CN111098605A - A kind of laser transfer machine and transfer method - Google Patents
A kind of laser transfer machine and transfer method Download PDFInfo
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- CN111098605A CN111098605A CN202010058979.3A CN202010058979A CN111098605A CN 111098605 A CN111098605 A CN 111098605A CN 202010058979 A CN202010058979 A CN 202010058979A CN 111098605 A CN111098605 A CN 111098605A
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- guide rail
- frame
- scraper
- silicon wafer
- belt guide
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- 238000000034 method Methods 0.000 title claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 111
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 111
- 239000010703 silicon Substances 0.000 claims abstract description 111
- 239000002002 slurry Substances 0.000 claims abstract description 55
- 238000007648 laser printing Methods 0.000 claims abstract description 14
- 238000010023 transfer printing Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims description 91
- 239000011521 glass Substances 0.000 claims description 62
- 238000001514 detection method Methods 0.000 claims description 51
- 230000032258 transport Effects 0.000 claims description 37
- 238000001179 sorption measurement Methods 0.000 claims description 16
- 238000003892 spreading Methods 0.000 claims description 14
- 230000007480 spreading Effects 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 10
- 230000009471 action Effects 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 238000004513 sizing Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000872 buffer Substances 0.000 claims description 5
- 239000012634 fragment Substances 0.000 claims description 4
- 238000007639 printing Methods 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004579 marble Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/44—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements
- B41J2/442—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements using lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/06—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length by rubbing contact, e.g. by brushes, by pads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
- B65H5/02—Feeding articles separated from piles; Feeding articles to machines by belts or chains, e.g. between belts or chains
- B65H5/021—Feeding articles separated from piles; Feeding articles to machines by belts or chains, e.g. between belts or chains by belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
- B65H5/22—Feeding articles separated from piles; Feeding articles to machines by air-blast or suction device
- B65H5/222—Feeding articles separated from piles; Feeding articles to machines by air-blast or suction device by suction devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
- B65H5/36—Article guides or smoothers, e.g. movable in operation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2801/00—Application field
- B65H2801/03—Image reproduction devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a laser transfer printer, which comprises a transportation system, a slurry paving system and a laser printing system, wherein the transportation system is used for conveying slurry to a printing machine; the transportation system comprises a front section guide rail, a rear section guide rail and an alternate transportation platform positioned between the front section guide rail and the rear section guide rail; the slurry paving system comprises a paving support frame, a scraper movable table, a scraper cylinder, a scraper frame, a paving upper top frame and a slurry device; the laser printing system comprises a laser straight line module and a laser transmitter. The whole laser transfer machine is optimized, the using amount of slurry on a silicon wafer is reduced, the precision in laser printing is improved, the slurry is matched with a grid line more perfectly, the running speed and the working efficiency of the whole machine are improved, and the production cost of an enterprise is reduced. The invention also discloses a transfer printing method. The transfer printing method reduces the size required in the whole printing process, improves the printing precision through the matching of the size and the grid line, and reduces the production cost of enterprises.
Description
Technical Field
The invention relates to the technical field of solar silicon wafer printing, in particular to a laser transfer printing machine and a transfer printing method.
Background
The photovoltaic solar silicon wafer (hereinafter referred to as a silicon wafer) is a core part in a solar power generation system and is also a part with the highest value in the solar power generation system. The silicon chip is used for converting solar energy into electric energy, and the electric energy is stored by a storage battery or directly loaded to work.
The laser printing is to accurately print points of slurry according to the grid lines on the silicon wafer by laser, but the slurry is directly coated on the grid lines in the existing method, the amount of the slurry is not easy to control, and the slurry is used in a large amount, so that the printing precision is low, and the production cost is high.
Disclosure of Invention
One object of the present invention is: the utility model provides a laser transfer machine, this laser transfer machine's whole process optimization has reduced the thick liquids quantity on the silicon chip, precision when having improved laser printing, and thick liquids and grid line's cooperation are more perfect, have still improved the functioning speed and the work efficiency of complete machine, reduce the manufacturing cost of enterprise.
Another object of the invention is: the transfer printing method reduces the size required in the whole printing process, improves the printing accuracy through the matching of the size and the grid line, and reduces the production cost of enterprises.
In order to achieve the purpose, the invention adopts the following technical scheme:
a laser transfer machine comprises a transportation system, a slurry paving system and a laser printing system;
the transportation system comprises a front section guide rail, a rear section guide rail and an alternate transportation platform positioned between the front section guide rail and the rear section guide rail, the alternate transportation platform comprises a transportation vertical frame, a front horizontal straight line module and a rear horizontal straight line module are respectively fixed on two sides of the transportation vertical frame, the movable end of the front horizontal linear module is connected with a front vertical linear module, the movable end of the front vertical linear module is connected with a front L-shaped transportation frame, the top of the front L-shaped transport frame is fixed with a front vacuum adsorption plate, the front vacuum adsorption plate is provided with a front guide groove matched with the front section thin belt guide rail, the movable end of the rear horizontal linear module is connected with a rear vertical linear module, the movable end of the rear vertical linear module is connected with a rear L-shaped transportation frame, a rear vacuum adsorption plate is fixed at the top of the rear L-shaped transportation frame, and a rear guide groove matched with the rear section thin belt guide rail is formed in the rear vacuum adsorption plate;
the slurry tiling system comprises a tiling support frame, a scraper movable table, a scraper cylinder, a scraper frame, a tiling upper top frame and a slurry device, wherein the scraper movable table slides in the upper end of the tiling support frame along the horizontal direction, the fixed end of the scraper cylinder is installed on the scraper movable table, the driving end of the scraper cylinder vertically upwards is connected with the middle part of the scraper frame, a scraper is installed on the scraper frame, lower glass sliding wheels are arranged at two ends of the scraper frame, the tiling upper top frame is positioned above the scraper frame, a glass sliding table is arranged at the lower end of the tiling upper top frame, an upper glass sliding wheel is arranged at the bottom of the glass sliding table, the slurry device is positioned above the scraper frame, and slurry in the slurry device is coated on the scraper;
the laser printing system comprises a laser straight line module and a laser emitter, the laser straight line module is vertically arranged and located right above the alternate transportation platform, and the laser emitter is connected with a driving end of the laser straight line module.
As a preferred technical scheme, the front section track comprises a front section coarse belt guide rail and a front section thin belt guide rail, the front section thin belt guide rail is positioned at one end of the front section coarse belt guide rail close to the alternate transportation platform, a motor clamping piece mechanism is arranged on the front section coarse belt guide rail, a clamping piece mounting plate is arranged on the motor clamping piece mechanism, a clamping piece belt is mounted on the clamping piece mounting plate, one side of the clamping piece belt is connected with a left clamping piece, the other side of the clamping piece belt is connected with a right clamping piece, and the left clamping piece and the right clamping piece are respectively positioned at two sides of the front section coarse belt guide rail;
the rear section track comprises a rear section thick belt guide rail and a rear section thin belt guide rail, and the rear section thin belt guide rail is located at one end, close to the alternate transportation platform, of the rear section thick belt guide rail.
As a preferred technical scheme, a silicon wafer positioning frame is arranged above the front section thin belt guide rail, and four silicon wafer positioning cameras are arranged at the lower end of the silicon wafer positioning frame.
As a preferred technical scheme, a silicon wafer detection frame is arranged above the rear-section thick belt guide rail, a silicon wafer detection installation position is arranged in the middle of the silicon wafer detection frame, a silicon wafer detection camera is installed on the silicon wafer detection installation position, guide rail light sources are arranged around the silicon wafer detection camera, and the guide rail light sources are fixed on the silicon wafer detection frame.
As an optimal technical scheme, the top of the clamping piece mounting plate is provided with a clamping piece motor, two sides of the upper end of the clamping piece mounting plate are respectively provided with a clamping piece driving wheel and a clamping piece driven wheel, a clamping piece belt is in transmission connection with the clamping piece driving wheel and the clamping piece driven wheel, and the driving end of the clamping piece motor is connected with the clamping piece driving wheel.
As a preferred technical scheme, a sliding table cylinder is arranged on the flatly-paved upper top frame, the fixed end of the sliding table cylinder is fixed at the bottom of the flatly-paved upper top frame, and the driving end of the sliding table cylinder is vertically downward and is connected with the middle part of the glass sliding table.
As an optimal technical scheme, the upper end of the tiled support frame is provided with a scraper slide rail along the horizontal direction, the bottom of the scraper movable table is provided with a scraper slide block, and the scraper slide block is connected to the scraper slide rail in a sliding manner.
As a preferred technical scheme, both ends of the scraper slide rail are provided with movable table buffer blocks.
As an optimal technical scheme, thick liquids tiling system still includes revolving stage, activity carousel and tiling test rack, the vertical setting of revolving stage, the activity carousel is installed on the drive end of revolving stage, it is provided with a plurality of splint station, every to surround on the activity carousel equal centre gripping has the glass board on the splint station, the tiling test rack is located one the top of splint station, the middle part of tiling test rack is provided with tiling camera installation position, install the tiling on the tiling camera installation position and detect the camera, the tiling support frame is located one side of revolving stage.
A transfer method comprising the steps of:
the silicon chip is placed on the front section thick belt guide rail, and after the position of the silicon chip is corrected by the motor clamping piece mechanism, the front section thick belt guide rail conveys the silicon chip to the front section thin belt guide rail;
the silicon wafer positioning camera carries out positioning detection on the silicon wafer on the front section thin belt guide rail;
the front L-shaped transport frame on the transport vertical frame moves to the front section thin belt guide rail to receive the silicon wafer under the combined action of the front vertical linear module and the front horizontal linear module, and moves the silicon wafer to the middle part of the transport vertical frame;
the turntable rotates the movable turntable, and the glass plate clamped by the clamping plate station on the movable turntable moves to the flat laying support frame;
the slurry feeder supplies slurry to corresponding positions on the scraper according to the grid lines on the silicon wafer;
a scraper positioned below the glass plate applies the slurry from one end of the glass plate to the other end;
the turntable rotates the movable turntable, the glass plate coated with the sizing agent is moved to the position below the tiling detection camera, and the tiling detection camera detects the sizing agent coating condition;
the turntable rotates the movable turntable to move the inspected glass plate to the upper part of the middle part of the transportation vertical frame;
after the height of the laser emitter is controlled by the laser linear module, the laser emitter irradiates the glass plate, and the slurry is accurately coated on a grid line of a silicon wafer;
the rear L-shaped transport frame on the transport vertical frame moves to the middle of the transport vertical frame to receive the printed silicon wafers under the combined action of the rear vertical linear module and the rear horizontal linear module, and moves the silicon wafers to the rear section thin belt guide rail;
moving the silicon wafer to the rear-section thick belt guide rail by the rear-section thin belt guide rail, and performing fragment detection on the silicon wafer on the rear-section thick belt guide rail by the aid of the tiled detection camera;
and waiting for taking the silicon wafer in the next process by the silicon wafer positioned on the rear section coarse belt guide rail.
The invention has the beneficial effects that: the laser transfer printing machine is optimized integrally, so that the using amount of slurry on a silicon wafer is reduced, the precision of laser printing is improved, the slurry is matched with a grid line more perfectly, the running speed and the working efficiency of the whole machine are improved, and the production cost of an enterprise is reduced; the transfer printing method reduces the size required in the whole printing process, improves the printing accuracy through the matching of the size and the grid line, and reduces the production cost of enterprises.
Drawings
The invention is explained in more detail below with reference to the figures and examples.
Fig. 1 is a first overall structural schematic diagram of a laser transfer machine according to an embodiment;
fig. 2 is a second overall structural schematic diagram of a laser transfer machine according to an embodiment;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
FIG. 4 is a schematic structural diagram of a transportation system according to an embodiment;
FIG. 5 is a schematic structural view of a front section rail according to an embodiment;
FIG. 6 is a schematic structural diagram of a motor jaw mechanism according to an embodiment;
FIG. 7 is a schematic structural view of an alternate transport platform according to an embodiment (a virtual rear L-shaped transport frame is erected in the middle of a transport upright frame);
FIG. 8 is a left side view of the alternate transport platform of the embodiment (with an upstanding virtual rear L-shaped transport frame in the middle of the transport upright);
FIG. 9 is a schematic structural view of a rear guide rail according to an embodiment;
FIG. 10 is a schematic diagram of a slurry spreading system according to an embodiment;
FIG. 11 is an enlarged view of a portion of FIG. 10 at B;
fig. 12 is a right side view of a schematic configuration of a slurry spreading system according to an embodiment.
In fig. 1 to 12:
1. a front section guide rail; 2. a rear-section guide rail; 3. alternate transport platforms; 4. a front section coarse belt guide rail; 5. a front section thin belt guide rail; 6. a clip mounting plate; 7. a clip belt; 8. a left clamping piece; 9. a right side clamping piece; 10. a rear section coarse belt guide rail; 11. a rear section thin belt guide rail; 12. transporting the vertical frame; 13. a front horizontal linear module; 14. a rear horizontal linear module; 15. a front vertical linear module; 16. a rear vertical linear module; 17. a front L-shaped transport rack; 18. a rear L-shaped transport rack; 19. a front vacuum adsorption plate; 20. a rear vacuum adsorption plate; 21. a front guide groove; 22. a rear guide groove; 23. a silicon wafer positioning frame; 24. a silicon wafer positioning camera; 25. a silicon wafer detection frame; 26. detecting a mounting position by a silicon chip; 27. a rail light source; 28. a clip motor; 29. a clip driving wheel; 30. a clamping piece driven wheel; 31. a guide wheel; 32. a limit sensor; 33. a baffle plate; 34. a silicon chip sensor; 35. a turntable; 36. a movable turntable; 37. laying a detection frame; 38. laying the support frames flatly; 39. a scraper movable table; 40. a scraper cylinder; 41. a doctor holder; 42. laying the upper top frame flatly; 43. a slurry feeder; 44. a clamping plate station; 45. a glass plate; 46. tiling a camera mounting position; 47. a scraper; 48. a lower glass sliding wheel; 49. upper glass sliding wheels; 50. a glass slide table; 51. a scraper slide rail; 52. a scraper slider; 53. a sliding table cylinder; 54. a movable table buffer block; 55. a marble supporting table; 56. detecting a light source; 57. a laser straight line module; 58. a laser emitter.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
As shown in fig. 1 to 12, in the present embodiment, a laser transfer machine includes a transportation system, a slurry spreading system, and a laser printing system;
the transportation system comprises a front section guide rail 1, a rear section guide rail 2 and an alternate transportation platform 3 positioned between the front section guide rail 1 and the rear section guide rail 2, wherein the alternate transportation platform 3 comprises a transportation vertical frame 12, a front horizontal linear module 13 and a rear horizontal linear module 14 are respectively fixed on two sides of the transportation vertical frame 12, the movable end of the front horizontal linear module 13 is connected with a front vertical linear module 15, the movable end of the front vertical linear module 15 is connected with a front L-shaped transportation frame 17, the top of the front L-shaped transportation frame 17 is fixed with a front vacuum adsorption plate 19, the front vacuum adsorption plate 19 is provided with a front guide groove 21 matched with the front section thin belt guide rail 5, the movable end of the rear horizontal linear module 14 is connected with a rear vertical linear module 16, the movable end of the rear vertical linear module 16 is connected with a rear L-shaped transportation frame 18, a rear vacuum adsorption plate 20 is fixed at the top of the rear L-shaped transport frame 18, and a rear guide groove 22 matched with the rear section thin belt guide rail 11 is arranged on the rear vacuum adsorption plate 20;
the slurry spreading system comprises a spreading support frame 38, a scraper movable table 39, a scraper cylinder 40, a scraper frame 41, a spreading upper top frame 42 and a slurry device 43, the scraper moving table 39 slides in the horizontal direction on the upper end of the flat support frame 38, the fixed end of the scraper cylinder 40 is arranged on the scraper movable table 39, the driving end of the scraper cylinder 40 is vertically upward and connected with the middle part of the scraper frame 41, a scraper 47 is arranged on the scraper frame 41, lower glass sliding wheels 48 are arranged at both ends of the scraper frame 41, the upper flatbed upper frame 42 is positioned above the scraper frame 41, a glass slide table 50 is arranged at the lower end of the upper flatbed frame 42, an upper glass sliding wheel 49 is arranged at the bottom of the glass sliding table 50, the slurry feeder 43 is positioned above the scraper frame 41, and slurry in the slurry feeder 43 is coated on the scraper 47;
the laser printing system comprises a laser straight line module 57 and a laser emitter 58, wherein the laser straight line module 57 is vertically arranged and located right above the alternate transportation platform 3, and the laser emitter 58 is connected with the driving end of the laser straight line module 57.
Specifically, the front section track comprises a front section thick belt guide rail 4 and a front section thin belt guide rail 5, the front section thin belt guide rail 5 is located at one end, close to the alternate transportation platform 3, of the front section thick belt guide rail 4, a motor clamping piece mechanism is arranged on the front section thick belt guide rail 4, a clamping piece mounting plate 6 is arranged on the motor clamping piece mechanism, a clamping piece belt 7 is mounted on the clamping piece mounting plate 6, one side of the clamping piece belt 7 is connected with a left clamping piece 8, the other side of the clamping piece belt 7 is connected with a right clamping piece 9, and the left clamping piece 8 and the right clamping piece 9 are respectively located on two sides of the front section thick belt guide rail 4; the rear section track comprises a rear section thick belt guide rail 10 and a rear section thin belt guide rail 11, and the rear section thin belt guide rail 11 is located at one end, close to the alternate transportation platform 3, of the rear section thick belt guide rail 10.
And a silicon wafer positioning frame 23 is arranged above the front section thin belt guide rail 5, and four silicon wafer positioning cameras 24 are arranged at the lower end of the silicon wafer positioning frame 23.
The silicon wafer detection device is characterized in that a silicon wafer detection frame 25 is arranged above the rear-section thick belt guide rail 10, a silicon wafer detection installation position 26 is arranged in the middle of the silicon wafer detection frame 25, a silicon wafer detection camera is installed on the silicon wafer detection installation position 26, guide rail light sources 27 are arranged around the silicon wafer detection camera, and the guide rail light sources 27 are fixed on the silicon wafer detection frame 25.
The silicon wafer is placed on the front section thick belt guide rail 4, the clamping piece belt 7 runs, so that the left side clamping piece 8 and the right side clamping piece 9 are simultaneously close to the middle of the front section thick belt guide rail 4, the purpose is to correct the position of the silicon wafer, then the front section thick belt guide rail 4 conveys the silicon wafer to the front section thin belt guide rail 5, and the silicon wafer positioning camera 24 above the front section thin belt guide rail 5 carries out positioning detection on the silicon wafer.
Then the front L-shaped transport frame 17 rises from the lower part of the front section thin belt guide rail 5 under the combined action of the front horizontal straight line module 13 and the front vertical straight line module 15, at this time, the front section thin belt guide rail 5 sinks into the front guide groove 21, the silicon wafer is jacked up, the front vacuum adsorption plate 19 adsorbs the silicon wafer, then the front L-shaped transport frame 17 moves to the middle part of the transport vertical frame 12 to place the silicon wafer on the printing mechanism for printing, and meanwhile, the front L-shaped transport frame 17 moves to the front section thin belt guide rail 5 again to prepare for adsorbing the next silicon wafer.
The laser linear module 57 controls the height position of the laser emitter 58 along the vertical direction, and then when the laser emitter 58 works, the paste on the glass plate 45 stably falls on the grid line of the silicon wafer for printing.
When being in the silicon chip at transportation grudging post 12 middle part carries out the laser printing back that finishes, back L type transportation frame 18 is in back horizontal straight line module 14 with under the combined action of the vertical straight line module 16 in back, move to the middle part of transportation grudging post 12, by back vacuum adsorption board 20 adsorbs (showing on the picture and being in the virtual back L type transportation frame 18 of the jack-up in transportation grudging post 12 middle part is used for signalling preceding L type transportation frame 17 with back L type transportation frame 18 transports the silicon chip to the position of printing), then back L type transportation frame 18 moves to back section thin type belt guide 11, back section thin type belt guide 11 sinks in back guide slot 22, places the silicon chip on back section thin type belt guide 11, back section thin type belt guide 11 transports the silicon chip to back section thick type belt guide 10.
The guide rail light source 27 provides bright light, and the silicon wafer detection camera performs fragment detection on the silicon wafer on the rear-section coarse belt guide rail 10 and then waits for the next device to take a wafer.
In this embodiment, the flatly-paved upper top frame 42 is provided with a sliding table cylinder 53, a fixed end of the sliding table cylinder 53 is fixed at the bottom of the flatly-paved upper top frame 42, and a driving end of the sliding table cylinder 53 is vertically downward and connected with the middle part of the glass sliding table 50.
The upper end of the flat laying support frame 38 is provided with a scraper slide rail 51 along the horizontal direction, the bottom of the scraper movable table 39 is provided with a scraper slide block 52, and the scraper slide block 52 is connected to the scraper slide rail 51 in a sliding manner.
In the process of coating the glass plate 45 with the sizing agent, the sliding table air cylinder 53 on the horizontally-paved upper top frame 42 controls the driving end to extend out, the glass sliding table 50 moves downwards, the height of the glass plate 45 can not be raised is fixed, then the glass moving mechanism moves the glass plate 45 to the sizing agent paving system of the laser transfer printing machine, and the upper glass sliding wheel 49 can reduce friction when the glass plate 45 moves to the lower side of the horizontally-paved upper top frame 42.
The slurry feeder 43 supplies slurry to corresponding positions on the scraper 47 according to the grid lines on the silicon wafer, the scraper cylinder 40 controls the scraper frame 41 to ascend, the scraper cylinder 40 is stopped when the slurry on the scraper 47 touches the glass plate 45, then the scraper movable table 39 moves along the horizontal direction under the interaction of the scraper slide block 52 and the scraper slide rail 51, and at the same time, the scraper 47 applies the slurry from one end of the glass plate 45 to the other end. Then the driving end of the scraper cylinder 40 is contracted, and the scraper holder 41 moves downwards along with the scraper 47 and resets, so that the coating of the slurry of one glass plate 45 is completed.
And the lower glass sliding wheel 48 can roll on the glass plate 45 during the process of coating the glass plate 45 with the slurry by moving the scraper 47, so that the abrasion of the scraper frame 41 on the glass plate 45 is reduced.
In this embodiment, a clip motor 28 is disposed at the top of the clip mounting plate 6, a clip driving wheel 29 and a clip driven wheel 30 are disposed on two sides of the upper end of the clip mounting plate 6, the clip belt 7 is connected between the clip driving wheel 29 and the clip driven wheel 30 in a transmission manner, and a driving end of the clip motor 28 is connected to the clip driving wheel 29.
When the motor clamping piece mechanism needs to work, the clamping piece motor 28 is started, the clamping piece belt 7 is driven to move through power transmission between the clamping piece driving wheel 29 and the clamping piece driven wheel 30, and the left clamping piece 8 and the right clamping piece 9 can be simultaneously drawn close to the middle to correct the silicon wafer.
More specifically, the left clamping piece 8 and the right clamping piece 9 are both provided with a plurality of guide wheels 31.
The guide wheels 31 are arranged on the left clamping piece 8 and the right clamping piece 9, so that abrasion between the clamping pieces and two sides of a silicon wafer is reduced.
And, still be fixed with limit sensor 32 on the clamping piece mounting panel 6, be fixed with separation blade 33 on the left side clamping piece 8, separation blade 33 with limit sensor 32 signal connection.
When the left clip 8 moves to the farthest position, the blocking piece 33 blocks the signal of the limit sensor 32, and controls the clip motor 28 to stop rotating.
And silicon chip sensors 34 are arranged in the middle of the front section coarse belt guide rail 4 and the middle of the rear section coarse belt guide rail 10.
The silicon chip sensor 34 can sense whether a silicon chip exists on the rough belt guide rail in real time.
In this embodiment, the two ends of the scraper slide rail 51 are both provided with a movable table buffer block 54.
In order to prevent the scraper movable table 39 from moving excessively and colliding with the edge of the flat supporting frame 38 during the movement of the scraper movable table 39 along the scraper slide rail 51, the movable table buffer block 54 is additionally arranged, and the limit movable position of the scraper movable table 39 is limited.
In this embodiment, slurry tiling system still includes revolving stage 35, activity carousel 36 and tiling test rack 37, the vertical setting of revolving stage 35, activity carousel 36 is installed on the drive end of revolving stage 35, the annular a plurality of splint station 44 that is provided with on the activity carousel 36, every all the centre gripping has glass board 45 on the splint station 44, tiling test rack 37 is located one the top of splint station 44, the middle part of tiling test rack 37 is provided with tiling camera installation position 46, install the tiling on the tiling camera installation position 46 and detect the camera, tiling support frame 38 is located one side of revolving stage 35.
After the glass plate 45 on one of the clamping plate stations 44 is coated with the slurry, the glass plate 45 is carried to the detection station by the movable turntable 36, the glass plate 45 is detected by the flat-laying detection camera on the flat-laying camera mounting station 46 at the detection station, the glass plate 45 meeting the requirement is carried to the laser printing station again for printing, so that the whole process flow is completed, the printed glass plate 45 is transferred to the flat-laying support frame 38 again for coating with the slurry, and the process is repeated.
Meanwhile, a marble supporting table 55 for supporting the turntable 35 is connected to the lower end of the turntable 35.
By virtue of the marble supporting stand 55 as a support, it is ensured that the height of the glass plate 45 conforms to the height of the doctor blade 47 for applying the paste.
The tiled detection frame 37 is provided with a detection light source 56, and the detection light source 56 surrounds the tiled camera mounting position 46.
The light source 56 is right the glass plate 45 is supplemented with light, so that the detection accuracy of the tiled detection camera is greatly improved.
A transfer method comprising the steps of:
the silicon chip is placed on the front section thick belt guide rail, and after the position of the silicon chip is corrected by the motor clamping piece mechanism, the front section thick belt guide rail conveys the silicon chip to the front section thin belt guide rail;
the silicon wafer positioning camera carries out positioning detection on the silicon wafer on the front section thin belt guide rail;
the front L-shaped transport frame on the transport vertical frame moves to the front section thin belt guide rail to receive the silicon wafer under the combined action of the front vertical linear module and the front horizontal linear module, and moves the silicon wafer to the middle part of the transport vertical frame;
the turntable rotates the movable turntable, and the glass plate clamped by the clamping plate station on the movable turntable moves to the flat laying support frame;
the slurry feeder supplies slurry to corresponding positions on the scraper according to the grid lines on the silicon wafer;
a scraper positioned below the glass plate applies the slurry from one end of the glass plate to the other end;
the turntable rotates the movable turntable, the glass plate coated with the sizing agent is moved to the position below the tiling detection camera, and the tiling detection camera detects the sizing agent coating condition;
the turntable rotates the movable turntable to move the inspected glass plate to the upper part of the middle part of the transportation vertical frame;
after the height of the laser emitter is controlled by the laser linear module, the laser emitter irradiates the glass plate, and the slurry is accurately coated on a grid line of a silicon wafer;
the rear L-shaped transport frame on the transport vertical frame moves to the middle of the transport vertical frame to receive the printed silicon wafers under the combined action of the rear vertical linear module and the rear horizontal linear module, and moves the silicon wafers to the rear section thin belt guide rail;
moving the silicon wafer to the rear-section thick belt guide rail by the rear-section thin belt guide rail, and performing fragment detection on the silicon wafer on the rear-section thick belt guide rail by the aid of the tiled detection camera;
and waiting for taking the silicon wafer in the next process by the silicon wafer positioned on the rear section coarse belt guide rail.
It should be noted that the above-mentioned embodiments are only preferred embodiments of the present invention and the technical principles used, and any changes or substitutions which can be easily conceived by those skilled in the art within the technical scope of the present invention disclosed herein should be covered within the protective scope of the present invention.
Claims (10)
1. A laser transfer machine is characterized by comprising a transportation system, a slurry paving system and a laser printing system;
the transportation system comprises a front section guide rail, a rear section guide rail and an alternate transportation platform positioned between the front section guide rail and the rear section guide rail, the alternate transportation platform comprises a transportation vertical frame, a front horizontal straight line module and a rear horizontal straight line module are respectively fixed on two sides of the transportation vertical frame, the movable end of the front horizontal linear module is connected with a front vertical linear module, the movable end of the front vertical linear module is connected with a front L-shaped transportation frame, the top of the front L-shaped transport frame is fixed with a front vacuum adsorption plate, the front vacuum adsorption plate is provided with a front guide groove matched with the front section thin belt guide rail, the movable end of the rear horizontal linear module is connected with a rear vertical linear module, the movable end of the rear vertical linear module is connected with a rear L-shaped transportation frame, a rear vacuum adsorption plate is fixed at the top of the rear L-shaped transportation frame, and a rear guide groove matched with the rear section thin belt guide rail is formed in the rear vacuum adsorption plate;
the slurry tiling system comprises a tiling support frame, a scraper movable table, a scraper cylinder, a scraper frame, a tiling upper top frame and a slurry device, wherein the scraper movable table slides in the upper end of the tiling support frame along the horizontal direction, the fixed end of the scraper cylinder is installed on the scraper movable table, the driving end of the scraper cylinder vertically upwards is connected with the middle part of the scraper frame, a scraper is installed on the scraper frame, lower glass sliding wheels are arranged at two ends of the scraper frame, the tiling upper top frame is positioned above the scraper frame, a glass sliding table is arranged at the lower end of the tiling upper top frame, an upper glass sliding wheel is arranged at the bottom of the glass sliding table, the slurry device is positioned above the scraper frame, and slurry in the slurry device is coated on the scraper;
the laser printing system comprises a laser straight line module and a laser emitter, the laser straight line module is vertically arranged and located right above the alternate transportation platform, and the laser emitter is connected with a driving end of the laser straight line module.
2. The laser transfer machine according to claim 1, wherein the front section track comprises a front section thick belt guide rail and a front section thin belt guide rail, the front section thin belt guide rail is located at one end of the front section thick belt guide rail close to the alternate transport platform, a motor clamping piece mechanism is arranged on the front section thick belt guide rail, a clamping piece mounting plate is arranged on the motor clamping piece mechanism, a clamping piece belt is mounted on the clamping piece mounting plate, a left clamping piece is connected to one side of the clamping piece belt, a right clamping piece is connected to the other side of the clamping piece belt, and the left clamping piece and the right clamping piece are respectively located at two sides of the front section thick belt guide rail;
the rear section track comprises a rear section thick belt guide rail and a rear section thin belt guide rail, and the rear section thin belt guide rail is located at one end, close to the alternate transportation platform, of the rear section thick belt guide rail.
3. The laser transfer machine according to claim 2, wherein a silicon wafer positioning frame is arranged above the front section thin belt guide rail, and four silicon wafer positioning cameras are arranged at the lower end of the silicon wafer positioning frame.
4. The laser transfer printing machine according to claim 2, wherein a silicon wafer detection frame is arranged above the rear-section coarse belt guide rail, a silicon wafer detection installation position is arranged in the middle of the silicon wafer detection frame, a silicon wafer detection camera is installed on the silicon wafer detection installation position, guide rail light sources are arranged around the silicon wafer detection camera, and the guide rail light sources are fixed on the silicon wafer detection frame.
5. The laser transfer machine according to claim 2, wherein a clip motor is provided on the top of the clip mounting plate, a clip driving wheel and a clip driven wheel are provided on both sides of the upper end of the clip mounting plate, the clip belt is drivingly connected between the clip driving wheel and the clip driven wheel, and the driving end of the clip motor is connected to the clip driving wheel.
6. The laser transfer machine according to claim 1, wherein a slide table cylinder is provided on the flat upper head frame, a fixed end of the slide table cylinder is fixed to a bottom of the flat upper head frame, and a driving end of the slide table cylinder is vertically downward and connected to a middle portion of the glass slide table.
7. The laser transfer machine according to claim 1, wherein the upper end of the flat support frame is provided with a scraper slide rail along a horizontal direction, and the bottom of the scraper movable table is provided with a scraper slide block which is slidably connected to the scraper slide rail.
8. The laser transfer machine according to claim 1, wherein both ends of the scraper slide rail are provided with movable table buffers.
9. The laser transfer machine according to claim 1, wherein the slurry spreading system further comprises a turntable, a movable turntable, and a spreading support frame, the turntable is vertically disposed, the movable turntable is mounted on a driving end of the turntable, a plurality of clamping plate stations are disposed around the movable turntable, each clamping plate station holds a glass plate, the spreading support frame is located above one clamping plate station, a spreading camera mounting position is disposed in a middle portion of the spreading support frame, a spreading detection camera is mounted on the spreading camera mounting position, and the spreading support frame is located on one side of the turntable.
10. A transfer method characterized by comprising the steps of:
the silicon chip is placed on the front section thick belt guide rail, and after the position of the silicon chip is corrected by the motor clamping piece mechanism, the front section thick belt guide rail conveys the silicon chip to the front section thin belt guide rail;
the silicon wafer positioning camera carries out positioning detection on the silicon wafer on the front section thin belt guide rail;
the front L-shaped transport frame on the transport vertical frame moves to the front section thin belt guide rail to receive the silicon wafer under the combined action of the front vertical linear module and the front horizontal linear module, and moves the silicon wafer to the middle part of the transport vertical frame;
the turntable rotates the movable turntable, and the glass plate clamped by the clamping plate station on the movable turntable moves to the flat laying support frame;
the slurry feeder supplies slurry to corresponding positions on the scraper according to the grid lines on the silicon wafer;
a scraper positioned below the glass plate applies the slurry from one end of the glass plate to the other end;
the turntable rotates the movable turntable, the glass plate coated with the sizing agent is moved to the position below the tiling detection camera, and the tiling detection camera detects the sizing agent coating condition;
the turntable rotates the movable turntable to move the inspected glass plate to the upper part of the middle part of the transportation vertical frame;
after the height of the laser emitter is controlled by the laser linear module, the laser emitter irradiates the glass plate, and the slurry is accurately coated on a grid line of a silicon wafer;
the rear L-shaped transport frame on the transport vertical frame moves to the middle of the transport vertical frame to receive the printed silicon wafers under the combined action of the rear vertical linear module and the rear horizontal linear module, and moves the silicon wafers to the rear section thin belt guide rail;
moving the silicon wafer to the rear-section thick belt guide rail by the rear-section thin belt guide rail, and performing fragment detection on the silicon wafer on the rear-section thick belt guide rail by the aid of the tiled detection camera;
and waiting for taking the silicon wafer in the next process by the silicon wafer positioned on the rear section coarse belt guide rail.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115848031A (en) * | 2022-12-13 | 2023-03-28 | 深圳市圭华智能科技有限公司 | Non-contact metallization system |
| CN116314466A (en) * | 2023-03-31 | 2023-06-23 | 浙江晶科能源有限公司 | A silicon wafer automatic transmission mechanism and a silicon wafer movement abnormal processing method |
| CN116691151A (en) * | 2023-05-11 | 2023-09-05 | 广东科隆威智能装备股份有限公司 | Laser transfer machine and transfer mode thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007122443A1 (en) * | 2006-04-25 | 2007-11-01 | Cl Inspiration Llc | Improved laser device for forming texts or images on credit cards or the like |
| CN102756540A (en) * | 2012-08-06 | 2012-10-31 | 无锡嘉瑞光伏有限公司 | Printing plate for photovoltaic cell screen printing technology |
| CN103811581A (en) * | 2012-11-08 | 2014-05-21 | 上海神舟新能源发展有限公司 | Method employing ink-jet printing to make crystalline silica solar cell |
| CN107584866A (en) * | 2017-10-31 | 2018-01-16 | 京东方科技集团股份有限公司 | A kind of screen printing apparatus, system and its control method |
| CN207274155U (en) * | 2017-09-12 | 2018-04-27 | 深圳德利速印刷机械设备有限公司 | A kind of gloss-providing unit machine of the external hanging type anilox roll chambered doctor blade of offset press |
| CN109367206A (en) * | 2018-11-07 | 2019-02-22 | 无锡奥特维科技股份有限公司 | Screen printing equipment and cell stacking systems |
| CN109585609A (en) * | 2018-12-27 | 2019-04-05 | 武汉帝尔激光科技股份有限公司 | A kind of solar battery sheet laser ablation and printing integrative apparatus |
| CN212219665U (en) * | 2020-01-18 | 2020-12-25 | 东莞市科隆威自动化设备有限公司 | Laser transfer printing machine |
-
2020
- 2020-01-18 CN CN202010058979.3A patent/CN111098605B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007122443A1 (en) * | 2006-04-25 | 2007-11-01 | Cl Inspiration Llc | Improved laser device for forming texts or images on credit cards or the like |
| CN102756540A (en) * | 2012-08-06 | 2012-10-31 | 无锡嘉瑞光伏有限公司 | Printing plate for photovoltaic cell screen printing technology |
| CN103811581A (en) * | 2012-11-08 | 2014-05-21 | 上海神舟新能源发展有限公司 | Method employing ink-jet printing to make crystalline silica solar cell |
| CN207274155U (en) * | 2017-09-12 | 2018-04-27 | 深圳德利速印刷机械设备有限公司 | A kind of gloss-providing unit machine of the external hanging type anilox roll chambered doctor blade of offset press |
| CN107584866A (en) * | 2017-10-31 | 2018-01-16 | 京东方科技集团股份有限公司 | A kind of screen printing apparatus, system and its control method |
| CN109367206A (en) * | 2018-11-07 | 2019-02-22 | 无锡奥特维科技股份有限公司 | Screen printing equipment and cell stacking systems |
| CN109585609A (en) * | 2018-12-27 | 2019-04-05 | 武汉帝尔激光科技股份有限公司 | A kind of solar battery sheet laser ablation and printing integrative apparatus |
| CN212219665U (en) * | 2020-01-18 | 2020-12-25 | 东莞市科隆威自动化设备有限公司 | Laser transfer printing machine |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115848031A (en) * | 2022-12-13 | 2023-03-28 | 深圳市圭华智能科技有限公司 | Non-contact metallization system |
| CN116314466A (en) * | 2023-03-31 | 2023-06-23 | 浙江晶科能源有限公司 | A silicon wafer automatic transmission mechanism and a silicon wafer movement abnormal processing method |
| CN116691151A (en) * | 2023-05-11 | 2023-09-05 | 广东科隆威智能装备股份有限公司 | Laser transfer machine and transfer mode thereof |
| CN116691151B (en) * | 2023-05-11 | 2024-04-02 | 广东科隆威智能装备股份有限公司 | A laser transfer machine and its transfer method |
| WO2024230442A1 (en) * | 2023-05-11 | 2024-11-14 | 广东科隆威智能装备股份有限公司 | Laser transfer printing machine and transfer printing method thereof |
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|---|---|
| CN111098605B (en) | 2024-07-05 |
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