CN110709980A - 具有提高的生产量和加工灵活性的cmp机器 - Google Patents

具有提高的生产量和加工灵活性的cmp机器 Download PDF

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Publication number
CN110709980A
CN110709980A CN201880031946.0A CN201880031946A CN110709980A CN 110709980 A CN110709980 A CN 110709980A CN 201880031946 A CN201880031946 A CN 201880031946A CN 110709980 A CN110709980 A CN 110709980A
Authority
CN
China
Prior art keywords
carrier head
substrate
rotation
platen
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880031946.0A
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English (en)
Chinese (zh)
Inventor
D·R·特洛伊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongshuo Technology Co
AXUS Tech LLC
Original Assignee
Chongshuo Technology Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongshuo Technology Co filed Critical Chongshuo Technology Co
Publication of CN110709980A publication Critical patent/CN110709980A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201880031946.0A 2017-04-26 2018-04-06 具有提高的生产量和加工灵活性的cmp机器 Pending CN110709980A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762602538P 2017-04-26 2017-04-26
US62/602,538 2017-04-26
PCT/US2018/026590 WO2018200165A1 (en) 2017-04-26 2018-04-06 Cmp machine with improved throughput and process flexibility

Publications (1)

Publication Number Publication Date
CN110709980A true CN110709980A (zh) 2020-01-17

Family

ID=63915835

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880031946.0A Pending CN110709980A (zh) 2017-04-26 2018-04-06 具有提高的生产量和加工灵活性的cmp机器

Country Status (6)

Country Link
US (2) US20180311784A1 (ja)
EP (1) EP3616237A4 (ja)
JP (3) JP7094983B2 (ja)
KR (2) KR20240110657A (ja)
CN (1) CN110709980A (ja)
WO (1) WO2018200165A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022526214A (ja) 2019-02-14 2022-05-24 アクス テクノロジー エルエルシー 基板キャリアヘッドおよび処理システム
CN114206551A (zh) * 2019-08-02 2022-03-18 崇硕科技公司 用于工件抛光期间晶片滑移检测的原位调整的方法和设备
KR20210095047A (ko) * 2020-01-22 2021-07-30 주식회사 씨티에스 웨이퍼 건조 모듈 및 이를 포함하는 씨엠피 장치
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020132566A1 (en) * 2001-03-15 2002-09-19 Jeong In Kwon System and method for chemical mechanical polishing using multiple small polishing pads
US20070141954A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Paired pivot arm
US20080038993A1 (en) * 2006-08-08 2008-02-14 Jeong In-Kwon Apparatus and method for polishing semiconductor wafers
CN102124545A (zh) * 2008-08-14 2011-07-13 应用材料公司 具有可移动的浆液分配器的化学机械抛光机及方法

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Publication number Priority date Publication date Assignee Title
US5562524A (en) * 1994-05-04 1996-10-08 Gill, Jr.; Gerald L. Polishing apparatus
US6354926B1 (en) * 1997-03-12 2002-03-12 Lam Research Corporation Parallel alignment method and apparatus for chemical mechanical polishing
JP2000061821A (ja) 1998-08-19 2000-02-29 Speedfam-Ipec Co Ltd ポリッシング装置における外気連通機構
JP3797822B2 (ja) * 1999-06-30 2006-07-19 株式会社荏原製作所 ポリッシング装置
US6189680B1 (en) * 1999-07-27 2001-02-20 Fujikoshi Kikai Kogyo Kabushiki Kaisha Rotary conveyor
JP4485643B2 (ja) 1999-08-30 2010-06-23 三菱マテリアル株式会社 研磨装置及び被研磨材の研磨方法
US6602121B1 (en) * 1999-10-28 2003-08-05 Strasbaugh Pad support apparatus for chemical mechanical planarization
JP4257017B2 (ja) 2000-05-02 2009-04-22 不二越機械工業株式会社 ウェーハの研磨装置
JP2001326201A (ja) 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
US6923711B2 (en) * 2000-10-17 2005-08-02 Speedfam-Ipec Corporation Multizone carrier with process monitoring system for chemical-mechanical planarization tool
US6439981B1 (en) * 2000-12-28 2002-08-27 Lsi Logic Corporation Arrangement and method for polishing a surface of a semiconductor wafer
KR100488376B1 (ko) * 2001-04-27 2005-05-11 가부시키가이샤 고베 세이코쇼 기판 처리 방법 및 기판 처리 설비
US6817923B2 (en) * 2001-05-24 2004-11-16 Applied Materials, Inc. Chemical mechanical processing system with mobile load cup
US6575818B2 (en) * 2001-06-27 2003-06-10 Oriol Inc. Apparatus and method for polishing multiple semiconductor wafers in parallel
KR20050004156A (ko) * 2002-05-17 2005-01-12 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치 및 기판처리방법
JP2005131772A (ja) 2003-10-31 2005-05-26 Ebara Corp ポリッシング装置
JP5112061B2 (ja) * 2004-07-02 2013-01-09 ストラスボー ウエハ処理方法およびシステム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020132566A1 (en) * 2001-03-15 2002-09-19 Jeong In Kwon System and method for chemical mechanical polishing using multiple small polishing pads
US20070141954A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Paired pivot arm
US20080038993A1 (en) * 2006-08-08 2008-02-14 Jeong In-Kwon Apparatus and method for polishing semiconductor wafers
CN102124545A (zh) * 2008-08-14 2011-07-13 应用材料公司 具有可移动的浆液分配器的化学机械抛光机及方法

Also Published As

Publication number Publication date
JP2020518475A (ja) 2020-06-25
JP2024026436A (ja) 2024-02-28
WO2018200165A1 (en) 2018-11-01
JP7408726B2 (ja) 2024-01-05
EP3616237A1 (en) 2020-03-04
US20180311784A1 (en) 2018-11-01
KR20200002928A (ko) 2020-01-08
JP7094983B2 (ja) 2022-07-04
JP2022141653A (ja) 2022-09-29
US20220088744A1 (en) 2022-03-24
EP3616237A4 (en) 2020-12-16
KR102680584B1 (ko) 2024-07-03
KR20240110657A (ko) 2024-07-15

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