CN110788433B - Full-automatic liquid level stabilizing soldering device and using method thereof - Google Patents
Full-automatic liquid level stabilizing soldering device and using method thereof Download PDFInfo
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- CN110788433B CN110788433B CN201911036815.4A CN201911036815A CN110788433B CN 110788433 B CN110788433 B CN 110788433B CN 201911036815 A CN201911036815 A CN 201911036815A CN 110788433 B CN110788433 B CN 110788433B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a full-automatic liquid level stabilizing soldering device and a using method thereof, wherein the full-automatic liquid level stabilizing soldering device comprises a control box, wherein a supporting plate frame is arranged on the side edge of the control box, and a lifting assembly is arranged on the supporting plate frame; the full-automatic liquid level stabilizing soldering device comprises a main motor, a linkage rotating rod, a rear connecting plate and a guide post, wherein the main motor is arranged at the upper end of a supporting plate frame, the linkage rotating rod is connected below the main motor, the lower end of the linkage rotating rod is connected with the rear connecting plate, and the upper end of the guide post is arranged below the supporting plate frame.
Description
Technical Field
The invention relates to a full-automatic liquid level stabilizing soldering device, in particular to a full-automatic liquid level stabilizing soldering device and a using method thereof.
Background
The existing full-automatic liquid level stabilizing soldering technology needs manual replacement after a soldering plate is soldered, so that a lot of time is consumed, the workload of workers is increased, scalding is easy, safety accidents occur, and danger is caused to people.
Disclosure of Invention
The invention aims to provide a full-automatic liquid level stabilizing soldering device and a use method thereof.
In order to achieve the purpose, the invention provides the following technical scheme: a full-automatic liquid level stabilizing soldering device comprises a control box, wherein a supporting plate frame is arranged on the side edge of the control box, and a lifting assembly is arranged on the supporting plate frame;
the lifting assembly comprises a main motor, a linkage rotating rod, a rear connecting plate and a guide post, the main motor is arranged at the upper end of the supporting plate frame, the linkage rotating rod is connected below the main motor, the lower end of the linkage rotating rod is connected with the rear connecting plate, the upper end of the guide post is arranged below the supporting plate frame, a soldering rack is arranged on the guide post, and a soldering assembly is arranged at the lower end of the soldering rack;
the soldering assembly comprises a U-shaped frame, connecting shafts, connecting seats, clamping grooves and plates to be soldered, the connecting shafts are arranged on the outer sides of two ends of the U-shaped frame, the connecting seats are arranged on two sides of the inner end of the U-shaped frame, the clamping grooves are formed in the connecting seats, the groove walls of the outer side ends of the clamping grooves are higher than those of the inner side ends of the clamping grooves, the plates to be soldered are arranged in the clamping grooves, the soldering grooves are formed below the soldering assembly, and the feeding devices are arranged on the side edges of the soldering assembly;
the feeding device comprises a supporting plate, a feeding plate, a pushing assembly and a pressing assembly, wherein the upper end of the supporting plate is connected with the feeding plate, the pushing assembly is installed at one end of the feeding plate, the pressing assembly is arranged in the soldering rack, a fixed bedplate is connected below the feeding device, and the other end of the fixed bedplate is installed on the sliding box;
the material pressing assembly comprises a telescopic rod, a telescopic cylinder and a material pressing block, the telescopic cylinder is arranged at the upper end of the soldering rack, one end of the telescopic cylinder penetrates through the soldering rack to be connected with the telescopic rod, the material pressing block is arranged at the bottom end of the telescopic rod, and the material pressing assembly corresponds to the position of the clamping groove;
the using method comprises the following steps:
the method comprises the following steps: the bottom end of a soldering board is provided with a clamping board, the soldering board is arranged on the U-shaped frame by clamping the clamping board in a clamping groove of the connecting seat, the main motor drives the linkage rotating rod to rotate, the soldering machine frame is driven to move up and down on the guide post, the U-shaped frame is driven to move up and down and can move down to the soldering groove, and a rotary cylinder in the soldering machine frame drives the U-shaped frame to rotate left and right to perform soldering on two side edges;
step two: after a soldered plate to be soldered is taken out, a rotary cylinder in a soldering rack drives a U-shaped frame to turn over, a clamping groove turns over to the upper side, the U-shaped frame is parallel to a feeding plate, a plurality of plates to be soldered are discharged on the feeding plate, a servo motor drives a linked gear to drive a pushing rotating rod to push forward, a pushing plate pushes the plates to be soldered to move to the clamping groove, and a groove wall with a higher outer side is positioned to enable the plates to be soldered to be clamped above the clamping groove;
step three: telescopic cylinder drive telescopic link downstream drives and presses the material piece to push down, treats that the tin soldering board needs the corner of soldering tin to both sides extension design, treats to set up the indent in the tin soldering board, presses the material piece attached in the indent top, presses down and treats the tin soldering board, will treat the cardboard of tin soldering board bottom to fix in the stuck groove, accomplishes the material loading.
Furthermore, one end of the supporting plate frame is installed on the side of the control box, and the other end of the supporting plate frame is installed on the side of the sliding box.
Furthermore, the upper end of the linkage rotating rod penetrates through the support plate frame to be connected with an output shaft of the main motor, and the lower end of the linkage rotating rod penetrates through the rear connecting plate and is in threaded movable connection with the rear connecting plate.
Furthermore, the number of the guide posts is two, one end of each guide post is fixedly arranged on the support plate frame, the other end of each guide post is fixed on the fixed bedplate, and the guide posts are movably arranged at the two ends of the soldering rack.
Furthermore, a rotary cylinder is arranged in the soldering rack, the soldering rack is connected with a connecting shaft on the side of the U-shaped rack through the rotary cylinder, and the U-shaped rack is movably connected with the soldering rack through the connecting shaft and the rotary cylinder.
Further, the material pushing assembly comprises a linked gear, a pushing rotating rod, a pushing plate and a sliding groove, the sliding groove is formed in the upper material plate, the side end of the soldering plate is movably connected with the upper material plate through the sliding groove, the pushing plate is arranged at the rear end of the soldering plate, the pushing plate is mounted at the front end of the pushing rotating rod, the gear below the pushing rotating rod is connected with the linked gear, and one end of the linked gear is connected with a servo motor.
Compared with the prior art, the invention has the beneficial effects that:
the invention relates to a full-automatic liquid level stabilizing soldering device and a use method thereof, a to-be-soldered board is arranged on a U-shaped frame by clamping a clamping board in a clamping groove of a connecting seat, a rotary cylinder in a soldering frame drives the U-shaped frame to rotate left and right to perform soldering on two side edges, the soldered board to be soldered can be taken out, the rotary cylinder and a main motor are controlled by a control box to replace manual work, the stability of the work is enhanced through mechanical operation, the labor and the time are saved, the danger of manual operation is avoided, the use safety is improved, a servo motor drives a linked gear to drive a pushing rotating rod to push forwards, a push plate pushes the to-be-soldered board to move to the clamping groove, a groove wall with a higher outer side is used for positioning, the to-be-soldered board is clamped above the clamping groove and is used for positioning through the groove wall, the efficiency of feeding is improved, the effective positioning is realized, and the overall practicability is improved, treat to set up the indent in the soldering plate, press the material piece attached in indent top, press and treat the soldering plate, will treat the cardboard of soldering plate bottom and fix in the stuck groove, accomplish the material loading, through automatic feeding, reduce the inconvenience of artifical material loading, raise the efficiency, reduce a large amount of time, improve production efficiency.
Drawings
FIG. 1 is an overall schematic view of the present invention;
FIG. 2 is a partial front elevational view of the present invention;
FIG. 3 is a schematic view of a soldering assembly of the present invention;
FIG. 4 is a schematic view of a rotation of a soldering assembly of the present invention;
FIG. 5 is a schematic view of soldering of a soldered assembly of the present invention;
FIG. 6 is a side, semi-sectional view of a portion of the present invention;
FIG. 7 is a schematic view of the pusher assembly of the present invention;
fig. 8 is a schematic structural view of the swaging assembly of the present invention.
Detailed Description
The technical scheme in the embodiment of the invention will be made clear below by combining the attached drawings in the embodiment of the invention; in the following description, it is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments described.
Referring to fig. 1-8, a full-automatic liquid-stabilizing soldering device and a method for using the same, includes a control box 1, a support plate frame 2 is installed on a side of the control box 1, a lifting component 3 is installed on the support plate frame 2, the lifting component 3 includes a main motor 31, a linkage rotating rod 32, a rear connecting plate 33 and guide posts 34, the main motor 31 is installed on the upper end of the support plate frame 2, the linkage rotating rod 32 is connected below the main motor 31, the rear connecting plate 33 is connected below the linkage rotating rod 32, the upper end of the guide posts 34 is installed below the support plate frame 2, a soldering rack 4 is installed on the guide posts 34, a soldering component 5 is installed on the lower end of the soldering rack 4, the upper end of the linkage rotating rod 32 penetrates through the support plate frame 2 and is connected with an output shaft of the main motor 31, the lower end of the linkage rotating rod 32 penetrates through the rear connecting plate 33 and is movably connected with threads of the rear connecting plate 33, two guide posts 34 are provided, one end is fixedly installed on the support plate frame 2, the other end of the tin soldering rack is fixed on the fixed bedplate 8, the two ends of the tin soldering rack 4 are movably arranged on the guide posts 34, the main motor 31 drives the linkage rotating rod 32 to rotate, and the tin soldering rack 4 is driven to move up and down on the guide posts 34, so that the U-shaped rack 51 is driven to move up and down and can move down to the tin soldering groove 6, the whole structure is stable, the stability in working is high, the sensitivity is greatly improved, and the working efficiency is increased; the material pressing assembly 74 comprises a telescopic rod 741, a telescopic cylinder 742 and a material pressing block 743, the telescopic cylinder 742 is arranged at the upper end of the soldering rack 4, one end of the telescopic cylinder 742 penetrates through the soldering rack 4 to be connected with the telescopic rod 741, the material pressing block 743 is installed at the bottom end of the telescopic rod 741, the material pressing assembly 74 corresponds to the position of the clamping groove 54, the telescopic cylinder 742 drives the telescopic rod 741 to move downwards to drive the material pressing block 743 to press downwards, the corner of the board 55 to be soldered, which needs soldering, extends towards two sides, a pressing groove is formed in the board 55 to be soldered, the material pressing block 743 is attached above the pressing groove, the board 55 to be soldered is pressed, the clamping plate at the bottom end of the board 55 to be soldered is fixed in the clamping groove 54, and the material loading is completed, through automatic material loading, the inconvenience of manual material loading is reduced, the efficiency is improved, a large amount of time is saved, and the production efficiency is improved; the use method is that the soldering board 55 to be soldered is arranged on the U-shaped frame 51 by clamping the soldering board in the clamping groove 54 of the connecting seat 53, the rotary cylinder in the soldering frame 4 drives the U-shaped frame 51 to rotate left and right to perform soldering on two side edges, the soldered board 55 to be soldered can be taken out, the rotary cylinder and the main motor 31 are controlled by the control box 1 to replace manual work, through mechanical operation, the stability of the work is enhanced, manpower and time are saved, the danger of manual operation is avoided, the use safety is improved, the servo motor drives the associated gear 731 to drive the pushing rotating rod 732 to push forwards, the pushing plate 733 pushes the soldering board 55 to be soldered to move to the clamping groove 54, the groove wall with higher outer side is positioned, the soldering board 55 to be soldered is clamped above the clamping groove 54 and is positioned through the groove wall, the efficiency of feeding is improved, the effective positioning is realized, the overall practicability is improved, a pressing groove is arranged in the soldering board 55, pressing block 743 is attached above the indent, presses and treats soldering board 55, will treat that the cardboard of soldering board 55 bottom is fixed in the card income groove 54, accomplishes the material loading, through automatic feeding, reduces the inconvenience of artifical material loading, raises the efficiency, subtracts and economizes a large amount of time, improves production efficiency.
Referring to fig. 3-5, the soldering assembly 5 includes a U-shaped frame 51, a connecting shaft 52, a connecting seat 53, a slot 54 and a board to be soldered 55, the connecting shaft 52 is installed outside two ends of the U-shaped frame 51, the connecting seat 53 is installed on two sides of the inner end of the U-shaped frame 51, the slot 54 is installed in the connecting seat 53, the slot wall of the outer end of the slot 54 is higher than the slot wall of the inner end, the board to be soldered 55 is installed in the slot 54, a soldering slot 6 is installed below the soldering assembly 5, a rotary cylinder is installed in the soldering frame 4, the soldering frame 4 is connected with the connecting shaft 52 on the side of the U-shaped frame 51 through the rotary cylinder, the U-shaped frame 51 is movably connected with the soldering frame 4 through the connecting shaft 52 and the rotary cylinder, the board is installed at the bottom end of the board to be soldered 55, the board to be soldered is installed on the U-shaped frame 51 by clamping the board in the slot 54 of the connecting seat 53, the rotary cylinder in the soldering frame 4 drives the U-shaped frame 51 to rotate left and right, soldering on two sides is carried out, a soldered plate 55 to be soldered can be taken out, the control box 1 controls the rotary cylinder and the main motor 31 to replace manual work, the stability of work is enhanced through mechanical operation, manpower and time are saved, danger caused by manual operation is avoided, and the use safety is improved.
Referring to fig. 6-7, a feeding device 7 is disposed at a side of the soldering assembly 5, the feeding device 7 includes a supporting plate 71, a feeding plate 72, a pushing assembly 73 and a pressing assembly 74, the upper end of the supporting plate 71 is connected to the feeding plate 72, one end of the feeding plate 72 is provided with the pushing assembly 73, the pressing assembly 74 is disposed in the soldering frame 4, a fixed platen 8 is connected to a lower portion of the feeding device 7, the other end of the fixed platen 8 is mounted on a sliding box 9, the pushing assembly 73 includes a coupling gear 731, a pushing rotating rod 732, a pushing plate 733 and a sliding slot 734, the sliding slot 734 is disposed in the feeding plate 72, a side end of the board 55 to be soldered is movably connected to the feeding plate 72 through the sliding slot 734, the pushing plate 733 is disposed at a rear end of the board 55 to be soldered, the pushing plate 733 is mounted at a front end of the pushing rotating rod 732, the gear 731 is connected to the coupling gear 731, one end of the coupling gear 731 is connected to a servo motor, a rotary cylinder in the soldering frame 4 drives the U-shaped frame 51 to turn, the stuck groove 54 upset to the top, U type frame 51 is parallel with last flitch 72, go up to discharge a plurality ofly on the flitch 72 and treat soldering board 55, servo motor drive allies oneself with the gear 731 and drives to promote to push away before the bull stick 732, push pedal 733 promotes to treat that soldering board 55 moves to the stuck groove 54 on, there is the higher cell wall in the outside to fix a position, the messenger treats soldering board 55 card in the top of stuck groove 54, fix a position through the cell wall, improve the efficiency of material loading, and effective positioning, improve whole practicality.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (6)
1. The full-automatic liquid level stabilizing soldering device is characterized by comprising a control box (1), wherein a supporting plate frame (2) is arranged on the side edge of the control box (1), and a lifting assembly (3) is arranged on the supporting plate frame (2);
the lifting assembly (3) comprises a main motor (31), a linkage rotating rod (32), a rear connecting plate (33) and guide posts (34), the main motor (31) is mounted at the upper end of the supporting plate frame (2), the linkage rotating rod (32) is connected below the main motor (31), the lower end of the linkage rotating rod (32) is connected with the rear connecting plate (33), the upper end of each guide post (34) is mounted below the supporting plate frame (2), a soldering rack (4) is mounted on each guide post (34), and a soldering assembly (5) is mounted at the lower end of each soldering rack (4);
the soldering component (5) comprises a U-shaped frame (51), a connecting shaft (52), connecting seats (53), clamping grooves (54) and plates to be soldered (55), the connecting shafts (52) are mounted on the outer sides of the two ends of the U-shaped frame (51), the connecting seats (53) are mounted on the two sides of the inner end of the U-shaped frame (51), the clamping grooves (54) are formed in the connecting seats (53), the groove wall of the outer end of each clamping groove (54) is higher than the groove wall of the inner end of each clamping groove, the plates to be soldered (55) are mounted in the clamping grooves (54), the soldering grooves (6) are formed below the soldering component (5), and a feeding device (7) is arranged on the side edge of the soldering component (5);
the feeding device (7) comprises a supporting plate (71), a feeding plate (72), a pushing assembly (73) and a pressing assembly (74), the upper end of the supporting plate (71) is connected with the feeding plate (72), the pushing assembly (73) is installed at one end of the feeding plate (72), the pressing assembly (74) is arranged in the tin soldering rack (4), a fixed bedplate (8) is connected to the lower portion of the feeding device (7), and the other end of the fixed bedplate (8) is installed on the sliding box (9);
the material pressing assembly (74) comprises a telescopic rod (741), a telescopic cylinder (742) and a material pressing block (743), the telescopic cylinder (742) is arranged at the upper end of the soldering rack (4), one end of the telescopic cylinder (742) penetrates through the soldering rack (4) to be connected with the telescopic rod (741), the material pressing block (743) is installed at the bottom end of the telescopic rod (741), and the material pressing assembly (74) corresponds to the clamping groove (54);
the using method comprises the following steps:
the method comprises the following steps: the bottom end of a board to be soldered (55) is provided with a clamping board, the board to be soldered (55) is clamped in a clamping groove (54) of a connecting seat (53) and then is arranged on a U-shaped frame (51), a main motor (31) drives a linkage rotating rod (32) to rotate, a soldering rack (4) is driven to move up and down on a guide post (34), the U-shaped frame (51) is driven to move up and down and can move down to a soldering groove (6), and a rotary cylinder in the soldering rack (4) drives the U-shaped frame (51) to rotate left and right to perform soldering on two sides;
step two: after the soldered plates (55) to be soldered are taken out, a rotary cylinder in a soldering rack (4) drives a U-shaped frame (51) to turn over, a clamping groove (54) turns over to the upper side, the U-shaped frame (51) is parallel to a feeding plate (72), a plurality of plates (55) to be soldered are discharged on the feeding plate (72), a servo motor drives a coupling gear (731) to drive a pushing rotating rod (732) to push forwards, a push plate (733) pushes the plates (55) to be soldered to move to the clamping groove (54), and a groove wall with a higher outer side is positioned, so that the plates (55) to be soldered are clamped above the clamping groove (54);
step three: the telescopic cylinder (742) drives the telescopic rod (741) to move downwards to drive the material pressing block (743) to press downwards, the corner of the tin soldering board (55) needing tin soldering extends towards two sides, a pressing groove is formed in the tin soldering board (55), the material pressing block (743) is attached to the upper portion of the pressing groove, the tin soldering board (55) is pressed, and the clamping board at the bottom end of the tin soldering board (55) is fixed in the clamping groove (54) to finish feeding.
2. A fully automatic liquid level stabilizing soldering device as claimed in claim 1, wherein one end of the support plate frame (2) is mounted on the side of the control box (1), and the other end is mounted on the side of the sliding box (9).
3. The full-automatic liquid level stabilizing soldering device according to claim 1, wherein the upper end of the linkage rotating rod (32) penetrates through the support plate frame (2) to be connected with the output shaft of the main motor (31), and the lower end of the linkage rotating rod (32) penetrates through the rear connecting plate (33) and is in threaded movable connection with the rear connecting plate (33).
4. The full-automatic liquid level stabilizing soldering device as claimed in claim 1, wherein two guide posts (34) are provided, one end of each guide post is fixedly arranged on the support plate frame (2), the other end of each guide post is fixed on the fixed bedplate (8), and the two ends of the soldering machine frame (4) are movably arranged on the guide posts (34).
5. The full-automatic liquid level stabilizing soldering device according to claim 1, wherein a rotary cylinder is arranged in the soldering rack (4), the soldering rack (4) is connected with a connecting shaft (52) at the side of the U-shaped frame (51) through the rotary cylinder, and the U-shaped frame (51) is movably connected with the soldering rack (4) through the connecting shaft (52) and the rotary cylinder.
6. The full-automatic liquid level stabilizing soldering device according to claim 1, wherein the material pushing assembly (73) comprises a linked gear (731), a pushing rotating rod (732), a pushing plate (733) and a sliding groove (734), the sliding groove (734) is arranged in the feeding plate (72), the side end of the plate to be soldered (55) is movably connected with the feeding plate (72) through the sliding groove (734), the pushing plate (733) is arranged at the rear end of the plate to be soldered (55), the pushing plate (733) is arranged at the front end of the pushing rotating rod (732), the gear below the pushing rotating rod (732) is connected with the linked gear (731), and one end of the linked gear (731) is connected with a servo motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911036815.4A CN110788433B (en) | 2019-10-29 | 2019-10-29 | Full-automatic liquid level stabilizing soldering device and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911036815.4A CN110788433B (en) | 2019-10-29 | 2019-10-29 | Full-automatic liquid level stabilizing soldering device and using method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN110788433A CN110788433A (en) | 2020-02-14 |
| CN110788433B true CN110788433B (en) | 2022-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911036815.4A Active CN110788433B (en) | 2019-10-29 | 2019-10-29 | Full-automatic liquid level stabilizing soldering device and using method thereof |
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| Country | Link |
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| CN (1) | CN110788433B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1706791A1 (en) * | 1990-04-11 | 1992-01-23 | Ленинградское научно-производственное объединение "Авангард" | Soldering device |
| CN2756375Y (en) * | 2004-12-14 | 2006-02-08 | 盐城市电子设备厂 | Material loading device for tin skicky machine |
| CN205817149U (en) * | 2016-06-15 | 2016-12-21 | 重庆文客巴科技有限公司 | A kind of electronic product production welding bench |
| CN207766686U (en) * | 2018-02-05 | 2018-08-24 | 昆山英业特电子科技有限公司 | A kind of material-receiving device for SMT |
| CN208644322U (en) * | 2018-07-24 | 2019-03-26 | 深圳市声顿科技有限公司 | A kind of data line tin soldering machine |
| CN208781692U (en) * | 2018-08-24 | 2019-04-23 | 长阳安品源电子科技有限公司 | Electronic component automates tin soldering equipment |
| CN209390468U (en) * | 2018-10-16 | 2019-09-13 | 上海节卡机器人科技有限公司 | Lithium battery robot PCB circuit board welds feed bin |
| CN211052777U (en) * | 2019-10-29 | 2020-07-21 | 资兴市慧华电子有限公司 | Full-automatic liquid level stabilizing soldering device |
-
2019
- 2019-10-29 CN CN201911036815.4A patent/CN110788433B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1706791A1 (en) * | 1990-04-11 | 1992-01-23 | Ленинградское научно-производственное объединение "Авангард" | Soldering device |
| CN2756375Y (en) * | 2004-12-14 | 2006-02-08 | 盐城市电子设备厂 | Material loading device for tin skicky machine |
| CN205817149U (en) * | 2016-06-15 | 2016-12-21 | 重庆文客巴科技有限公司 | A kind of electronic product production welding bench |
| CN207766686U (en) * | 2018-02-05 | 2018-08-24 | 昆山英业特电子科技有限公司 | A kind of material-receiving device for SMT |
| CN208644322U (en) * | 2018-07-24 | 2019-03-26 | 深圳市声顿科技有限公司 | A kind of data line tin soldering machine |
| CN208781692U (en) * | 2018-08-24 | 2019-04-23 | 长阳安品源电子科技有限公司 | Electronic component automates tin soldering equipment |
| CN209390468U (en) * | 2018-10-16 | 2019-09-13 | 上海节卡机器人科技有限公司 | Lithium battery robot PCB circuit board welds feed bin |
| CN211052777U (en) * | 2019-10-29 | 2020-07-21 | 资兴市慧华电子有限公司 | Full-automatic liquid level stabilizing soldering device |
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| Publication number | Publication date |
|---|---|
| CN110788433A (en) | 2020-02-14 |
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