CN111172507A - Planar target burn through alarm system - Google Patents
Planar target burn through alarm system Download PDFInfo
- Publication number
- CN111172507A CN111172507A CN202010146391.3A CN202010146391A CN111172507A CN 111172507 A CN111172507 A CN 111172507A CN 202010146391 A CN202010146391 A CN 202010146391A CN 111172507 A CN111172507 A CN 111172507A
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- CN
- China
- Prior art keywords
- target
- planar target
- planar
- alarm
- burn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 24
- 239000013077 target material Substances 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims description 8
- 230000005284 excitation Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 239000002699 waste material Substances 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical group [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本发明公开一种平面靶材烧穿报警系统，包括磁控溅射平面靶、导线、报警器及控制系统，所述磁控溅射平面靶上设有平面靶材，所述导线设置于所述平面靶材的底部且所述导线外部包裹有绝缘层，所述导线与所述控制系统电连接，所述控制系统与所述报警器电连接。本发明平面靶材烧穿报警系统具有能最大限度的使用靶材，减少靶材浪费，且避免出现靶材烧穿而损坏平面靶的优点。
The present invention discloses a planar target burn-through alarm system, comprising a magnetron sputtering planar target, a wire, an alarm and a control system, wherein the magnetron sputtering planar target is provided with a planar target, the wire is arranged at the bottom of the planar target and the outside of the wire is wrapped with an insulating layer, the wire is electrically connected to the control system, and the control system is electrically connected to the alarm. The planar target burn-through alarm system of the present invention has the advantages of being able to use the target material to the maximum extent, reducing the waste of the target material, and avoiding the damage of the planar target due to the burn-through of the target material.
Description
Technical Field
The invention relates to a magnetron sputtering planar target, in particular to a planar target burn-through alarm system which uses a target material to the maximum extent, reduces target material waste and avoids the damage of the planar target caused by target material burn-through.
Background
In a coating production line, a magnetron sputtering technology is often used, and the working principle of magnetron sputtering is that electrons collide with argon atoms in the process of flying to a substrate under the action of an electric field so as to ionize the argon atoms to generate positive ions and new electrons; new electrons fly to the substrate, positive ions are accelerated to fly to the cathode target under the action of an electric field, the surface of the target is bombarded with high energy, the target material is sputtered, and neutral target atoms or molecules in sputtered particles are deposited on the substrate to form a film.
In magnetron sputtering production, the target material can generate an etching track and is gradually consumed, and because the coating line is in a vacuum state, the target material consumption condition of the planar target cannot be effectively judged, and the consumption of the target material is generally estimated according to experience and used accumulated power. However, such estimation usually has a certain error, and when the error is too large, the target is not used to the maximum extent, which results in waste of the target and increases the production cost, or the target is burnt through, which results in damage of the planar target, water leakage or abnormal state of the coating line, so that the existing estimation method brings many problems to the production.
Disclosure of Invention
The invention aims to provide a planar target burn-through alarm system which uses a target to the maximum extent, reduces target waste and avoids damage to a planar target caused by target burn-through.
In order to achieve the purpose, the planar target burnthrough alarm system provided by the invention comprises a magnetron sputtering planar target, a lead, an alarm and a control system, wherein the magnetron sputtering planar target is provided with the planar target, the lead is arranged at the bottom of the planar target, an insulating layer is wrapped outside the lead, the lead is electrically connected with the control system, and the control system is electrically connected with the alarm.
Compared with the prior art, the bottom of the planar target is provided with the lead, the outside of the lead is wrapped with the insulating layer, when the planar target is burnt through, the insulating layer on the surface of the lead is burnt immediately, so that an electric signal is generated on the lead, and the lead is electrically connected with the control system, so that the control system can feed back according to the received electric signal and give an alarm through the alarm, so that a film coating line stops coating at once, the purpose of protecting the target is achieved, and the target is prevented from being burnt through to damage the planar target; in addition, due to the existence of the alarm system, the target can be used safely without reserving a certain margin, the target can be used to the maximum extent, the waste of the target is greatly reduced, and the production cost is reduced.
Preferably, the number of the leads is two, and the leads are arranged at the bottom of the etching track of the planar target.
Preferably, the control system comprises a processor and an operating system, the conducting wire is electrically connected with the processor, and the processor is electrically connected with the operating system and the alarm.
Preferably, the bottom of the planar target is provided with a heat conducting fin, and the wire is located between the planar target and the heat conducting fin. The heat conducting fins can transfer heat on the planar target to the flange, and heat dissipation is facilitated.
Specifically, the heat conducting sheet is a graphite sheet.
Preferably, the magnetron sputtering planar target further includes a flange, a water passage tube, an excitation coil, a sleeve, an insulating sleeve, a permanent magnet column and an insulating spacer, the insulating sleeve is sleeved outside the permanent magnet column, the sleeve is sleeved outside the insulating sleeve, the excitation coil is sleeved outside the sleeve, the flange is sleeved and fixed at one end of the sleeve, the flange is provided with an annular groove for cooling water to pass through, the water passage tube is respectively and hermetically communicated with two sides of the annular groove, the insulating spacer is sleeved outside the flange, and the planar target is arranged outside the flange.
Specifically, the magnetron sputtering planar target further comprises a pressing ring, the pressing ring presses the planar target material against the concave groove on the outer side of the flange, and the pressing ring is fixedly connected with the flange.
Specifically, the magnetron sputtering planar target further comprises a shielding cover, and the shielding cover is arranged above the periphery of the planar target. By arranging the shielding case, the target material in the magnetron sputtering process can be prevented from being sputtered to other places of the planar target to cause damage to the planar target.
Drawings
Fig. 1 is a schematic structural diagram of a planar target burn-through alarm system according to the present invention.
FIG. 2 is a schematic structural diagram of a magnetron sputtering planar target of the present invention.
Detailed Description
In order to explain technical contents, structural features, and effects achieved by the present invention in detail, the following detailed description is given with reference to the embodiments and the accompanying drawings.
As shown in fig. 1, the planar target burnthrough alarm system 100 of the present invention includes a magnetron sputtering planar target 1, a wire 2, an alarm 3, and a control system 4, wherein the magnetron sputtering planar target 1 is provided with a planar target 11, the wire 2 is disposed at the bottom of the planar target 11, an insulating layer is wrapped outside the wire 2, the wire 2 is electrically connected to the control system 4, and the control system 4 is electrically connected to the alarm 3.
The number of the leads 2 is two, and the leads are arranged at the bottom of the etching track of the planar target 11.
The control system 4 comprises a processor 41 and an operating system 42, the lead 2 is electrically connected with the processor 41, and the processor 41 is electrically connected with the operating system 42 and the alarm 3.
As shown in fig. 2, the magnetron sputtering planar target 1 includes the planar target 11, a planar flange 12, a water passage tube 13, an excitation coil 14, a sleeve 15, an insulating sleeve 16, a permanent magnet column 17, and an insulating spacer 18, where the insulating sleeve 16 is sleeved outside the permanent magnet column 17, the sleeve 15 is sleeved outside the insulating sleeve 16, the excitation coil 14 is sleeved outside the sleeve 15, the flange 12 is sleeved and fixed at one end of the sleeve 15, the flange 12 is provided with an annular groove 121 through which cooling water passes, the water passage tube 13 is respectively and hermetically communicated with two sides of the annular groove 121, the insulating spacer 18 is sleeved outside the flange 12, and the planar target 11 is disposed outside the flange 12.
As shown in fig. 2, the magnetron sputtering planar target 1 further includes a pressing ring 19, the pressing ring 19 presses the planar target 11 against the concave groove on the outer side of the flange 12, and the pressing ring 19 is fixedly connected to the flange 12.
As shown in fig. 2, the magnetron sputtering planar target 1 further includes a shielding cover 20, and the shielding cover 20 is disposed above the periphery of the planar target 11. By being arranged on the shielding case 20, the target material in the magnetron sputtering process can be prevented from being sputtered to other parts of the planar target, so that the planar target can be prevented from being damaged.
As shown in fig. 2, a heat conducting sheet 21 is disposed at the bottom of the planar target 11, and the heat conducting sheet 21 is a graphite sheet. The lead wires 2 are located between the planar target 11 and the heat-conducting fins 21. The heat conducting fins 21 can transfer heat on the planar target 11 to the flange 12, which is beneficial to heat dissipation.
Compared with the prior art, the bottom of the planar target 11 is provided with the lead 2, the outside of the lead 2 is wrapped by the insulating layer, when the planar target 11 is burnt through, the insulating layer on the surface of the lead 2 is burnt immediately, so that an electric signal is generated on the lead 2, and the lead 2 is electrically connected with the control system 4, so that the control system 4 can feed back according to the received electric signal and give an alarm through the alarm 3, so that a coating line stops coating immediately, the purpose of protecting the target is achieved, and the target is prevented from being burnt through to damage the planar target; in addition, due to the existence of the alarm system, the target can be used safely without reserving a certain margin, the target can be used to the maximum extent, the waste of the target is greatly reduced, and the production cost is reduced.
The above disclosure is only a preferred embodiment of the present invention, and certainly should not be taken as limiting the scope of the present invention, which is therefore intended to cover all equivalent changes and modifications within the scope of the present invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010146391.3A CN111172507A (en) | 2020-03-05 | 2020-03-05 | Planar target burn through alarm system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010146391.3A CN111172507A (en) | 2020-03-05 | 2020-03-05 | Planar target burn through alarm system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111172507A true CN111172507A (en) | 2020-05-19 |
Family
ID=70649610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010146391.3A Pending CN111172507A (en) | 2020-03-05 | 2020-03-05 | Planar target burn through alarm system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111172507A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5487823A (en) * | 1993-04-28 | 1996-01-30 | Japan Energy Corporation | Sputtering targets having life alarm function |
| CN201534876U (en) * | 2009-09-27 | 2010-07-28 | 北京京东方光电科技有限公司 | Planar magnetic control sputtering device |
| CN202415680U (en) * | 2011-12-30 | 2012-09-05 | 深圳市创益科技发展有限公司 | Magnetic control sputtering target with detection device |
| US20130206589A1 (en) * | 2012-02-14 | 2013-08-15 | Solar Applied Materials Technology Corp. | Sputtering Target Having Alarm Function |
| CN104404463A (en) * | 2014-11-14 | 2015-03-11 | 河海大学 | Planar magnetron sputtering target |
| CN205940475U (en) * | 2016-07-19 | 2017-02-08 | 江西共青城汉能薄膜太阳能有限公司 | Dark measuring device of magnetron sputtering flat target sculpture |
| CN107034439A (en) * | 2017-04-27 | 2017-08-11 | 武汉华星光电技术有限公司 | For the target consumption condition monitoring system and monitoring method in spattering filming device |
| CN208175008U (en) * | 2018-05-24 | 2018-11-30 | 洛阳丰联科绑定技术有限公司 | A kind of heating device of the Intelligent box type furnace for metal targets binding |
| CN212770937U (en) * | 2020-03-05 | 2021-03-23 | 东莞南玻工程玻璃有限公司 | Planar target burn through alarm system |
-
2020
- 2020-03-05 CN CN202010146391.3A patent/CN111172507A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5487823A (en) * | 1993-04-28 | 1996-01-30 | Japan Energy Corporation | Sputtering targets having life alarm function |
| CN201534876U (en) * | 2009-09-27 | 2010-07-28 | 北京京东方光电科技有限公司 | Planar magnetic control sputtering device |
| CN202415680U (en) * | 2011-12-30 | 2012-09-05 | 深圳市创益科技发展有限公司 | Magnetic control sputtering target with detection device |
| US20130206589A1 (en) * | 2012-02-14 | 2013-08-15 | Solar Applied Materials Technology Corp. | Sputtering Target Having Alarm Function |
| CN104404463A (en) * | 2014-11-14 | 2015-03-11 | 河海大学 | Planar magnetron sputtering target |
| CN205940475U (en) * | 2016-07-19 | 2017-02-08 | 江西共青城汉能薄膜太阳能有限公司 | Dark measuring device of magnetron sputtering flat target sculpture |
| CN107034439A (en) * | 2017-04-27 | 2017-08-11 | 武汉华星光电技术有限公司 | For the target consumption condition monitoring system and monitoring method in spattering filming device |
| CN208175008U (en) * | 2018-05-24 | 2018-11-30 | 洛阳丰联科绑定技术有限公司 | A kind of heating device of the Intelligent box type furnace for metal targets binding |
| CN212770937U (en) * | 2020-03-05 | 2021-03-23 | 东莞南玻工程玻璃有限公司 | Planar target burn through alarm system |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20200519 |