CN110933871B - Processing technology for rear cover opening of printed circuit rigid-flex printed circuit board - Google Patents
Processing technology for rear cover opening of printed circuit rigid-flex printed circuit board Download PDFInfo
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- CN110933871B CN110933871B CN201911364801.5A CN201911364801A CN110933871B CN 110933871 B CN110933871 B CN 110933871B CN 201911364801 A CN201911364801 A CN 201911364801A CN 110933871 B CN110933871 B CN 110933871B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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Abstract
The invention relates to a processing technology for opening a printed circuit soft and hard combined board after opening a cover, which comprises the following steps: attaching a cover film on an upper copper foil and a lower copper foil of a soft board at a part, needing to be bent, of the soft board, windowing a first prepreg at the bent part of the soft board, fishing a groove at a hard-hard intersection line of a hard board substrate, taking a second prepreg and a cover copper foil, stacking and pressing to form a hard-soft combined board semi-finished product, manufacturing a mold required by a cover opening process, and punching. The process improves the production efficiency of products, reduces the production cost, and mainly ensures that the soft board is not damaged when the product is uncapped after processing, thereby improving the yield of the products.
Description
Technical Field
The invention relates to a processing technology of a printed circuit board, in particular to a processing technology of a printed circuit soft-hard combined board after uncovering.
Background
With the trend of developing consumer electronics products with lightness, thinness, integration and multiple functions, the requirements on the manufacturing process of the rigid-flexible printed circuit board are higher and higher. Following this trend, the flexible printed circuit board of the multi-layer flexible printed circuit board will gradually become an important part of the printed circuit board, and the advantages of the product include more design space saving, less assembly, faster and more stable signal transmission, etc.
The rigid-flex board generally has two kinds of uncaps before uncapping and uncap after in semi-manufactured goods processing technology, and this patent is main to the processing technology of uncapping after. In the printed circuit board industry, the processing method of opening the cover of the soft and hard combined board generally comprises UV laser cutting and CO 2 The three methods are long in processing time and high in cost, and the cutting and blind fishing depth is too large to damage the soft plate due to parameter setting errors or other reasons during operation of personnel, so that products are scrapped.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide the processing technology for the rear uncovering of the printed circuit rigid-flex board, which can improve the production efficiency of products, reduce the production cost, ensure that the flexible board is not damaged during the rear uncovering processing of the products and improve the yield of the products.
According to the technical scheme provided by the invention, the processing technology for the printed circuit soft and hard combined board rear uncovering comprises the following steps:
a. taking a manufactured soft board substrate, wherein the soft board substrate comprises an upper soft board copper foil, a soft board and a lower soft board copper foil, the upper soft board copper foil is fixed on the upper surface of the soft board, and the lower soft board copper foil is fixed on the lower surface of the soft board;
b. coating a covering film on the upper copper foil and the lower copper foil of the flexible printed circuit board at the part of the flexible printed circuit board, which needs to be bent, wherein the thickness of the position where the covering film is coated is recorded as H 1 ；
c. Taking a first semi-cured sheet, windowing the first semi-cured sheet at the bent part of the flexible printed circuit board, and recording the thickness of the first semi-cured sheet as H 2 ；
d. Taking a manufactured hard board substrate, wherein the hard board substrate comprises an upper hard board copper foil, a hard board and a lower hard board copper foil, the upper hard board copper foil is fixed on the upper surface of the hard board, the lower hard board copper foil is fixed on the lower surface of the hard board, and the thickness of the hard board substrate is marked as H 3 (ii) a Carrying out fishing groove treatment on the soft and hard intersection line of the hard board substrate, and fishing out a groove body;
e. taking a second prepreg for later use;
f. taking a covering copper foil for later use;
g. stacking the covering copper foil, the second prepreg, the hard board substrate, the first prepreg, the soft board substrate, the first prepreg, the hard board substrate, the second prepreg and the covering copper foil in sequence from bottom to top and then pressing the stacked materials into a soft and hard combination board semi-finished product, wherein the thickness of the soft and hard combination board semi-finished product is marked as H 4 ；
h. According to the required conventional process flow, the soft-hard combination plate semi-finished product is produced to the later uncapping flow;
i. the mold comprises a mold base plate, spring positioning columns required in the process of punching are arranged at the edge positions of the upper surface of the mold base plate, a blade is fixed on the upper surface of the mold base plate corresponding to the soft and hard intersection lines, the blade is a single-side vertical cutting edge, and the height H of the blade is equal to that of the blade 5 = (H 4 -H 1 )/2-H 2 -H 3 /2；
j. And (e) performing punching on the semi-finished product of the rigid-flex board which needs to be subjected to rear cover opening processing by using the die manufactured in the step (i), wherein during punching, the blade completely breaks the second prepreg, and the blade does not touch the flexible board, so that the processing procedure of opening the cover behind the rigid-flex board is completed.
Preferably, the thickness of the flexible board is 0.04-0.06 mm, and the thickness of the upper copper foil of the flexible board and the thickness of the lower copper foil of the flexible board are both 0.015-0.019 mm.
Preferably, the thickness of the first semi-cured sheet is 0.070-0.080 mm.
Preferably, the thickness of the hard board is 0.25-0.35 mm, and the thickness of the copper foil on the hard board and the thickness of the copper foil under the hard board are both 0.015-0.019 mm.
Preferably, the thickness of the second prepreg is 0.070-0.080 mm.
Preferably, the thickness of the covering copper foil is 0.015-0.019 mm.
Preferably, the width of the fishing groove is at least 0.4 mm.
In the step h, the conventional process flow sequentially comprises the steps of drilling, electroplating, pattern circuit, printing ink printing, surface treatment and molding.
The process improves the production efficiency of products, reduces the production cost, and mainly ensures that the soft board is not damaged when the product is uncapped after processing, thereby improving the yield of the products.
Drawings
Fig. 1 is a schematic view of a flexible printed circuit board to which a cover film is attached.
FIG. 2 is a schematic view of the structure of the first semi-cured sheet after windowing.
Fig. 3 is a schematic structural diagram of the hard board substrate after the groove is fished.
Fig. 4 is a schematic structural diagram of a second prepreg.
Fig. 5 is a schematic view of the structure of the clad copper foil.
Fig. 6 is a schematic structural view of a semi-finished product of the soft and hard combined plate.
Fig. 7 is a schematic structural diagram of a finished product of the rigid-flex board.
Fig. 8 is a schematic view of a back opening cover mold in the present invention.
Detailed Description
The present invention is further illustrated by the following examples.
Example 1
A processing technology for opening a rear cover of a printed circuit rigid-flex printed circuit board comprises the following steps:
a. taking a manufactured soft board substrate (the supplier of the soft board substrate is Songyang electronic materials (Kunshan) Limited company, the model is A-2005 ED), wherein the soft board substrate comprises an upper soft board copper foil 11, a soft board 12 and a lower soft board copper foil 13, the thickness of the soft board 12 is 0.05mm, the upper soft board copper foil 11 is fixed on the upper surface of the soft board 12, the lower soft board copper foil 13 is fixed on the lower surface of the soft board 12, and the thicknesses of the upper soft board copper foil 11 and the lower soft board copper foil 13 are both 0.017 mm;
b. a cover film 2 (the supplier of the cover film 2 is Taihong science and technology Co., Ltd., model FGA 0525) is attached to the upper copper foil 11 and the lower copper foil 13 of the flexible printed circuit board at the portion where the flexible printed circuit board is to be bent, and the thickness of the cover film 2 is represented as H 1 ；
c. Taking the first semi-cured sheet 3, performing windowing treatment on the first semi-cured sheet 3 at the bent part of the soft board to form a window 31, wherein the thickness of the first semi-cured sheet 3 is 0.075mm, and the thickness of the first semi-cured sheet 3 (the supplier of the first semi-cured sheet 3 is Taiwan optoelectronics material (Kunshan) Co., Ltd., model number of 108068% Lowflow) is recorded as H 2 ；
d. Taking a manufactured hard board substrate (the supplier of the hard board substrate is a photoelectronic material (Kunshan) Co., Ltd., the model is 0.012H/H OZ), wherein the hard board substrate comprises an upper hard board copper foil 41, a hard board 42 and a lower hard board copper foil 43, the upper hard board copper foil 41 is fixed on the upper surface of the hard board 42, the lower hard board copper foil 43 is fixed on the lower surface of the hard board 42, the thickness of the hard board 42 is 0.3mm, the thicknesses of the upper hard board copper foil 41 and the lower hard board copper foil 43 are both 0.017mm, and the thickness of the hard board substrate is marked as H 3 (ii) a Carrying out fishing groove treatment on the soft and hard intersection line of the hard board substrate, wherein the width of a fished groove body 44 is at least 0.8 mm;
e. taking a second prepreg 5 with a thickness of 0.075mm (the supplier of the second prepreg 5 is taiwan optoelectronics materials (kunshan) ltd. model 108065% Lowflow);
f. taking a covering copper foil 6 with the thickness of 0.017 mm;
g. in the order from bottom to topStacking the covering copper foil 6, the second prepreg 5, the hard board substrate, the first prepreg 3, the soft board substrate, the first prepreg 3, the hard board substrate, the second prepreg 5 and the covering copper foil 6 and then pressing the stacked materials into a soft and hard combination board semi-finished product, wherein the thickness of the soft and hard combination board semi-finished product is recorded as H 4 ；
h. Processing the semi-finished product of the rigid-flexible printed circuit board to a later uncovering process according to the required conventional process flow (the conventional process flow sequentially comprises the steps of drilling, electroplating, graphic circuit, printing ink printing, surface treatment and molding);
i. the mold comprises a mold bottom plate 71, a spring positioning column 72 required for punching is arranged at the edge position of the upper surface of the mold bottom plate 71, the spring positioning column 72 is used for positioning a plate needing to be opened, a blade 73 is fixed on the upper surface of the mold bottom plate 71 corresponding to a soft and hard cross-connecting line, the blade 73 is a single-side vertical cutting edge, the tangent plane of the hard plate after punching is ensured to be a straight line, and the height H of the blade 73 is high 5 = (H 4 -H 1 )/2-H 2 -H 3 2, the height of the blade 73 calculated according to the formula does not touch the soft board 12 when the rear cover opening punch type is carried out, so the soft board 12 is absolutely not damaged;
j. and (3) performing punching on the semi-finished product of the rigid-flexible printed circuit board to be subjected to rear cover opening processing by using the die manufactured in the step i, wherein during punching, the blade 73 completely breaks the second prepreg 5, and the blade 73 cannot touch the flexible printed circuit board 12, so that the processing procedure of opening the cover after the rigid-flexible printed circuit board is completed, and the finished product of the rigid-flexible printed circuit board is obtained.
The calculation formula of the height of the blade edge 73 in the invention is H 5 = (H 4 -H 1 )/2-H 2 -H 3 The blade height calculated according to the formula does not touch the soft board 12 during punching, so that the soft board 12 is not damaged absolutely, and the UV laser cutting and CO mentioned in the technical background are avoided 2 The laser cutting, mechanical blind fishing and other processing methods cause the cutting and blind fishing depth to be overlarge and damage the soft plate 12 because of parameter setting errors or other reasons during operation of personnel, so that the product is scrapped.
Claims (6)
1. A processing technology for opening a printed circuit soft and hard combined board after opening a cover is characterized by comprising the following steps:
a. taking a manufactured soft board substrate, wherein the soft board substrate comprises a soft board upper copper foil (11), a soft board (12) and a soft board lower copper foil (13), the soft board upper copper foil (11) is fixed on the upper surface of the soft board (12), and the soft board lower copper foil (13) is fixed on the lower surface of the soft board (12);
b. attaching a cover film (2) on an upper copper foil (11) and a lower copper foil (13) of the flexible board at the part of the flexible board to be bent, wherein the thickness of the portion where the cover film (2) is attached is recorded as H 1 ；
c. Taking the first semi-cured sheet (3), windowing the first semi-cured sheet (3) at the bent part of the flexible printed circuit board, and marking the thickness of the first semi-cured sheet (3) as H 2 ；
d. Taking a manufactured hard board substrate, wherein the hard board substrate comprises a hard board upper copper foil (41), a hard board (42) and a hard board lower copper foil (43), the hard board upper copper foil (41) is fixed on the upper surface of the hard board (42), the hard board lower copper foil (43) is fixed on the lower surface of the hard board (42), and the thickness of the hard board substrate is recorded as H 3 (ii) a Carrying out fishing groove treatment on the soft and hard cross-connecting line of the hard board substrate, and fishing out a groove body (44), wherein the width of the fishing groove is at least 0.4 mm;
e. taking a second prepreg (5) for standby;
f. taking the covering copper foil (6) for standby;
g. stacking the covering copper foil (6), the second prepreg (5), the hard board substrate, the first prepreg (3), the soft board substrate, the first prepreg (3), the hard board substrate, the second prepreg (5) and the covering copper foil (6) in sequence from bottom to top and pressing the stacked materials into a soft and hard combination board semi-finished product, wherein the thickness of the soft and hard combination board semi-finished product is recorded as H 4 ；
h. According to the required conventional process flow, the process from the production of the semi-finished product of the soft-hard combined plate to the later uncovering process sequentially comprises the steps of drilling, electroplating, graphic lines, printing ink printing, surface treatment and molding;
i. after being manufacturedThe mold required by the uncovering process comprises a mold bottom plate (71), a spring positioning column (72) required for punching is arranged at the edge position of the upper surface of the mold bottom plate (71), a blade (73) is fixed on the upper surface of the mold bottom plate (71) corresponding to the soft and hard intersection line, the blade (73) is a single-side vertical cutting edge, and the height H of the blade (73) is equal to the height H of the blade 5 = (H 4 -H 1 )/2-H 2 -H 3 /2；
j. And (3) performing punching on the semi-finished product of the rigid-flex board to be subjected to rear cover opening processing by using the die manufactured in the step i, wherein during punching, the second prepreg (5) is completely broken by the blade (73), and the blade (73) cannot touch the flexible board (12) to complete the processing procedure of rear cover opening of the rigid-flex board.
2. The process for processing the back open cover of the printed circuit soft and hard combined board as claimed in claim 1, wherein the process comprises the following steps: the thickness of the soft board (12) is 0.04-0.06 mm, and the thickness of the upper copper foil (11) and the lower copper foil (13) of the soft board are both 0.015-0.019 mm.
3. The process for processing the back open cover of the printed circuit soft and hard combined board as claimed in claim 1, wherein the process comprises the following steps: the thickness of the first semi-cured sheet (3) is 0.070-0.080 mm.
4. The process for processing the rear cover of the printed circuit rigid-flex printed circuit board as claimed in claim 1, which is characterized in that: the thickness of the hard board (42) is 0.25-0.35 mm, and the thickness of the upper copper foil (41) and the thickness of the lower copper foil (43) of the hard board are both 0.015-0.019 mm.
5. The process for processing the rear cover of the printed circuit rigid-flex printed circuit board as claimed in claim 1, which is characterized in that: the thickness of the second prepreg (5) is 0.070-0.080 mm.
6. The process for processing the back open cover of the printed circuit soft and hard combined board as claimed in claim 1, wherein the process comprises the following steps: the thickness of the covering copper foil (6) is 0.015-0.019 mm.
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| CN201911364801.5A CN110933871B (en) | 2019-12-26 | 2019-12-26 | Processing technology for rear cover opening of printed circuit rigid-flex printed circuit board |
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| CN201911364801.5A CN110933871B (en) | 2019-12-26 | 2019-12-26 | Processing technology for rear cover opening of printed circuit rigid-flex printed circuit board |
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| CN110933871A CN110933871A (en) | 2020-03-27 |
| CN110933871B true CN110933871B (en) | 2022-07-26 |
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| CN111712065B (en) * | 2020-07-08 | 2022-08-12 | 高德(江苏)电子科技股份有限公司 | Machining process for avoiding fracture of copper in holes of rigid-flex board |
| CN112654179A (en) * | 2020-12-07 | 2021-04-13 | 高德（无锡）电子有限公司 | Processing technology for rear cover opening of printed circuit soft and hard combined board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003264369A (en) * | 2002-03-07 | 2003-09-19 | Denso Corp | Method for manufacturing printed board and structure of printed board |
| CN101554669A (en) * | 2008-04-08 | 2009-10-14 | 南亚电路板股份有限公司 | Cutting mould and shaping method of soft-hard composite circuit board |
| CN107548235A (en) * | 2017-08-24 | 2018-01-05 | 高德（无锡）电子有限公司 | A kind of radium-shine cuttings of UV drag for groove with machinery and dock the processing method uncapped |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003264369A (en) * | 2002-03-07 | 2003-09-19 | Denso Corp | Method for manufacturing printed board and structure of printed board |
| CN101554669A (en) * | 2008-04-08 | 2009-10-14 | 南亚电路板股份有限公司 | Cutting mould and shaping method of soft-hard composite circuit board |
| CN107548235A (en) * | 2017-08-24 | 2018-01-05 | 高德（无锡）电子有限公司 | A kind of radium-shine cuttings of UV drag for groove with machinery and dock the processing method uncapped |
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Effective date of registration: 20230831 Address after: No. 32 Chunhui Middle Road, Yunlin Street, Xishan District, Wuxi City, Jiangsu Province, 214101 Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee before: Gultech (Wuxi) Electronics Co.,Ltd. |