CN111029292B - Bonding and separating device and method for crystal ingot - Google Patents
Bonding and separating device and method for crystal ingot Download PDFInfo
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- CN111029292B CN111029292B CN201911360479.9A CN201911360479A CN111029292B CN 111029292 B CN111029292 B CN 111029292B CN 201911360479 A CN201911360479 A CN 201911360479A CN 111029292 B CN111029292 B CN 111029292B
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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Abstract
The invention provides a bonding and separating device of a crystal ingot, which comprises a centering disc, a lifting platform, a heating device and a discharging part. The centering device comprises a centering disc, a plurality of pushing blocks, a plurality of positioning rods and a plurality of positioning rods, wherein one surface of the centering disc is provided with an object placing hole, the surface of the centering disc is also provided with a plurality of pushing blocks in a sliding manner, the sliding direction of each pushing block points to the object placing hole, and the side surface of the centering disc is provided with a discharging channel communicated with the object placing hole; the lifting platform is arranged in the object placing hole in a sliding manner; the heating device is used for heating the material placed on the lifting platform; the discharge portion is movable within the discharge channel. The push block can move to the center of centering disc along with the rotation of centering disc, from a plurality of direction contact ingot, push away the ingot to the center of centering disc and fix it, heating device can heat the binder, can bond ingot and frock after the binder cooling of hot melt, and the hot melt binder adhesion power descends when separation ingot and frock, and cooperation discharge passage and portion of unloading can be separated ingot and frock, and work efficiency is higher, and centering is more accurate during the bonding moreover.
Description
Technical Field
The invention relates to ingot processing equipment, in particular to a bonding and separating device and method for an ingot.
Background
Silicon carbide (also called carborundum (SiC)) is prepared by high-temperature smelting quartz sand, petroleum coke (or coal coke), wood dust (salt is required when green silicon carbide is produced) and other raw materials in a resistance furnace. Silicon carbide also has a rare mineral in nature, morusite. Silicon carbide, in terms of hardness, is diamond only, cubic boron nitride being harder than silicon carbide. The processing is generally carried out by using harder materials than the silicon carbide, because the size of the silicon carbide is required to be controlled, a tool is required to assist the processing in the processing, and at the moment, an adhesive is required to bond the ingot and the tool, so that the processing is convenient.
When the ingot and the tool are separated after being bonded by the binder and processed, the prior art adopts manual bonding and separation, has low automation level, and has the defects of inaccurate centering, insecure bonding, low efficiency and the like.
The above description is included in the technical recognition scope of the inventors, and does not necessarily constitute the prior art.
Disclosure of Invention
In order to solve the problems, the invention provides a bonding and separating device and a bonding and separating method for an ingot, which can solve the problem of inaccurate centering during manual operation, are convenient to bond, have high automation degree and improve the working efficiency.
First, the present application provides a bonding separation apparatus of an ingot, which includes a centering plate, a lifting platform, a heating device, and a discharging part. The centering device comprises a centering disc, a plurality of pushing blocks, a plurality of positioning rods and a plurality of positioning rods, wherein one surface of the centering disc is provided with an object placing hole, the surface of the centering disc is also provided with a plurality of pushing blocks in a sliding manner, the sliding direction of each pushing block points to the object placing hole, and the side surface of the centering disc is also provided with a discharging channel communicated with the object placing hole; the lifting platform is arranged in the object placing hole in a sliding manner; the heating device is used for heating the material placed on the lifting platform; the discharge portion is movable within the discharge channel.
The frock is put on the centering dish, and the high position of the frock of placing on the platform in vertical direction can be adjusted to lift platform, and the fixing device of being convenient for is fixed the ingot. When the ingot and the tool are bonded, the push blocks move towards the center, the push blocks are contacted with the ingot from multiple directions, the ingot is pushed to the center of the centering disc and fixed, the bonding agent is placed in the tool, the tool is placed on the platform and heated by the heating device, the hot-melt bonding agent can well bond the ingot and the tool, the problem of inaccurate centering during manual operation is avoided, the automation degree is high, and the working efficiency is higher; when the ingot and the tool are separated, the heating device can heat the adhesive for bonding the ingot and the tool, the adhesive force between the ingot and the tool is reduced after the adhesive is hot-melted, the ingot and the tool can be separated, the lifting platform can move to the position on the same plane as the unloading channel, and the tool is pushed away from the lifting platform by the unloading part, so that the separation process of the ingot and the tool is completed, and the separation process is simple and efficient. The bonding and separation of the crystal ingot can be completed through the bonding and separation device, and the working efficiency is high.
In one possible realization of the adhesive separating device, the side of the push block facing the accommodating hole is provided with a first pressure sensor. When the ingot is placed on the centering disc, the push block moves towards the object placing hole to fix the ingot at an accurate position, the first pressure sensor can measure the pressure between the push block and the ingot to determine whether the push block clamps the ingot or not, and can determine whether the pressure between the push block and the ingot is too large or not at the same time, so that the ingot is prevented from being damaged due to the fact that the push block presses the ingot too large.
In one possible realization of the adhesive separating device, the heating device is arranged on the lifting platform. The lifting platform is provided with a bonding agent, and when the heating device is positioned on the lifting platform, the heating device can directly heat the bonding agent so as to change the bonding agent from a solid state to a fluid state, so that the tool and the crystal ingot can be bonded or the tool and the crystal ingot can be separated conveniently.
In one possible implementation manner of the bonding and separating device, an object stage is arranged on the periphery of the centering disc, the object stage is provided with a mechanical arm, a sucker is arranged at the end of the mechanical arm, the mechanical arm can drive the sucker to move linearly towards the centering disc, and the mechanical arm can drive the sucker to rotate around the mechanical arm; the objective table still is provided with the year thing district, and the thing district is used for placing the material, is convenient for to the centralized management of material. After the sucking disc absorbs the material from year thing district, the arm can shift the material to lift platform accurately through driving the motion that the sucking disc was two degrees of freedom, and in the same way, the arm also can shift the material to year thing district from lift platform with the sucking disc.
In one possible implementation manner of the bonding and separating device, the objective table is provided with an angle cylinder, an output shaft of the angle cylinder is provided with a pressure rod, so that the pressure rod can rotate around the output shaft and can move linearly towards the centering disc, and the pressure rod is pressed downwards towards the crystal ingot under the action of the angle cylinder to press the crystal ingot and the tool together, so that the crystal ingot and the tool can be bonded together through the bonding agent.
In one possible realisation of the adhesive separating device, the pressure bar is provided with a second pressure sensor. The second pressure sensor is used to determine whether the material is compacted from the top. The second pressure sensor can measure the pressure between the pressure rod and the crystal ingot to determine whether the pressure rod gives a downward force to the crystal ingot or not, and can also determine whether the pressure between the pressure rod and the crystal ingot is too large or not, so that the crystal ingot is prevented from being damaged due to the fact that the pressure of the pressure rod to the crystal ingot is too large.
In one possible realisation of the adhesive separating device, the object table is provided with an air blowing device. The air blowing device cools the bonding agent between the tool and the crystal ingot, so that the crystal ingot and the tool are combined more tightly, and meanwhile, the air blowing device can accelerate the curing of the bonding agent, so that the crystal ingot and the tool are bonded together more quickly.
The application also provides a bonding method of the crystal ingot, and the bonding of the crystal ingot and the tool can be simply and efficiently completed by using the bonding and separating device of the crystal ingot. Which comprises the following steps:
sequentially placing the tool and the binder on a lifting platform, and heating the binder by a heating device;
placing the crystal ingot in the middle of the centering disc, and enabling the lifting platform to carry out lifting motion to enable the tool to contact the crystal ingot;
centering the ingot by a push block;
heating until the adhesive melts, and stopping heating by the heating device.
The application also provides a separation method of the crystal ingot, and the crystal ingot can be simply and efficiently separated from the tool by using the bonding separation device of the crystal ingot. Which comprises the following steps:
placing the bonded ingot and the tool on a lifting platform, and heating the ingot and the tool placed on the lifting platform by a heating device;
heating until the crystal ingot can be separated from the tool, stopping heating by the heating device, and moving the crystal ingot to the next program;
the lifting platform moves to the position on the same plane with the discharging channel in a lifting mode;
the unloading part pushes the tool away from the lifting platform.
According to the bonding and separating device and method for the crystal ingot, the fixing device with the centering disc is adopted to fix the material, so that the eccentric problem caused by manual operation is solved; the steps of bonding and separating the crystal ingot and the tool are completely mechanized, so that the efficiency is high, the crystal ingot processing device is convenient to match with upstream and downstream equipment in the crystal ingot processing procedure, and the overall automation level of the crystal ingot processing is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view showing a configuration of an ingot arrangement apparatus according to an embodiment of the present application.
Description of reference numerals: the device comprises a centering disc 10, an article placing hole 11, a pushing block 12, a discharging channel 13, a lifting platform 20, a discharging part 30, an object stage 40, a mechanical arm 41, a suction disc 42, an object carrying area 43, an angle cylinder 44, a pressure rod 45, a blowing device 46, a servo motor 47 and a conveyor belt 48.
Detailed Description
In order to more clearly explain the overall concept of the present invention, the following detailed description is given by way of example in conjunction with the accompanying drawings.
It should be noted that in the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and thus the scope of the present invention is not limited by the specific embodiments disclosed below.
In addition, in the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate orientations and positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Specifically, in the present invention, the direction "front" may be understood as a direction away from the human body when the placement device of the ingot is positioned on the front side of the human body during actual use, and the opposite direction is defined as "rear", i.e., a direction toward the human body when the placement device of the ingot is positioned on the front side of the human body during actual use.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Fig. 1 is a schematic view of a bonded separation device for an ingot according to an embodiment of the present application.
As shown in fig. 1, the ingot arranging apparatus according to the present embodiment includes a centering plate 10, a lifting platform 20, a heating device (not shown), and a discharging part 30. An object placing hole 11 is formed in one surface of the centering disc 10, a plurality of pushing blocks 12 are arranged on the surface of the centering disc 10 in a sliding mode, the sliding direction of each pushing block 12 points to the object placing hole 11, and a discharging channel 13 communicated with the object placing holes is further formed in the side face of the centering disc 10. The platform for placing the materials is a lifting platform 20, and the lifting platform 20 is slidably arranged in the placing hole 11. The heating device is used for heating the material placed on the lifting platform 20, and the discharging part 30 can move in the discharging channel 13.
When bonding the ingot and the tool, firstly, the tool and the bonding agent are placed on the lifting platform 20, the ingot is placed on the centering disc 10, the push blocks 12 move towards the center, contact the ingot from multiple directions, and push the ingot to the center of the centering disc 10 and fix the ingot. The height positions of the tool and the adhesive placed on the platform in the vertical direction are adjusted through the lifting platform 20. The heating device heats, the bonding agent placed on the lifting platform 20 melts under the action of the heating device, and the ingot and the tool are finally bonded together by the hot-melt bonding agent. The lifting platform 20 can adjust the height positions of the tool and the adhesive placed on the platform in the vertical direction; the pushing block 12 fixes the ingot, so that the problem of inaccurate centering during manual operation can be avoided, and the working efficiency is higher.
When the ingot and the tool are separated, the bonded tool and the ingot are firstly placed on the lifting platform 20, the heating device can heat the bonding agent for bonding the ingot and the tool, the bonding force between the ingot and the tool is reduced after the bonding agent is hot-melted, the ingot and the tool can be separated, the lifting platform 20 can move to the position on the same plane as the unloading channel 13, the tool is pushed away from the lifting platform 20 by the unloading part 30, and therefore the separation process of the ingot and the tool is completed, and the separation process is simple and efficient.
In one embodiment, the unloading section 30 may be configured as a telescopic cylinder, through which the tool is pushed away from the lifting platform 20.
In one embodiment, the pushing block 12 and the centering disk 10 are slidably connected together through a screw, the centering disk 10 is connected with a driving device through a transmission component such as a gear, and the pushing block 12 moves along the radial direction of the centering disk 10 when the centering disk 10 rotates under the driving of the driving device so as to fix and position the ingot placed on the centering disk 10. The drive means may be arranged as a servo motor.
Specifically, a first pressure sensor (not shown in the figure) is arranged on one side of the push block 12 facing the object placing hole 11, and the first pressure sensor is electrically connected with the controller; when the ingot is placed on the centering disc 10, the push block 12 moves towards the object placing hole 11 to fix the ingot at an accurate position, the first pressure sensor can measure the pressure between the push block 12 and the ingot to determine whether the push block 12 clamps the ingot or not, and can also determine whether the pressure between the push block and the ingot is too large or not, so that the ingot is prevented from being damaged due to the fact that the push block 12 has too large pressure on the ingot.
In one embodiment, to prevent the ingot from being damaged, a rubber pad or other buffer material may be disposed on the side of the pushing block 12 facing the object placing hole 11 to prevent the ingot from being damaged during contact with the pushing block 12, thereby ensuring the integrity of the ingot.
Specifically, the heating device is disposed on the elevating platform 20. The lifting platform is provided with a bonding agent, and when the heating device is positioned on the lifting platform, the heating device can directly heat the bonding agent so as to change the bonding agent from a solid state to a fluid state, so that the tool and the crystal ingot can be bonded or the tool and the crystal ingot can be separated conveniently.
In one embodiment, the heating means may be disposed in the centering plate 10 near the periphery of the object placing hole 11, and the adhesive on the elevating platform 20 may be heated.
Specifically, as shown in fig. 1, an object stage 40 is disposed on the periphery of the centering plate 10, the object stage 40 is provided with a mechanical arm 41, a suction cup 42 is disposed at an end of the mechanical arm 41, the mechanical arm 41 can drive the suction cup 42 to move linearly towards the centering plate 10, and the mechanical arm 41 can drive the suction cup 42 to rotate around the mechanical arm 41; the stage 40 is also provided with a carrier region 43. The material carrying area 43 is used for placing materials such as tools and binders, and is convenient for centralized management of the materials. The mechanical arm 41 sucks a tool or a bonding agent through the suction disc 42, the suction disc 42 is driven to rotate around the mechanical arm to transfer the material to the upper side of the material placing hole 11, the suction disc 42 is driven by the mechanical arm 41 to move linearly towards the centering disc 10 to control the distance from the suction disc 42 to the lifting platform 20, and finally the material is placed on the lifting platform 20. Similarly, the robot 41 and the suction cup 42 can transfer the material from the lifting platform 20 to the material holding area 43, which is not described herein.
Specifically, the object stage 40 is further provided with an angle cylinder 44, an output shaft of the angle cylinder 44 is provided with a pressure rod 45, so that the pressure rod 45 can rotate around the output shaft and can move linearly towards the centering disc 10, and the pressure rod 45 is used for fixing the material from the top. When the ingot and the tooling are bonded, after the pressure rod 45 rotates by 90 degrees under the action of the rotating angle cylinder 44, the pressure rod 45 reaches the upper part of the ingot, the pressure rod 45 presses downwards towards the ingot under the action of the rotating angle cylinder 44, the ingot and the tooling are pressed together, and the ingot and the tooling can be bonded together through the bonding agent.
In particular, the strut 45 is provided with a second pressure sensor (not shown in the figures). The second pressure sensor is used to determine whether the material is compacted from the top. The second pressure sensor can measure the pressure between the pressure rod 45 and the ingot to determine whether the pressure rod 45 applies downward force to the ingot, and also can determine whether the pressure between the pressure rod 45 and the ingot is too large to avoid the ingot from being damaged due to the too large pressure of the pressure rod 45 to the ingot.
In one embodiment, the struts 45 can be replaced according to the size of the ingot, with struts 45 of smaller size being selected when the ingot is smaller and struts 45 of larger size being selected when the ingot is larger.
Specifically, as shown in fig. 1, the stage 40 is provided with a blower 46, and the blower 46 is electrically connected to the controller. When the ingot and the tool are bonded, the bonding agent is melted under the action of the heating device, the ingot and the tool are tightly combined together under the action of the pressing rod 45, the blowing device 46 cools the bonding agent between the tool and the ingot, so that the ingot and the tool are more tightly combined, and meanwhile, the blowing device can accelerate the solidification of the bonding agent, so that the ingot and the tool are more quickly bonded together.
In one embodiment, the blowing device 46 is configured as a fan, and the number of the fans can be flexibly selected according to actual needs.
Specifically, when the ingot is bonded with the tool by using the bonding and separating device for the ingot, the tool and the bonding agent are firstly grabbed by the suction cup 42 on the mechanical arm 41 and are sequentially placed on the lifting platform 20, and the heating device heats the bonding agent placed on the lifting platform 20 according to a set temperature; the ingot is grabbed by the sucking disc 42 on the mechanical arm 41 and placed in the middle of the centering disc 10, and the lifting platform 20 carries out lifting motion so that the tool contacts the ingot; centering the ingot in the middle of the centering disc 10 through a push block 12; stopping heating after the heating device is heated to a set temperature; at the moment, the adhesive is heated and melted, the contacted crystal ingot and the tooling are bonded together, the crystal ingot and the tooling can be bonded together after the adhesive is cooled, and the adhesive can be blown by the blowing device 46 in the cooling process, so that the cooling process of the adhesive is accelerated.
Specifically, when the ingot and the tool are separated, the bonded ingot and the tool are placed on the lifting platform 20, and the heating device heats the ingot and the tool placed on the lifting platform; heating until the crystal ingot can be separated from the tool, stopping heating by the heating device, heating and melting the adhesive which plays a role in bonding at the moment, reducing the bonding force of the tool and the crystal ingot, grabbing the crystal ingot by the suction cup 42 on the mechanical arm 41, and transferring the crystal ingot to the next procedure; the tooling is located on the lifting platform 20 at this time, and the lifting platform 20 carries out lifting motion to enable the lifting platform 20 to move to the position on the same plane as the discharging channel 13; the unloading part 30 can push the tool away from the lifting platform 20 when moving in the unloading channel 13, and enter a subsequent processing procedure. The whole separation process is simple and efficient, and the automation degree is higher.
When the crystal ingot is bonded or separated from the tool, the configuration device can be controlled by a control system, so that the automation of the crystal ingot configuration process is further realized.
The ingot configuring apparatus further includes a control system that is automatically controlled using a PLC (programmable logic controller). The PLC control system is electrically connected with the mechanical arm 41, the sucking disc 42, the corner cylinder 44, the telescopic cylinder 30, the lifting platform 20, a heating device in the lifting platform 20, a servo motor and a blowing device 46 respectively. The PLC control system is internally preset with a control program, the control program gradually controls each device to work according to the request of an operator or the state of the current material, and the automatic operation of material adhesion or separation is realized, specifically:
bonding of ingot to tooling
The mechanical arm 41 receives the suction signal given by the PLC, rotates to the position of the object carrying area 43, the sucking disc 42 obtains the signal, the tool on the object carrying area 43 is sucked, the mechanical arm 41 drives the sucking disc 42 to rotate to the position of the lifting platform 20, the sucking disc 42 is opened to put down the tool, and the tool is placed on the lifting platform 20 through the object placing hole 11 in the middle of the centering disc 10.
Repeating the operation to place the solid adhesive on the tool, heating the heating device after the step is completed, starting heating the lifting platform 20 according to the set temperature, and sucking the crystal ingot to the tool by the mechanical arm 41 and the sucking disc 42 in the same way.
When the lifting platform 20 receives a signal and reaches a bonding position, a servo motor 47 driving the centering disc 10 obtains a starting signal to rotate a bevel gear of the centering disc 10 according to a set speed, small bevel gears of three push block parts of the centering disc 10 rotate to start centering (rubber gaskets are arranged at contact parts of the three push blocks and crystal ingots to prevent pressure injury), and a first pressure sensor measures the pressure between the push blocks 12 and the crystal ingots; when the three parts of the centering disc 10 all reach the set pressure value, the motor stops braking, and the crystal ingot is protected from being damaged.
Heating to the set temperature and stopping heating. Then the corner cylinder 44 works, rotates 90 degrees and presses down, and the second pressure sensor of the pressure rod 45 stops pressing down after reaching the set value. And then, the air blowing device 46 is started, cooled down by air blowing, stopped in 5 minutes, the tool is firmly adhered, and the PLC controls the corner cylinder 44 to reset. After the angle cylinder 44 is reset. In the same way, the mechanical arm 41 and the suction cup 42 suck the finished tool to the next process, and at the moment, one-time bonding is finished.
(II) separation of crystal ingot and tool
The PLC control system controls the mechanical arm 41 to drive the sucker 42 to suck the processed tool from the object carrying area 43 to the lifting platform 20, and the lifting platform 20 starts to heat to the set temperature according to the set temperature and stops heating. Sucking by a sucking disc 42, radially displacing the mechanical arm 41 for a certain distance to separate the crystal ingot from the tool, sucking the crystal ingot by the sucking disc 42 to the next cleaning process, descending the lifting platform 20 to the position of a conveyor belt 48 arranged on the objective table 40, starting the unloading part 30 to push the tool to the conveyor belt 48, transferring the tool out of the unloading channel 13 through the conveyor belt 48 and conveying the tool to other processes.
According to the ingot configuration device, the steps of bonding and separation are completely mechanized through the matching of the mechanism devices, so that the efficiency is high, and the bonding eccentricity problem caused by manual operation is eliminated; the controller manages and allocates the work of each device, so that the bonding and separation operation of the crystal ingot and the tool can be efficiently realized, other upstream and downstream equipment in the crystal ingot processing procedure can be conveniently matched, and the overall automation level of crystal ingot processing is greatly improved.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (9)
1. A bonded separation device of an ingot, comprising:
the device comprises a centering disc (10), wherein one surface of the centering disc (10) is provided with an object placing hole (11), the surface of the centering disc (10) is also provided with a plurality of push blocks (12) in a sliding manner, the sliding direction of each push block (12) points to the object placing hole (11), and the side surface of the centering disc (10) is also provided with a discharging channel (13) communicated with the object placing hole (11);
the lifting platform (20), the lifting platform (20) is arranged in the placing hole (11) in a sliding manner;
the heating device is used for heating the material placed on the lifting platform (20);
a discharge section (30), the discharge section (30) being movable within the discharge channel (13).
2. An ingot bonding separation apparatus as set forth in claim 1, wherein a side of the push block (12) facing the placing hole (11) is provided with a first pressure sensor.
3. An ingot bonding separation apparatus as set forth in claim 1, wherein the heating means is provided to the elevating platform (20).
4. An ingot bonding separation apparatus as set forth in claim 1, wherein the centering plate (10) is provided at its periphery with a stage (40), the stage (40) is provided with a robot arm (41), a suction cup (42) is provided at an end of the robot arm (41), the robot arm (41) can move the suction cup (42) linearly toward the centering plate (10), and the robot arm (41) can move the suction cup (42) rotatably about the robot arm (41);
the object stage (40) is also provided with an object carrying area (43).
5. An ingot bonding separation apparatus as set forth in claim 4, wherein the stage (40) is provided with a rotation angle cylinder (44), and an output shaft of the rotation angle cylinder (44) is provided with a pressing rod (45) so that the pressing rod (45) can rotate around the output shaft and can move linearly toward the centering disc (10).
6. An ingot bonding separation apparatus as set forth in claim 5, wherein the pressure lever (45) is provided with a second pressure sensor.
7. An ingot bonding separation apparatus as set forth in claim 4, wherein the stage (40) is provided with an air blowing device (46).
8. The bonding method of a bonding separation device of an ingot as set forth in any one of claims 1 to 7, wherein,
sequentially placing a tool and a binder on the lifting platform (20), and heating the binder by the heating device;
placing the ingot in the middle of the centering disc (10), and enabling the lifting platform (20) to perform lifting movement to enable the tool to contact the ingot;
centering the ingot by the pusher block (12);
heating until the adhesive melts, and stopping heating by the heating device.
9. The separation method of the bonded separation means of an ingot as set forth in any one of claims 1 to 7, wherein,
placing the bonded ingot and the tool on the lifting platform (20), and heating the ingot and the tool placed on the lifting platform (20) by the heating device;
heating until the crystal ingot can be separated from the tool, stopping heating by the heating device, and moving the crystal ingot to the next procedure;
the lifting platform (20) moves to the position on the same plane with the discharging channel (13) in a lifting mode;
the unloading part (30) pushes the tool away from the lifting platform (20).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911360479.9A CN111029292B (en) | 2019-12-25 | 2019-12-25 | Bonding and separating device and method for crystal ingot |
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| CN201911360479.9A CN111029292B (en) | 2019-12-25 | 2019-12-25 | Bonding and separating device and method for crystal ingot |
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| CN111029292A CN111029292A (en) | 2020-04-17 |
| CN111029292B true CN111029292B (en) | 2022-08-02 |
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