CN110738968A - Chip on film and display device - Google Patents
Chip on film and display device Download PDFInfo
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- CN110738968A CN110738968A CN201911200696.1A CN201911200696A CN110738968A CN 110738968 A CN110738968 A CN 110738968A CN 201911200696 A CN201911200696 A CN 201911200696A CN 110738968 A CN110738968 A CN 110738968A
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- source driver
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- 239000000758 substrate Substances 0.000 claims abstract description 50
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 4
- 239000013310 covalent-organic framework Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3275—Details of drivers for data electrodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
Abstract
The invention provides a chip on film and a display device, the chip on film comprises a film substrate, a source driver arranged on the film substrate and provided with a side and a second side which are arranged oppositely in the direction, and a light-emitting voltage transmission circuit arranged on the film substrate and positioned on the side of the film substrate together with the source driver, wherein the light-emitting voltage transmission circuit comprises an anode voltage input circuit, the anode voltage input circuit comprises at least input lines and a plurality of second input lines, the input line is positioned on the side of the source driver, the second input lines are positioned on the second side of the source driver, and each input line is electrically connected with the plurality of second input lines.
Description
Technical Field
The invention relates to the technical field of display, in particular to a chip on film and a display device.
Background
The OLED display device is widely accepted by due to its excellent functions of color gamut, viewing angle, thinning, lightening, low power consumption, high contrast, and being bendable, and is gradually becoming the development direction of future display technologies in the related art, a PCB (printed circuit board) and a display Panel (Panel) are usually connected by a COF (chip on film), however, during the actual use process, the COF is prone to generate heat, and the COF is prone to be burned out at the edge of the film substrate of the display Panel or at the edge of the PCB (printed circuit board).
Thus, the related art of the current OLED display device still needs to be improved.
Disclosure of Invention
The present invention is directed to that solves the technical problems of the related art at least at fixed degree, and of the present invention is directed to provide flip chip films that effectively avoid the problem of thermal burning.
According to embodiments of the invention, the flip chip comprises a film substrate, a source driver disposed on the film substrate and having a th side and a second side opposite to each other in a th direction, a light emitting voltage transmitting circuit disposed on the film substrate and located on the same side of the film substrate as the source driver, and an anode voltage input circuit including at least input lines and a plurality of second input lines, wherein the input line is located on a th side of the source driver, the second input line is located on the second side of the source driver, and each of the input lines is electrically connected to the plurality of second input lines.
According to the embodiment of the invention, a plurality of the second input lines are uniformly distributed in the second direction, and the second direction is perpendicular to the th direction.
According to the embodiment of the invention, the th input line and the second input line are arranged on the surface of the film substrate, the light emitting voltage transmission circuit further comprises a th connection line which is arranged between the th input line and the second input line and is electrically connected with the th input line and the second input line, and the th connection line is arranged inside the source driver.
According to the embodiment of the invention, the light emitting voltage transmission circuit further comprises a th input connection terminal, wherein the th input connection terminal is arranged between the th input line and the th connection line, is positioned between the source driver and the film substrate and is electrically connected with the th input line and the th connection line, and a second input connection terminal is arranged between the second input line and the th connection line, is positioned between the source driver and the film substrate and is electrically connected with the second input line and the th connection line.
According to an embodiment of the present invention, the light emitting voltage transmitting circuit is disposed on a surface of the film substrate, and further includes a second connection line between the th input line and the second input line and electrically connected to the th input line and the second input line, the second connection line being disposed between the film substrate and the source driver.
According to an embodiment of the present invention, the second connection line is integrally formed with the th input line and the second input line .
According to an embodiment of the present invention, the light emission voltage transmitting circuit further includes: and the cathode voltage output circuit is arranged on the film base material and is positioned at two opposite sides of the source electrode driver in the second direction.
According to an embodiment of the present invention, the chip on film further includes a plurality of data signal lines disposed on the film substrate, electrically connected to the source driver, disposed on the second side of the source driver, and alternately disposed with the plurality of second input lines.
According to another aspect of the invention, the invention provides display devices, which comprise a display panel, at least of the above-mentioned flip-chip films, wherein the second input line of the flip-chip films is electrically connected with the display panel, and a printed circuit board electrically connected with the th input line of the flip-chip films, wherein the light-emitting voltage passing through the flip-chip films in the display panel can be uniformly transmitted, thereby greatly reducing the phenomenon of heating and burning caused by current concentration.
Drawings
Fig. 1 is a schematic plan view of flip-chip films according to an embodiment of the invention.
Fig. 2 is a schematic plan view of another embodiments of the chip on film according to the invention.
Fig. 3 is a schematic plan view of another embodiments of the chip on film according to the invention.
Fig. 4 is a schematic sectional view taken along line a-a of fig. 1.
Fig. 5 is a schematic cross-sectional view of embodiments of the flip-chip film of the invention.
Fig. 6 is a schematic plan view of another embodiments of the chip on film according to the invention.
Fig. 7 is a schematic sectional view taken along line B-B in fig. 6.
Fig. 8 is a schematic cross-sectional view of another exemplary embodiments of the flip-chip film according to the invention.
Fig. 9 is a schematic plan view of another embodiments of the chip on film according to the invention.
Fig. 10 is a schematic plan view of exemplary display devices according to the present invention.
Detailed Description
The following describes embodiments of the present invention in detail. The following examples are illustrative only and are not to be construed as limiting the invention. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
The present invention has been completed based on the following findings and recognition by the inventors:
the inventor has found that COFs generate heat easily due to the fact that COFs need to transmit a light emitting voltage while transmitting data signals, and particularly, in a display device, an anode voltage (ELVDD) of the light emitting voltage is transmitted from an anode voltage input circuit to the inside of a display Panel (Panel) through a printed circuit board, and a cathode voltage (ELVSS) of the light emitting voltage is transmitted from a cathode voltage output circuit to a PCB through the inside of the Panel to form a current loop, sets ELVDD voltage and ELVSS voltage transmission lines at both side edges of a film substrate, and sets a source driver in the middle of the film substrate, and easily causes current concentration due to the simultaneous transmission of the ELVDD voltage and the ELVSS voltage at the edge of the COF, and the COFs have resistance values at the edge of the display Panel substrate, thereby easily generating heat, and easily generating heat at the edge of the display Panel substrate or the edge of the PCB.
In view of the above, in aspects of the present invention, the present invention provides flip chip films, according to an embodiment of the present invention, referring to fig. 1, the flip chip film 100 includes a film substrate 10, a source driver 20, the source driver 10 is disposed on the film substrate 10 and has a side and a second side disposed opposite to each other in a 0 direction, a light emitting voltage transmitting circuit 30, the light emitting voltage transmitting circuit 30 is disposed on the film substrate 10 and is located on the same side of the film substrate 10 as the source driver 20, the light emitting voltage transmitting circuit includes an anode voltage input circuit 32, the anode voltage input circuit 32 includes at least input lines 321 and a plurality of second input lines 322, the input line 321 is located on a side of the source driver 20, the second input line 322 is located on the second side of the source driver 20, and each of the input lines 321 is electrically connected to the plurality of second input lines 322, thereby, the current input lines of are distributed to the plurality of second input lines, thereby achieving a better light emitting effect of the flip chip film by the distributed current input lines, and further improving the flip chip film display quality of the flip chip film, thereby effectively preventing the flip chip from the flip chip film from being burned, and further improving the flip chip package.
According to an embodiment of the present invention, in order to further step disperse the current in the anode voltage input circuit, the plurality of second input lines 322 are uniformly distributed in the second direction, and the second direction is perpendicular to the direction, in particular, embodiments, referring to fig. 2, the uniform distribution of the plurality of second input lines 322 in the second direction may mean that the distances d1 between any two adjacent second input lines 322 are equal, and in other embodiments, the uniform distribution of the plurality of second input lines 322 in the second direction may mean that the distances d1 between any two adjacent second input lines 322 are equal, and the distance d1 is determined according to the length L of the source driver in the second direction, so that the length L is fully utilized by the plurality of second input lines 322, the distance d1 is increased as much as possible, the current dispersion effect is better, and the thermal destruction may be lower as possible.
In concrete examples, referring to fig. 3, the second side of the source driver 20 is provided with N second input lines 322, the two outermost second input lines 322 are respectively aligned with edges of the source driver 20 on both sides in the th direction, and a distance d1 between any two adjacent second input lines 322 is L/(N-1). in another concrete examples, referring to fig. 1, the second side of the source driver 20 is provided with N second input lines 322, the edge of the source driver 20 on both sides in the th direction and the second input line 322 adjacent thereto respectively have a th distance L1 and a second distance L2, and a distance d1 between any two adjacent second input lines 322 is (L-L7378-L2)/(N-1), wherein the th distances L1 and L2 may be set according to actual needs, such as may be set according to errors of a manufacturing process, as long as a process error requirement is met, may also be set according to other use requirements, including but not limited to 2 + L2, and others, such as a component used in cooperation with another 584624 and others.
According to the embodiment of the invention, the light-emitting voltage needs to be transmitted through the th input line and the second input line, and th input lines need to be transmitted to a plurality of second input lines in the transmission process, at this time, a connection line can be arranged between the th input line and the second input line to better realize the conversion from th input line to multipath transmission.
referring to FIG. 4, the input line 321 and the second input line 322 are disposed on the surface of the film substrate 10, the light emitting voltage transmitting circuit 32 further includes a connecting line 323 disposed between the input line 321 and the second input line 322 and electrically connected to the input line 321 and the second input line 322, and the connecting line 323 is disposed inside the source driver 20. therefore, disposing the connecting line inside the source driver can improve the integration and facilitate the fabrication, and the input line and the second input line can be electrically connected while connecting the source driver.
According to an embodiment of the present invention, in order to facilitate connection of the th connection line with the th input line and the second input line, referring to fig. 5, the light emitting voltage transmitting circuit 32 may further include a 0 th input connection terminal 324, the 1 th input connection terminal 324 being disposed between the th input line 321 and the th connection line 323, being disposed between the source driver 20 and the film substrate 10, and being electrically connected with the th input line 321 and the th connection line 323, and a second input connection terminal 325, the second input connection terminal 325 being disposed between the second input line 322 and the th connection line 323, being disposed between the source driver 20 and the film substrate 10, and being electrically connected with the second input line 322 and the th connection line 323, whereby connection between the th input line, the second input line, and the th connection line is firmer, and contact resistance is smaller.
In other embodiments, referring to fig. 6 and 7, the light emitting voltage transmitting circuit 32 is disposed on the surface of the film substrate 10, and further includes a second connection line 326 disposed between the input line 321 and the second input line 322 and electrically connected to the input line 321 and the second input line 322, wherein the second connection line 326 is disposed between the film substrate 10 and the source driver 20.
referring to FIG. 8, the second connection line 326 is integrally formed with the th input line 321 and the second input line 322 . therefore, the second connection line 326, the th input line 321 and the second input line 322 can be prepared steps, which simplifies the preparation steps and reduces the contact resistance.
It should be noted that, there is no particular limitation on the positional relationship between the orthographic projection of the second connection line on the film substrate and the orthographic projection of the source driver on the film substrate, the orthographic projection of the second connection line on the film substrate may cover the orthographic projection of the source driver on the film substrate, the orthographic projection of the second connection line on the film substrate may overlap with the orthographic projection of the source driver on the film substrate, the orthographic projection of the second connection line on the film substrate may fall within the orthographic projection of the source driver on the film substrate, and fig. 6 and 7 only show the case where the orthographic projection of the second connection line on the film substrate may cover the orthographic projection of the source driver on the film substrate, but it should not be construed as a limitation to the present invention.
It is to be understood that, in order to form a circuit loop, referring to fig. 1, the light emitting voltage transmitting circuit 32 may further include: and cathode voltage output circuits 34, wherein the cathode voltage output circuits 34 are disposed on the film substrate 10 and respectively located at two opposite sides of the source driver 20 in the second direction. Therefore, the current dispersion effect is better.
According to an embodiment of the present invention, referring to fig. 9, the chip on film may further include a plurality of data signal lines 40, wherein the plurality of data signal lines 40 are disposed on the film substrate 10, electrically connected to the source driver 20, located on the second side of the source driver 20, and alternately disposed with the plurality of second input lines 324. Therefore, the data signal line (namely the data line) and the light-emitting voltage line (namely the second input line) are uniformly arranged, so that the light-emitting voltage transmission resistance is minimized (through holes are minimized), and the reduction of the voltage Drop (IR-Drop) phenomenon of the light-emitting voltage is facilitated.
It should be noted that, the large-sized display device has higher light-emitting voltage, larger current and more serious heat concentration, and the flip-chip film of the present invention can effectively solve the problem of burning of the flip-chip film caused by heat concentration, so the flip-chip film is particularly suitable for large-sized display devices, such as televisions, stage screens, display screens, and the like.
In another aspect of the present invention, referring to fig. 10, the present invention provides display devices, according to an embodiment of the present invention, the display device includes a display panel 200, at least of the above-mentioned flip-chip films 100, wherein the second input lines 322 of the flip-chip films 100 are electrically connected to the display panel 100, and a printed circuit board 300, wherein the printed circuit board 300 is electrically connected to the th input lines 321 of the flip-chip films, and the light emitting voltage passing through the flip-chip films in the display panel can be uniformly transmitted, thereby greatly reducing the heat burning phenomenon caused by current concentration.
According to the embodiment of the present invention, the specific type of the display device is not particularly limited, and specifically, the display device may be a mobile phone, a television, a game machine, a stage display screen, an display screen, a wearable device, and the like, and it can be understood that, besides the display panel, the flip chip film, and the printed circuit board described above, the display device may further include necessary structures and components of a conventional display device, taking a television as an example, and may further include a housing, a sound system, a bluetooth component, and the like, which are not described in detail in .
In the description of the present invention, it is to be understood that the terms "" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
In the description herein, reference to the terms " embodiments," " embodiments," "examples," "specific examples," or " examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least embodiments or examples of the invention.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (9)
1, kinds of chip on films, comprising:
a film substrate;
a source driver disposed on the film substrate having opposing and second sides in an direction;
the light-emitting voltage transmission circuit is arranged on the film substrate and is positioned on the same side of the film substrate as the source driver, the light-emitting voltage transmission circuit comprises an anode voltage input circuit, the anode voltage input circuit comprises at least th input lines and a plurality of second input lines, the th input line is positioned on the th side of the source driver, the second input line is positioned on the second side of the source driver, and each th input line is electrically connected with the plurality of second input lines.
2. The chip on film of claim 1, wherein the plurality of second input lines are uniformly distributed in the second direction, and the second direction is perpendicular to the th direction.
3. The chip on film of claim 1, wherein the th input line and the second input line are disposed on the surface of the film substrate, and the light emitting voltage transmitting circuit further comprises a th connection line disposed between the th input line and the second input line and electrically connected to the th input line and the second input line, and the th connection line is disposed inside the source driver.
4. The chip on film of claim 3, wherein the light emitting voltage transmitting circuit further comprises:
an th input connection terminal, wherein the th input connection terminal is arranged between the th input line and the th connection line, is positioned between the source driver and the film substrate, and is electrically connected with the th input line and the th connection line;
a second input connection terminal provided between the second input line and the th connection line, between the source driver and the film substrate, and electrically connected to the second input line and the th connection line.
5. The chip on film of claim 1, wherein the light emitting voltage transmitting circuit is disposed on the surface of the film substrate, and further comprising a second connection line disposed between the th input line and the second input line and electrically connected to the th input line and the second input line, the second connection line being disposed between the film substrate and the source driver.
6. The COF of claim 5, wherein the second connection line is integrally formed with the th input line and the second input line.
7. The chip on film according to any of claims 1-6, wherein the light emitting voltage transmitting circuit further comprises:
and the cathode voltage output circuit is arranged on the film base material and is positioned at two opposite sides of the source electrode driver in the second direction.
8. The chip on film of any of claims 1-6, further comprising a plurality of data signal lines disposed on the film substrate, electrically connected to the source driver, disposed on a second side of the source driver, and alternately disposed with the plurality of second input lines.
A display device of , comprising:
a display panel;
at least flip chips as defined in any of claims 1-8 , wherein the second input trace is electrically connected to the display panel;
the printed circuit board is electrically connected with the th input line in the chip on film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911200696.1A CN110738968A (en) | 2019-11-29 | 2019-11-29 | Chip on film and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911200696.1A CN110738968A (en) | 2019-11-29 | 2019-11-29 | Chip on film and display device |
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| Publication Number | Publication Date |
|---|---|
| CN110738968A true CN110738968A (en) | 2020-01-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911200696.1A Pending CN110738968A (en) | 2019-11-29 | 2019-11-29 | Chip on film and display device |
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| CN (1) | CN110738968A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113608387A (en) * | 2021-07-30 | 2021-11-05 | 惠科股份有限公司 | Chip on film and display device |
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| US20070296659A1 (en) * | 2006-06-27 | 2007-12-27 | Yun-Hee Kwak | Display substrate and display device having the same |
| CN103680384A (en) * | 2012-09-26 | 2014-03-26 | 乐金显示有限公司 | Display device having flexible film cable |
| CN103839516A (en) * | 2012-11-22 | 2014-06-04 | 乐金显示有限公司 | Organic light emitting display device |
| CN103903557A (en) * | 2012-12-24 | 2014-07-02 | 乐金显示有限公司 | Display device including driving unit |
| CN206864502U (en) * | 2017-06-02 | 2018-01-09 | 纳晶科技股份有限公司 | Electroluminescent device and the display device containing it |
| CN108375856A (en) * | 2017-01-31 | 2018-08-07 | 株式会社半导体能源研究所 | Display device, display module and electronic equipment |
-
2019
- 2019-11-29 CN CN201911200696.1A patent/CN110738968A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070296659A1 (en) * | 2006-06-27 | 2007-12-27 | Yun-Hee Kwak | Display substrate and display device having the same |
| CN103680384A (en) * | 2012-09-26 | 2014-03-26 | 乐金显示有限公司 | Display device having flexible film cable |
| CN103839516A (en) * | 2012-11-22 | 2014-06-04 | 乐金显示有限公司 | Organic light emitting display device |
| CN103903557A (en) * | 2012-12-24 | 2014-07-02 | 乐金显示有限公司 | Display device including driving unit |
| CN108375856A (en) * | 2017-01-31 | 2018-08-07 | 株式会社半导体能源研究所 | Display device, display module and electronic equipment |
| CN206864502U (en) * | 2017-06-02 | 2018-01-09 | 纳晶科技股份有限公司 | Electroluminescent device and the display device containing it |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113608387A (en) * | 2021-07-30 | 2021-11-05 | 惠科股份有限公司 | Chip on film and display device |
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Application publication date: 20200131 |