CN110900393A - Chamfer grinding device - Google Patents
Chamfer grinding device Download PDFInfo
- Publication number
- CN110900393A CN110900393A CN201911141593.2A CN201911141593A CN110900393A CN 110900393 A CN110900393 A CN 110900393A CN 201911141593 A CN201911141593 A CN 201911141593A CN 110900393 A CN110900393 A CN 110900393A
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- China
- Prior art keywords
- tape
- grinding
- rotating shaft
- connecting rod
- chamfer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides chamfer grinding equipment which comprises a central shaft, a plurality of connecting rods, a plurality of adhesive tape rotating shafts and grinding adhesive tapes, wherein the connecting rods are distributed around the central shaft, the connecting rods are positioned in the same plane, the plane is vertical to the central shaft, the first end of each connecting rod is connected with the central shaft, the second end of each connecting rod is provided with one adhesive tape rotating shaft, the axis of each adhesive tape rotating shaft is parallel to the central shaft, and the grinding adhesive tapes are arranged around the adhesive tape rotating shafts, so that the grinding adhesive tapes can rotate around the adhesive tape rotating shafts. Therefore, in the embodiment of the invention, the grinding adhesive tape is supported by the adhesive tape rotating shaft and the supporting rod, and the grinding of the semiconductor is realized when the grinding adhesive tape rotates, so that the grinding adhesive tape is prevented from being in rigid contact with the semiconductor, the possibility of damage to the semiconductor is reduced, and the yield of products is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to chamfer grinding equipment.
Background
In the semiconductor processing process, after the wire cutting is finished, chamfering processing needs to be carried out on the relatively sharp part of the edge of the semiconductor so as to remove edge breakage or fine cracks possibly existing on the edge part and reduce stress concentration.
Disclosure of Invention
The embodiment of the invention provides chamfer grinding equipment, which aims to solve the problem that the conventional chamfer grinding equipment is in rigid contact with a semiconductor and can cause large yield loss.
In order to solve the technical problem, the invention is realized as follows:
the embodiment of the invention provides chamfer grinding equipment which comprises a central shaft, a plurality of connecting rods, a plurality of adhesive tape rotating shafts and grinding adhesive tapes, wherein the connecting rods are distributed around the central shaft, the connecting rods are positioned in the same plane, the plane is vertical to the central shaft, the first end of each connecting rod is connected with the central shaft, the second end of each connecting rod is provided with one adhesive tape rotating shaft, the axis of each adhesive tape rotating shaft is parallel to the central shaft, and the grinding adhesive tapes are arranged around the adhesive tape rotating shafts, so that the grinding adhesive tapes can rotate around the adhesive tape rotating shafts.
Optionally, at least one of the plurality of connecting rods is a telescopic rod.
Optionally, at least one of the connecting rods is rotatably connected to the central shaft and can rotate around the central shaft.
Optionally, many connecting rods include head rod, second connecting rod, third connecting rod and fourth connecting rod, the second end of many connecting rods is provided with first sticky tape pivot, second sticky tape pivot, third sticky tape pivot and fourth sticky tape pivot respectively, the central point of first sticky tape pivot with line between the central point of second sticky tape pivot is on a parallel with the central point of third sticky tape pivot with line between the central point of fourth sticky tape pivot, so that encircle a plurality of sticky tape pivots the grinding sticky tape is trapezoidal.
Optionally, the included angle between at least one waist line of the trapezoidal grinding tape and the lower bottom is adjustable, and the adjustment range is 68 degrees to 89 degrees.
Optionally, the device further comprises a central guide rail, the central shaft is disposed in the central guide rail and can slide along the extension of the central guide rail, and the central shaft is perpendicular to the plane where the central guide rail is located.
Optionally, the central guide rail is circular arc-shaped.
Optionally, the polishing device further comprises a cleaning component, wherein the cleaning component is arranged towards the abrasive tape to clean the abrasive tape.
Optionally, the grinding device further comprises a cooling assembly for cooling the grinding tape.
Optionally, the grinding device further comprises a driving assembly, wherein the output end of the driving assembly is in transmission connection with at least one adhesive tape rotating shaft so as to drive the adhesive tape rotating shaft to rotate and drive the grinding adhesive tape to rotate through the adhesive tape rotating shaft.
Therefore, in the embodiment of the invention, the grinding adhesive tape is supported by the adhesive tape rotating shaft and the supporting rod, and the grinding of the semiconductor is realized when the grinding adhesive tape rotates, so that the grinding adhesive tape is prevented from being in rigid contact with the semiconductor, the possibility of damage to the semiconductor is reduced, and the yield of products is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a chamfer grinding apparatus according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides chamfer grinding equipment.
The chamfer grinding equipment is used for manufacturing chamfers after products are machined. In one embodiment, the chamfer grinding apparatus includes a central shaft 101, a plurality of connecting rods 102, a plurality of tape spindles 103, and a grinding tape 104.
As shown in fig. 1, a plurality of connecting rods 102 are arranged around a central shaft 101, each connecting rod 102 is located in the same plane, the plane is perpendicular to the central shaft 101, a first end of each connecting rod 102 is connected to the central shaft 101, a second end of each connecting rod 102 is provided with a tape rotating shaft 103, and an axis of each tape rotating shaft 103 is parallel to the central shaft 101.
The grinding tape 104 is disposed around a plurality of tape rotating shafts 103, and it is understood that the connecting rod 102 and the tape rotating shafts 103 form a frame for supporting the grinding tape 104, the grinding tape 104 is supported by each tape rotating shaft 103, and the portion of the grinding tape 104 between two adjacent tape rotating shafts 103 is suspended.
Further, the abrasive tape 104 can rotate around a plurality of tape spindles 103 during use. Specifically, when the chamfering and grinding device is used, a product to be ground, such as a silicon wafer, is fixed at a designated position, the grinding tape 104 is in contact with the position of the product where the chamfering needs to be processed, and further, the grinding tape 104 is controlled to rotate, so that the grinding tape 104 and the surface of the product move relatively, the product is ground, and the chamfering processing is completed.
In a specific embodiment, a driving assembly may be further provided, an output end of the driving assembly is in transmission connection with at least one adhesive tape rotating shaft 103 to drive the adhesive tape rotating shaft 103 to rotate, and the adhesive tape rotating shaft 103 drives the grinding adhesive tape 104 to rotate, so that the grinding adhesive tape 104 and a product move relatively, grinding of the product is achieved, and processing of a chamfer is completed.
In this way, in the embodiment of the present invention, the grinding tape 104 is supported by the tape rotating shaft 103 and the supporting rod, and when the grinding tape 104 rotates, the semiconductor is ground. Because the part of the grinding adhesive tape 104 between two adjacent adhesive tape rotating shafts 103 is suspended, the grinding adhesive tape 104 actually has a certain movement margin and has relatively small contact strength with the semiconductor, thereby avoiding the grinding adhesive tape 104 from being in rigid contact with the semiconductor, reducing the possibility of damage to the semiconductor and being beneficial to improving the yield of products.
Further, since the grinding tape 104 is supported by a plurality of tape bearings located on the connecting rod, the moving path of the grinding tape 104 is long, on one hand, the open structure helps to diffuse and separate the dust generated in the grinding process, reduces the adverse effect that the dust generated in the processing process may bring to the product, and on the other hand, also helps to dissipate heat, thereby helping to improve the processing effect.
In one embodiment, to further enhance the cleaning effect, a cleaning assembly is also provided that is disposed toward the abrasive tape 104 to clean the abrasive tape 104.
Specifically, this cleaning assembly can choose for use the structure of blowing, sets up the fan and the jet head that links to each other with the output of fan, and the jet head orientation grinds sticky tape 104 and sets up to blow off the dust on the grinding sticky tape 104 through the jet head. When the chamfer of the silicon wafer is processed, more silicon dust may be generated, and the dust on the grinding tape 104 is blown off, which helps to reduce the possible adverse effect on the production process.
In addition, the cleaning assembly may optionally include a flushing structure, such as a water pump and a water jet directed toward the abrasive tape 104, to flush the abrasive tape 104 to reduce the possibility of dust generated during the grinding process adhering to the abrasive tape 104.
Obviously, other devices such as a dust suction device and the like can be selected for the cleaning assembly as long as the cleaning of the abrasive tape 104 can be achieved.
In another embodiment, a cooling assembly is provided to further enhance heat dissipation, and the cooling assembly is used to cool the abrasive tape 104.
It should be understood that during the grinding process, a large amount of heat is generated due to the continuous friction between the grinding tape 104 and the product, and if the temperature is too high, the product may be adversely affected, so that a cooling component may be further provided in the embodiment.
The cooling assembly may be used to cool the polishing tape 104 by means including, but not limited to, air cooling, water cooling, etc., thereby reducing the adverse effects that the high temperature may have on the polishing process.
In an alternative embodiment, the cleaning assembly is also reused as the cooling assembly, for example, a rinsing device is provided to clean the abrasive tape 104 on the one hand and to cool and cool the abrasive tape 104 by a rinsing liquid used in the rinsing process on the other hand.
In an alternative embodiment, the support shape of the abrasive tape 104 is adjustable to accommodate chamfering at different angles.
In the embodiment, the support shape of the grinding tape 104 is controlled to adjust the relative angle between the grinding tape 104 and the product, so that chamfers with different angles can be machined by the equipment.
In one embodiment, at least one of the plurality of connecting rods 102 is a telescoping rod, such that control of the shape of the abrasive tape 104 can be achieved by controlling the length of the connecting rod 102.
In another embodiment, the shape of the polishing tape 104 is controlled by controlling the included angle between the connecting rods 102, and in particular, at least one of the connecting rods 102 is rotatably connected to the central shaft 101 and can rotate around the central shaft 101.
In addition, the two modes can be combined, and the adjustment of the positions of the four adhesive tape rotating shafts 103, namely the control of the shape of the grinding adhesive tape 104 can also be realized.
In one embodiment, the plurality of connecting rods 102 includes a first connecting rod, a second connecting rod, a third connecting rod and a fourth connecting rod, and a total of four connecting rods are taken as an example for illustration.
A first adhesive tape rotating shaft, a second adhesive tape rotating shaft, a third adhesive tape rotating shaft and a fourth adhesive tape rotating shaft are respectively arranged at the second end of the connecting rod 102, and a connecting line between the central point of the first adhesive tape rotating shaft and the central point of the second adhesive tape rotating shaft is parallel to a connecting line between the central point of the third adhesive tape rotating shaft and the central point of the fourth adhesive tape rotating shaft, so that the grinding adhesive tapes surrounding the adhesive tape rotating shafts are trapezoidal.
Taking a processed silicon wafer as an example, in the use process, the setting angle of the chamfering grinding device is shown in fig. 1, and the silicon wafer is fixed in the horizontal direction, which can be understood as that the axis of the silicon wafer is in the vertical direction.
First, the tip end surface of the silicon wafer is ground using the bottom of the trapezoid structure, that is, the outer circumference of the silicon wafer, and then the chamfered portions between the upper and lower surfaces and the tip end surface of the silicon wafer are processed using the waist of the trapezoid structure.
In this embodiment, the range of the included angle between at least one waist line of the trapezoid-shaped grinding tape 104 and the bottom is adjustable, and the adjustment range is 68 degrees to 89 degrees, that is, the range of the bottom angle of the trapezoid-shaped grinding tape 104 is 68 degrees to 89 degrees, or as shown in fig. 1, the size range of the angle AOB formed between one waist of the trapezoid-shaped grinding tape 104 and the horizontal direction is 11 degrees to 22 degrees, so that the chamfer angle of 11 degrees to 22 degrees can be processed, and the silicon wafer processing with different requirements can be met.
Further, in another embodiment, the device further comprises a center rail 105, the center shaft 101 is disposed in the center rail 105 and can slide along the extension of the center rail 105, and the center shaft 101 is perpendicular to the plane of the center rail 105.
It should be understood that the chamfer grinding device in the above embodiment can only realize the processing of T-shaped chamfer, but in the present embodiment, when the central shaft 101 moves on the central guide rail 105, the whole chamfer grinding device moves along with the central shaft, and the moving track is the same as the shape of the guide rail, so that the processing of chamfer of other structures can also be realized.
For example, in one embodiment, the center rail 105 has a circular arc shape, and thus, the movement locus of the chamfering and grinding apparatus is also a circular arc shape, thereby enabling the processing of the R-shaped chamfer.
Through setting up this central guide rail 105, can realize richening the usage of chamfer grinding device, adapt to the processing of multiple chamfer.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a chamfer grinding device, its characterized in that includes center pin, many connecting rods, a plurality of sticky tape pivot and grinding sticky tape, many connecting rods are around the center pin is arranged, each the connecting rod all is located the coplanar, just the plane with the center pin is perpendicular, each the first end of connecting rod with the center pin links to each other, each the second end of connecting rod is provided with one the sticky tape pivot, each the axis of sticky tape pivot all with the center pin is parallel, just grinding sticky tape centers on a plurality of sticky tape pivots sets up, so that grinding sticky tape can encircle a plurality of sticky tape pivots rotate.
2. The chamfer grinding apparatus of claim 1, wherein at least one of the plurality of connecting rods is a telescoping rod.
3. The chamfer grinding apparatus of claim 1 or 2, wherein at least one of the plurality of connecting rods is rotatably connected to the central shaft and is capable of rotating about the central shaft.
4. The chamfer grinding device according to claim 3, wherein the plurality of connecting rods comprise a first connecting rod, a second connecting rod, a third connecting rod and a fourth connecting rod, a first tape rotating shaft, a second tape rotating shaft, a third tape rotating shaft and a fourth tape rotating shaft are respectively disposed at second ends of the plurality of connecting rods, and a connecting line between a central point of the first tape rotating shaft and a central point of the second tape rotating shaft is parallel to a connecting line between a central point of the third tape rotating shaft and a central point of the fourth tape rotating shaft, so that the grinding tape surrounding the plurality of tape rotating shafts is trapezoidal.
5. The chamfer grinding device of claim 4, wherein the angle between at least one waist line and the lower bottom of the trapezoid-shaped grinding tape is adjustable in a range of 68 degrees to 89 degrees.
6. The chamfer grinding apparatus of claim 1, further comprising a center rail, said center shaft disposed within said center rail and capable of sliding along said extension of said center rail, said center shaft being perpendicular to the plane of said center rail.
7. The chamfer grinding apparatus of claim 6, wherein the central guide track is circular in shape.
8. The chamfer grinding apparatus of claim 1 further comprising a cleaning assembly disposed toward the grinding tape to clean the grinding tape.
9. The chamfer grinding apparatus of claim 1, further comprising a cooling assembly for cooling the grinding tape.
10. The chamfer grinding device according to claim 1, further comprising a driving assembly, wherein an output end of the driving assembly is in transmission connection with at least one of the tape rotating shafts so as to drive the tape rotating shafts to rotate and drive the grinding tapes to rotate through the tape rotating shafts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911141593.2A CN110900393B (en) | 2019-11-20 | 2019-11-20 | Chamfer grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911141593.2A CN110900393B (en) | 2019-11-20 | 2019-11-20 | Chamfer grinding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110900393A true CN110900393A (en) | 2020-03-24 |
| CN110900393B CN110900393B (en) | 2021-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911141593.2A Active CN110900393B (en) | 2019-11-20 | 2019-11-20 | Chamfer grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110900393B (en) |
Citations (10)
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|---|---|---|---|---|
| US3524284A (en) * | 1967-08-22 | 1970-08-18 | Corning Glass Works | Abrasive milling head for numerically controlled apparatus |
| CN201579684U (en) * | 2010-01-27 | 2010-09-15 | 马勒三环气门驱动(湖北)有限公司 | Polishing device of air-valve rod abrasive belt |
| CN201833252U (en) * | 2010-10-04 | 2011-05-18 | 吉林大学 | Self-adaptive grinding and polishing processing machine tool for complex curved surfaces |
| CN202540095U (en) * | 2012-02-10 | 2012-11-21 | 中山市大雅五金制品有限公司 | Abrasive belt grinder for grinding circular arc |
| CN103978414A (en) * | 2014-06-03 | 2014-08-13 | 宝鸡银康机械设备有限公司 | Automatic arc slab rough grinding machine |
| CN204321794U (en) * | 2013-08-29 | 2015-05-13 | 康宁股份有限公司 | For the lapping device of abrading glass plate |
| CN206216423U (en) * | 2016-09-09 | 2017-06-06 | 石家庄博深石油机械有限公司 | Spiral workpiece polishing device |
| CN207824613U (en) * | 2018-01-26 | 2018-09-07 | 盐城市大丰中意机械有限公司 | A kind of belt sander |
| CN108620992A (en) * | 2018-06-28 | 2018-10-09 | 安徽帮创智能科技有限公司 | A kind of modified capped end polishing machine |
| CN108673307A (en) * | 2018-07-27 | 2018-10-19 | 武汉科技大学 | A kind of portable end socket polishing belt sander |
-
2019
- 2019-11-20 CN CN201911141593.2A patent/CN110900393B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3524284A (en) * | 1967-08-22 | 1970-08-18 | Corning Glass Works | Abrasive milling head for numerically controlled apparatus |
| CN201579684U (en) * | 2010-01-27 | 2010-09-15 | 马勒三环气门驱动(湖北)有限公司 | Polishing device of air-valve rod abrasive belt |
| CN201833252U (en) * | 2010-10-04 | 2011-05-18 | 吉林大学 | Self-adaptive grinding and polishing processing machine tool for complex curved surfaces |
| CN202540095U (en) * | 2012-02-10 | 2012-11-21 | 中山市大雅五金制品有限公司 | Abrasive belt grinder for grinding circular arc |
| CN204321794U (en) * | 2013-08-29 | 2015-05-13 | 康宁股份有限公司 | For the lapping device of abrading glass plate |
| CN103978414A (en) * | 2014-06-03 | 2014-08-13 | 宝鸡银康机械设备有限公司 | Automatic arc slab rough grinding machine |
| CN206216423U (en) * | 2016-09-09 | 2017-06-06 | 石家庄博深石油机械有限公司 | Spiral workpiece polishing device |
| CN207824613U (en) * | 2018-01-26 | 2018-09-07 | 盐城市大丰中意机械有限公司 | A kind of belt sander |
| CN108620992A (en) * | 2018-06-28 | 2018-10-09 | 安徽帮创智能科技有限公司 | A kind of modified capped end polishing machine |
| CN108673307A (en) * | 2018-07-27 | 2018-10-19 | 武汉科技大学 | A kind of portable end socket polishing belt sander |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110900393B (en) | 2021-12-03 |
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Effective date of registration: 20211020 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |