CN110854255A - Preparation method of LED patch of car light surface light source - Google Patents

Preparation method of LED patch of car light surface light source Download PDF

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Publication number
CN110854255A
CN110854255A CN201911147903.1A CN201911147903A CN110854255A CN 110854255 A CN110854255 A CN 110854255A CN 201911147903 A CN201911147903 A CN 201911147903A CN 110854255 A CN110854255 A CN 110854255A
Authority
CN
China
Prior art keywords
packaging
light source
chip
led patch
steps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911147903.1A
Other languages
Chinese (zh)
Inventor
汪文佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou Wuyi Jiali Auto Parts Co Ltd
Original Assignee
Changzhou Wuyi Jiali Auto Parts Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changzhou Wuyi Jiali Auto Parts Co Ltd filed Critical Changzhou Wuyi Jiali Auto Parts Co Ltd
Priority to CN201911147903.1A priority Critical patent/CN110854255A/en
Publication of CN110854255A publication Critical patent/CN110854255A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Abstract

The invention relates to a preparation method of an LED patch of an automobile lamp surface light source, which comprises the following steps: the first step is as follows: adhering the chip on a fixed platform arranged on the bracket; the second step is that: welding a lead of a first bonding pad arranged on the bracket with a second bonding pad of the chip; the third step: covering a transparent cover on the chip, packaging, and packaging the transparent cover with packaging glue; the fourth step: and sticking the whole support on the reflecting sheet. The invention has simple process, good packaging effect and long service life.

Description

Preparation method of LED patch of car light surface light source
Technical Field
The invention relates to a preparation method of an LED patch, in particular to a preparation method of an automobile lamp LED patch.
Background
The car light is the indispensable lighting apparatus of car, and along with the development of car light, current car light uses the LED paster as the light source. It has long service life, can be used as a surface light source, is suitable for various shapes, and improves the aesthetic degree. Most of the existing LED patch preparation adopts a packaging process method, but the problems of complex process, high process difficulty and the like are still solved.
Disclosure of Invention
The invention aims to provide the preparation method of the LED patch of the surface light source of the car lamp, which has the advantages of simple process, good packaging effect and long service life.
In order to achieve the purpose, the technical scheme of the invention is as follows: a preparation method of an LED patch of an automobile lamp surface light source comprises the following steps:
the first step is as follows: adhering the chip on a fixed platform arranged on the bracket;
the second step is that: welding a lead of a first bonding pad arranged on the bracket with a second bonding pad of the chip;
the third step: covering a transparent cover on the chip, packaging, and packaging the transparent cover with packaging glue;
the fourth step: and sticking the whole support on the reflecting sheet.
Preferably, the transparent cover is an arc-shaped cover.
Preferably, the packaging adhesive is silicone rubber.
Preferably, the reflective sheet is a PET reflective patch.
After the process is adopted, the fixing platform is arranged on the support, the chip is pasted and positioned on the fixing platform, so that the lead cannot be loosened during welding, and then packaging operation is carried out. Simple process, good packaging effect and long service life.
Drawings
FIG. 1 is a schematic of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following examples, which are given in conjunction with the accompanying drawings.
Referring to fig. 1, a method for preparing an LED patch for a surface light source of a vehicle lamp includes the following steps:
the first step is as follows: the chip 57 is stuck on a fixed platform 59 arranged on the bracket 1;
the second step is that: bonding the lead 55 of the first pad 511 provided on the support 1 to the second pad 58 of the chip 57;
the third step: covering the transparent cover 2 at the chip, then packaging, and packaging the transparent cover 2 with packaging glue 56;
the fourth step: the entire support 1 is adhered to the reflector 5.
Referring to fig. 1, the transparent cover 2 is an arc-shaped cover. The arc transparent cover has long service life.
Referring to fig. 1, the packaging adhesive 56 is a silicone rubber. The cured silicone rubber has good elasticity and high and low temperature resistance, and can reach the temperature of-50-200 ℃.
Referring to fig. 1, the reflective sheet 5 is a PET reflective patch. The reflective patch has low cost and long service life.
The LED patch produced by adopting the steps has the advantages of simple process, good impact resistance and long service life.

Claims (4)

1. A preparation method of an LED patch of an automobile lamp surface light source is characterized by comprising the following steps: the method comprises the following steps:
the first step is as follows: adhering the chip (57) on a fixed platform (59) arranged on the bracket (1);
the second step is that: welding a lead (55) of a first bonding pad (511) arranged on the bracket (1) with a second bonding pad (58) of the chip (57);
the third step: covering the chip with a transparent cover (2), then packaging, and packaging the transparent cover (2) with packaging glue (56);
the fourth step: the whole bracket (1) is stuck on the reflecting sheet (5).
2. The method for preparing the LED patch of the area light source of the car lamp according to claim 1, wherein the method comprises the following steps: the transparent cover (2) is an arc cover.
3. The method for preparing the LED patch of the area light source of the car lamp according to claim 1, wherein the method comprises the following steps: the packaging glue (56) is organic silicon rubber.
4. The method for preparing the LED patch of the area light source of the car lamp according to claim 1, wherein the method comprises the following steps: the reflective sheet (5) is a PET reflective patch.
CN201911147903.1A 2019-11-21 2019-11-21 Preparation method of LED patch of car light surface light source Pending CN110854255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911147903.1A CN110854255A (en) 2019-11-21 2019-11-21 Preparation method of LED patch of car light surface light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911147903.1A CN110854255A (en) 2019-11-21 2019-11-21 Preparation method of LED patch of car light surface light source

Publications (1)

Publication Number Publication Date
CN110854255A true CN110854255A (en) 2020-02-28

Family

ID=69603218

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911147903.1A Pending CN110854255A (en) 2019-11-21 2019-11-21 Preparation method of LED patch of car light surface light source

Country Status (1)

Country Link
CN (1) CN110854255A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101097973A (en) * 2006-06-26 2008-01-02 南京汉德森科技股份有限公司 High power LED two-dimension light source
CN101540362A (en) * 2009-04-23 2009-09-23 南京汉德森科技股份有限公司 Method for mixing light to form an LED warm white light source and light source structure therefrom
CN103022319A (en) * 2012-12-17 2013-04-03 四川鼎吉光电科技有限公司 Light emitting diode (LED) encapsulating structure
CN103151445A (en) * 2013-03-04 2013-06-12 中国科学院半导体研究所 Low thermal resistance LED (Light Emitting Diode) packaging structure and packaging method
CN203118985U (en) * 2012-12-17 2013-08-07 四川鼎吉光电科技有限公司 Led packaging structure
JP2014082408A (en) * 2012-10-18 2014-05-08 Toppan Printing Co Ltd Lead frame for led light-emitting element, manufacturing method therefor and led package using the same
CN208504036U (en) * 2018-04-13 2019-02-15 深圳市暗能量电源有限公司 A kind of LED street lamp mould group

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101097973A (en) * 2006-06-26 2008-01-02 南京汉德森科技股份有限公司 High power LED two-dimension light source
CN101540362A (en) * 2009-04-23 2009-09-23 南京汉德森科技股份有限公司 Method for mixing light to form an LED warm white light source and light source structure therefrom
JP2014082408A (en) * 2012-10-18 2014-05-08 Toppan Printing Co Ltd Lead frame for led light-emitting element, manufacturing method therefor and led package using the same
CN103022319A (en) * 2012-12-17 2013-04-03 四川鼎吉光电科技有限公司 Light emitting diode (LED) encapsulating structure
CN203118985U (en) * 2012-12-17 2013-08-07 四川鼎吉光电科技有限公司 Led packaging structure
CN103151445A (en) * 2013-03-04 2013-06-12 中国科学院半导体研究所 Low thermal resistance LED (Light Emitting Diode) packaging structure and packaging method
CN208504036U (en) * 2018-04-13 2019-02-15 深圳市暗能量电源有限公司 A kind of LED street lamp mould group

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Application publication date: 20200228