CN110744164B - Reflow soldering device with good heating effect - Google Patents
Reflow soldering device with good heating effect Download PDFInfo
- Publication number
- CN110744164B CN110744164B CN201910954444.1A CN201910954444A CN110744164B CN 110744164 B CN110744164 B CN 110744164B CN 201910954444 A CN201910954444 A CN 201910954444A CN 110744164 B CN110744164 B CN 110744164B
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- cover
- heat
- drainage
- reflow soldering
- bottom end
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 32
- 238000005476 soldering Methods 0.000 title claims abstract description 24
- 230000000694 effects Effects 0.000 title claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 43
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- 238000000605 extraction Methods 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 12
- 238000005057 refrigeration Methods 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 claims description 2
- 230000007723 transport mechanism Effects 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 8
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 3
- 235000017491 Bambusa tulda Nutrition 0.000 description 3
- 241001330002 Bambuseae Species 0.000 description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 3
- 239000011425 bamboo Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000001914 filtration Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/24—Particle separators, e.g. dust precipitators, using rigid hollow filter bodies
- B01D46/2403—Particle separators, e.g. dust precipitators, using rigid hollow filter bodies characterised by the physical shape or structure of the filtering element
- B01D46/2411—Filter cartridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
- B65G15/30—Belts or like endless load-carriers
- B65G15/48—Belts or like endless load-carriers metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G23/00—Driving gear for endless conveyors; Belt- or chain-tensioning arrangements
- B65G23/02—Belt- or chain-engaging elements
- B65G23/04—Drums, rollers, or wheels
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of reflow soldering, in particular to a reflow soldering device with a good heating effect. The PCB board processing device has the advantages that the conveying mechanism is arranged, so that the PCB board to be processed can be moved and transported, meanwhile, the lifting mechanism is arranged, so that the conveying mechanism can be supported, and the stability of the PCB board in the moving and transporting process is effectively improved; preheating mechanism through setting up to can collect the heat that heating mechanism got rid of, reach energy-conserving effect with this, can filter and purify the produced harmful gas in the heating mechanism operation process simultaneously.
Description
Technical Field
The invention relates to the field of reflow soldering, in particular to a reflow soldering device with a good heating effect.
Background
Reflow soldering is one of three main processes in the SMT mounting process. Reflow soldering is mainly used for soldering a circuit board with mounted components, the solder paste is melted by heating to fuse and solder the surface mounted components and the circuit board bonding pads, and then the solder paste is cooled by the cooling of the reflow soldering to solidify the components and the bonding pads together. However, the conventional reflow soldering device wastes more heat energy in the operation process, and meanwhile, gas generated by a factory pollutes the air environment, so that the reflow soldering device with a good heating effect is provided.
Disclosure of Invention
The invention aims to solve the defects that more heat energy is wasted and gas generated by a factory pollutes the air environment in the prior art, and provides a reflow soldering device with a good heating effect.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows: a reflow soldering device with good heating effect comprises two symmetrical sealed shells, wherein two adjacent sides of the shells are fixedly connected through a connecting plate, a conveying mechanism is arranged between the two connecting plates and comprises mounting plates respectively connected to the end parts of the connecting plates, two adjacent ends of the two mounting plates are respectively rotatably provided with a driving roller shaft and a driven roller shaft, one end of the driving roller shaft penetrates through the adjacent mounting plates and is connected with a motor in an end part, the driving roller shaft and the driven roller shaft are connected through a conveying belt, the conveying belt is arranged in a net shape and is made of high-temperature-resistant metal materials, a lifting mechanism is arranged between the driving roller shaft and the driven roller shaft and comprises a lifting frame horizontally arranged on the inner side of the conveying belt, and a plurality of lifting rollers are rotatably arranged in the lifting frame at equal intervals, the top and the transmission band contact of lifting the roller bearing, just all be connected through buffer gear between lifting frame four corners and the adjacent connecting plate the inside bottom that the clamshell is close to one side each other all has set gradually preheating mechanism, heating mechanism and cooling body from a left side to the right side symmetry.
Preferably, the buffer mechanism comprises a sliding sleeve fixedly installed at the outer peripheral angle of the lifting frame, an I-shaped rod is fixedly installed on a connecting plate at a position corresponding to the sliding sleeve, the sliding sleeve is slidably installed at the outer side of the I-shaped rod, and a support spring is sleeved on the I-shaped rod below the sliding sleeve.
Preferably, preheat the mechanism and include first drainage cover and the heat extraction cover of respectively fixed mounting in the inside bottom of clamshell, first drainage cover is located the intermediate position of clamshell, just drainage hole has been seted up to the clamshell bottom that first drainage cover corresponds the position, a plurality of mounting holes have been seted up to the clamshell bottom equidistance that the heat extraction cover corresponds the position, drainage fan is all installed to the inside of mounting hole first drainage cover top intercommunication has a section of thick bamboo, it has two drainage tubes to strain intercommunication between a section of thick bamboo and the heat extraction cover.
Preferably, heating mechanism includes the thermal-arrest box of fixed mounting in the inside bottom of clamshell, the thermal-arrest box is located between first drainage cover and the heat extraction cover, just the top fixed mounting of thermal-arrest box has the nitrogen gas heater, the gas injection pipe of nitrogen gas heater extends to the clamshell outside, the gas-supply pipe and the thermal-arrest box intercommunication of nitrogen gas heater the internal bottom of clamshell that the thermal-arrest box corresponds the position has evenly seted up a plurality of heat extraction holes.
Preferably, the cooling mechanism comprises a refrigeration device and a second drainage cover which are respectively and fixedly installed at the bottom end inside the shell cover, an air inlet pipe of the refrigeration device extends to the outside of the shell cover, an exhaust pipe of the refrigeration device is connected with the second drainage cover, and a cooling hole is formed in the bottom end inside the shell cover corresponding to the second drainage cover.
Preferably, a plurality of heat-conducting plates are arranged in the heat collecting box at equal intervals, and the heat-conducting plates and the heat collecting box are of an integrally formed structure.
Compared with the prior art, the invention has the following beneficial effects:
1. the PCB board processing device has the advantages that the conveying mechanism is arranged, so that the PCB board to be processed can be moved and transported, meanwhile, the lifting mechanism is arranged, so that the conveying mechanism can be supported, and the stability of the PCB board in the moving and transporting process is effectively improved;
2. preheating mechanism through setting up to can collect the heat that heating mechanism got rid of, reach energy-conserving effect with this, can filter and purify the produced harmful gas in the heating mechanism operation process simultaneously.
Drawings
FIG. 1 is a schematic structural view of a reflow soldering apparatus with good heating effect according to the present invention;
FIG. 2 is a schematic view of the internal structure of the case of the reflow soldering apparatus with good heating effect according to the present invention;
FIG. 3 is a schematic structural view of a lifting mechanism of a reflow soldering apparatus with good heating effect according to the present invention;
FIG. 4 is a schematic view of a bottom structure of a case of a reflow soldering apparatus with a good heating effect according to the present invention;
FIG. 5 is a schematic view of the internal structure of a heat collecting box of a reflow soldering apparatus with good heating effect according to the present invention;
fig. 6 is a schematic structural diagram of a buffering mechanism of a reflow soldering apparatus with a good heating effect according to the present invention.
In the figure: the device comprises a shell cover 1, a mounting plate 2, a connecting plate 3, a driving roll shaft 4, a transmission belt 5, a motor 6, an air inlet pipe 7, an air injection pipe 8, an I-shaped rod 9, a sliding sleeve 10, a supporting spring 11, a lifting frame 12, a lifting roll shaft 13, a driven roll shaft 14, a first flow guide cover 15, a heat exhaust cover 16, a flow guide pipe 17, a heat collection box 18, a nitrogen heater 19, refrigeration equipment 20, an exhaust pipe 21, a second flow guide cover 22, a heat conduction plate 23, a mounting hole 24, a flow guide fan 25, a flow guide hole 26, a cooling hole 27 and a filter cylinder 28.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
As shown in fig. 1-6, a reflow soldering apparatus with good heating effect comprises two symmetrical sealed housings 1, adjacent sides of the two housings 1 are fixedly connected through connecting plates 3, a conveying mechanism is arranged between the two connecting plates 3 and comprises mounting plates 2 respectively connected to the ends of the connecting plates 3, a driving roller shaft 4 and a driven roller shaft 14 are respectively rotatably mounted between the two mounting plates 2 at the adjacent ends, one end of the driving roller shaft 4 penetrates through the adjacent mounting plates 2 and is connected with a motor 6 at the end part, the driving roller shaft 4 is connected with the driven roller shaft 14 through a conveying belt 5, the conveying belt 5 is arranged in a net shape and is made of high-temperature-resistant metal materials, and a lifting mechanism is arranged between the driving roller shaft 4 and the driven roller shaft 14; the motor 6 is connected with an external power supply, so that the driving roller shaft 4 and the driven roller shaft 14 can drive the transmission belt 5 to rotate, thereby moving and transporting the PCB to be processed.
The lifting mechanism comprises a lifting frame 12 horizontally arranged on the inner side of the conveying belt 5, a plurality of lifting rollers 13 are rotatably arranged in the lifting frame 12 at equal intervals, the tops of the lifting rollers 13 are in contact with the conveying belt 5, four corners of the lifting frame 12 are connected with adjacent connecting plates 3 through buffer mechanisms, each buffer mechanism comprises a sliding sleeve 10 fixedly arranged on the peripheral corner of the outer side of the lifting frame 12, a I-shaped rod 9 is fixedly arranged on the corresponding connecting plate 3 of the sliding sleeve 10, the sliding sleeve 10 is slidably arranged on the outer side of the I-shaped rod 9, a supporting spring 11 is sleeved on the I-shaped rod 9 below the sliding sleeve 10, and a preheating mechanism, a heating mechanism and a cooling mechanism are symmetrically and sequentially arranged at the inner bottom end, close to one side of the shell cover 1, from left to right; through setting up sliding sleeve 10, I-shaped pole 9 and supporting spring 11 to can carry out zonulae occludens with lifting frame 12 and connecting plate 3, simultaneously through setting up supporting spring 11, thereby can cause lifting frame 12 to have certain cushioning nature, through setting up a plurality of lifting rollers 13, thereby can support conveying belt 5, effectively increase the stability of PCB board in the removal transportation.
The heating mechanism comprises a heat collecting box 18 fixedly arranged at the bottom end inside the shell cover 1, the heat collecting box 18 is positioned between the first flow guide cover 15 and the heat exhaust cover 16, a nitrogen heater 19 is fixedly arranged at the top end of the heat collecting box 18, an air injection pipe 8 of the nitrogen heater 19 extends to the outside of the shell cover 1, an air delivery pipe of the nitrogen heater 19 is communicated with the heat collecting box 18, a plurality of heat exhaust holes are uniformly formed in the bottom end inside the shell cover 1 at the position corresponding to the heat collecting box 18, a plurality of heat conducting plates 23 are equidistantly arranged inside the heat collecting box 18, and the heat conducting plates 23 and the heat collecting box 18 are of an integrally formed structure; through nitrogen heater 19 to can carry out rapid heating to nitrogen gas, can collect the gas of high temperature through heat collection box 18, can spout through the hole of clearing heat and carry out the heating work to the PCB board, through setting up heat-conducting plate 23, thereby can play good heat storage effect, reduce thermal loss.
The preheating mechanism comprises a first drainage cover 15 and a heat extraction cover 16 which are fixedly installed at the bottom end inside the shell cover 1 respectively, the first drainage cover 15 is located in the middle of the shell cover 1, a drainage hole 26 is formed in the bottom end of the shell cover 1 at the position corresponding to the first drainage cover 15, a plurality of mounting holes 24 are formed in the bottom end of the shell cover 1 at the position corresponding to the heat extraction cover 16 at equal intervals, drainage fans 25 are installed inside the mounting holes 24, a filter cylinder 28 is communicated with the top of the first drainage cover 15, and two drainage tubes 17 are communicated between the filter cylinder 28 and the heat extraction cover 16; through 25 circular telegrams with drainage fan to first drainage cover 15 can collect the heat that heating mechanism got rid of, strains a section of thick bamboo 28 through setting up, thereby can carry out filtration purification with produced harmful gas among the heating operation process, and the steam that finishes of filtering passes through drainage tube 17 and inputs to heat extraction cover 16 inside, and the temperature greatly reduced of steam this moment can preheat the work to the PCB board that needs processing through 24 discharges of mounting hole, avoids appearing the high temperature damage phenomenon.
The cooling mechanism comprises a refrigeration device 20 and a second flow guide cover 22 which are fixedly installed at the bottom end inside the shell cover 1 respectively, an air inlet pipe 7 of the refrigeration device 20 extends to the outside of the shell cover 1, an air outlet pipe 21 of the refrigeration device 20 is connected with the second flow guide cover 22, and a cooling hole 27 is formed in the bottom end inside the shell cover 1 at the position corresponding to the second flow guide cover 22; through being connected refrigeration plant 20 with external power source to can cool off the air that intake pipe 7 let in, through inside blast pipe 21 inputs to second drainage cover 22, spout through cooling hole 27 again, it can to cool off fast to the PCB product that the operation finishes.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. The utility model provides a reflow soldering device that heating effect is good, includes two sealed clamshell (1) of mutual symmetry, two all through connecting plate (3) fixed connection between adjacent side of clamshell (1), its characterized in that, two be equipped with transport mechanism between connecting plate (3), transport mechanism includes mounting panel (2) of connecting respectively at connecting plate (3) tip, two of adjacent one end rotate respectively between mounting panel (2) and install drive roller (4) and driven roller (14), the one end of drive roller (4) runs through adjacent mounting panel (2) and end connection has motor (6), connect through transmission band (5) between drive roller (4) and the driven roller (14), transmission band (5) are netted setting and are high temperature resistant metal material and make be equipped with the lift mechanism between drive roller (4) and the driven roller (14), the lifting mechanism comprises a lifting frame (12) horizontally arranged on the inner side of a transmission belt (5), a plurality of lifting rollers (13) are installed in the lifting frame (12) in a rotating mode at equal intervals in the interior, the tops of the lifting rollers (13) are in contact with the transmission belt (5), the four corners of the lifting frame (12) and the adjacent connecting plates (3) are connected through a buffer mechanism, a preheating mechanism, a heating mechanism and a cooling mechanism are symmetrically and sequentially arranged at the bottom end, close to one side, of the shell cover (1) from left to right, the preheating mechanism comprises a first drainage cover (15) and a heat exhaust cover (16) which are fixedly arranged at the bottom end of the shell cover (1) respectively, the first drainage cover (15) is located at the middle position of the shell cover (1), and drainage holes (26) are formed in the bottom end, corresponding to the first drainage cover (15), of the shell cover (1), the heat extraction cover (16) is provided with a plurality of mounting holes (24) at equal intervals at the bottom end of the shell cover (1) corresponding to the position, the inside of each mounting hole (24) is provided with a drainage fan (25), the top of the first drainage cover (15) is communicated with a filter cylinder (28), the filter cylinders (28) and the heat extraction cover (16) are communicated with two drainage tubes (17), the heating mechanism comprises a heat collection box (18) fixedly mounted at the bottom end inside the shell cover (1), the heat collection box (18) is positioned between the first drainage cover (15) and the heat extraction cover (16), the top end of the heat collection box (18) is fixedly provided with a nitrogen heater (19), a gas injection pipe (8) of the nitrogen heater (19) extends to the outside of the shell cover (1), a gas pipe of the nitrogen heater (19) is communicated with the heat collection box (18), and a plurality of heat extraction holes are uniformly formed at the bottom end inside the shell cover (1) corresponding to the position of the heat collection box (18), cooling body is including refrigeration plant (20) and second drainage cover (22) of difference fixed mounting in the inside bottom of clamshell (1), the intake pipe (7) of refrigeration plant (20) extend to clamshell (1) outside, blast pipe (21) of refrigeration plant (20) are connected with second drainage cover (22), just cooling hole (27) have been seted up to clamshell (1) inside bottom that second drainage cover (22) correspond the position.
2. The reflow soldering device with the good heating effect as claimed in claim 1, wherein the buffering mechanism comprises a sliding sleeve (10) fixedly mounted at the outer peripheral angle of the lifting frame (12), a I-shaped rod (9) is fixedly mounted on the connecting plate (3) at the position corresponding to the sliding sleeve (10), the sliding sleeve (10) is slidably mounted at the outer side of the I-shaped rod (9), and a supporting spring (11) is sleeved on the I-shaped rod (9) below the sliding sleeve (10).
3. A reflow soldering apparatus with good heating effect according to claim 1, wherein a plurality of heat conducting plates (23) are installed in the heat collecting box (18) at equal intervals, and the heat conducting plates (23) and the heat collecting box (18) are of an integrated structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910954444.1A CN110744164B (en) | 2019-10-09 | 2019-10-09 | Reflow soldering device with good heating effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910954444.1A CN110744164B (en) | 2019-10-09 | 2019-10-09 | Reflow soldering device with good heating effect |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110744164A CN110744164A (en) | 2020-02-04 |
| CN110744164B true CN110744164B (en) | 2021-12-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910954444.1A Active CN110744164B (en) | 2019-10-09 | 2019-10-09 | Reflow soldering device with good heating effect |
Country Status (1)
| Country | Link |
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| CN (1) | CN110744164B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116916642B (en) * | 2023-08-02 | 2024-02-09 | 上海璞丰光电科技有限公司 | SMT welding equipment |
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|---|---|---|---|---|
| JP2003332725A (en) * | 2002-05-14 | 2003-11-21 | Matsushita Electric Ind Co Ltd | Reflow heating method and device |
| JP2005144558A (en) * | 2004-11-25 | 2005-06-09 | Shiiba:Kk | Reflow furnace |
| CN103157873A (en) * | 2011-12-16 | 2013-06-19 | 西安中科麦特电子技术设备有限公司 | Reflow soldering machine |
| CN106304682A (en) * | 2016-08-16 | 2017-01-04 | 成都俱进科技有限公司 | Counter-current welding equipment for SMT production technology |
| CN107743344A (en) * | 2017-11-20 | 2018-02-27 | 成都俱进科技有限公司 | A kind of gas phase reflow soldering system on conveyer belt |
| CN207629346U (en) * | 2017-12-18 | 2018-07-20 | 杭州韶晖电子科技有限公司 | A kind of reflow soldering apparatus that heating effect is good |
| CN108633188A (en) * | 2017-03-18 | 2018-10-09 | 韦煜辉 | A kind of safety-type reflow machine |
| CN108861320A (en) * | 2018-07-26 | 2018-11-23 | 朱宏洁 | Feed device is used in a kind of cutting of stainless steel plate |
| CN209424707U (en) * | 2018-12-22 | 2019-09-24 | 广州市鸿河光电子有限公司 | A kind of reflow soldering apparatus that heating effect is good |
-
2019
- 2019-10-09 CN CN201910954444.1A patent/CN110744164B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003332725A (en) * | 2002-05-14 | 2003-11-21 | Matsushita Electric Ind Co Ltd | Reflow heating method and device |
| JP2005144558A (en) * | 2004-11-25 | 2005-06-09 | Shiiba:Kk | Reflow furnace |
| CN103157873A (en) * | 2011-12-16 | 2013-06-19 | 西安中科麦特电子技术设备有限公司 | Reflow soldering machine |
| CN106304682A (en) * | 2016-08-16 | 2017-01-04 | 成都俱进科技有限公司 | Counter-current welding equipment for SMT production technology |
| CN108633188A (en) * | 2017-03-18 | 2018-10-09 | 韦煜辉 | A kind of safety-type reflow machine |
| CN107743344A (en) * | 2017-11-20 | 2018-02-27 | 成都俱进科技有限公司 | A kind of gas phase reflow soldering system on conveyer belt |
| CN207629346U (en) * | 2017-12-18 | 2018-07-20 | 杭州韶晖电子科技有限公司 | A kind of reflow soldering apparatus that heating effect is good |
| CN108861320A (en) * | 2018-07-26 | 2018-11-23 | 朱宏洁 | Feed device is used in a kind of cutting of stainless steel plate |
| CN209424707U (en) * | 2018-12-22 | 2019-09-24 | 广州市鸿河光电子有限公司 | A kind of reflow soldering apparatus that heating effect is good |
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| CN110744164A (en) | 2020-02-04 |
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