CN110972388A - High-efficient radiating PCB board - Google Patents
High-efficient radiating PCB board Download PDFInfo
- Publication number
- CN110972388A CN110972388A CN201811139331.8A CN201811139331A CN110972388A CN 110972388 A CN110972388 A CN 110972388A CN 201811139331 A CN201811139331 A CN 201811139331A CN 110972388 A CN110972388 A CN 110972388A
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- China
- Prior art keywords
- heat
- conducting
- conducting piece
- jack
- spacing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Abstract
The invention discloses a PCB (printed circuit board) with high-efficiency heat dissipation, which comprises a substrate and a ceramic heat-conducting plate, wherein a heat-insulating layer is arranged between the substrate and the ceramic heat-conducting plate, a first jack, a second jack and a third jack are arranged on the substrate, a first heat-conducting piece matched with the first jack and used for transferring heat on a singlechip to the ceramic heat-conducting plate, a second heat-conducting piece matched with the second jack and used for transferring heat on an analog-to-digital converter to the ceramic heat-conducting plate, and a third heat-conducting piece matched with the third jack and used for transferring heat on a voltage stabilizer to the ceramic heat-conducting plate are arranged on the ceramic heat-conducting plate, the first heat-conducting piece, the second heat-conducting piece and the third heat-conducting piece penetrate through the heat-insulating layer, and are in interference fit with the first jack, the second jack and the third jack respectively; this high-efficient radiating PCB board has outstanding radiating effect to the electronic component on itself.
Description
Technical Field
The invention relates to a PCB board capable of efficiently dissipating heat.
Background
Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate.
The PCB is widely applied to electronic devices, but electronic components on the PCB easily generate a large amount of heat during the use process, but the current PCB does not have good heat dissipation performance, and therefore, it is desirable to develop a PCB having excellent heat dissipation effect on the electronic components on the PCB.
Disclosure of Invention
The invention aims to provide a PCB board with high heat dissipation efficiency, which has excellent heat dissipation effect on electronic elements on the PCB board.
In order to solve the problems, the invention adopts the following technical scheme:
a PCB board with high-efficiency heat dissipation comprises a base plate and a ceramic heat-conducting plate, a heat-insulating layer is arranged between the base plate and the ceramic heat-conducting plate, a first jack, a second jack and a third jack are arranged on the base plate, a first heat-conducting piece matched with the first jack and used for transferring heat on a singlechip to the ceramic heat-conducting plate, a second heat-conducting piece matched with the second jack and used for transferring heat on an analog-to-digital converter to the ceramic heat-conducting plate, and a third heat-conducting piece matched with the third jack and used for transferring heat on a voltage stabilizer to the ceramic heat-conducting plate are arranged on the ceramic heat-conducting plate, the first heat-conducting piece, the second heat-conducting piece and the third heat-conducting piece penetrate through the heat-insulating layer, the first heat-conducting piece, the second heat-conducting piece and the third heat-conducting piece are in interference fit with the first jack, the second jack and the third jack, The second heat-conducting piece and the third heat-conducting piece are respectively inserted into the first jack, the second jack and the third jack, and the upper end surfaces of the first heat-conducting piece, the second heat-conducting piece and the third heat-conducting piece are all level with the upper surface of the substrate.
As preferred, be provided with first through-hole and second through-hole on the base plate, first through-hole and second through-hole all are the arc setting, first through-hole and second through-hole are the symmetry and set up, be provided with first spacing and the spacing of second on the ceramic heat-conducting plate, first spacing and the spacing of second all are the arc setting, first spacing and the spacing of second all run through the insulating layer setting, first through-hole and second through-hole setting are worn out respectively to first spacing and the spacing end of second, be formed with the hold up tank that is used for depositing the electric capacity between first spacing and the spacing of second, through being provided with first spacing and the spacing of second for the heat that electric capacity sent can transmit the ceramic heat-conducting plate through first spacing and the spacing of second on, can play good radiating effect to electric capacity.
Preferably, the first heat-conducting piece, the second heat-conducting piece, the third heat-conducting piece, the first limiting strip and the second limiting strip are all arranged in an integrated mode with the ceramic heat-conducting plate, and through the design of the integrated mode, the first heat-conducting piece, the second heat-conducting piece, the third heat-conducting piece, the first limiting strip and the second limiting strip have good stability and good integrity.
As preferred, the up end of first heat-conducting piece, second heat-conducting piece and third heat-conducting piece all is provided with first heat conduction silica gel pad, the intrados of first spacing and the spacing of second all is provided with second heat conduction silica gel pad, and through being provided with first heat conduction silica gel pad and second heat conduction silica gel pad, after singlechip, analog to digital converter and stabiliser welded the base plate, singlechip, analog to digital converter and stabiliser can hug closely with heat conduction silica gel pad, not only can guarantee to have better heat transfer effect, can obtain better cushioning effect simultaneously.
Preferably, the side face of the substrate is provided with a groove part, the groove part is provided with an insertion groove, the substrate, the ceramic heat-conducting plate and the heat-insulating layer are all inserted into the insertion groove, the substrate, the ceramic heat-conducting plate, the heat-insulating layer and the groove part are all provided with screw through holes, after the substrate, the ceramic heat-conducting plate and the heat-insulating layer are inserted into the groove part, the stability can be further improved, the separation of the substrate, the ceramic heat-conducting plate and the heat-insulating layer is prevented, and particularly after screws are adopted to be connected with the shell, the case and the like, the stability of the substrate, the ceramic heat-conducting plate.
Preferably, the substrate is provided with a copper foil wiring.
Preferably, the heat insulation layer is a nano microporous heat insulation felt.
Preferably, the first heat-conducting piece, the second heat-conducting piece and the third heat-conducting piece are bonded with respective first heat-conducting silica gel pads, the first limiting strip and the second limiting strip are bonded with respective second silica gel heat-conducting pads, the first heat-conducting piece, the second heat-conducting piece and the third heat-conducting piece are connected with respective first heat-conducting silica gel pads stably, and the first limiting strip and the second limiting strip are connected with respective second silica gel heat-conducting pads reliably.
The invention has the beneficial effects that: the heat on the singlechip, the analog-digital converter and the voltage stabilizer is transferred to the ceramic heat-conducting plate isolated from the substrate by the heat-conducting piece, so that a good heat dissipation effect can be achieved for three parts with larger heat productivity, namely the singlechip, the analog-digital converter and the voltage stabilizer, thereby effectively prolonging the service life and the service stability of the singlechip, the analog-digital converter and the voltage stabilizer, and the heat transferred to the ceramic heat-conducting plate is difficult to transfer back to the substrate again, thereby achieving an excellent heat dissipation effect, in addition, the substrate is provided with a first through hole and a second through hole which are both arranged in an arc shape, the first through hole and the second through hole are symmetrically arranged, the ceramic heat-conducting plate is provided with a first limiting strip and a second limiting strip which are both arranged in an arc shape, and the first limiting strip and the second limiting strip both penetrate through the heat-insulating layer, first through-hole and second through-hole setting are worn out respectively to first spacing and the spacing end of second, are formed with the hold up tank that is used for depositing the electric capacity between first spacing and the spacing of second, through being provided with first spacing and the spacing of second for the heat that electric capacity sent can transmit the ceramic heat-conducting plate through first spacing and the spacing of second on, can play good radiating effect to electric capacity. First heat-conducting piece, second heat-conducting piece, third heat-conducting piece, first spacing and the spacing of second all set up with ceramic heat-conducting plate formula as an organic whole, and through the design that has adopted the integral type, first heat-conducting piece, second heat-conducting piece, third heat-conducting piece, first spacing and the spacing of second have better stability, and the wholeness is good. The up end of first heat conduction piece, second heat conduction piece and third heat conduction piece all is provided with first heat conduction silica gel pad, the intrados of first spacing and the spacing of second all is provided with second heat conduction silica gel pad, through being provided with first heat conduction silica gel pad and second heat conduction silica gel pad, a single-chip microcomputer, adc and stabiliser weld behind the base plate, a single-chip microcomputer, adc and stabiliser can be hugged closely with heat conduction silica gel pad, not only can guarantee to have better heat transfer effect, can obtain better cushioning effect simultaneously. The base plate side is provided with the groove spare, be provided with the insertion groove on the groove spare, the base plate, ceramic heat-conducting plate and insulating layer all insert in the insertion groove, the base plate, ceramic heat-conducting plate, all be provided with the screw hole on insulating layer and the groove spare, through being provided with the groove spare, the base plate, ceramic heat-conducting plate and insulating layer insert behind the groove spare, promotion stability that can step forward, prevent the base plate, ceramic heat-conducting plate and insulating layer separation, especially adopted the screw and shell and quick-witted case etc. to be connected the back, can make the base plate, the stability of ceramic heat-conducting plate and insulating layer. The first heat conducting piece, the second heat conducting piece and the third heat conducting piece are all bonded with the first heat conducting silica gel pads on the first heat conducting piece, the first limiting strip and the second limiting strip are all bonded with the second silica gel heat conducting pads on the second heat conducting piece, the first heat conducting piece, the second heat conducting piece and the third heat conducting piece are all connected with the first heat conducting silica gel pads on the first heat conducting piece, the second heat conducting piece and the third heat conducting piece are good in connection stability, and the first limiting strip and the second limiting strip are all connected with the second silica gel heat conducting pads on the second heat conducting piece reliably.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a top view of a PCB board with efficient heat dissipation according to the present invention.
Fig. 2 is a schematic structural diagram of a PCB board with a high heat dissipation efficiency after a substrate is removed.
Fig. 3 is a top view of a substrate of a PCB board with efficient heat dissipation according to the present invention.
Fig. 4 is a top view of a second limiting strip of the PCB with high heat dissipation efficiency according to the present invention.
Fig. 5 is a schematic view of a partial structure of a slot member of a PCB with high heat dissipation efficiency according to the present invention.
In the figure:
1. a substrate; 2. a ceramic heat conducting plate; 3. a thermal insulation layer; 4. a first jack; 5. a second jack; 6. a third jack; 7. a first heat-conducting member; 8. a second heat-conducting member; 9. a third heat-conducting member; 10. a first through hole; 11. a second through hole; 12. a first limit strip; 13. a second limit strip; 14. a first heat-conducting silica gel pad; 15. a second heat-conducting silica gel pad; 16. a trough member; 17. inserting the groove; 18. and (4) perforating the screw.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the embodiments, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a conventional manner such as bolt fixing, pin shaft connecting, adhesive fixing, or rivet fixing, which is commonly used in the prior art, and therefore, the detailed description thereof will not be provided in the examples.
Example 1
As shown in fig. 1-3, a PCB board with high heat dissipation efficiency comprises a substrate 1 and a ceramic heat-conducting plate 2, wherein a heat-insulating layer 3 is disposed between the substrate 1 and the ceramic heat-conducting plate 2, the substrate 1 is provided with a first jack 4, a second jack 5 and a third jack 6, the ceramic heat-conducting plate 2 is provided with a first heat-conducting member 7 which is matched with the first jack 4 and is used for transferring heat from a single chip computer to the ceramic heat-conducting plate 2, a second heat-conducting member 8 which is matched with the second jack 5 and is used for transferring heat from an analog-to-digital converter to the ceramic heat-conducting plate 2, and a third heat-conducting member 9 which is matched with the third jack 6 and is used for transferring heat from a voltage stabilizer to the ceramic heat-conducting plate 2, the first heat-conducting member 7, the second heat-conducting member 8 and the third heat-conducting member 9 all penetrate through the heat-insulating layer 3, and the first heat-conducting member 7, the second heat-, The second jack 5 and the third jack 6 are in interference fit, the first heat-conducting piece 7, the second heat-conducting piece 8 and the third heat-conducting piece 9 are respectively inserted into the first jack 4, the second jack 5 and the third jack 6, and the upper end surfaces of the first heat-conducting piece 7, the second heat-conducting piece 8 and the third heat-conducting piece 9 are all level with the upper surface of the substrate 1.
The beneficial effect of this embodiment does: through being provided with the heat-conducting piece and transmitting the singlechip, on the ceramic heat-conducting plate of keeping apart with the base plate heat transfer on adc and the stabiliser, can play good radiating effect to the singlechip, the great part of these three calorific capacity of adc and stabiliser to can effectual promotion singlechip, the life and the stability in use of adc and stabiliser, and on the heat that transmits on the ceramic heat-conducting plate is difficult to transmit the base plate again, thereby can play outstanding radiating effect.
Example 2
As shown in fig. 1 to 5, a PCB board with high heat dissipation efficiency comprises a substrate 1 and a ceramic heat-conducting plate 2, wherein a heat-insulating layer 3 is disposed between the substrate 1 and the ceramic heat-conducting plate 2, the substrate 1 is provided with a first jack 4, a second jack 5 and a third jack 6, the ceramic heat-conducting plate 2 is provided with a first heat-conducting member 7 which is matched with the first jack 4 and is used for transferring heat from a single chip computer to the ceramic heat-conducting plate 2, a second heat-conducting member 8 which is matched with the second jack 5 and is used for transferring heat from an analog-to-digital converter to the ceramic heat-conducting plate 2, and a third heat-conducting member 9 which is matched with the third jack 6 and is used for transferring heat from a voltage stabilizer to the ceramic heat-conducting plate 2, the first heat-conducting member 7, the second heat-conducting member 8 and the third heat-conducting member 9 all penetrate through the heat-insulating layer 3, and the first heat-conducting member 7, the second heat-, The second jack 5 and the third jack 6 are in interference fit, the first heat-conducting piece 7, the second heat-conducting piece 8 and the third heat-conducting piece 9 are respectively inserted into the first jack 4, the second jack 5 and the third jack 6, and the upper end surfaces of the first heat-conducting piece 7, the second heat-conducting piece 8 and the third heat-conducting piece 9 are all level with the upper surface of the substrate 1.
The substrate 1 is provided with a first through hole 10 and a second through hole 11, the first through hole 10 and the second through hole 11 are both arranged in an arc shape, the first through hole 10 and the second through hole 11 are symmetrically arranged, the ceramic heat-conducting plate 2 is provided with a first limit strip 12 and a second limit strip 13, the first limit strip 12 and the second limit strip 13 are both arranged in an arc shape, the first limit strip 12 and the second limit strip 13 both penetrate through the heat-insulating layer 3, the tail ends of the first limit strip 12 and the second limit strip 13 respectively penetrate through the first through hole 10 and the second through hole 11, a storage groove (not shown in the figure) for storing electric capacity is formed between the first limit strip 12 and the second limit strip 13, and heat emitted by a capacitor can be transferred to the ceramic heat-conducting plate 2 through the first limit strip 12 and the second limit strip 13 by arranging the first limit strip 12 and the second limit strip 13, the capacitor can have a good heat dissipation effect.
First heat-conducting piece 7, second heat-conducting piece 8, third heat-conducting piece 9, first spacing 12 and the spacing 13 of second all set up with ceramic heat-conducting plate 2 formula as an organic whole, and through the design that has adopted the integral type, first heat-conducting piece 7, second heat-conducting piece 8, third heat-conducting piece 9, first spacing 12 and the spacing 13 of second have better stability, and the wholeness is good.
The up end of first heat-conducting piece 7, second heat-conducting piece 8 and third heat-conducting piece 9 all is provided with first heat conduction silica gel pad 14, the intrados of first spacing 12 and the spacing 13 of second all is provided with second heat conduction silica gel pad 15, through being provided with first heat conduction silica gel pad 14 and second heat conduction silica gel pad 15, after singlechip, analog-to-digital converter and stabiliser welded base plate 1, singlechip, analog-to-digital converter and stabiliser can hug closely with heat conduction silica gel pad, not only can guarantee to have better heat transfer effect, can obtain better cushioning effect simultaneously.
The utility model discloses a thermal insulation board, including base plate 1, ceramic heat-conducting plate 2, insulating layer 3, slot piece 16, base plate 1, ceramic heat-conducting plate 2 and insulating layer 16, base plate 1, ceramic heat-conducting plate 2, insulating layer 3 and slot piece 16 are provided with the bolt hole 18 on the side of base plate 1, be provided with insertion slot 17 on the slot piece 16, base plate 1, ceramic heat-conducting plate 2 and insulating layer 3 all insert in insertion slot 17, base plate 1, ceramic heat-conducting plate 2 and insulating layer 3 pile up back and insertion slot 17 interference fit, can further promote stability, prevent that base plate 1, ceramic heat-conducting plate 2 and insulating layer 3 separate, especially adopted the screw to be connected the back with shell and quick-witted case etc. can make base plate 1, ceramic heat-conducting plate 2 and insulating layer 3's stability obtain very.
The substrate 1 is provided with a copper foil wiring (not shown).
The heat insulation layer 3 is a nanometer micropore heat insulation felt.
First heat-conducting piece 7, second heat-conducting piece 8 and third heat-conducting piece 9 all bond rather than first heat conduction silica gel pad on separately, first spacing 12 and the spacing 13 of second all bond rather than second silica gel heat-conducting pad on separately, and first heat-conducting piece 7, second heat-conducting piece 8 and third heat-conducting piece 9 all are connected stability well rather than first heat conduction silica gel pad on separately, and first spacing 12 and the spacing 13 of second all are connected reliably rather than second silica gel heat-conducting pad on separately.
The beneficial effect of this embodiment does: the heat on the singlechip, the analog-digital converter and the voltage stabilizer is transferred to the ceramic heat-conducting plate isolated from the substrate by the heat-conducting piece, so that a good heat dissipation effect can be achieved for three parts with larger heat productivity, namely the singlechip, the analog-digital converter and the voltage stabilizer, thereby effectively prolonging the service life and the service stability of the singlechip, the analog-digital converter and the voltage stabilizer, and the heat transferred to the ceramic heat-conducting plate is difficult to transfer back to the substrate again, thereby achieving an excellent heat dissipation effect, in addition, the substrate is provided with a first through hole and a second through hole which are both arranged in an arc shape, the first through hole and the second through hole are symmetrically arranged, the ceramic heat-conducting plate is provided with a first limiting strip and a second limiting strip which are both arranged in an arc shape, and the first limiting strip and the second limiting strip both penetrate through the heat-insulating layer, first through-hole and second through-hole setting are worn out respectively to first spacing and the spacing end of second, are formed with the hold up tank that is used for depositing the electric capacity between first spacing and the spacing of second, through being provided with first spacing and the spacing of second for the heat that electric capacity sent can transmit the ceramic heat-conducting plate through first spacing and the spacing of second on, can play good radiating effect to electric capacity. First heat-conducting piece, second heat-conducting piece, third heat-conducting piece, first spacing and the spacing of second all set up with ceramic heat-conducting plate formula as an organic whole, and through the design that has adopted the integral type, first heat-conducting piece, second heat-conducting piece, third heat-conducting piece, first spacing and the spacing of second have better stability, and the wholeness is good. The up end of first heat conduction piece, second heat conduction piece and third heat conduction piece all is provided with first heat conduction silica gel pad, the intrados of first spacing and the spacing of second all is provided with second heat conduction silica gel pad, through being provided with first heat conduction silica gel pad and second heat conduction silica gel pad, a single-chip microcomputer, adc and stabiliser weld behind the base plate, a single-chip microcomputer, adc and stabiliser can be hugged closely with heat conduction silica gel pad, not only can guarantee to have better heat transfer effect, can obtain better cushioning effect simultaneously. The base plate side is provided with the groove spare, be provided with the insertion groove on the groove spare, the base plate, ceramic heat-conducting plate and insulating layer all insert in the insertion groove, the base plate, ceramic heat-conducting plate, all be provided with the screw hole on insulating layer and the groove spare, through being provided with the groove spare, the base plate, ceramic heat-conducting plate and insulating layer insert behind the groove spare, promotion stability that can step forward, prevent the base plate, ceramic heat-conducting plate and insulating layer separation, especially adopted the screw and shell and quick-witted case etc. to be connected the back, can make the base plate, the stability of ceramic heat-conducting plate and insulating layer. The first heat conducting piece, the second heat conducting piece and the third heat conducting piece are all bonded with the first heat conducting silica gel pads on the first heat conducting piece, the first limiting strip and the second limiting strip are all bonded with the second silica gel heat conducting pads on the second heat conducting piece, the first heat conducting piece, the second heat conducting piece and the third heat conducting piece are all connected with the first heat conducting silica gel pads on the first heat conducting piece, the second heat conducting piece and the third heat conducting piece are good in connection stability, and the first limiting strip and the second limiting strip are all connected with the second silica gel heat conducting pads on the second heat conducting piece reliably.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention.
Claims (8)
1. The utility model provides a high-efficient radiating PCB board which characterized in that: the heat-conducting ceramic plate comprises a substrate and a ceramic heat-conducting plate, wherein a heat-insulating layer is arranged between the substrate and the ceramic heat-conducting plate, a first jack, a second jack and a third jack are arranged on the substrate, a first heat-conducting piece matched with the first jack and used for transferring heat on a singlechip to the ceramic heat-conducting plate, a second heat-conducting piece matched with the second jack and used for transferring heat on an analog-to-digital converter to the ceramic heat-conducting plate, and a third heat-conducting piece matched with the third jack and used for transferring heat on a voltage stabilizer to the ceramic heat-conducting plate are arranged on the ceramic heat-conducting plate, the first heat-conducting piece, the second heat-conducting piece and the third heat-conducting piece penetrate through the heat-insulating layer, the first heat-conducting piece, the second heat-conducting piece and the third heat-conducting piece are respectively in interference fit with the first jack, the second jack and the third jack, and the first heat-conducting piece, the second, In the second jack and the third jack, the upper end surfaces of the first heat-conducting piece, the second heat-conducting piece and the third heat-conducting piece are all level with the upper surface of the substrate.
2. A PCB board with efficient heat dissipation as recited in claim 1, wherein: be provided with first through-hole and second through-hole on the base plate, first through-hole and second through-hole all are the arc setting, first through-hole and second through-hole are the symmetry and set up, be provided with first spacing and the spacing of second on the ceramic heat-conducting plate, first spacing and the spacing of second all are the arc setting, first spacing and the spacing of second all run through the insulating layer setting, first through-hole and second through-hole setting are worn out respectively to first spacing and the spacing end of second, be formed with the hold up tank that is used for depositing the electric capacity between first spacing and the spacing of second.
3. A PCB board with efficient heat dissipation as recited in claim 2, wherein: the first heat conducting piece, the second heat conducting piece, the third heat conducting piece, the first limiting strip and the second limiting strip are all arranged in an integrated mode with the ceramic heat conducting plate.
4. A PCB board with efficient heat dissipation as recited in claim 3, wherein: the up end of first heat conduction spare, second heat conduction spare and third heat conduction spare all is provided with first heat conduction silica gel pad, the intrados of first spacing strip and the spacing strip of second all is provided with second heat conduction silica gel pad.
5. A PCB board with high heat dissipation efficiency as recited in claim 4, wherein: the heat insulation board is characterized in that a groove piece is arranged on the side face of the base plate, an insertion groove is formed in the groove piece, the base plate, the ceramic heat conduction plate and the heat insulation layer are all inserted into the insertion groove, and bolt through holes are formed in the base plate, the ceramic heat conduction plate, the heat insulation layer and the groove piece.
6. A PCB board with high heat dissipation efficiency as recited in claim 5, wherein: the substrate is provided with a copper foil circuit.
7. An efficient heat dissipation PCB as recited in claim 6, wherein: the heat insulation layer is a nano micropore heat insulation felt.
8. An efficient heat dissipation PCB board as recited in claim 7, wherein: the first heat-conducting piece, the second heat-conducting piece and the third heat-conducting piece are all bonded with respective first heat-conducting silica gel pads, and the first limiting strip and the second limiting strip are all bonded with respective second silica gel heat-conducting pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811139331.8A CN110972388A (en) | 2018-09-28 | 2018-09-28 | High-efficient radiating PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811139331.8A CN110972388A (en) | 2018-09-28 | 2018-09-28 | High-efficient radiating PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110972388A true CN110972388A (en) | 2020-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811139331.8A Pending CN110972388A (en) | 2018-09-28 | 2018-09-28 | High-efficient radiating PCB board |
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| CN (1) | CN110972388A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1560672A (en) * | 2004-02-17 | 2005-01-05 | �Ѵ���ɷ�����˾ | Backlight module and heat sink structure |
| JP2014007323A (en) * | 2012-06-26 | 2014-01-16 | Mitsubishi Electric Corp | Semiconductor package |
| CN205160908U (en) * | 2015-11-26 | 2016-04-13 | 昆山万源通电子科技有限公司 | Circumscribed heat dissipation PCB board |
| CN207264918U (en) * | 2017-09-06 | 2018-04-20 | 株洲宏达膜电有限公司 | The more capacitance packaging mechanisms of tandem |
-
2018
- 2018-09-28 CN CN201811139331.8A patent/CN110972388A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1560672A (en) * | 2004-02-17 | 2005-01-05 | �Ѵ���ɷ�����˾ | Backlight module and heat sink structure |
| JP2014007323A (en) * | 2012-06-26 | 2014-01-16 | Mitsubishi Electric Corp | Semiconductor package |
| CN205160908U (en) * | 2015-11-26 | 2016-04-13 | 昆山万源通电子科技有限公司 | Circumscribed heat dissipation PCB board |
| CN207264918U (en) * | 2017-09-06 | 2018-04-20 | 株洲宏达膜电有限公司 | The more capacitance packaging mechanisms of tandem |
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