gluing module 8 gluing and die cutting module 5, and then compounded with lower printing material to obtain semi-finished product, and semi-finished product is die-cut by module 5 (waste material is wound by manual axial deviation rectifying, the chip detection module 10 detects chips, the defective product identification module 12 codes the chips, the striping module 14 strips the chips, and then the chips are rolled.
Example 2
The utility model provides a quick customization full function module combination formula RFID compounding machine, which comprises a frame 1, frame 1 is at least three-layer, all install the automation that links to each other through conveyer belt module 13 on every layer frame 1 and rectify and receive unreel module 3, traction module 7, rubber coating module 8, cross cutting module 5 and decide and change a module 6, still install folding module 9 that links to each other through conveyer belt module 13 each other on frame 1, chip detection module 10, defective products sign module 12 and branch strip module 14, people only need put different raw materialss on the frame 1 of different layers, can realize automatic encapsulation, satisfy different demands.
In order to ensure the accuracy of the finished product, the frame 1 is also provided with an external deviation rectifying module 4 which can rectify the deviation again.
Further, the gluing module 8 comprises a main body, a gluing roller and a gluing motor, wherein the gluing roller and the gluing motor are both arranged on the main body, and the output end of the gluing motor is connected with the gluing roller.
The work flow of the rapid customization full-function module combined type RFID compound machine specifically comprises the following steps:
step one, gluing chips of upper and lower layers of printed matters for packaging: the lower layer printing material is subjected to gluing and cutting and transferring module 6 through the automatic deviation rectifying reeling and unreeling module 3, the traction module 7 and the gluing module 8, the chip is compounded with the lower layer printing material after passing through the automatic deviation rectifying reeling and unreeling module 3, the traction module 7 and the cutting and transferring module 6, the upper layer printing material is compounded with the lower layer printing material after passing through the automatic deviation rectifying reeling and unreeling module 3, the traction module 7, the gluing module 8, the gluing module 5 and the die cutting module 5 to obtain a semi-finished product, the semi-finished product is subjected to die cutting through the die cutting module 5, a chip is detected by the chip detection module 10, a code is sprayed by the defective product identification module 12, the strip is separated by the strip separation module 14;
step two, packaging the upper and lower layers of printed products with adhesive chips: the lower layer printing material passes through an automatic deviation rectifying winding and unwinding module 3, a die cutting module 5, a cutting transfer module 6 and a die cutting module 5, a double faced adhesive tape passes through the automatic deviation rectifying winding and unwinding module 3 and the die cutting module 5 and then is compounded with the lower layer printing material, a chip passes through the automatic deviation rectifying winding and unwinding module 3, a traction module 7 and the cutting transfer module 6 and then is compounded with the lower layer printing material, an upper layer printing material passes through the automatic deviation rectifying winding and unwinding module 3, the traction module 7 and the die cutting module 5, the double faced adhesive tape passes through the automatic deviation rectifying winding and unwinding module 3 and the traction module 7 and then is compounded with the upper layer printing material to obtain a semi-finished product, the semi-finished product is subjected to die cutting by the die cutting module 5, a chip detection by a chip detection module 10, a code spraying and strip dividing module 14 for a defective product;
step three, packaging and folding the upper and lower layer printed matter gluing chips: the lower layer printing material is subjected to automatic deviation rectifying winding and unwinding module 3, traction module 7, gluing module 8, gluing and cutting and transferring module 6, the chip is compounded with the lower layer printing material after passing through automatic deviation rectifying winding and unwinding module 3, traction module 7 and cutting and transferring module 6, the upper layer printing material is compounded with the lower layer printing material after passing through automatic deviation rectifying winding and unwinding module 3, traction module 7, gluing module 8, gluing and die cutting module 5, a semi-finished product is obtained, the semi-finished product is subjected to die cutting by die cutting module 5, folding by folding module 9, chip detection by chip detection module 10, chip spraying by defective product identification module 12, strip dividing by strip dividing module 14, and then rolling;
step four, gluing the upper and lower layers of printed matters, and packaging the printed matters by a lining paper chip: lower printing material passes through the automatic deviation rectifying, winding and unwinding module 3, the traction module 7, the gluing module 8, the cutting and transferring module 6 and the die cutting module 5 and then is compounded with upper printing material, the lining paper passes through the automatic deviation rectifying, winding and unwinding module 3, the die cutting module 5 and the cutting and transferring module 6 and then is compounded with lower printing material, the double-faced adhesive tape is compounded with the lining paper through the die cutting module 5 and die-cuts the double-faced adhesive tape, the double-faced adhesive tape is covered by the automatic deviation rectifying, winding and unwinding module 3, the chip passes through the automatic deviation rectifying, winding and unwinding module 3, the traction module 7 and the cutting and transferring module 6 and then is compounded with lower printing material, the upper printing material passes through the automatic deviation rectifying, winding and unwinding module 3, the traction module 7, the gluing module 8, the die cutting module 5 and then is compounded with lower printing material to obtain semi-finished products, the, And the defective product identification module 12 codes and strips the defective product identification module 14, and then rolls the defective product identification module.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112488276A (en) * | 2020-12-22 | 2021-03-12 | 芜湖维聚智控科技有限公司 | RFID electronic tag composite forming process |
| CN112549723A (en) * | 2020-12-14 | 2021-03-26 | 巨力辉腾科技（北京）有限公司 | Multi-row automatic rotary-pasting composite process die-cutting machine |
| CN113488766A (en) * | 2021-06-03 | 2021-10-08 | 维聚智控科技(北京)有限公司 | Production process and production system of environment-friendly antenna |
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