CN111183027A - 包含铝和金属层的导电背板 - Google Patents
包含铝和金属层的导电背板 Download PDFInfo
- Publication number
- CN111183027A CN111183027A CN201880064943.7A CN201880064943A CN111183027A CN 111183027 A CN111183027 A CN 111183027A CN 201880064943 A CN201880064943 A CN 201880064943A CN 111183027 A CN111183027 A CN 111183027A
- Authority
- CN
- China
- Prior art keywords
- backsheet
- layer
- conductive
- polymer
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 61
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 56
- 239000002184 metal Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000004411 aluminium Substances 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 239000000956 alloy Substances 0.000 claims abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 239000011135 tin Substances 0.000 claims abstract description 3
- 229910052718 tin Inorganic materials 0.000 claims abstract description 3
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Images
Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
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- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
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- B32B2307/70—Other properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2457/12—Photovoltaic modules
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17195176 | 2017-10-06 | ||
EP17195176.7 | 2017-10-06 | ||
PCT/EP2018/077348 WO2019068934A1 (en) | 2017-10-06 | 2018-10-08 | ELECTROCONDUCTIVE BACK SHEET COMPRISING ALUMINUM LAYER AND METALLIC LAYER |
Publications (2)
Publication Number | Publication Date |
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CN111183027A true CN111183027A (zh) | 2020-05-19 |
CN111183027B CN111183027B (zh) | 2023-09-01 |
Family
ID=60185983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201880064943.7A Active CN111183027B (zh) | 2017-10-06 | 2018-10-08 | 包含铝和金属层的导电背板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20200243703A1 (zh) |
EP (1) | EP3691890B1 (zh) |
CN (1) | CN111183027B (zh) |
ES (1) | ES2900269T3 (zh) |
WO (1) | WO2019068934A1 (zh) |
Citations (8)
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CN1412861A (zh) * | 2001-10-12 | 2003-04-23 | 拜尔公司 | 具有热塑性热熔融体粘合剂层的光电组件和其生产方法 |
EP2109137A2 (en) * | 2008-04-10 | 2009-10-14 | Samsung Electronics Co., Ltd. | Graded composition encapsulation thin film comprising anchoring layer and method of fabricating the same |
US20120234593A1 (en) * | 2011-03-18 | 2012-09-20 | Applied Materials, Inc. | Conductive foils having multiple layers and methods of forming same |
CN104851926A (zh) * | 2015-04-02 | 2015-08-19 | 占洪平 | 一种用于背接触太阳能组件的电路装置及其制备方法 |
US20150318423A1 (en) * | 2012-12-21 | 2015-11-05 | Agfa-Gevaert | A back sheet for photovoltaic modules |
CN105308756A (zh) * | 2013-05-07 | 2016-02-03 | 荷兰能源研究中心基金会 | 太阳能电池板及用于制造这种太阳能电池板的方法 |
CN205542811U (zh) * | 2016-04-22 | 2016-08-31 | 山东拜科通新材料科技有限公司 | 一种用于铝基柔性导电背板的电流引出装置 |
US20170133537A1 (en) * | 2014-03-21 | 2017-05-11 | E I Du Pont De Nemours And Company | Integrated back-sheets for back-contact solar cell modules |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101463708B1 (ko) | 2005-06-13 | 2014-11-19 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 플루오로중합체 함유 라미네이트 |
CA2680268C (en) | 2007-03-09 | 2015-11-03 | 3M Innovative Properties Company | Multilayer film |
US20090151773A1 (en) * | 2007-12-14 | 2009-06-18 | E. I. Du Pont De Nemours And Company | Acid Terpolymer Films or Sheets and Articles Comprising the Same |
DE102011084521A1 (de) * | 2011-10-14 | 2013-04-18 | Evonik Industries Ag | Verwendung einer Mehrschichtfolie mit Polyamid- und Polypropylenschichten für die Herstellung photovoltaischer Module |
KR20170060001A (ko) * | 2014-09-26 | 2017-05-31 | 코베스트로 도이칠란트 아게 | 무색, 투명 및 내열성 폴리우레탄 필름 및 이를 제조하는 방법 |
-
2018
- 2018-10-08 US US16/652,776 patent/US20200243703A1/en not_active Abandoned
- 2018-10-08 WO PCT/EP2018/077348 patent/WO2019068934A1/en unknown
- 2018-10-08 EP EP18779731.1A patent/EP3691890B1/en active Active
- 2018-10-08 CN CN201880064943.7A patent/CN111183027B/zh active Active
- 2018-10-08 ES ES18779731T patent/ES2900269T3/es active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1412861A (zh) * | 2001-10-12 | 2003-04-23 | 拜尔公司 | 具有热塑性热熔融体粘合剂层的光电组件和其生产方法 |
EP2109137A2 (en) * | 2008-04-10 | 2009-10-14 | Samsung Electronics Co., Ltd. | Graded composition encapsulation thin film comprising anchoring layer and method of fabricating the same |
US20120234593A1 (en) * | 2011-03-18 | 2012-09-20 | Applied Materials, Inc. | Conductive foils having multiple layers and methods of forming same |
US20150318423A1 (en) * | 2012-12-21 | 2015-11-05 | Agfa-Gevaert | A back sheet for photovoltaic modules |
CN105308756A (zh) * | 2013-05-07 | 2016-02-03 | 荷兰能源研究中心基金会 | 太阳能电池板及用于制造这种太阳能电池板的方法 |
US20170133537A1 (en) * | 2014-03-21 | 2017-05-11 | E I Du Pont De Nemours And Company | Integrated back-sheets for back-contact solar cell modules |
CN104851926A (zh) * | 2015-04-02 | 2015-08-19 | 占洪平 | 一种用于背接触太阳能组件的电路装置及其制备方法 |
CN205542811U (zh) * | 2016-04-22 | 2016-08-31 | 山东拜科通新材料科技有限公司 | 一种用于铝基柔性导电背板的电流引出装置 |
Also Published As
Publication number | Publication date |
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ES2900269T3 (es) | 2022-03-16 |
US20200243703A1 (en) | 2020-07-30 |
WO2019068934A1 (en) | 2019-04-11 |
EP3691890B1 (en) | 2021-09-15 |
CN111183027B (zh) | 2023-09-01 |
EP3691890A1 (en) | 2020-08-12 |
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