CN111185961B - Antenna processing equipment and method for composite and multi-station full-die-cutting ultrahigh frequency tag - Google Patents

Antenna processing equipment and method for composite and multi-station full-die-cutting ultrahigh frequency tag Download PDF

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CN111185961B
CN111185961B CN202010193126.0A CN202010193126A CN111185961B CN 111185961 B CN111185961 B CN 111185961B CN 202010193126 A CN202010193126 A CN 202010193126A CN 111185961 B CN111185961 B CN 111185961B
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antenna
die
layer
die cutting
cutting
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CN111185961A (en
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黄光伟
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D9/00—Cutting apparatus combined with punching or perforating apparatus or with dissimilar cutting apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

本发明提供了一种复合及多工位全模切超高频标签的天线加工设备和方法，涉及超高频标签天线的天线本体上设有由模切方式形成的芯片绑定定位点和由模切方式形成的芯片绑定点；所述天线本体的天线层一侧还粘贴第二基材层或第一基材层及第二基材层，其特征在于：该加工设备包括第一模切机构、第二模切机构和牵引机构。本发明解决现有技术存在的问题一：如何避免运用蚀刻工艺来生产超高频电子标签天线的芯片绑定点和芯片绑定定位点的问题，问题二：在超高频电子标签天线的生产过程中如何完全避免运用蚀刻工艺的问题，问题三：加工过程中如何防止天线层移动或传动时位置发生偏移，问题四：如何帮助天线层在保持张力同时更好地移动或传动。

The present invention provides a composite and multi-station fully die-cut UHF tag antenna processing equipment and method, involving an UHF tag antenna having an antenna body provided with a chip binding positioning point formed by die-cutting and a chip binding point formed by die-cutting; a second substrate layer or a first substrate layer and a second substrate layer are also pasted on one side of the antenna layer of the antenna body, characterized in that the processing equipment includes a first die-cutting mechanism, a second die-cutting mechanism and a traction mechanism. The present invention solves the problems existing in the prior art: one: how to avoid using etching technology to produce chip binding points and chip binding positioning points of UHF electronic tag antennas; two: how to completely avoid using etching technology in the production process of UHF electronic tag antennas; three: how to prevent the position of the antenna layer from shifting when it moves or transmits during processing; and four: how to help the antenna layer move or transmit better while maintaining tension.

Description

Antenna processing equipment and method for composite and multi-station full-die-cutting ultrahigh frequency tag
Technical Field
The invention relates to the technical field of electronic tags, in particular to an antenna processing device and method for a composite and multi-station full-die-cutting ultrahigh-frequency tag.
Background
At present, the chip binding points and the chip binding positioning points of the ultrahigh frequency electronic tag antenna are still produced by adopting an etching process, and chemical substances such as hydrochloric acid and the like are needed by adopting the etching process, so that the environmental influence is large, and therefore, how to avoid the production of the chip binding points and the chip binding positioning points of the ultrahigh frequency electronic tag antenna by adopting the etching process becomes a problem to be solved urgently.
In addition, how to completely avoid the problem of using etching technology in the production process of the ultrahigh frequency electronic tag antenna, how to prevent the antenna layer from shifting in the moving or transmission process and how to help the antenna layer to better move or transmit while maintaining the tension in the processing process is also a problem to be solved.
Disclosure of Invention
The invention aims to provide a full-die-cut ultrahigh frequency electronic tag antenna and processing equipment and processing technology thereof, which mainly solve the problems of the prior art that how to avoid the problems of chip binding points and chip binding positioning points of the ultrahigh frequency electronic tag antenna by using an etching technology, how to completely avoid the problems of using the etching technology in the production process of the ultrahigh frequency electronic tag antenna, how to prevent the problem of shifting of the antenna layer during the movement or transmission in the processing process, and how to help the antenna layer to better move or transmit while maintaining the tension.
In order to achieve the aim, the invention adopts the technical scheme that the antenna processing equipment of the composite and multi-station full-die-cutting ultrahigh frequency tag relates to the antenna body of the ultrahigh frequency tag antenna, and a chip binding positioning point formed by a die-cutting mode and a chip binding point formed by the die-cutting mode are arranged on the antenna body; the antenna processing equipment for the composite and multi-station full-die-cutting ultrahigh frequency tag is characterized by comprising a first die-cutting mechanism, a second die-cutting mechanism and a traction mechanism, wherein the first die-cutting mechanism is used for die-cutting a chip binding positioning point and a chip binding point of an ultrahigh frequency tag antenna, the second die-cutting mechanism is used for die-cutting the peripheral edge of the ultrahigh frequency tag antenna, and the traction mechanism is used for carrying out traction on the antenna layer of the antenna body and/or the antenna layer of the composite first substrate layer and the antenna layer of the second substrate layer in the processing process of the first die-cutting mechanism and the second die-cutting mechanism.
The antenna processing equipment of the composite and multi-station full-die-cutting ultrahigh frequency tag further comprises an antenna hole processing mechanism for die-cutting an antenna hole of the ultrahigh frequency tag antenna, a composite mechanism for compositing a second substrate layer and the antenna layer or compositing the second substrate layer and a first substrate layer adhered to the antenna layer, a first waste discharge winding mechanism for winding the waste antenna processed by the first die-cutting mechanism and the second die-cutting mechanism or winding the waste antenna processed by the first die-cutting mechanism and the second die-cutting mechanism and the first substrate layer of the waste, and a third unreeling mechanism for unreeling an isolation layer on the antenna layer, wherein the traction mechanism comprises a first traction device and a second traction device, an input port of the first traction device is used for inputting the antenna layer to be processed or the antenna layer adhered to the first substrate layer, an output port of the first traction device is used for inputting the antenna hole processing mechanism, an output port of the antenna hole processing mechanism is used for inputting the composite mechanism, an output port of the composite mechanism is used for the waste antenna, an output port of the composite mechanism is used for the first die-cutting mechanism is used for inputting the waste antenna processed by the composite mechanism, an output port of the first die-cutting mechanism is used for the antenna, an output of the first die-cutting mechanism is used for the antenna is used for unreeling, and the antenna is used for the antenna is processed, and is used for the antenna is first output, and is used for the antenna to be processed;
The antenna layer to be processed or the antenna layer adhered with the first substrate layer is input into the input port of the first traction device, the output port of the first traction device corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the compound mechanism, the output port of the compound mechanism corresponds to the input port of the second die cutting mechanism, the output port of the second die cutting mechanism corresponds to the input port of the first die cutting mechanism, the output port of the first die cutting mechanism corresponds to the input port of the first waste discharge winding mechanism and the input port of the second traction device, the output port of the third unreeling mechanism corresponds to the input port of the second traction device, and the output port of the second traction device outputs the processed antenna of the ultrahigh frequency tag.
Further, the first die cutting mechanism is composed of a flat die cutting mechanism, and the flat die cutting mechanism is a flat die cutting machine comprising at least one die cutting tool for flat die cutting of chip binding positioning points and chip binding points;
Or the first die cutting mechanism is composed of a circular cutter die cutting mechanism, and the circular cutter die cutting mechanism is a circular cutter die cutting machine comprising at least one rolling cutter for die cutting a chip binding positioning point and a chip binding point of the circular cutter;
Or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting tool for flat die cutting a chip binding positioning point or a chip binding point and at least one hob cutting tool for circular cutter die cutting the chip binding point or the chip binding positioning point;
The second die cutting mechanism is a flat die cutting machine for flat die cutting the peripheral edges of the antenna body or a circular cutter die cutting machine for circular cutter die cutting the peripheral edges of the antenna body;
The antenna hole processing mechanism is a flat die cutter for flat die cutting of antenna holes or a circular cutter die cutter for circular cutter die cutting of antenna holes.
Further, the first die cutting mechanism for die cutting the chip binding positioning points and the chip binding points and the second die cutting mechanism for die cutting the peripheral edges of the antenna body are combined into a flat die cutting machine or a circular cutter die cutting machine.
Further, the processing equipment further comprises a first unreeling mechanism for unreeling the antenna layer to be processed or the antenna layer to be processed of the composite first substrate layer, a coating mechanism for coating an adhesive on one side of the antenna layer to be processed or one side of the first substrate layer, which is not adhered with the antenna layer, a drying mechanism for drying the antenna layer coated with the adhesive by the coating mechanism or a drying mechanism for drying the antenna layer of the composite first substrate layer coated with the adhesive by the coating mechanism, a second unreeling mechanism for unreeling the second substrate layer, and a finished product reeling mechanism for reeling the processed antenna layer, the second substrate layer and the isolation layer together;
The output port of the first unreeling mechanism corresponds to the input port of the coating mechanism, the output port of the coating mechanism corresponds to the input port of the drying mechanism, the output port of the drying mechanism corresponds to the input port of the first traction device, the output port of the second unreeling mechanism corresponds to the input port of the compound mechanism, and the input port of the finished product reeling mechanism corresponds to the output port of the second traction device.
Further, a deviation correcting device is additionally arranged between the drying mechanism and the first traction device, an output port of the drying mechanism corresponds to an input port of the deviation correcting device, and an output port of the deviation correcting device corresponds to an input port of the first traction device.
Further, the number of the chip binding points is two, and the first die cutting mechanism is divided into a flat die cutting machine for carrying out flat die cutting on one chip binding point or a round cutter die cutting machine for carrying out round cutter die cutting, and a flat die cutting machine for carrying out flat die cutting on the other chip binding point and the chip binding positioning point or a round cutter die cutting machine for carrying out round cutter die cutting;
The output port of the compound mechanism corresponds to the input port of the flat die cutting machine or the round cutter die cutting machine for carrying out flat die cutting on one of the chip binding points, the output port of the flat die cutting machine or the round cutter die cutting machine for carrying out flat die cutting on one of the chip binding points corresponds to the input port of the flat die cutting machine or the round cutter die cutting machine for carrying out flat die cutting on the other chip binding point and the chip binding point, and the output port of the flat die cutting machine or the round cutter die cutting machine for carrying out flat die cutting on the other chip binding point and the chip binding point corresponds to the input port of the second die cutting mechanism;
Or the output port of the compound mechanism corresponds to the input port of the flat die cutting machine or the round knife die cutting machine for carrying out flat die cutting on the other chip binding point and the chip binding positioning point, the output port of the flat die cutting machine or the round knife die cutting machine for carrying out flat die cutting on the other chip binding point and the chip binding positioning point corresponds to the input port of the flat die cutting machine or the round knife die cutting machine for carrying out flat die cutting on one chip binding point, and the output port of the flat die cutting machine or the round knife die cutting machine for carrying out round knife die cutting on one chip binding point corresponds to the input port of the second die cutting mechanism.
Further, the number of the chip binding points is two, and the processing equipment further comprises a second waste discharging and winding mechanism;
The first die cutting mechanism comprises a first flat die cutting machine or a first round cutter die cutting machine for carrying out flat die cutting on the redundant antennas or the first base material layers on two sides of the antenna layer and the redundant antennas and the redundant first base material layers on two sides of the antenna layer, and a second flat die cutting machine or a second round cutter die cutting machine for carrying out flat die cutting on the other chip binding points and the chip binding positioning points, wherein the input port of the first flat die cutting machine or the first round cutter die cutting machine corresponds to the output port of the composite mechanism, the output port of the first flat die cutting machine or the first round cutter die cutting machine corresponds to the input port of the second waste discharging winding mechanism and the input port of the second flat die cutting machine or the second round cutter die cutting machine, and the output port of the second flat die cutting machine or the second round cutter die cutting machine corresponds to the input port of the second die cutting mechanism;
Or the first die cutting mechanism comprises a first flat die cutting machine or a first round cutter die cutting machine for carrying out flat die cutting on one chip binding point, redundant antennas or first base material layers on two sides of the antenna layer and redundant antennas and redundant first base material layers on two sides of the antenna layer, and a second flat die cutting machine or a second round cutter die cutting machine for carrying out flat die cutting on the other chip binding point and the chip binding point, wherein an input port of the second flat die cutting machine or the second round cutter die cutting machine corresponds to an output port of the composite mechanism, an output port of the second flat die cutting machine or the second round cutter die cutting machine corresponds to an input port of the first flat die cutting machine or the first round cutter die cutting machine, and an output port of the first flat die cutting machine or the first round cutter die cutting machine corresponds to an input port of the second waste discharge winding mechanism and an input port of the second die cutting mechanism;
or the first die-cutting mechanism comprises a first flat die-cutting machine for flat die-cutting one of the chip binding points or a first round-cutter die-cutting machine for round-cutter die-cutting, and a second flat die-cutting machine for flat die-cutting the other chip binding point and the chip binding point, and simultaneously, the redundant antenna or the first substrate layer on two sides of the antenna layer and the redundant antenna and the redundant first substrate layer on two sides of the antenna layer, wherein the input port of the first flat die-cutting machine or the first round-cutter die-cutting machine corresponds to the output port of the composite mechanism, the output port of the first flat die-cutting machine or the first round-cutter die-cutting machine corresponds to the input port of the second flat die-cutting machine or the second round-cutter die-cutting machine, and the output port of the second flat die-cutting machine or the second round-cutter die-cutting machine corresponds to the input port of the second waste discharging and winding mechanism and the input port of the second die-cutting mechanism
Or the first die cutting mechanism comprises a first flat die cutting machine for carrying out flat die cutting on one chip binding point or a first round cutter die cutting machine for carrying out round cutter die cutting, and a second flat die cutting machine for carrying out flat die cutting on the other chip binding point and the chip binding positioning point, the redundant antenna or the first substrate layers on two sides of the antenna layer and the redundant antenna and the redundant first substrate layers on two sides of the antenna layer at the same time, wherein the input port of the second flat die cutting machine or the second round cutter die cutting machine corresponds to the output port of the composite mechanism, the output port of the second flat die cutting machine or the second round cutter die cutting machine corresponds to the input port of the second waste discharging winding mechanism and the input port of the first flat die cutting machine or the first round cutter die cutting machine, and the output port of the first flat die cutting machine or the first round cutter die cutting machine corresponds to the input port of the second die cutting mechanism.
The processing equipment further comprises an antenna hole waste collection device used for collecting waste antennas generated after the antenna hole processing mechanism is perforated or waste antennas generated after the antenna hole processing mechanism is perforated and used for collecting waste first substrate layers, the antenna hole waste collection device is located below the antenna hole processing mechanism, the compounding mechanism is further provided with a heating drum used for heating an adhesive, and the compounding mechanism comprises a rubber roller used for compounding a second substrate layer with the antenna layers or a rubber roller used for compounding the second substrate layer with the antenna layers of the first substrate layers.
A method for processing an antenna of a composite and multi-station full-die-cutting ultrahigh frequency tag relates to an antenna processing device of the composite and multi-station full-die-cutting ultrahigh frequency tag, and is characterized by comprising the following production steps of
The first unreeling mechanism unreels the antenna layer to be processed or the antenna layer of the composite first substrate layer, and coating the adhesive on one side of the antenna layer to be processed or one side of the antenna layer of the composite first substrate layer, which is not adhered with the antenna layer, through the coating mechanism;
step two, the coated antenna layer or the coated antenna layer of the composite first substrate layer is sent to a drying mechanism, and the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer is dried by the drying mechanism;
Step three, the dried antenna layer or the antenna layer of the composite first base material layer is sent to a deviation rectifying device, and the deviation rectifying device is utilized to conduct reference positioning on the dried antenna layer or the antenna layer of the composite first base material layer, and the transfer direction of the antenna layer or the antenna layer of the composite first base material layer is corrected and/or calibrated;
The antenna layer after correction or the antenna layer of the composite first base material layer is sent to a first traction device, the first traction device is used for helping the antenna layer or the antenna layer of the composite first base material layer to carry out transmission, the first traction device and the second traction device are used for coacting to further control the transmission speed of the antenna layer or the antenna layer of the composite first base material layer, and the tension of the antenna layer or the antenna layer of the composite first base material layer in the transmission process is stable and each die cutting set is accurate
Step five, the antenna layer passing through the first traction device or the antenna layer of the composite first substrate layer is sent to an antenna hole processing mechanism for carrying out antenna hole punching, the antenna hole processing mechanism carries out antenna hole punching on the antenna layer or the antenna layer of the composite first substrate layer, and a waste antenna generated after punching or a waste antenna generated after punching and a waste first substrate layer enter an antenna hole waste collection device;
Step six, the antenna layer after the perforation of the antenna hole or the antenna layer of the composite first substrate layer after the perforation of the antenna hole is composited with the second substrate layer of the second unreeling mechanism through the compositing mechanism, namely the second substrate layer is bonded with the antenna layer or the first substrate layer through the bonding agent;
Step seven, the antenna layer after the second substrate layer is compounded, firstly, carrying out flat die cutting and/or circular knife die cutting on the antenna of the antenna layer through a first die cutting mechanism to form a chip binding point and a chip binding positioning point, then carrying out flat die cutting and/or circular knife die cutting on the antenna at the periphery edge of the antenna body of the antenna layer through a second die cutting mechanism to form the outer contour of the antenna body, then forming a preliminarily formed antenna body and a residual waste antenna on the second substrate layer, and winding and discharging the residual waste antenna through a first waste discharging winding mechanism;
Or the antenna layer after the second substrate layer and the first substrate layer are compounded is subjected to flat die cutting and/or circular knife die cutting to form a chip binding point and a chip binding positioning point simultaneously by a first die cutting mechanism, then is subjected to die cutting and/or roller cutting to form the outer contour of the antenna body simultaneously by the antenna at the periphery edge of the antenna layer antenna body of the first substrate layer and the first substrate layer by a second die cutting mechanism, and then is subjected to preliminary molding to form the antenna body of the first substrate layer, the residual waste antenna and the first substrate layer corresponding to the residual waste, and the residual waste antenna and the first substrate layer corresponding to the residual waste are rolled and discharged by a first waste discharging and rolling mechanism;
Or the antenna layer after the second substrate layer is compounded, firstly carrying out flat die cutting and/or circular knife die cutting on the antennas at the peripheral edges of the antenna body of the antenna layer through a second die cutting mechanism to form the outer outline of the antenna body, then carrying out flat die cutting and/or circular knife die cutting on the antennas of the antenna layer through a first die cutting mechanism to form chip binding points and chip binding positioning points, then forming a preliminarily formed antenna body and residual waste antennas on the second substrate layer, and winding and discharging the residual waste antennas through a first waste discharging winding mechanism;
Or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer are subjected to flat die cutting and/or circular knife die cutting simultaneously by a second die cutting mechanism to form the outer contour of the antenna body, then subjected to flat die cutting and/or circular knife die cutting simultaneously by the first die cutting mechanism to form a chip binding point and a chip binding positioning point, and then the primarily formed antenna body of the composite first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer are formed on the second substrate layer, and the residual waste antenna and the corresponding residual waste first substrate layer are rolled and discharged by a first waste discharging rolling mechanism;
Or the antenna layer after the second substrate layer is compounded and the first substrate layer is firstly subjected to flat pressing die cutting or circular knife die cutting on one chip binding point through a first flat pressing die cutting machine or a first circular knife die cutting machine of a first die cutting mechanism, and simultaneously, the redundant antennas on two sides of the antenna layer or the redundant antennas on two sides of the first substrate layer and the redundant first substrate layer are subjected to flat pressing die cutting or circular knife die cutting to form two sides of residual antenna waste or two sides of residual antenna waste and the first substrate waste, the two sides of residual antenna waste or two sides of residual antenna waste and the first substrate waste are wound and exhausted through a second waste exhausting winding mechanism, then carrying out flat die cutting or circular knife die cutting on the other chip binding point and the chip binding positioning point by a second flat die cutting machine or a second circular knife die cutting machine of the first die cutting mechanism to jointly form the chip binding point and the chip binding positioning point, then carrying out flat die cutting and/or circular knife die cutting on the antenna at the periphery edge of the antenna body of the antenna layer or on the antenna corresponding to the periphery edge of the antenna body of the antenna layer and the first substrate layer by the second die cutting mechanism to form the outer contour of the antenna body, and rolling and discharging residual antenna waste or residual antenna waste and first substrate waste after the processing of the chip binding point, the chip binding positioning point and the outer contour of the antenna body by the first waste discharging rolling mechanism;
Or the antenna layer after the second substrate layer is compounded with the first substrate layer is subjected to flat die cutting or circular cutter die cutting on one of the chip binding points through a first flat die cutting machine or a first circular cutter die cutting machine of the first die cutting mechanism, then the second flat die cutting machine or the second circular cutter die cutting machine of the first die cutting mechanism carries out flat die cutting or circular cutter die cutting on the other chip binding point and the chip binding positioning point, simultaneously carries out flat die cutting or circular cutter die cutting on the redundant antennas on two sides of the antenna layer or the redundant antennas on two sides of the redundant first substrate layer and the antenna layer and the redundant antennas on two sides of the first substrate layer to jointly form the chip binding point, the chip binding positioning point, the two-side residual antenna waste or the two-side residual antenna waste and the first substrate waste, and the second waste discharge winding mechanism is used for winding and discharging the two-side residual antenna waste or the two-side residual antenna waste and the first substrate waste, and then the second die cutting mechanism is used for simultaneously carrying out flat die cutting and/or circular knife die cutting on the antenna at the periphery of the antenna body of the antenna layer or on the antenna corresponding to the periphery of the antenna body of the antenna layer and the first substrate layer to form the outer contour of the antenna body, and the chip binding points, the chip binding positioning points and the residual antenna waste or the residual antenna waste and the first substrate waste after the outer contour of the antenna body is processed are wound and discharged through the first waste discharge winding mechanism.
Step eight, after the first waste discharge winding mechanism winds and discharges waste, the isolation layer is unreeled by the third unreeling mechanism, so that the isolation layer is covered on the antenna of the antenna body formed preliminarily or on the first substrate layer;
And step nine, the antenna body covered with the isolation layer is sent to a second traction device, the antenna body covered with the isolation layer is helped to be transmitted to a finished product winding mechanism by the second traction device, and the finished product winding mechanism is used for winding to form a die-cut ultrahigh frequency electronic tag antenna finished product.
Further, the antenna hole processing mechanism is used for punching the antenna holes on the antenna layer, and a flat press die cutting process or a circular knife die cutting process is adopted.
In the step six, in the process that the antenna layer after the perforation of the antenna hole or the antenna layer of the composite first substrate layer is compounded with the second substrate layer unreeled by the second unreeled mechanism through the compounding mechanism, the heating drum of the compounding mechanism synchronously heats the adhesive on the antenna layer, and the adhesive stick is used for compounding the second substrate layer with the antenna layer or compounding the second substrate layer with the antenna layer of the composite first substrate layer;
Further, the temperature range of the heating drum is 50-200 ℃, the temperature range of the drying mechanism is 40-160 ℃, and the coating mechanism is used for coating the adhesive on the antenna layer or the first substrate layer and contains a diluting solvent;
Further, the first die cutting mechanism performs one-time platen die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer to form a chip binding point and a chip binding positioning point;
or the first die cutting mechanism carries out two or more times of flat die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer to form a chip binding point and a chip binding positioning point.
In view of the technical characteristics, the invention has the following beneficial effects:
1. According to the full-die-cut ultrahigh frequency electronic tag antenna, the die-cutting forming mode is adopted for the die-cutting forming mode of the die-binding points and the die-binding positioning points, such as flat die cutting and/or circular knife die cutting, so that the full-die-cut ultrahigh frequency electronic tag antenna is separated from an etching process, and the influence and/or pollution of chemical substances generated by the etching process on the environment can be effectively reduced.
2. According to the full-die-cut ultrahigh frequency electronic tag antenna, a die cutting mode, such as platen die cutting and/or circular knife die cutting, can be adopted for perforation of the antenna holes, so that the full-die-cut ultrahigh frequency electronic tag antenna is separated from an etching process, and the influence and/or pollution of chemical substances generated by the etching process on the environment can be effectively reduced.
3. According to the full-die-cut ultrahigh frequency electronic tag antenna, die cutting modes, such as platen die cutting and/or circular knife die cutting, can be adopted for the peripheral edge parts of the antenna body, so that the full-die-cut ultrahigh frequency electronic tag antenna is separated from an etching process, and the influence and/or pollution of chemical substances generated by the etching process on the environment can be effectively reduced.
4. In the processing equipment of the full die-cut ultrahigh frequency electronic tag antenna, the positions and the processing sequences of the chip binding points, the chip binding positioning points and the processing equipment of the peripheral edge parts of the antenna body can be interchanged, and the processing effects of the chip binding points, the chip binding positioning points and the peripheral edge parts of the antenna body are not influenced.
5. The processing technology of the full-die-cut ultrahigh frequency electronic tag antenna provided by the invention only comprises a processing mode of die-cutting and forming a die-binding point and a die-binding positioning point, and is included in the protection scope of the invention, the processing mode can help the full-die-cutting processing of the ultrahigh frequency electronic tag antenna, and the production of the ultrahigh frequency electronic tag antenna can be carried out at the lowest point of environmental pollution without any etching technology, and even is basically harmless.
6. The traction mechanism can be composed of at least two traction devices, for example, the two traction devices are used for placing the die-cutting mechanism (comprising an antenna hole processing mechanism, a compounding mechanism, a first die-cutting mechanism, a second die-cutting mechanism and the like) between the two traction devices, the two traction devices are used for helping good movement or transmission effects of the antenna layer or the antenna layer compounding the first substrate layer and the second substrate layer in the die-cutting process of the die-cutting mechanism, so that the moving force is enhanced, the shell is not easy to clamp in the moving process, and meanwhile, the antenna layer or the antenna layer compounding the first substrate layer and the antenna layer compounding the second substrate layer in the die-cutting process of the die-cutting mechanism are straightened or leveled through the two traction devices, so that good tension is kept, the die-cutting mechanism can be convenient to process, and the die-cutting processing effect is improved. The traction mechanism can effectively help to assist the antenna layer in moving or transmitting better while maintaining tension during processing.
7. The deviation correcting device can help correct the moving position of the antenna layer which is output by the drying mechanism and is coated with the adhesive or the antenna layer of the composite first substrate layer, accurately positions and corrects the moving direction, ensures that the transmission position of the antenna layer which enters the subsequent processing program or the antenna layer of the composite first substrate layer is accurate, and helps to improve the die cutting effect and the die cutting accuracy of the subsequent die cutting mechanism. In the processing process, the deviation correcting device can effectively prevent the antenna layer from moving or shifting in position during transmission.
8. The second waste discharge winding mechanism can improve waste discharge effect and product processing quality.
Drawings
Fig. 1 is a schematic structural diagram of a full die cut ultrahigh frequency tag antenna in embodiment 1.
Fig. 2 is a schematic structural diagram of an antenna processing apparatus for a composite and multi-station full die-cut ultrahigh frequency tag in embodiment 1.
Fig. 3 is a schematic cross-sectional structure of an all-die-cut ultrahigh frequency electronic tag antenna (without the first substrate layer) in embodiment 1.
Fig. 4 is a schematic cross-sectional structure of an all-die-cut ultrahigh frequency electronic tag antenna (including a first substrate layer) in embodiment 1.
Fig. 5 is a schematic diagram of an antenna processing apparatus for a composite and multi-station full die cut ultrahigh frequency tag in embodiment 4.
In the figure, 1 is a first unreeling mechanism, 2 is a coating mechanism, 3 is a drying mechanism, 4 is an antenna hole processing mechanism, 5 is an antenna hole waste collection device, 6 is a compounding mechanism, 7 is a second unreeling mechanism, 8 is a round-knife die-cutting machine used for round-knife die-cutting one of the chip binding points in the first die-cutting mechanism, 9 is a round-knife die-cutting machine used for round-knife die-cutting the other chip binding point and the chip binding point in the first die-cutting mechanism, 10 is a second die-cutting mechanism, 11 is a first waste discharge reeling mechanism, 12 is a third unreeling mechanism, 13 is a finished product reeling mechanism, 14 is a chip binding point, 15 is a chip binding point, 16 is an antenna hole, 17 is an antenna body, 18 is aluminum foil, 19 is an adhesive coated by the coating mechanism, 20 is paper used as a second base material layer, 21 is a PET layer used as a first base material layer, 22 is an adhesive used for pre-compounding the PET layer and the aluminum foil, 23 is a first traction device, 24 is a second waste traction device, 25 is a deviation correcting device, 26 is a second waste reeling mechanism.
Detailed Description
The application is further described below in conjunction with the detailed description. It is to be understood that these examples are illustrative of the present application and are not intended to limit the scope of the present application. Furthermore, it should be understood that various changes and modifications can be made by one skilled in the art after reading the teachings of the present application, and such equivalents are intended to fall within the scope of the application as defined in the appended claims.
Referring to fig. 1 and 2, embodiment 1, an antenna processing device for a composite and multi-station full-die-cut ultrahigh frequency tag, which relates to an antenna body 17 of an ultrahigh frequency tag antenna, wherein a die bonding positioning point 14 formed by a die cutting mode and a die bonding point 15 formed by a die cutting mode are arranged on the antenna body;
The die cutting mode is adopted to manufacture the chip binding positioning points 14 and 15 of the ultrahigh frequency electronic tag antenna, so that an etching process is avoided in the process of producing the chip binding positioning points 14 and 15, pollution of chemical substances to the environment can be effectively reduced, in addition, the edges of the periphery of the chip binding positioning points 14 and 15 formed by the die cutting mode are smooth and smooth, uneven edge shapes cannot exist, and the quality of the ultrahigh frequency electronic tag antenna is improved.
The peripheral edge of the antenna body 17 is formed by die cutting.
The antenna body 17 is further provided with an antenna hole 16 formed by die cutting.
That is, all parts on the ultra-high frequency electronic tag antenna can be die-cut, the whole ultra-high frequency electronic tag antenna can be produced by die-cut, the complete etching process can be separated, and the pollution to the environment is minimized, even no chemical pollution is caused.
The die cutting mode can adopt platen die cutting and/or circular knife die cutting, and the circular knife die cutting is also called rolling cutting.
In this embodiment 1, there are two chip bonding points 15, one antenna hole 16, and a slot formed between the chip bonding points 15 communicates with the antenna hole 16 and the outside of the antenna.
The antenna layer side of the antenna body 17 is further adhered with a second substrate layer or a first substrate layer and a second substrate layer, preferably the first substrate layer is a polyester film, preferably the PET layer 21 of the first substrate layer, and the second substrate layer is a polyester film or paper 20, wherein the polyester film is preferably a PET layer, the antenna of the antenna layer may be a metal foil, such as an aluminum foil, a copper foil, etc., and in this embodiment 1, the antenna of the antenna layer is preferably an aluminum foil 18.
The antenna processing equipment of the composite and multi-station full-die-cutting ultrahigh frequency tag comprises a first die-cutting mechanism, a second die-cutting mechanism and an antenna hole processing mechanism, wherein the first die-cutting mechanism is used for die-cutting a chip binding positioning point 14 and a chip binding point 15 of the ultrahigh frequency tag antenna, the second die-cutting mechanism is used for die-cutting the peripheral edge of the ultrahigh frequency tag antenna, the antenna hole processing mechanism 4 is used for die-cutting an antenna hole 16 of the ultrahigh frequency tag antenna, the composite mechanism 6 is used for compositing a second substrate layer and an antenna layer or compositing a second substrate layer and a first substrate layer adhered with the antenna layer, the first waste discharging and winding mechanism 11 is used for winding the waste antenna processed by the first die-cutting mechanism and the second die-cutting mechanism and the first substrate layer of waste, the third unreeling mechanism 12 is used for unreeling an isolation layer on the antenna layer, and the antenna layer and/or the antenna layer composited with the first substrate layer and the second substrate layer in the processing process (particularly in each die-cutting link) is pulled;
Preferably, the traction mechanism is a first traction device 23 and a second traction device 24, wherein the input port of the first traction device 23 is used for inputting an antenna layer to be processed or an antenna layer pasted with a first substrate layer (for example, an aluminum foil 18 is compounded with a first substrate layer, namely, a PET layer 21 in advance through an adhesive 22, namely, is pasted together), the output port of the first traction device 23 corresponds to the input port of the antenna hole processing mechanism 4, the output port of the antenna hole processing mechanism 4 corresponds to the input port of the compounding mechanism 6, the output port of the compounding mechanism 6 corresponds to the input port of the first die cutting mechanism, the output port of the first die cutting mechanism corresponds to the input port of the second die cutting mechanism 10, the output port of the second die cutting mechanism 10 corresponds to the input port of the first waste discharge winding mechanism 11 and the input port of the second traction device 24, the output port of the third unwinding mechanism 12 corresponds to the input port of the second traction device 24, and the output port of the second traction device 24 outputs the processed ultrahigh frequency tag antenna.
Alternatively, the traction mechanism comprises a first traction device 23 and a second traction device 24, wherein the input port of the first traction device 23 is input into an antenna layer to be processed or an antenna layer adhered with a first substrate layer, the output port of the first traction device 23 is corresponding to the input port of the antenna hole processing mechanism 4, the output port of the antenna hole processing mechanism 4 is corresponding to the input port of the compound mechanism 6, the output port of the compound mechanism 6 is corresponding to the input port of the second die cutting mechanism 10, the output port of the second die cutting mechanism 10 is corresponding to the input port of the first waste discharge winding mechanism 11 and the input port of the second traction device 24, the output port of the third unwinding mechanism 12 is corresponding to the input port of the second traction device 24, and the output port of the second traction device 24 is output into the processed antenna of the ultrahigh frequency tag.
The traction mechanism is arranged between the first traction device 23 and the second traction device 24 through the antenna hole processing mechanism 4, the compound mechanism 6, the first die cutting mechanism (a circular cutter die cutting machine 8 for performing circular cutter die cutting on one chip binding point and a circular cutter die cutting machine 9 for performing circular cutter die cutting on the other chip binding point and the other chip binding point), the second die cutting mechanism 10 and the first waste discharging winding mechanism 11, and the third unwinding mechanism 12 so as to facilitate the processing of the antenna layer and/or the first substrate layer and/or the second substrate layer and/or the isolation layer corresponding to the components to be well moved or conveyed, and simultaneously can also facilitate the maintenance of stable and uniform tension of the antenna layer and/or the first substrate layer and/or the second substrate layer and/or the isolation layer in the moving process, in particular the processing operation corresponding to the components to be convenient, and the accuracy of the processing operation is ensured.
The first die cutting mechanism is composed of a flat die cutting mechanism, and the flat die cutting mechanism is a flat die cutting machine comprising at least one die cutting tool for flat die cutting of the chip binding positioning point 14 and the chip binding point 15;
Or the first die cutting mechanism is composed of a circular cutter die cutting mechanism, and the circular cutter die cutting mechanism is a circular cutter die cutting machine comprising at least one rolling cutter for die cutting a chip binding positioning point 14 and a chip binding point 15 by the circular cutter;
Or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting tool for flat die cutting a chip binding positioning point 14 or a chip binding positioning point 15 and at least one hob cutting tool for circular cutter die cutting the chip binding positioning point 14 or the chip binding positioning point 15;
The second die cutting mechanism 10 is a flat die cutting machine for flat die cutting the peripheral edge of the antenna body 17 or a circular knife die cutting machine for circular knife die cutting the peripheral edge of the antenna body 17;
The antenna hole processing mechanism is a platen die cutter for platen die cutting the antenna hole 16, or the antenna hole processing mechanism is a circular cutter die cutter for circular cutter die cutting the antenna hole 16.
That is to say, the first die cutting mechanism, the second die cutting mechanism 10 and the antenna hole processing mechanism 4 can select a flat die cutting mechanism and/or a circular knife die cutting mechanism according to actual conditions to realize a die cutting process, so that the requirements of the full die cutting ultrahigh frequency electronic tag antenna on the die cutting process are met, and especially the requirements of the chip binding positioning points 14, the chip binding points 15, the peripheral edges of the antenna body 17 and the antenna holes 16 on the die cutting process are met.
The processing equipment further comprises a first unreeling mechanism 1 for unreeling an antenna layer to be processed or a composite first substrate layer, a coating mechanism 2 for coating an adhesive on one side of the antenna layer to be processed or one side of the first substrate layer, which is not adhered with the antenna layer, a drying mechanism 3 for drying the antenna layer coated with the adhesive by the coating mechanism or a drying mechanism 3 for drying the antenna layer coated with the adhesive by the coating mechanism, which is composite with the first substrate layer, a second unreeling mechanism 7 for unreeling a second substrate layer, and a finished product reeling mechanism 13 for reeling the processed antenna layer, the second substrate layer and the isolation layer together;
The output port of the first unreeling mechanism 1 corresponds to the input port of the coating mechanism 2, the output port of the coating mechanism 2 corresponds to the input port of the drying mechanism 3, the output port of the drying mechanism 3 corresponds to the input port of the first traction device 23, the output port of the second unreeling mechanism 7 corresponds to the input port of the compound mechanism 6, and the input port of the finished product reeling mechanism 13 corresponds to the output port of the second traction device 24.
When the full-die-cut ultrahigh frequency electronic tag antenna is processed, a first substrate layer is not arranged, the coating mechanism directly coats an adhesive on one side of the antenna layer when the antenna layer is processed, when the first die-cutting mechanism dies the chip binding positioning point 14 and the chip binding point 15, the second die-cutting mechanism 10 dies the peripheral edge of the antenna body 17, and the antenna hole processing mechanism 4 dies the antenna hole 16, only the antenna layer is die-cut, but the second substrate layer is not die-cut. The adhesive 19 applied by the application mechanism 2 at this time is used to compound the antenna layer and the second substrate layer together by the compounding mechanism 7, i.e., the antenna layer and the second substrate layer are bonded together with the adhesive 19. The finished product of the full die-cut ultrahigh frequency electronic tag antenna produced on the premise is an antenna layer (namely aluminum foil 18) which is bonded with a second substrate layer (namely paper 20) through an adhesive 19 of a coating mechanism 2 from top to bottom, and the detail is shown in fig. 3.
When the full die-cut ultrahigh frequency electronic tag antenna is processed, the first substrate layer can be added, or the first substrate layer can be omitted. Preferably, a first substrate layer is adopted, the first substrate layer is used for supporting an antenna on the antenna layer, the first substrate layer protects the antenna in the antenna layer processing process, at the moment, the coating mechanism 2 coats an adhesive on one side of the first substrate layer, which is not adhered with the antenna layer, when the first die cutting mechanism dies the die bonding positioning point 14 and the die bonding point 15, the second die cutting mechanism 10 dies the peripheral edge of the antenna body 17, and the antenna hole processing mechanism 4 dies the antenna hole 16, the first substrate layer and the antenna layer can be die-cut simultaneously, but the second substrate layer is not die-cut. The adhesive 19 applied by the application mechanism 2 is used to compound the first substrate layer and the second substrate layer together by the compounding mechanism 6, i.e., the first substrate layer and the second substrate layer are bonded together with the adhesive 19. The finished product of the full die-cut ultrahigh frequency electronic tag antenna produced on the premise is an antenna layer (namely an aluminum foil 18) and an antenna layer pasting composite first substrate layer (namely a PET layer 21), wherein pasting composite means that the PET layer 21 is compounded with the aluminum foil 18 in advance through an adhesive 22 for compounding and pasting the PET layer 21 and the aluminum foil 18 in advance, then the antenna layer of the composite first substrate layer is put into a coating mechanism 2 through a first unreeling mechanism 1), and the first substrate layer (namely the PET layer 21) is pasted and compounded with a second substrate layer (namely paper 20) through an adhesive 19 of the coating mechanism, and the detail is shown in fig. 4.
A deviation correcting device 25 is additionally arranged between the drying mechanism 3 and the first traction device 23, an output port of the drying mechanism 3 corresponds to an input port of the deviation correcting device 25, and an output port of the deviation correcting device 25 corresponds to an input port of the first traction device 23. The deviation correcting device 25 is used for correcting and calibrating the position of the antenna layer coming out of the drying mechanism 3 or the antenna layer of the composite first substrate layer when the position deviation occurs in the forward movement (i.e. in the transportation process or the moving process), especially when the position error of the side edge occurs or the position deviation occurs in the antenna layer of the composite first substrate layer, the deviation correcting device 25 plays a role in correcting, that is, the deviation correcting device 25 performs reference positioning on the antenna layer coming out of the drying mechanism 3 or the antenna layer of the composite first substrate layer, corrects the moving direction, ensures the accuracy of the advancing direction and the positions of the two sides when the antenna layer enters the first traction device 23, and helps to promote and/or ensure the processing precision of the subsequent first die cutting mechanism and/or the second die cutting mechanism. Or if the antenna layer or the antenna layer of the composite first substrate layer is shifted in the transmission position of the antenna layer or the antenna of the composite first substrate layer after drying due to thermal expansion in the drying mechanism, the deviation correcting device 25 can also perform position correction and position calibration.
The number of the chip binding points is two, and the first die cutting mechanism is divided into a flat die cutting machine for carrying out flat die cutting on one chip binding point or a round cutter die cutting machine 8 for carrying out round cutter die cutting, and a flat die cutting machine for carrying out flat die cutting on the other chip binding point and the chip binding positioning point or a round cutter die cutting machine 9 for carrying out round cutter die cutting.
The output port of the compound mechanism 6 corresponds to the input port of the flat die cutter for flat die cutting or the round die cutter 8 for round die cutting on one of the die-bonding points 15, the output port of the flat die cutter for flat die cutting or the round die cutter 8 for round die cutting on one of the die-bonding points 15 corresponds to the input port of the flat die cutter for flat die cutting or the round die cutter 9 for flat die cutting on the other die-bonding point 15 and the die-bonding point 14, and the output port of the flat die cutter for flat die cutting on the other die-bonding point 15 and the die-bonding point 14 corresponds to the input port of the second die cutting mechanism 10;
Alternatively, the output port of the compound mechanism 6 corresponds to the input port of the flat-die cutting machine or the round-knife cutting machine 9 for flat-die cutting the other chip binding point 15 and the chip binding positioning point 14, the output port of the flat-die cutting machine or the round-knife cutting machine 9 for flat-die cutting the other chip binding point 15 and the chip binding positioning point 14 corresponds to the input port of the flat-die cutting machine or the round-knife cutting machine 8 for flat-die cutting one chip binding point 15, and the output port of the flat-die cutting machine or the round-knife cutting machine 8 for flat-die cutting one chip binding point 15 corresponds to the input port of the second die cutting mechanism 10.
In this embodiment 1, the full-die-cut ultrahigh frequency electronic tag antenna takes the antenna layer to be processed of the composite first substrate layer as an example (if the composite first substrate layer is not present, the antenna layer to be processed of the composite first substrate layer can be directly replaced by the antenna layer to be processed of the composite first substrate layer), and the connection relationship between the devices is as follows, wherein the antenna layer to be processed of the composite first substrate layer of the first unwinding mechanism 1 correspondingly enters the input port of the coating mechanism 2, the antenna layer (at this time, the adhesive is coated on one side surface of the first substrate layer) of the coated composite first substrate layer outputted by the coating mechanism 2 enters the input port of the corresponding drying mechanism 3, the output port of the drying mechanism 3 corresponds to the input port of the deviation rectifying device 25, the output port of the deviation rectifying device 25 enters the input port of the corresponding to the first traction device 23, the output port of the antenna hole 16 outputted by the antenna hole processing mechanism 4 then enters the input port of the corresponding composite first substrate layer 6, the second substrate layer unwound by the second unwinding mechanism 7 also enters the input port of the corresponding composite mechanism 6, the second substrate layer outputted by the second unwinding mechanism 7 simultaneously enters the output port of the composite mechanism 6 (at this time, the adhesive is coated on one side surface of the first substrate layer is coated by the first substrate layer and the second substrate layer is die-cut 10) and the first substrate layer is die-cut by the die-cut mechanism 2, the waste antenna and the first substrate layer of the waste after the flat-press die cutting and/or the circular knife die cutting are/is processed corresponds to the input port of the first waste discharging winding mechanism 11, the antenna layer and the second substrate layer (at this time, the first substrate layer is still between the antenna layer and the second substrate layer, see fig. 4) after the flat-press die cutting and/or the circular knife die cutting are processed enter the corresponding third unreeling mechanism 12, and after an isolating layer is overlapped on the antenna layer or the second substrate layer through the third unreeling mechanism 12, the antenna layer which is compounded with the second substrate layer and the first substrate layer and overlapped with the isolating layer enters the input port of the finished product winding mechanism 13. The finished product of the full die-cut ultrahigh frequency electronic tag antenna is formed at this time, and the antenna layer (namely the aluminum foil 18) and the antenna layer are adhered and compounded with a first substrate layer (namely the first substrate layer is namely the PET layer 21, the adhering and compounding here means that after the PET layer 21 is compounded with the aluminum foil 18 in advance through an adhesive 22 for compounding and adhering the PET layer 21 and the aluminum foil 18 in advance, the antenna layer compounded with the first substrate layer is put into the coating mechanism 2 through the first unreeling mechanism 1), and the first substrate layer (namely the PET layer 21) is adhered and compounded with a second substrate layer (namely the paper 20) through an adhesive 19 of the coating mechanism, and the details are shown in fig. 4.
The first die cutting mechanism and the second die cutting mechanism 10 can be interchanged in both position and processing sequence.
The antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer output by the composite mechanism 6 enter an input port of the second die-cutting mechanism 10, and then enter an input port of the first die-cutting mechanism from an output port of the second die-cutting mechanism 10, and the output port of the first die-cutting mechanism outputs the antenna layer of the composite second substrate layer after being subjected to flat die-cutting and/or round die-cutting processing or outputs the antenna layer of the composite first substrate layer and the antenna layer of the second substrate layer after being subjected to flat die-cutting and/or round die-cutting processing, wherein the waste antenna after being subjected to flat die-cutting and/or round die-cutting processing and the waste first substrate layer correspond to the input port of the first waste discharging and winding mechanism 11.
The compounding mechanism 9 is further provided with a heating drum for heating an adhesive, the adhesive is convenient to bond the second substrate layer and one side surface of the first substrate layer, which is not adhered with the antenna layer, the compounding function of the second substrate layer and the first substrate layer can be better realized after the adhesive passes through the compounding mechanism 6, and the compounding mechanism 6 comprises a rubber roller for compounding the second substrate layer with the antenna layer or a rubber roller for compounding the second substrate layer with the antenna layer of the first substrate layer.
When the antenna layer of the composite first substrate layer is perforated in the antenna hole processing mechanism 4 after being dried by the drying mechanism 2, the adhesive 19 coated by the coating mechanism 2 does not influence perforation, so that perforation operation of the antenna hole is facilitated.
A processing method of an antenna of a composite and multi-station full die-cut ultrahigh frequency tag is characterized by comprising the following production steps of
The method comprises the steps that an antenna layer to be processed or a composite first substrate layer is unreeled by a first unreeling mechanism 1, adhesive coating is conducted on one side of the antenna layer to be processed or one side, which is not adhered to the antenna layer, of the antenna layer of the composite first substrate layer through a coating mechanism 2, the coating mechanism 2 is used for coating the antenna layer or the adhesive 19 on the first substrate layer, and a diluting solvent is contained in the adhesive 19, and can dilute the adhesive 19 coated by the coating mechanism 2, so that the adhesive can meet the processing requirement of the full-die-cut ultrahigh frequency electronic tag antenna.
And secondly, the coated antenna layer or the coated antenna layer of the composite first substrate layer is sent to a drying mechanism 3, the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer is dried by the drying mechanism 3, the temperature range of the drying mechanism 3 is 40-160 ℃, the drying mechanism helps the adhesive to dry, and the punching operation of the antenna holes 16 of the antenna layer is facilitated.
Step three, the dried antenna layer or the antenna layer of the composite first base material layer is sent to a deviation rectifying device 25, and the deviation rectifying device 25 is utilized to conduct reference positioning on the dried antenna layer or the antenna layer of the composite first base material layer, and the transfer direction of the antenna layer or the antenna layer of the composite first base material layer is corrected and/or calibrated;
The antenna layer after correction or the antenna layer of the composite first base material layer is sent to a first traction device, the first traction device 23 is used for helping the antenna layer or the antenna layer of the composite first base material layer to carry out transmission, and the first traction device 23 and a second traction device 24 are used for coaction to further control the transmission speed of the antenna layer or the antenna layer of the composite first base material layer, and the tension of the antenna layer or the antenna layer of the composite first base material layer in the transmission process is stable and the die cutting positions of all the die cutting sleeves are accurate;
And fifthly, conveying the antenna layer or the antenna layer of the composite first substrate layer to an antenna hole processing mechanism 4 for punching an antenna hole, wherein the antenna hole processing mechanism 4 punches an antenna hole 16 on the antenna layer or the antenna layer of the composite first substrate layer, and enabling a waste antenna generated after punching or a waste antenna generated after punching and the waste first substrate layer to enter an antenna hole waste collection device 5, wherein the antenna hole processing mechanism 4 punches the antenna hole 16 and adopts a flat die cutting process or a circular knife die cutting process.
Step six, the antenna layer of the antenna layer after the perforation of the antenna hole 16 or the antenna layer of the composite first substrate layer after the perforation of the antenna hole is composited with the second substrate layer of the second unreeling mechanism 7 through the compositing mechanism 6, namely the second substrate layer is bonded with the antenna layer or the first substrate layer through the adhesive, taking the antenna layer to be processed of the composite first substrate layer as an example, the compositing mechanism 6 is also provided with a heating drum, and the heating drum synchronously heats the adhesive 19 on the antenna layer in the process of compositing the antenna layer of the composite first substrate layer after the perforation of the antenna hole 16 with the second substrate layer unreeled by the second unreeling mechanism 7 through the compositing mechanism 6. The temperature range of the heating drum is 50-200 ℃, the antenna layer after the antenna holes are punched is heated, at the moment, the adhesive 19 coated on the antenna layer of the composite first substrate layer (the adhesive is actually coated on the first substrate layer) is heated and melted, the antenna layer of the composite first substrate layer is conveniently bonded with the second substrate layer by using the melted adhesive 19, and the composite mechanism 7 is conveniently bonded between the first substrate layer and the second substrate layer.
The antenna layer after the second substrate layer and the first substrate layer are compounded is subjected to flat die cutting and/or circular knife die cutting to form a chip binding point 14 and a chip binding positioning point 15 through a first die cutting mechanism, then the antenna at the periphery edge of the antenna layer antenna body of the first substrate layer and the first substrate layer are subjected to die cutting and/or roll cutting to form the outer contour of the antenna body through a second die cutting mechanism 10, and then the primarily formed antenna body of the first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer are formed on the second substrate layer, and the residual waste antenna and the corresponding residual waste first substrate layer are rolled and discharged through a first waste discharging rolling mechanism 11;
The alternative scheme of this step is that the first die cutting mechanism and the second die cutting mechanism 10 are interchanged in position and processing sequence, namely, the antenna layers of the second substrate layer and the first substrate layer are compounded, firstly, the antenna and the first substrate layer corresponding to the peripheral edge of the antenna body of the antenna layer are subjected to flat die cutting and/or circular knife die cutting simultaneously by the second die cutting mechanism to form the outer contour of the antenna body, then, the antenna and the first substrate layer of the antenna layer are subjected to flat die cutting and/or circular knife die cutting simultaneously by the first die cutting mechanism to form the chip binding point 15 and the chip binding positioning point 14, then, the antenna body of the preliminarily molded compound first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer are formed on the second substrate layer, and the residual waste antenna and the corresponding residual waste first substrate layer are rolled and discharged by the first waste discharging rolling mechanism 11
Assuming that the antenna layer released by the first unreeling mechanism 1 is not adhered with the first substrate layer, at the moment, the antenna layer compounded with the second substrate layer is subjected to flat die cutting and/or circular cutter die cutting to form a chip binding point 15 and a chip binding positioning point 14 by the first die cutting mechanism, then subjected to flat die cutting and/or circular cutter die cutting to form an outer contour of the antenna body by the second die cutting mechanism 10, then formed into a preliminarily formed antenna body and a residual waste antenna by the second substrate layer, and the residual waste antenna is rolled and discharged by the first waste discharging and rolling mechanism 11, or alternatively, subjected to flat die cutting and/or circular cutter die cutting to form an outer contour of the antenna body by the antenna body periphery of the antenna layer by the second die cutting mechanism 10, then subjected to flat die cutting and/or circular cutter die cutting to form the chip binding point 15 and the chip binding positioning point 14 by the antenna body by the first die cutting mechanism, and then formed into the preliminarily formed antenna body and the residual waste antenna by the first waste discharging and rolling mechanism 11.
Referring to fig. 2, in the seventh step of the processing technology of the full-die-cut ultrahigh frequency electronic tag antenna in this embodiment 1, the first die-cutting mechanism is divided into a flat die-cutting machine for flat die-cutting one of the die-bonding points 15 or a circular-cutter die-cutting machine 8 for round-cutter die-cutting, and a flat die-cutting machine for flat die-cutting the other die-bonding point 15 and the die-bonding point 14 or a circular-cutter die-cutting machine 9 for round-cutter die-cutting, and in this embodiment 1, the first die-cutting mechanism is divided into a circular-cutter die-cutting machine 8 for round-cutter die-cutting the other die-bonding point 15 and the die-bonding point 14.
The above-mentioned circular knife die-cutting machine 8 that is used for carrying out the circular knife die-cutting to one of them chip binding point 15, the circular knife die-cutting machine 9 that is used for carrying out the circular knife die-cutting to another chip binding point 15 and chip binding setpoint 14, and carry out the second die-cutting mechanism 10 that the circular knife die-cutting formed the outline of antenna body 17 to the antenna of antenna body 17 peripheral edge of antenna layer, the position and the processing order of three can be adjusted wantonly, exchange, all can realize the processing to the outline of chip binding setpoint 14, chip binding point 15, antenna body 17.
Step eight, after the waste is rolled and discharged by the first waste discharge rolling mechanism 11, the isolation layer is unreeled by the third unreeling mechanism 12, so that the isolation layer is covered on the antenna of the antenna body formed preliminarily or on the first substrate layer;
And step nine, the antenna body covered with the isolation layer is sent to a second traction device, the antenna body covered with the isolation layer is helped to be conveyed to a finished product winding mechanism by the second traction device, and the finished product winding mechanism 13 is used for winding to form a die-cut ultrahigh frequency electronic tag antenna finished product.
The antenna hole processing mechanism 4 performs the perforation of the antenna hole 16 on the antenna layer, and adopts a flat press die cutting process or a circular knife die cutting process.
In the sixth step, in the process of compounding the antenna layer after the perforation of the antenna hole 16 or the antenna layer of the composite first substrate layer with the second substrate layer unwound by the second unwinding mechanism 7 through the compounding mechanism 6, the heating drum of the compounding mechanism 6 synchronously heats the adhesive on the antenna layer, and the adhesive stick is used to compound the second substrate layer with the antenna layer or compound the second substrate layer with the antenna layer of the composite first substrate layer;
Of course, the first die cutting mechanism may perform die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer, and/or die cutting on the first substrate layer twice or more to form die binding points and die binding positioning points. The operation is more complicated, the steps are more various, but the processing precision can be improved, and the product quality is improved.
The embodiment 2 is basically the same as the embodiment 1, and the difference is that in the seventh production step of the processing technology of the full-die-cut ultrahigh-frequency electronic tag antenna in embodiment 2, the first die-cutting mechanism is a die-cutting machine which simultaneously performs flat die-cutting and/or circular-cutter die-cutting on the die-bonding points 15 and 14, that is, the first die-cutting mechanism completes flat die-cutting and/or circular-cutter die-cutting on the die-bonding points 15 and 14 at one time, for example, the flat die-cutting machine is replaced by the circular-cutter die-cutting machine to perform flat die-cutting on the antenna layer at one time to form the die-bonding points 15 and 14, that is, the die-cutting cutter of the flat die-cutting machine forms the die-bonding points 15 and 14 at one time on the antenna layer, for example, the die-cutting cutter of the die-cutting tool is used for controlling the thickness of the blade of the die-cutting tool, so that the die-cutting tool can form a cutter die-cutting die according to the shape requirements of the die-bonding points 15 and 14, and further realize one-time die-cutting on the die-bonding points 15 and 14, such as to realize one-time die-cutting on the die-bonding points 15 and 14, or one-off operation of adjacent blades, and especially realize one-time die-cutting and/or more than-bonding points 14 and one-time die-bonding point 14. And then carrying out flat die cutting and/or circular knife die cutting on the antennae at the peripheral edges of the antenna body 17 of the antenna layer through the second die cutting mechanism 10 to form the outer contour of the antenna body 17.
The first die cutting mechanism is used for carrying out one-time platen die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer to form a chip binding point and a chip binding positioning point.
The positions and the processing sequences of the first die cutting mechanism and the second die cutting mechanism can be interchanged.
Compared with the specific embodiment 1, the processing efficiency of the embodiment 2 is higher, and the die cutting molding of the die bonding points 15 and 14 is performed once, so that the accuracy is higher.
Embodiment 3 the embodiment 3 is basically the same as the embodiment 1, except that in the seventh production step of the processing technology of the full-die-cut ultrahigh frequency electronic tag antenna in embodiment 3, the first die-cutting mechanism for die-cutting the die-bonding sites 14 and 15 and the second die-cutting mechanism 10 for die-cutting the peripheral edge of the antenna body 17 are combined into one flat die-cutting machine or circular cutter die-cutting machine.
That is, the first die cutting mechanism and the second die cutting mechanism 10 are combined into a flat die cutting machine or a round cutter die cutting machine, the flat die cutting and/or round cutter die cutting of the chip binding point 15, the chip binding point 14 and the outer contour of the antenna body 17 can be finished at one time, and the operations of flat die cutting and/or round cutter die cutting on the antennas at the peripheral edges of the antenna body 17 of the antenna layer can be performed to form the outer contour of the antenna body 17, such as the operation of replacing the flat die cutting machine into the round cutter die cutting machine by the flat die cutting machine is similar, the flat die cutting is performed on the antenna layer to form the outer contour of the chip binding point 15, the chip binding point 14 and the antenna body 17, that is, the die cutting tools of the flat die cutting machine perform one-off die cutting forming on the antenna layer to form the chip binding point 15, the chip binding point 14 and the outer contour of the antenna body 17, such as the chip binding point 15, the chip binding point 14 and the outer contour of the antenna body 17, and the adjacent chip binding point 14 are formed by one-off die cutting, and the adjacent chip binding point 14 and/or the adjacent chip binding point 14 are formed by one-off die cutting point 14, and the adjacent chip binding point 14 and the adjacent chip binding point or the adjacent chip binding point 14 are formed by one-off die cutting point or the adjacent chip binding point 14.
At this time, the antenna layer of the first substrate layer and the composite second substrate layer output by the composite mechanism 6 in the seventh step enters the input port of a flat press die cutter or a circular cutter die cutter combined by the first die cutting mechanism and the second die cutting mechanism 10, and then the output port of the flat press die cutter or the circular cutter die cutter outputs the antenna layer of the first substrate layer and the antenna layer of the second substrate layer after being subjected to flat press die cutting and/or circular cutter die cutting processing and corresponding to the input port of the first waste discharge winding mechanism 11 and the input port of the first traction device 24, wherein the waste antenna and the waste first substrate layer after being subjected to flat press die cutting and/or circular cutter die cutting processing are subjected to waste discharge winding by the first waste discharge winding mechanism 11.
Compared with the specific embodiments 1 and 2, the processing efficiency of the embodiment 3 is higher, and the accuracy is higher because the die cutting and forming of the outer contours of the die bonding points 15, the die bonding positioning points 14 and the antenna body 17 are performed once.
Embodiment 4, referring to fig. 5, embodiment 4 is substantially the same as embodiment 1, except that in embodiment 4, the number of the chip binding points is two, and the processing device further includes a second waste discharging and winding mechanism 26;
The first die cutting mechanism comprises a first flat die cutter or a first circular cutter die cutter 8 for carrying out flat die cutting on one chip binding point, two redundant antennas or first substrate layers on two sides of the antenna layer and two redundant antennas and two redundant first substrate layers on two sides of the antenna layer, and a second flat die cutter or a second circular cutter die cutter 9 for carrying out flat die cutting on the other chip binding point 15 and the chip binding positioning point 14; the input port of the first flat die-cutting machine or the first circular cutter die-cutting machine corresponds to the output port of the compound mechanism 6, the output port of the first flat die-cutting machine or the first circular cutter die-cutting machine corresponds to the input port of the second waste discharge winding mechanism 26 and the input port of the second flat die-cutting machine or the second circular cutter die-cutting machine 9, the output port of the second flat die-cutting machine or the second circular cutter die-cutting machine 9 corresponds to the input port of the second die-cutting mechanism 10, at this time, the seventh step in the corresponding processing step is the antenna layer after the second substrate layer is compounded or the antenna layer after the second substrate layer is compounded and the antenna layer of the first substrate layer, the first flat die-cutting machine or the first circular cutter die-cutting machine 8 firstly passes through the binding point of one chip, simultaneously carries out flat die-cutting or circular cutter die-cutting on the two-side redundant antennas of the antenna layer and the two-side redundant antenna waste materials and the first substrate material, and the two-side waste materials are formed through the second waste discharge winding mechanism 26, then, carrying out flat die cutting or circular knife die cutting on the other chip binding point 15 and the chip binding positioning point 14 by a second flat die cutting machine or a second circular knife die cutting machine 9 of the first die cutting mechanism to jointly form the chip binding point 15 and the chip binding positioning point 14, carrying out flat die cutting and/or circular knife die cutting on the antennas at the periphery edges of the antenna body of the antenna layer by the second die cutting mechanism 10 to form the outer contour of the antenna body, and rolling and discharging residual antenna waste or residual antenna waste and first base material waste after the outer contour of the chip binding point 15, the chip binding positioning point 14 and the antenna body 17 by the first waste discharging rolling mechanism 11; in the actual processing process, at least one row of antennas of the antenna layer to be processed or the antenna layer of the composite first substrate layer, which are parallel to the conveying direction (assumed to be the long direction), and even a plurality of rows of antennas of the finished ultrahigh frequency electronic tag can be processed, in order to meet the requirements of the die cutting mechanism at each stage, especially the width requirements of the latter processing die cutting device in the first die cutting mechanism or the second die cutting mechanism positioned behind the first die cutting mechanism on the antenna layer to be processed or the antenna layer of the composite first substrate layer, therefore, the operation of die cutting is carried out on the redundant parts on the two sides of the antenna layer to be processed or the antenna layer of the composite first substrate layer in the former processing die cutting device of the first die cutting mechanism is added, so as to meet the requirements of the latter processing die cutting device in the first die cutting mechanism or the second die cutting mechanism positioned behind the first die cutting mechanism in the processing process on the width direction of the antenna layer to be processed or the antenna layer of the composite first substrate layer.
Of course, there may be an alternative to this embodiment 4, in which the first die-cutting mechanism includes a first die-cutting machine 8 for die-cutting one of the die-bonding points or a first circular-cutter die-cutting machine for die-cutting a circular cutter; the first die-cutting mechanism further comprises a second flat-press die-cutting machine or a second round-cutter die-cutting machine 9 for carrying out flat-press die-cutting on the other chip binding point 15 and the chip binding positioning point 14, and simultaneously carrying out flat-press die-cutting on the redundant antenna or the first base material layer at two sides of the antenna layer and the redundant antenna and the redundant first base material layer at two sides of the antenna layer, wherein the input port of the first flat-press die-cutting machine or the first round-cutter die-cutting machine 8 corresponds to the output port of the composite mechanism 6, the output port of the first flat-press die-cutting machine or the first round-cutter die-cutting machine 8 corresponds to the input port of the second flat-press die-cutting machine or the second round-cutter die-cutting machine 9, and the output port of the second flat-press die-cutting machine or the second round-cutter die-cutting machine 9 corresponds to the input port of the second waste discharging and winding mechanism 26 and the input port of the second die-cutting mechanism 10; at this time, the seventh step of the corresponding processing steps is that the antenna layer after the second substrate layer is compounded or the antenna layer after the second substrate layer is compounded with the first substrate layer, firstly, one of the chip binding points is subjected to flat press die cutting or circular cutter die cutting by a first flat press die cutting machine or a first circular cutter die cutting machine 8 of the first die cutting mechanism, then the other chip binding point 15 and the chip binding point 14 are subjected to flat press die cutting by a second flat press die cutting machine or a second circular cutter die cutting machine 9 of the first die cutting mechanism, and meanwhile, the two redundant antennas on two sides of the antenna layer or the two redundant antennas on two sides of the first substrate layer and the antenna layer and the two redundant first substrate layers on two sides of the antenna layer are subjected to flat press die cutting or circular cutter die cutting to jointly form the chip binding point 15, the chip binding point 14, the two-side residual antenna waste or the two-side residual antenna waste and the first substrate waste are rolled and discharged through the second waste discharge rolling mechanism 26, then the antennae at the periphery of the antenna body of the antenna layer are subjected to flat die cutting and/or circular knife die cutting through the second die cutting mechanism 10 to form the outer contour of the antenna body, and the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17 are processed to obtain the residual antenna waste or the residual antenna waste and the first substrate waste, and the waste is rolled and discharged through the first waste discharge rolling mechanism 11. The first flat pressing die cutter or the first circular knife die cutter 8, the second flat pressing die cutter or the second circular knife die cutter 9 of the first die cutting mechanism can also be exchanged in position, and the effects are the same.
In addition, the processing equipment further comprises an antenna hole waste collection device 5 for collecting the waste antenna generated after the antenna hole processing mechanism 4 punches or the waste antenna generated after the antenna hole processing mechanism punches and the waste first substrate layer, wherein the antenna hole waste collection device 5 is positioned below the antenna hole processing mechanism 4, when the antenna hole processing mechanism 4 punches the antenna layer or the antenna layer of the composite first substrate layer, the antenna hole 16 directly penetrates through the antenna layer or the antenna layer of the composite first substrate layer to be die-cut, the waste antenna or the waste antenna of the corresponding antenna hole after punching and the waste first substrate layer enter or fall into the waste collection device 5 together, and the waste collection device 5 is preferably arranged right below the bottom of the antenna hole processing mechanism 4.
In this embodiment 4, the second waste discharging and winding mechanism 26 is newly added to improve the overall waste discharging and winding effect, so that the waste discharging is cleaner, the product yield is higher, the pressure of the first waste discharging and winding mechanism is dispersed, and the probability of the first waste discharging and winding mechanism interrupting the work is reduced.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.

Claims (13)

1. The antenna processing equipment of the composite and multi-station full-die-cutting ultrahigh frequency tag is characterized by comprising a first die-cutting mechanism, a second die-cutting mechanism and a traction mechanism, wherein the first die-cutting mechanism is used for die-cutting the die-bonding positioning points (14) of the ultrahigh frequency tag antenna and the die-cutting mechanism is used for die-cutting the peripheral edges of the ultrahigh frequency tag antenna, and the traction mechanism is used for carrying out traction on the antenna layer of the antenna body (17) and/or the antenna layer of the composite first substrate layer and the second substrate layer in the processing process of the first die-cutting mechanism and the second die-cutting mechanism (10);
A gap formed between the chip binding points (15) is communicated with the antenna hole (16) and the outside of the antenna;
The antenna processing equipment of the composite and multi-station full-die-cutting ultrahigh frequency tag also comprises an antenna hole processing mechanism (4) for die-cutting an antenna hole (16) of the ultrahigh frequency tag antenna, a composite mechanism (6) for compositing a second substrate layer and the antenna layer or compositing the second substrate layer and a first substrate layer adhered with the antenna layer, a first waste discharge winding mechanism (11) for winding the waste antenna processed by the first die-cutting mechanism and the second die-cutting mechanism (10) or winding the waste antenna processed by the first die-cutting mechanism and the second die-cutting mechanism (10) and a third unreeling mechanism (12) for unreeling an isolating layer on the antenna layer, wherein the traction mechanism comprises a first traction device (23) and a second traction device (24), an input port of the first traction device (23) is input with the antenna layer to be processed or the antenna layer adhered with the first substrate layer, an output port of the first traction device (23) corresponds to the antenna hole processing mechanism (4), an output port of the antenna hole processing mechanism (4) corresponds to an input port of the composite mechanism (6), an output port of the antenna hole processing mechanism (4) corresponds to an output port of the composite mechanism (6), a waste discharge winding mechanism (1) corresponds to an output port of the first die-cutting mechanism (10) of the composite mechanism (6), a waste discharge winding mechanism (24) corresponds to an output port of the first discharge winding mechanism (10) of the first traction device (10), the output port of the third unreeling mechanism (12) corresponds to the input port of the second traction device (24), and the output port of the second traction device (24) outputs the antenna of the processed ultrahigh frequency tag;
The antenna device comprises a first traction device (23) and a second traction device (24), wherein an input port of the first traction device (23) is used for inputting an antenna layer to be processed or an antenna layer adhered with a first substrate layer, an output port of the first traction device (23) is used for inputting an antenna hole processing mechanism (4), an output port of the antenna hole processing mechanism (4) is used for inputting a compound mechanism (6), an output port of the compound mechanism (6) is used for inputting a second die-cutting mechanism (10), an output port of the second die-cutting mechanism (10) is used for inputting the first die-cutting mechanism, an output port of the first die-cutting mechanism is used for inputting a first waste discharging winding mechanism (11) and an input port of the second traction device (24), an output port of the third unwinding mechanism (12) is used for outputting a processed ultrahigh frequency tag antenna.
2. The antenna processing device for the composite and multi-station full-die-cut ultrahigh-frequency tag of claim 1, wherein the first die-cutting mechanism is composed of a flat die-cutting mechanism, and the flat die-cutting mechanism is a flat die-cutting machine comprising at least one die-cutting tool for flat die-cutting a die-bonding positioning point (14) and a die-bonding point (15);
Or the first die cutting mechanism is composed of a circular cutter die cutting mechanism, and the circular cutter die cutting mechanism is a circular cutter die cutting machine comprising at least one rolling cutter for die cutting chip binding (positioning point (14) and chip binding point (15) of the circular cutter;
Or the first die cutting mechanism is a mixed die cutting mechanism formed by mixing a flat die cutting mechanism and a circular cutter die cutting mechanism, and the mixed die cutting mechanism is a mixed die cutting machine comprising at least one die cutting tool for flat die cutting a chip binding positioning point (14) or a chip binding point (15) and at least one hob cutting tool for circular cutter die cutting the chip binding point (15) or the chip binding positioning point (14);
The second die cutting mechanism (10) is a flat die cutting machine for flat die cutting the peripheral edge of the antenna body (17) or a circular cutter die cutting machine for circular cutter die cutting the peripheral edge of the antenna body (17);
The antenna hole processing mechanism (4) is a flat press die-cutting machine for flat press die-cutting the antenna holes (16) or a circular cutter die-cutting machine for circular cutter die-cutting the antenna holes (16).
3. The antenna processing device for the composite and multi-station full-die-cut ultrahigh-frequency tag of claim 2, wherein the first die-cutting mechanism for die-cutting the die-bonding positioning points (14) and the die-bonding points (15) and the second die-cutting mechanism (10) for die-cutting the peripheral edges of the antenna body (17) are combined into a flat die-cutting machine or a circular cutter die-cutting machine.
4. An antenna processing apparatus for a composite and multi-station full die-cut ultrahigh frequency tag according to any one of claims 1 to 3, further comprising a first unreeling mechanism (1) for unreeling an antenna layer to be processed or a composite first substrate layer to be processed, a coating mechanism (2) for coating an adhesive on one side of the antenna layer to be processed or one side of the first substrate layer to which the antenna layer is not attached, a drying mechanism (3) for drying the antenna layer coated with the adhesive by the coating mechanism (2) or a drying mechanism (3) for drying the antenna layer coated with the adhesive by the coating mechanism (2) of the composite first substrate layer, a second unreeling mechanism (7) for unreeling a second substrate layer, and a finished reeling mechanism (13) for reeling the processed antenna layer together with the second substrate layer and the isolation layer;
The delivery outlet of first unreeling mechanism (1) corresponds the input port of coating mechanism (2), and the delivery outlet of coating mechanism (2) corresponds the input port of stoving mechanism (3), and the delivery outlet of stoving mechanism (3) corresponds the input port of first draw gear (23), and the delivery outlet of second unreeling mechanism (7) corresponds the input port of compound mechanism (6), and the input port of finished product rolling mechanism (13) corresponds the delivery outlet of second draw gear (24).
5. The antenna processing device for the composite and multi-station full-die-cut ultrahigh frequency tag of claim 4, wherein a deviation rectifying device (25) is additionally arranged between the drying mechanism (3) and the first traction device (23), an output port of the drying mechanism (3) corresponds to an input port of the deviation rectifying device (25), and an output port of the deviation rectifying device (25) corresponds to an input port of the first traction device (23).
6. The antenna processing device for the composite and multi-station full-die-cut ultrahigh-frequency tag according to claim 5, wherein the number of the chip binding points (15) is two, and the first die-cutting mechanism is divided into a flat die cutter for carrying out flat die cutting on one chip binding point (15) or a round-cutter die cutter for carrying out round-cutter die cutting, and a flat die cutter for carrying out flat die cutting on the other chip binding point (15) and the chip binding point (14) or a round-cutter die cutter for carrying out round-cutter die cutting;
The output port of the compound mechanism (6) corresponds to the input port of the flat-die cutting machine or the round-knife cutting machine for flat-die cutting one of the chip binding points (15), the output port of the flat-die cutting machine or the round-knife cutting machine for flat-die cutting one of the chip binding points (15) corresponds to the input port of the flat-die cutting machine or the round-knife cutting machine for flat-die cutting the other chip binding point (15) and the chip binding positioning point (14), and the output port of the flat-die cutting machine or the round-knife cutting machine for flat-die cutting the other chip binding point (15) and the chip binding positioning point (14) corresponds to the input port of the second die cutting mechanism (10);
Or the output port of the compound mechanism (6) corresponds to the input port of the flat-die cutting machine or the round-knife cutting machine for flat-die cutting the other chip binding point (15) and the chip binding positioning point (14), the output port of the flat-die cutting machine or the round-knife cutting machine for flat-die cutting the other chip binding point (15) and the chip binding positioning point (14) corresponds to the input port of the flat-die cutting machine or the round-knife cutting machine for flat-die cutting one chip binding point (15), and the output port of the flat-die cutting machine or the round-knife cutting machine for flat-die cutting one chip binding point (15) corresponds to the input port of the second die cutting mechanism (10).
7. The antenna processing device for the composite and multi-station full-die-cut ultrahigh frequency tag of claim 5, wherein the number of the chip binding points (15) is two, and the processing device further comprises a second waste discharging and winding mechanism (26);
The first die cutting mechanism comprises a first flat die cutting machine or a first round cutter die cutting machine for carrying out flat die cutting on one chip binding point (15), redundant antennas or a first base material layer on two sides of the antenna layer and redundant antennas and redundant first base material layers on two sides of the antenna layer, and a second flat die cutting machine or a second round cutter die cutting machine for carrying out flat die cutting on the other chip binding point (15) and the chip binding positioning point (14), wherein the input port of the first flat die cutting machine or the first round cutter die cutting machine corresponds to the output port of the composite mechanism (6), the output port of the first flat die cutting machine or the first round cutter die cutting machine corresponds to the input port of the second waste discharging winding mechanism (26) and the input port of the second flat die cutting machine or the second round cutter die cutting machine, and the output port of the second flat die cutting machine or the second round cutter die cutting machine corresponds to the input port of the second die cutting mechanism (10);
Or the first die cutting mechanism comprises a first flat die cutting machine or a first round cutter die cutting machine for carrying out flat die cutting on one chip binding point (15), redundant antennas or a first base material layer on two sides of the antenna layer and redundant antennas and redundant first base material layers on two sides of the antenna layer, and a second flat die cutting machine or a second round cutter die cutting machine for carrying out flat die cutting on the other chip binding point (15) and the chip binding point (14), wherein the input port of the second flat die cutting machine or the second round cutter die cutting machine corresponds to the output port of the composite mechanism (6), the output port of the second flat die cutting machine or the second round cutter die cutting machine corresponds to the input port of the first flat die cutting machine or the first round cutter die cutting machine, and the output port of the first flat die cutting machine or the first round cutter die cutting machine corresponds to the input port of the second waste discharging winding mechanism (26) and the input port of the die cutting mechanism (10);
Or the first die-cutting mechanism comprises a first flat die-cutting machine for flat die-cutting one of the chip binding points (15) or a first round-cutter die-cutting machine for round-cutter die-cutting, and a second flat die-cutting machine for flat die-cutting the other chip binding point (15) and the chip binding positioning point (14), and simultaneously, the two sides of the redundant antenna or the first base material layer and the two sides of the antenna layer, and the redundant first base material layer, wherein the input port of the first flat die-cutting machine or the first round-cutter die-cutting machine corresponds to the output port of the compound mechanism (6), the output port of the first flat die-cutting machine or the first round-cutter die-cutting machine corresponds to the input port of the second flat die-cutting machine or the second round-cutter die-cutting machine, the output port of the second flat die-cutting machine or the second round-cutter die-cutting machine corresponds to the input port of the second waste discharging and rolling mechanism (26) and the input port of the second die-cutting mechanism (10)
Or the first die cutting mechanism comprises a first flat die cutting machine for flat die cutting one of the chip binding points (15) or a first round cutter die cutting machine for round cutter die cutting, and a second flat die cutting machine for flat die cutting the other chip binding point (15) and the chip binding locating point (14), and simultaneously, the redundant antennas or the first substrate layers on two sides of the antenna layer and the redundant antennas and the redundant first substrate layers on two sides of the antenna layer, wherein the input port of the second flat die cutting machine or the second round cutter die cutting machine corresponds to the output port of the composite mechanism (6), the output port of the second flat die cutting machine or the second round cutter die cutting machine corresponds to the input port of the second waste discharging winding mechanism (26) and the input port of the first flat die cutting machine or the first round cutter die cutting machine, and the output port of the first flat die cutting machine or the first round cutter die cutting machine corresponds to the input port of the second die cutting mechanism (10).
8. The antenna processing device for the composite and multi-station full-die-cut ultrahigh-frequency tag according to claim 6 or 7, wherein the antenna processing device further comprises an antenna hole (16) and a waste collecting device (5) for collecting a waste antenna generated after punching by the antenna hole processing mechanism (4) or a waste antenna generated after punching and a waste first substrate layer, the antenna hole (16) and the waste collecting device (5) are positioned below the antenna hole processing mechanism (4), the composite mechanism (6) is further provided with a heating drum for heating an adhesive, and the composite mechanism (6) comprises a rubber roller for compositing a second substrate layer with the antenna layer or a rubber roller for compositing the second substrate layer with the antenna layer of the composite first substrate layer.
9. An antenna processing method of a composite and multi-station full-die-cutting ultrahigh frequency tag relates to an antenna processing device of the composite and multi-station full-die-cutting ultrahigh frequency tag in claim 8, and is characterized in that the production steps are as follows
The method comprises the steps that firstly, an antenna layer to be processed or an antenna layer compounded with a first substrate layer is unreeled by a first unreeling mechanism (1), and adhesive coating is carried out on one side of the antenna layer to be processed or one side of the antenna layer compounded with the first substrate layer, which is not adhered with the antenna layer, by a coating mechanism (2);
Step two, the coated antenna layer or the coated antenna layer of the composite first substrate layer is sent to a drying mechanism (3), and the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer is dried by the drying mechanism (3);
Step three, the dried antenna layer or the antenna layer of the composite first base material layer is sent to a deviation rectifying device (25), and the deviation rectifying device (25) is utilized to conduct reference positioning on the dried antenna layer or the antenna layer of the composite first base material layer, and the transfer direction of the antenna layer or the antenna layer of the composite first base material layer is corrected and/or calibrated;
The antenna layer after correction or the antenna layer of the composite first substrate layer is sent to a first traction device (23), the first traction device (23) is used for helping the antenna layer or the antenna layer of the composite first substrate layer to carry out transmission, the first traction device (23) and a second traction device (24) are used for coacting to further control the transmission speed of the antenna layer or the antenna layer of the composite first substrate layer, and the tension of the antenna layer or the antenna layer of the composite first substrate layer in the transmission process is stable and each die cutting and positioning is accurate
Step five, the antenna layer passing through the first traction device (23) or the antenna layer of the composite first substrate layer is sent to an antenna hole processing mechanism (4) to punch an antenna hole (16), the antenna hole processing mechanism (4) punches the antenna hole (16) on the antenna layer or the antenna layer of the composite first substrate layer, and the waste antenna generated after punching or the waste antenna generated after punching and the waste first substrate layer enter an antenna hole (16) waste collection device (5);
Step six, the antenna layer after the perforation of the antenna hole (16) or the antenna layer after the perforation of the antenna hole (16) and the composite first substrate layer are composited together through the compositing mechanism (6) and the second substrate layer of the second unreeling mechanism (7), namely the second substrate layer is adhered with the antenna layer or the first substrate layer through an adhesive;
Step seven, the antenna layer after the second substrate layer is compounded, firstly, the antenna of the antenna layer is subjected to flat die cutting and/or circular knife die cutting through a first die cutting mechanism to form a chip binding point (15) and a chip binding positioning point (14), then, the antenna at the periphery edge of an antenna body (17) of the antenna layer is subjected to flat die cutting and/or circular knife die cutting through a second die cutting mechanism (10) to form the outer contour of the antenna body (17), then, the primarily formed antenna body (17) and the residual waste antenna are formed on the second substrate layer, and the residual waste antenna is rolled and discharged through a first waste discharging rolling mechanism (11);
Or the antenna layer after the second substrate layer and the first substrate layer are compounded, firstly, the first substrate layer and the antenna of the antenna layer are subjected to flat die cutting and/or circular knife die cutting simultaneously to form a chip binding point (15) and a chip binding positioning point (14) through a first die cutting mechanism, then, the antenna at the periphery edge of the antenna layer antenna body (17) of the first substrate layer and the first substrate layer are subjected to die cutting and/or roller cutting simultaneously through a second die cutting mechanism (10) to form the outer contour of the antenna body (17), then, the antenna body (17) of the first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer are formed on the second substrate layer, and the residual waste antenna and the corresponding residual waste first substrate layer are rolled and discharged through a first waste discharging rolling mechanism (11);
Or the antenna layer after the second substrate layer is compounded, firstly carrying out flat die cutting and/or circular knife die cutting on the antenna at the periphery edge of the antenna body (17) of the antenna layer through a second die cutting mechanism (10) to form the outer outline of the antenna body (17), then carrying out flat die cutting and/or circular knife die cutting on the antenna of the antenna layer through a first die cutting mechanism to form a chip binding point (15) and a chip binding positioning point (14), then forming a preliminarily formed antenna body (17) and a residual waste antenna on the second substrate layer, and winding and discharging the residual waste antenna through a first waste discharging winding mechanism (11);
Or the antenna layer of the composite second substrate layer and the antenna layer of the first substrate layer are subjected to flat die cutting and/or circular knife die cutting simultaneously on the antenna and the first substrate layer corresponding to the peripheral edge of the antenna body (17) of the antenna layer through a second die cutting mechanism (10) to form the outer outline of the antenna body (17), then subjected to flat die cutting and/or circular knife die cutting simultaneously on the antenna and the first substrate layer of the antenna layer through a first die cutting mechanism to form a chip binding point (15) and a chip binding positioning point (14), then the antenna body (17) of the composite first substrate layer, the residual waste antenna and the corresponding residual waste first substrate layer which are formed preliminarily are formed on the second substrate layer, and the residual waste antenna and the corresponding residual waste first substrate layer are rolled and discharged through a first waste discharging rolling mechanism (11);
or the antenna layer after the second substrate layer is compounded or the antenna layer of the second substrate layer and the first substrate layer is compounded, firstly, one chip binding point (15) is processed by a first flat die cutter or a first round die cutter of a first die cutting mechanism, meanwhile, the redundant antennas on two sides of the antenna layer or the redundant antennas on two sides of the first substrate layer and the antenna layer and the redundant first substrate layer are subjected to flat die cutting or round die cutting to form two sides of surplus antenna waste or two sides of surplus antenna waste and the first substrate waste, the two sides of surplus antenna waste or two sides of surplus antenna waste and the first substrate waste are wound and exhausted by a second waste exhausting winding mechanism (26), then carrying out flat die cutting or circular cutter die cutting on the other chip binding point (15) and the chip binding positioning point (14) by a second flat die cutting machine or a second circular cutter die cutting machine of the first die cutting mechanism to jointly form the chip binding point (15) and the chip binding positioning point (14), then carrying out flat die cutting and/or circular cutter die cutting on the antennas at the periphery of the antenna body (17) of the antenna layer or on the antennas corresponding to the periphery of the antenna body (17) of the antenna layer and the first substrate layer by the second die cutting mechanism (10) to form the outer contour of the antenna body (17), and carrying out rolling and waste discharging on the residual antenna waste or the residual antenna waste and the first substrate waste after the outer contour of the chip binding point (15), the chip binding positioning point (14) and the antenna body (17) by the first waste discharging rolling mechanism (11);
Or the antenna layer after the second substrate layer is compounded or the antenna layer of the second substrate layer and the first substrate layer is compounded, firstly, one of the chip binding points (15) is subjected to flat die cutting or circular cutter die cutting through a first flat die cutting machine or a first circular cutter die cutting machine of a first die cutting mechanism, then the other chip binding point (15) and the chip binding positioning point (14) are subjected to flat die cutting through a second flat die cutting machine or a second circular cutter die cutting machine of the first die cutting mechanism, meanwhile, the redundant antennas on two sides of the antenna layer or the redundant antennas on two sides of the redundant first substrate layer and the antenna layer and the redundant antennas on two sides of the first substrate layer and the first substrate layer are subjected to flat die cutting or circular cutter die cutting to jointly form the chip binding point (15), the chip binding positioning point (14), the residual antenna waste on two sides or the residual antenna waste on two sides and the first substrate waste, the method comprises the steps of rolling and discharging residual antenna waste on two sides or residual antenna waste on two sides and first substrate waste through a second waste discharge rolling mechanism (26), then conducting flat die cutting and/or circular knife die cutting on the antenna on the periphery edge of an antenna body (17) of an antenna layer or on the corresponding antenna on the periphery edge of the antenna body (17) of the antenna layer and the first substrate layer through a second die cutting mechanism (10) to form the outer outline of the antenna body (17), and rolling and discharging the residual antenna waste or residual antenna waste and first substrate waste after the chip binding points (15), the chip binding positioning points (14) and the outer outline of the antenna body (17) are processed through a first waste discharge rolling mechanism (11);
Step eight, after the waste is rolled and discharged by the first waste discharge rolling mechanism (11), the isolation layer is unreeled by the third unreeling mechanism (12) so that the isolation layer is covered on the antenna of the antenna body (17) formed preliminarily or on the first substrate layer;
And step nine, the antenna body (17) covered with the isolation layer is sent to a second traction device (24), the antenna body (17) covered with the isolation layer is helped to be sent to a finished product winding mechanism (13) through the second traction device (24), and a die-cut ultra-high frequency electronic tag antenna finished product is formed by winding of the finished product winding mechanism (13).
10. The method for processing the antenna of the composite and multi-station full-die-cut ultrahigh-frequency tag of claim 9, wherein the antenna hole processing mechanism (4) is used for punching the antenna holes (16) on the antenna layer, and a flat die cutting process or a circular knife die cutting process is adopted.
11. The method for processing the antenna of the composite and multi-station full-die-cut ultrahigh-frequency tag of claim 10, wherein in the step six, in the process that the antenna layer after punching the antenna hole (16) or the antenna layer of the composite first substrate layer is compounded with the second substrate layer unreeled by the second unreeled mechanism (7) through the compounding mechanism (6), the heating drum of the compounding mechanism (6) synchronously heats the adhesive on the antenna layer, and the adhesive stick is used for compounding the second substrate layer with the antenna layer or compounding the second substrate layer with the antenna layer of the composite first substrate layer.
12. The antenna processing method of the composite and multi-station full-die-cut ultrahigh frequency tag of claim 11, wherein the temperature range of the heating drum is 50-200 ℃, the temperature range of the drying mechanism (3) is 40-160 ℃, and the coating mechanism (2) is used for coating the adhesive on the antenna layer or the first substrate layer and contains a diluent solvent.
13. The method for processing the antenna of the composite and multi-station full-die-cut ultrahigh frequency tag according to any one of claims 9 to 12, wherein the first die-cutting mechanism performs one-time platen die cutting and/or circular cutter die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer and the first substrate layer to form a chip binding point (15) and a chip binding positioning point (14);
Or the first die cutting mechanism carries out two or more times of flat die cutting and/or circular knife die cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer to form a chip binding point (15) and a chip binding positioning point (14).
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203217604U (en) * 2013-01-29 2013-09-25 深圳市华阳微电子有限公司 All-in-one machine manufacturing split antenna RFID (Radio Frequency Identification) labels
CN211842283U (en) * 2020-03-18 2020-11-03 黄光伟 Antenna processing equipment for composite and multi-station full-die-cutting ultrahigh frequency tag

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100677676B1 (en) * 2005-04-12 2007-02-02 주식회사 모텍스 Label production equipment for electronic tags
CN110856289A (en) * 2018-08-20 2020-02-28 苏州汉纳材料科技有限公司 Flexible heating film and die cutting processing method and equipment thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203217604U (en) * 2013-01-29 2013-09-25 深圳市华阳微电子有限公司 All-in-one machine manufacturing split antenna RFID (Radio Frequency Identification) labels
CN211842283U (en) * 2020-03-18 2020-11-03 黄光伟 Antenna processing equipment for composite and multi-station full-die-cutting ultrahigh frequency tag

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