CN110875210B - Processing device - Google Patents
Processing device Download PDFInfo
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- CN110875210B CN110875210B CN201810996915.0A CN201810996915A CN110875210B CN 110875210 B CN110875210 B CN 110875210B CN 201810996915 A CN201810996915 A CN 201810996915A CN 110875210 B CN110875210 B CN 110875210B
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- moving mechanism
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- 238000012545 processing Methods 0.000 title claims abstract description 46
- 230000007246 mechanism Effects 0.000 claims abstract description 200
- 238000002791 soaking Methods 0.000 claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 35
- 210000005056 cell body Anatomy 0.000 claims description 14
- 238000000926 separation method Methods 0.000 claims description 5
- 238000001802 infusion Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 39
- 238000005192 partition Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a processing apparatus including: the carrier is used for placing the product; the soaking mechanism can store liquid and is used for soaking the product; the first moving mechanism is movably arranged and has a first working condition for at least partially placing the carrier into the soaking mechanism and a second working condition for taking out the carrier from the soaking mechanism; the second moving mechanism is movably arranged on the first moving mechanism and comprises a carrying mechanism, and the carrying mechanism is used for carrying and moving the product so as to put the product into the carrier. According to the technical scheme provided by the invention, the film and the wafer which are not completely separated can be automatically received and processed in a concentrated manner, so that the existing manual processing mode can be replaced, the processing efficiency is improved, and the film can be prevented from being damaged.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a processing device.
Background
After the wafer with the film is etched, the film and the wafer are combined by surface tension, if the etching process is not good, the film and the wafer cannot be completely separated when being separated, and the film and the wafer are called NG wafer in a whole. Sorting and separation is required for films and wafers that are not completely separated. At present, the NG wafer is only manually processed in the field, the mode needs real-time monitoring and manual timely processing, the manual processing efficiency is low, if the processing is not timely, the equipment can only be stopped, and the productivity of the equipment is limited. Moreover, the normally separated film can be recycled, but the film is easily damaged by manual handling.
Disclosure of Invention
The invention provides a processing device, which solves the problems of low efficiency and easy damage to a film when the film and a wafer which are not separated completely after etching are processed in the prior art.
In order to solve the above-described problems, the present invention provides a processing apparatus including: the carrier is used for placing the product; the soaking mechanism can store liquid and is used for soaking the product; the first moving mechanism is movably arranged and has a first working condition for at least partially placing the carrier into the soaking mechanism and a second working condition for taking out the carrier from the soaking mechanism; the second moving mechanism is movably arranged on the first moving mechanism and comprises a carrying mechanism, and the carrying mechanism is used for carrying and moving the product so as to put the product into the carrier.
Further, the carrying mechanism includes: a pallet fork for receiving and carrying a product; the first driving part is provided with a fifth working condition for moving the support fork to the outside of the carrier and a sixth working condition for moving the support fork to the inside of the carrier.
Further, the carrying mechanism further includes: the second driving part is arranged on the first driving part and is used for driving the support fork to move so as to separate the product on the support fork from the support fork.
Further, the first driving part is used for driving the supporting fork to vertically move, the second driving part is used for driving the supporting fork to horizontally move, the carrier comprises a feeding hole at the upper part, a first avoiding hole at the side face and a stopping piece, the stopping piece is positioned at the first avoiding hole, and the stopping piece is used for stopping a product to separate the product from the supporting fork; when the first moving mechanism is in a first working condition and the first driving part is in a sixth working condition, the second driving part can drive the support fork to move towards the outside of the carrier at the first avoiding opening, so that the product is left inside the carrier through the stop piece.
Further, the carrier still includes the bottom plate and around the curb plate at the bottom plate border, and the backstop is connected with the top surface of bottom plate, holds in the palm the fork and is two, and two hold in the palm the fork interval setting on first drive portion, and the interval between two holds in the palm the fork is greater than the width of backstop.
Further, the number of the second moving mechanisms is multiple, the number of the first moving mechanisms is one, and the multiple second moving mechanisms are arranged on the first moving mechanisms side by side; or, the plurality of second moving mechanisms are provided, the plurality of first moving mechanisms are provided, and the plurality of second moving mechanisms are arranged in one-to-one correspondence with the plurality of first moving mechanisms.
Further, the first moving mechanism includes: the bracket is movably arranged, and the second moving mechanism is arranged on the bracket; the first bracket is arranged on the bracket, the second moving mechanism is at least partially positioned above the first bracket, and the first bracket is used for bearing the carrier.
Further, the first moving mechanism is at least partially located above the soaking mechanism, and the first moving mechanism further comprises: and the bracket is arranged on the fourth driving part, and the fourth driving part is used for driving the bracket to move vertically.
Further, the first bracket comprises two supporting arms which are arranged at intervals, the two supporting arms are used for jointly bearing the carrier, and the second moving mechanism can put products into the carrier on the first bracket.
Further, the carrier includes: a bottom plate; a side plate surrounding the edge of the bottom plate to form a containing cavity for placing the product; the support plates are arranged on the side plates and at least partially protrude out of the outer surfaces of the side plates, the number of the support plates is two, the two support plates are respectively positioned on two sides of the accommodating cavity, and the two support arms are used for bearing the lower surfaces of the two support plates in one-to-one correspondence.
Further, the bottom plate and/or the side plate are/is provided with a liquid inlet communicated with the accommodating cavity, one of the supporting arm and the supporting plate is provided with a first positioning hole, the other of the supporting arm and the supporting plate is provided with a first positioning pin, and the first positioning pin can be arranged in the first positioning hole in a penetrating way to position the carrier.
Further, the soaking mechanism includes: the box body is used for storing liquid in a cavity; the baffle, the cavity interval of baffle with the box is first cell body and second cell body, and liquid in the first cell body can spill over to in the second cell body from the upper edge of baffle, and first cell body is arranged in soaking the product in the carrier.
Further, the soaking mechanism further comprises: the pump body, the bottom of first cell body is through pipeline and pump body intercommunication, and the second cell body is through pipeline and pump body intercommunication.
Further, the processing device further includes: and the third moving mechanism is movably arranged and is provided with a third working condition for receiving the carrier on the first moving mechanism and a fourth working condition for conveying the carrier to the outside.
Further, the third moving mechanism includes: the second bracket is movably arranged and is used for bearing the carrier; and a fifth driving part for driving the second bracket to move towards or away from the first moving mechanism.
Further, the third moving mechanism further includes: and the guide mechanism is used for guiding the second bracket.
Further, one of the carrier and the second bracket has a second positioning hole, and the other of the carrier and the second bracket has a second positioning pin that can be inserted into the second positioning hole to position the carrier.
By applying the technical scheme of the invention, the carrier, the soaking mechanism, the first moving mechanism and the second moving mechanism are arranged in the processing device, and the processing device can be used for processing the film and the wafer which are not completely separated after etching, so that the film and the wafer which are not completely separated can be automatically and intensively received and processed, the existing manual processing mode can be replaced, the processing efficiency is improved, and the film damage can be avoided. Specifically, the carrier can be immersed into the liquid of the immersing mechanism through the first moving mechanism, and the film and the wafer which are not completely separated are intensively placed into the carrier through the carrying mechanism in the second moving mechanism, so that the performance of the film and the wafer can be ensured while the film and the wafer are received, and the damage to the film and the wafer is avoided.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention. In the drawings:
fig. 1 is a schematic diagram showing a structure of a processing apparatus according to an embodiment of the present invention;
FIG. 2 shows a view of the processing device of FIG. 1 without a shield;
FIG. 3 shows an enlarged view of a portion of the processing device of FIG. 2;
FIG. 4 is a schematic diagram showing the first moving mechanism and the supporting mechanism in FIG. 3;
FIG. 5 is a schematic view showing the first moving mechanism of FIG. 3 engaged with a carrier;
FIG. 6 shows a schematic structural diagram of the carrier in FIG. 3;
FIG. 7 shows a schematic view of the soaking mechanism of FIG. 2;
fig. 8 shows a schematic structural view of the third moving mechanism in fig. 2.
Wherein the above figures include the following reference numerals:
10. a carrier; 11. a stopper; 12. a bottom plate; 121. a second positioning hole; 13. a side plate; 14. a supporting plate; 141. a first positioning hole; 15. a handle; 20. a soaking mechanism; 21. a case; 22. a partition plate; 23. a first tank body; 24. a second tank body; 25. a liquid inlet pipe; 26. a liquid outlet pipe; 27. a pump body; 30. a first moving mechanism; 31. a bracket; 32. a first bracket; 321. a bracket arm; 322. a first positioning pin; 33. a fourth driving section; 40. a supporting mechanism; 41. a fork; 42. a first driving section; 43. a second driving section; 60. a third movement mechanism; 61. a second bracket; 611. a second positioning pin; 62. a fifth driving section; 63. a guide mechanism; 64. a first limiting member; 65. a second limiting piece; 66. a connecting plate; 70. a frame; 71. a carrying platform; 80. and a protective cover.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 8, an embodiment of the present invention provides a processing apparatus including: a carrier 10 for placing a product; a soaking mechanism 20, the soaking mechanism 20 being capable of storing a liquid, the soaking mechanism 20 being for soaking a product; a first movement mechanism 30 movably disposed, the first movement mechanism 30 having a first condition for at least partially inserting the carrier 10 into the soak mechanism 20 and a second condition for removing the carrier 10 from the soak mechanism 20; a second moving mechanism movably disposed on the first moving mechanism 30, the second moving mechanism including a carrying mechanism 40, the carrying mechanism 40 for carrying and moving the product to place the product into the carrier 10.
By applying the technical scheme of the embodiment, the carrier 10, the soaking mechanism 20, the first moving mechanism 30 and the second moving mechanism are arranged in the processing device, and the processing device can be used for processing the film and the wafer which are not completely separated after etching, so that the film and the wafer which are not completely separated can be automatically and intensively received and intensively processed, the existing manual processing mode can be replaced, the processing efficiency is improved, and the film can be prevented from being damaged. Specifically, the carrier 10 may be immersed in the liquid of the immersing mechanism 20 by the first moving mechanism 30, and the film and the wafer which are not completely separated may be intensively placed in the carrier 10 by the carrying mechanism 40 in the second moving mechanism, so that the performance of the film and the wafer may be ensured while receiving, and damage to the film and the wafer may be avoided. In this embodiment, a carriage may be understood as a carriage and a movement. The present embodiment is capable of loading products into the carrier 10 in a load-bearing and moving manner of the load-bearing mechanism 40.
Specifically, as shown in fig. 4 and 5, the loading mechanism 40 includes: a pallet fork 41, the pallet fork 41 for receiving and carrying a product; the first driving part 42 and the pallet fork 41 are provided on the first driving part 42, and the first driving part 42 has a fifth operation mode in which the pallet fork 41 is moved to the outside of the carrier 10 and a sixth operation mode in which the pallet fork 41 is moved to the inside of the carrier 10. This allows the pallet fork 41 to be moved to the outside of the carrier 10 by the first driving part 42 to receive the product and the pallet fork 41 to be moved to the inside of the carrier 10 by the first driving part 42 to put the product into the carrier 10.
In the present embodiment, the carrying mechanism 40 further includes: the second driving part 43, the first driving part 42 is disposed on the second driving part 43, and the second driving part 43 is used for driving the pallet fork 41 to move so as to separate the product on the pallet fork 41 from the pallet fork 41. This allows for separation of the product carried on the pallet fork 41 from the pallet fork 41 for placement of the product into the carrier 10.
Specifically, the first driving part 42 is used for driving the supporting fork 41 to move vertically, the second driving part 43 is used for driving the supporting fork 41 to move horizontally, the carrier 10 comprises a feeding hole at the upper part, a first avoiding hole at the side surface and a stopping piece 11, the stopping piece 11 is positioned at the first avoiding hole, and the stopping piece 11 is used for stopping a product to separate the product from the supporting fork 41; when the first moving mechanism 30 is under the first working condition and the first driving portion 42 is under the sixth working condition, the second driving portion 43 can drive the fork 41 to move towards the outside of the carrier 10 at the first avoiding opening, so that the product is left inside the carrier 10 through the stop piece 11. This places the product into the carrier 10 by the cooperation of the second drive portion 43, the first drive portion 42 and the stopper 11. Because the carrier 10 can be immersed in the immersing mechanism 20, the product is immersed in the liquid of the immersing mechanism 20 after being put into the carrier 10 to maintain the performance of the product.
As shown in fig. 6, the carrier 10 further includes a bottom plate 12 and a side plate 13 surrounding the edge of the bottom plate 12, the stop member 11 is connected to the top surface of the bottom plate 12, two supporting forks 41 are disposed on the first driving portion 42 at intervals, and the interval between the two supporting forks 41 is greater than the width of the stop member 11. This arrangement increases the stability of the product carried by the two forks 41 and the stop 11 can extend between the two forks 41 to stop the product and thus disengage the product from the two forks 41.
In the present embodiment, a plurality of second moving mechanisms may be provided, and the first moving mechanism 30 may be provided in one, the plurality of second moving mechanisms being provided side by side on the first moving mechanism 30. This allows for simultaneous transport of multiple carriers 10 using one first movement mechanism 30 and for multiple second movement mechanisms to simultaneously load multiple carriers 10 with product. In the present embodiment, a plurality of second moving mechanisms may be provided, and a plurality of first moving mechanisms 30 may be provided, the plurality of second moving mechanisms being provided in one-to-one correspondence with the plurality of first moving mechanisms 30. Such that the plurality of first moving mechanisms 30 may be individually actuated, for example, one first moving mechanism 30 immersing one carrier 10 into the immersing mechanism 20 to receive the product, and the other first moving mechanism 30 taking out the carrier 10 filled with the product from the immersing mechanism 20 to output the product.
As shown in fig. 3 to 5, the first moving mechanism 30 includes: a bracket 31 movably provided, and a second moving mechanism is provided on the bracket 31; the first bracket 32 is disposed on the bracket 31, the second moving mechanism is at least partially located above the first bracket 32, and the first bracket 32 is used for carrying the carrier 10. In this way, the bracket 31 drives the second moving mechanism to move integrally, and the carrier 10 is carried by the first bracket 32.
In the present embodiment, the first moving mechanism 30 is at least partially located above the soaking mechanism 20, and the first moving mechanism 30 further includes: the fourth driving part 33, the bracket 31 is disposed on the fourth driving part 33, and the fourth driving part 33 is used for driving the bracket 31 to move vertically. The second moving mechanism is driven by the fourth driving part 33 to move in the vertical direction, so that the carrier 10 on the second moving mechanism can be put into the soaking mechanism 20 or taken out from the soaking mechanism 20.
Specifically, the first bracket 32 includes two supporting arms 321 disposed at intervals, the two supporting arms 321 are used for jointly carrying the carrier 10, and the second moving mechanism can put the product into the carrier 10 on the first bracket 32. Thus, a portion of the carrier 10 may be supported by the two support arms 321, and a gap between the two support arms 321 may avoid other portions of the carrier 10.
In the present embodiment, the carrier 10 includes: a bottom plate 12; a side plate 13, the side plate 13 surrounding the edge of the bottom plate 12 to form a containing cavity for placing the product; the support plates 14 are arranged on the side plates 13, the support plates 14 at least partially protrude out of the outer surfaces of the side plates 13, the number of the support plates 14 is two, the two support plates 14 are respectively positioned on two sides of the accommodating cavity, and the two support arms 321 are used for bearing the lower surfaces of the two support plates 14 in a one-to-one correspondence manner. The carrier 10 is supported and moved by the cooperation of the two carrier arms 321 with the two pallets 14.
Further, the bottom plate 12 and/or the side plate 13 have a liquid inlet hole communicating with the accommodating cavity, so that the liquid in the soaking mechanism 20 flows into the accommodating cavity of the carrier 10. One of the bracket 321 and the pallet 14 has a first positioning hole 141, and the other of the bracket 321 and the pallet 14 has a first positioning pin 322, and the first positioning pin 322 can be inserted into the first positioning hole 141 to position the carrier 10. This allows a reliable connection of the carrier arm 321 and the carrier plate 14, preventing the carrier 10 from falling. In this embodiment, the carrier 10 further includes a handle 15, and the handle 15 is disposed on the pallet 14, so that a person can grasp the carrier 10 or transport the carrier 10 using other devices.
As shown in fig. 7, the soaking mechanism 20 includes: a tank body 21, wherein a cavity of the tank body 21 is used for storing liquid; the partition plate 22, the partition plate 22 separates the cavity of the box 21 into a first tank 23 and a second tank 24, the liquid in the first tank 23 can overflow from the upper edge of the partition plate 22 into the second tank 24, and the first tank 23 is used for soaking the product in the carrier 10. The carrier 10 may thus be immersed in the first tank 23 to pass the liquid infusion product in the first tank 23 and overflow into the second tank 24 for collection when the liquid in the first tank 23 is excessive.
In the present embodiment, the lowest point of the upper edge of the partition 22 is lower than the lowest point of the upper edge of the tank 21 so that excessive liquid overflows from the upper edge of the partition 22 to the second tank 24. Specifically, the upper edge of the partition 22 may be set in a zigzag shape. The soaking mechanism 20 further includes: the liquid inlet pipe 25, the liquid inlet pipe 25 is communicated with the first groove 23 in an on-off manner; the liquid outlet pipe 26, the liquid outlet pipe 26 can be communicated with the second groove body 24. The liquid inlet pipe 25 is used for conveying liquid to the first tank body 23, and the liquid outlet pipe 26 is used for discharging excessive liquid in the second tank body 24.
In the present embodiment, the soaking mechanism 20 further includes: the pump body 27, the bottom of first cell body 23 passes through pipeline and communicates with the pump body 27, and the second cell body 24 passes through pipeline and communicates with the pump body 27. Thus, when the liquid needs to be replaced or discharged, the liquid in the first tank 23 can be transferred to the second tank 24 through the pump body 27, and then discharged to the outside through the liquid outlet pipe 26 communicating with the second tank 24. Of course, a pipeline may be provided to directly communicate the first tank 23 with the outside, and directly discharge the liquid when the liquid is required.
In this embodiment, the processing apparatus further includes: a third moving mechanism 60 is movably provided, and the third moving mechanism 60 has a third operating condition for receiving the carrier 10 on the first moving mechanism 30 and a fourth operating condition for conveying the carrier 10 to the outside. Thus, after a certain amount of the film and the wafer are received in the carrier 10, the carrier 10 can be transported to the outside by the third moving mechanism 60 to separate the film and the wafer.
As shown in fig. 8, the third moving mechanism 60 includes: a second bracket 61 movably provided, the second bracket 61 for carrying the carrier 10; the fifth driving part 62 is used for driving the second bracket 61 to move towards or away from the first moving mechanism 30. This makes it possible to bring the second carriage 61 close to the first moving mechanism 30 to convey the carrier 10 to the first moving mechanism 30 or to convey the carrier 10 from the first moving mechanism 30 to the second carriage 61. The carrier 10 can be output or retracted from the first moving mechanism 30 by the second carriage 61 being away from the first moving mechanism 30. In the present embodiment, the first moving mechanism 30 is located under the second operating condition, and the third moving mechanism 60 is located under the third operating condition, and the second bracket 61 is located under the carrier 10 on the first moving mechanism 30 to receive the carrier 10.
In the present embodiment, the third moving mechanism 60 further includes: and a guide mechanism 63, the guide mechanism 63 being for guiding the second bracket 61. By the guiding action of the guiding mechanism 63, the stability of the operation of the second carriage 61 can be ensured.
In this embodiment, the fifth driving part 62 and the guiding mechanism 63 are both located below the second bracket 61, the fifth driving part 62 is a rodless cylinder, and the guiding mechanism 63 includes a guide rail disposed parallel to the rodless cylinder. The fifth driving part 62 is provided as a rodless cylinder, and a guide rail is provided, so that the operation of the second carriage 61 can be stabilized and reliable. The fifth drive 62 may also be provided as a screw or other mechanism enabling linear movement. In the present embodiment, the third moving mechanism 60 further includes a connection plate 66, and the connection plate 66 is used to connect the second bracket 61 with the rodless cylinder and the guide rail.
In the present embodiment, the second bracket 61 has a first limiting member 64 thereon, and the fifth driving portion 62 has a second limiting member 65 thereon, where the first limiting member 64 and the second limiting member 65 are in stop fit to limit the moving distance of the second bracket 61. This can avoid interference of the second carriage 61 with other components and can accurately convey the carrier 10 to a desired position.
Specifically, one of the carrier 10 and the second bracket 61 has a second positioning hole 121, and the other of the carrier 10 and the second bracket 61 has a second positioning pin 611, and the second positioning pin 611 can be inserted into the second positioning hole 121 to position the carrier 10. This enables a reliable connection of the carrier 10 and the second bracket 61 by the cooperation of the second positioning holes 121 and the second positioning pins 611.
As shown in fig. 1 and 2, the processing apparatus further includes: the frame 70, the frame 70 has a bearing table 71, the bearing table 71 has a second avoiding port, the third moving mechanism 60 is arranged on the upper surface of the bearing table 71, the soaking mechanism 20 is positioned below the second avoiding port, and the first moving mechanism 30 is at least partially positioned above the second avoiding port; the protection cover 80 is covered on the frame 70, and the first moving mechanism 30 and the third moving mechanism 60 are both positioned in the protection cover 80, and the protection cover 80 is provided with a material taking opening which is arranged corresponding to the third moving mechanism 60. The frame 70 may support other components, wherein the carrier 71 may provide and support the third movement mechanism 60. The protection cover 80 can protect the components of the first moving mechanism 30, the second moving mechanism and the like, and ensure the operation safety.
In order to facilitate understanding of the arrangement of the present embodiment, the operation of the processing apparatus will be described below. The order of steps in the operation process is not limited, and can be adjusted according to the needs in actual use.
Loading of empty carriers 10:
the second carriage 61 of the third moving mechanism 60 has 2 stations, one for manual loading near the pick-out port and the other for picking up the carriers from the first carriage 32. Initial state: the second carriage 61 of the third moving mechanism 60 is located at the manual carrier station and the stand 31 is located at the lowest position.
Step 1: manually placing the carrier 10 on the second carriage 61 of the third movement mechanism 60;
step 2: the rodless cylinder (fifth driving part 62) of the third moving mechanism 60 moves to convey the carrier 10 from the manual carrier placing station to the first bracket 32 carrier taking station;
step 3: the bracket 31 is lifted to enable the first bracket 32 to support the supporting plate 14 of the carrier 10, and the supporting bracket is lifted to a certain height to enable the bottom plate 12 of the carrier 10 to be separated from the second positioning pin 611 on the second bracket 61;
step 4: the rodless cylinder of the third moving mechanism 60 moves to return the second carriage 61 to the initial position;
step 5: the bracket 31 descends to the lowest position, and the carrier 10 is immersed in the water of the immersing mechanism 20;
at this time, the carrier 10 is loaded, and NG wafer loading is possible.
Unloading of NG wafer filled carrier 10:
initial state: the second carriage 61 of the third moving mechanism 60 is located at the manual carrier station and the stand 31 is located at the lowest position.
Step 1: the bracket 31 is lifted to make the bottom plate 12 of the carrier 10 higher than the second bracket 61 of the third moving mechanism 60;
step 2: the rodless cylinder of the third moving mechanism 60 moves to move the second bracket 61 from the manual carrier station to the carrier picking station;
step 3: lowering the support 31 to drop the bottom plate 12 of the carrier 10 onto the second bracket 61;
step 4: the bracket 31 continues to descend, so that the first bracket 32 is separated from the supporting plate 14 of the carrier 10;
step 5: the rodless cylinder of the third moving mechanism 60 moves to move the carrier 10 to the manual pick-and-place carrier station;
step 6: the person manually removes the carrier 10 from the second bracket 61.
At this time, the unloading of the carrier 10 filled with NG wafer is completed, and the empty carrier 10 can be loaded with the empty carrier 10.
NG wafer loading procedure into carrier 10:
initial state: the bracket 31 is positioned at the lowest position; the first carriage 32 has already carried the carrier 10; the guide rod of the horizontal guide rod cylinder (the second driving part 43) is in an extending state; the guide rod of the vertical belt guide rod cylinder (first driving part 42) does not extend; the first tank 23 is filled with water, the water surface is lower than the pallet fork 41, and the part of the carrier 10 below the pallet fork 41 is soaked in the water.
Step 1: the manipulator delivers NG wafer over the pallet fork 41 of the pallet mechanism 40;
step 2: after the bracket 31 ascends and the supporting fork 41 contacts the bottom of the wafer of the NG wafer, the NG wafer is continuously ascended to be separated from the manipulator;
step 3: the robot leaves the fork 41;
step 4: the bracket 31 is lowered to the lowest position;
step 5: the guide rod of the vertical guide rod cylinder extends out and moves down the supporting fork 41, and the NG wafer is in the carrier 10 and immersed in water;
step 6: the guide rod of the horizontal guide rod cylinder is retracted to drive the supporting fork 41 to move towards the stop piece 11 of the carrier 10, and NG wafer is separated from the supporting fork 41 because one side is blocked by the stop piece 11 in the moving process, and the NG wafer slowly moves downwards to fall onto the bottom plate 12 of the carrier 10 due to the resistance of gravity and water;
step 7: the guide rod of the horizontal guide rod cylinder extends out, and the guide rod of the vertical guide rod cylinder retracts to return to the initial state.
The above steps are repeated to load the next NG wafer, where the NG wafer is stacked with the previous NG wafer. When NG wafer is stacked to a certain number, unloading of the carrier 10 filled with NG wafer can be performed, and this number can be set according to the actual requirements of the apparatus.
By applying the technical scheme of the invention, the carrier 10, the soaking mechanism 20, the first moving mechanism 30, the second moving mechanism and the third moving mechanism 60 are arranged in the processing device, and the processing device can be used for processing the film and the wafer which are not separated completely after etching, so that the film and the wafer which are not separated completely can be automatically received and processed intensively, the existing manual processing mode can be replaced, the processing efficiency is improved, and the film can be prevented from being damaged.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In the description of the present invention, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present invention; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present invention.
Claims (11)
1. A processing apparatus, comprising: a carrier (10) for placing a product; -a soaking mechanism (20), said soaking mechanism (20) being capable of storing a liquid, said soaking mechanism (20) being used for soaking said product; -a first movement mechanism (30) movably arranged, said first movement mechanism (30) having a first condition in which said carrier (10) is at least partially placed in said infusion mechanism (20) and a second condition in which said carrier (10) is removed from said infusion mechanism (20); a second movement mechanism movably arranged on the first movement mechanism (30), the second movement mechanism comprising a carrying mechanism (40), the carrying mechanism (40) being used for carrying and moving the product to put the product into the carrier (10);
the carrying mechanism (40) includes: a pallet fork (41), the pallet fork (41) for receiving and carrying the product; a first driving unit (42), wherein the pallet fork (41) is disposed on the first driving unit (42), and the first driving unit (42) has a fifth working condition for moving the pallet fork (41) to the outside of the carrier (10) and a sixth working condition for moving the pallet fork (41) to the inside of the carrier (10);
the carrying mechanism (40) further includes: a second driving part (43), wherein the first driving part (42) is arranged on the second driving part (43), and the second driving part (43) is used for driving the pallet fork (41) to move so as to separate a product on the pallet fork (41) from the pallet fork (41);
the first driving part (42) is used for driving the supporting fork (41) to vertically move, the second driving part (43) is used for driving the supporting fork (41) to horizontally move, the carrier (10) comprises a feeding hole at the upper part, a first avoiding hole at the side face and a stopping piece (11), the stopping piece (11) is positioned at the first avoiding hole, and the stopping piece (11) is used for stopping the product to separate the product from the supporting fork (41); when the first moving mechanism (30) is in the first working condition and the first driving part (42) is in the sixth working condition, the second driving part (43) can drive the supporting fork (41) to move towards the outside of the carrier (10) at the first avoiding opening so as to leave the product inside the carrier (10) through the stop piece (11);
the first movement mechanism (30) includes: a bracket (31) movably arranged, and the second moving mechanism is arranged on the bracket (31); a first carriage (32) arranged on the support (31), the second moving mechanism being at least partially located above the first carriage (32), the first carriage (32) being for carrying the carrier (10);
the first movement mechanism (30) is at least partially located above the steeping mechanism (20), the first movement mechanism (30) further comprising: the bracket (31) is arranged on the fourth driving part (33), and the fourth driving part (33) is used for driving the bracket (31) to move vertically;
the first bracket (32) comprises two bracket arms (321) which are arranged at intervals, the two bracket arms (321) are used for jointly bearing the carrier (10), and the second moving mechanism can put the product into the carrier (10) on the first bracket (32).
2. The processing device according to claim 1, wherein the carrier (10) further comprises a bottom plate (12) and a side plate (13) surrounding the edge of the bottom plate (12), the stop member (11) is connected with the top surface of the bottom plate (12), the number of the supporting forks (41) is two, the two supporting forks (41) are arranged on the first driving part (42) at intervals, and the interval between the two supporting forks (41) is larger than the width of the stop member (11).
3. The processing apparatus according to claim 1, wherein the plurality of second moving mechanisms is one, the plurality of first moving mechanisms (30) is provided side by side on the first moving mechanism (30); or, the number of the second moving mechanisms is plural, the number of the first moving mechanisms (30) is plural, and the plurality of the second moving mechanisms and the plurality of the first moving mechanisms (30) are arranged in one-to-one correspondence.
4. The processing device according to claim 1, wherein the carrier (10) comprises: a bottom plate (12); -a side plate (13), said side plate (13) surrounding the rim of said bottom plate (12) to form a containing cavity for the placement of said product; the support plates (14) are arranged on the side plates (13), the support plates (14) are at least partially protruded out of the outer surfaces of the side plates (13), the number of the support plates (14) is two, the two support plates (14) are respectively located on two sides of the containing cavity, and the two support arms (321) are used for bearing the lower surfaces of the two support plates (14) in a one-to-one correspondence mode.
5. The processing device according to claim 4, characterized in that the bottom plate (12) and/or the side plate (13) are provided with a liquid inlet hole communicated with the accommodating cavity, one of the supporting arm (321) and the supporting plate (14) is provided with a first positioning hole (141), the other one of the supporting arm (321) and the supporting plate (14) is provided with a first positioning pin (322), and the first positioning pin (322) can be penetrated into the first positioning hole (141) to position the carrier (10).
6. The processing device according to claim 1, wherein the soaking mechanism (20) comprises: the box body (21), the cavity of the said box body (21) is used for storing the liquid; the separation plate (22), the separation plate (22) will the cavity interval of box (21) is first cell body (23) and second cell body (24), liquid in first cell body (23) can follow in the upper edge of separation plate (22) overflows in second cell body (24), first cell body (23) are arranged in soaking in carrier (10) the product.
7. The processing device according to claim 6, wherein the soaking mechanism (20) further comprises: the bottom of the first groove body (23) is communicated with the pump body (27) through a pipeline, and the second groove body (24) is communicated with the pump body (27) through a pipeline.
8. The processing device of claim 6, wherein the processing device further comprises: a third moving mechanism (60) is movably arranged, and the third moving mechanism (60) is provided with a third working condition for receiving the carrier (10) on the first moving mechanism (30) and a fourth working condition for conveying the carrier (10) to the outside.
9. The processing apparatus according to claim 8, wherein the third movement mechanism (60) comprises: -a second carriage (61) movably arranged, said second carriage (61) being adapted to carry said carrier (10); and a fifth driving unit (62) for driving the second carriage (61) to move in a direction approaching or separating from the first moving mechanism (30).
10. The processing apparatus according to claim 9, wherein the third movement mechanism (60) further comprises: and a guide mechanism (63), wherein the guide mechanism (63) is used for guiding the second bracket (61).
11. The processing device according to claim 9, characterized in that one of the carrier (10) and the second bracket (61) has a second positioning hole (121), the other of the carrier (10) and the second bracket (61) has a second positioning pin (611), the second positioning pin (611) being able to pass into the second positioning hole (121) for positioning the carrier (10).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810996915.0A CN110875210B (en) | 2018-08-29 | 2018-08-29 | Processing device |
| PCT/CN2018/117212 WO2020042395A1 (en) | 2018-08-29 | 2018-11-23 | Processing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810996915.0A CN110875210B (en) | 2018-08-29 | 2018-08-29 | Processing device |
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| CN110875210B true CN110875210B (en) | 2024-03-19 |
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| WO2018090574A1 (en) * | 2016-11-21 | 2018-05-24 | 北京北方华创微电子装备有限公司 | Wafer transporting apparatus, processing chamber, mechanical arm, semiconductor apparatus, and wafer transporting method |
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| JP2000124285A (en) * | 1998-10-13 | 2000-04-28 | Anelva Corp | Auto-loader and substrate processor using the same |
| JP2003151968A (en) * | 2001-11-13 | 2003-05-23 | Dainippon Screen Mfg Co Ltd | Thin-film forming apparatus, film-supplying mechanism, film-accommodating cassette, transfer mechanism and transfer method |
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