CN110678045A

CN110678045A - Heat dissipation system

Info

Publication number: CN110678045A
Application number: CN201910948772.0A
Authority: CN
Inventors: 王爱梅; 田婷
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2020-01-10

Abstract

The present disclosure provides a heat dissipation system, comprising: a body for receiving a computing device, the body having at least first and second opposing openings, wherein airflow from the first opening to the second opening is capable of dissipating heat from the computing device; the temperature reducing device is arranged at the second opening and used for reducing the temperature of the airflow reaching the second opening; and the heat transmission device is in heat conduction contact with the computing equipment in a first part, and is in heat conduction contact with the cooling device in a second part, and is used for dissipating heat for the computing equipment.

Description

Heat dissipation system

Technical Field

The present disclosure relates to the field of heat dissipation, and more particularly, to a heat dissipation system.

Background

With the rapid development of the information age, computing devices such as servers and the like undertake a large amount of data operations, a large amount of heat is generated during the operation of the computing devices, and the normal operation of the servers is influenced when the temperature is high. Therefore, the temperature of the server needs to be reduced to ensure that the server operates safely and stably.

In the prior art, the heat of the computing equipment is dissipated through air flow, a fan can be arranged on the rear side of a cabinet for storing the computing equipment, air enters from the front side of the cabinet and is discharged from the rear side under the action of the fan, and the heat of the computing equipment is taken away through the air flow. But the computing device is cooled only by air and the cooling efficiency is low.

Disclosure of Invention

Optionally, the cooling device is connected with the body in a relatively movable manner; the second part is detachably connected with the cooling device.

Optionally, the heat transport device includes at least one heat pipe, each heat pipe includes a first pipe portion and a second pipe portion connected to each other, the first pipe portion extends in a first direction, the first direction includes a direction from the first opening of the body to the second opening, the second pipe portion extends in a second direction, and the second direction includes any one direction that satisfies a parallel condition with a connection surface of the cooling device; the first part of the heat transport device comprises a first tube part of the at least one heat conductive tube; the second part of the heat transport device comprises a second tube part of the at least one heat conducting tube.

Optionally, the cooling device comprises first and second opposing sides; the heat transfer device comprises a plurality of heat conduction pipes, wherein second pipe parts of partial heat conduction pipes in the plurality of heat conduction pipes extend from the first ends of the second pipe parts to the direction close to the first side edge of the cooling device, second pipe parts of partial heat conduction pipes extend from the first ends of the second pipe parts to the direction close to the second side edge of the cooling device, and the first ends of the second pipe parts are the ends, connected with the first pipe parts, of the second pipe parts.

Optionally, the heat transport device further includes at least one plate-shaped heat conduction block, each heat conduction block is connected to the second pipe portion of at least one heat conduction pipe, and a plate-shaped surface of the heat conduction block is opposite to the connection surface of the cooling device, so as to increase a contact area between the second pipe portion and the cooling device.

Optionally, the cooling device can rotate relative to the body, and the cooling device is located at the second opening of the body when the cooling device is at the first angle; the cooling device is provided with a plurality of holes, and the airflow reaching the second opening can flow through the cooling device through the plurality of holes; the cooling device further comprises a connecting surface, the connecting surface faces the second opening, and the second part of the heat transmission device is connected with the connecting surface in a detachable mode.

Optionally, the cooling device can move along the height direction of the body to be raised to a first height or lowered to a second height when the cooling device is at a first angle; when the temperature reduction device is raised to a first height, the connecting surface and the second part of the heat transmission device are in a connecting state; when the temperature reduction device is lowered to a second height, the connecting surface and the second part of the heat transmission device are in a non-connecting state;

optionally, a connecting piece is arranged on the connecting surface, a connecting groove with an opening facing the top of the cooling device is formed between the connecting piece and the connecting surface, and a heat conducting medium is filled in the connecting groove; the second part of the heat transmission device extends towards the bottom of the cooling device; under the condition that the temperature reduction device is raised to a first height, a second part of the heat transmission device extends into the connecting groove; and under the condition that the temperature reduction device is lowered to the second height, the second part of the heat transmission device is separated from the connecting groove.

Optionally, the connection surface is provided with a first connection hole penetrating through the connection surface; a second part of the heat transmission device is provided with a second connecting hole penetrating through the second part; under the condition that the cooling device is at a first angle, the first connecting hole is opposite to the second connecting hole; the cabinet further comprises a fastener, wherein the fastener is used for penetrating the first connecting hole and the second connecting hole under the condition that the cooling device is at a first angle, and the connecting surface is connected with the second part of the heat transmission device.

Optionally, the second part of the heat transport device extends in the width direction of the connection surface to an edge of the connection surface; the cabinet further comprises a clamp, wherein the clamp is used for clamping the edge of the connecting surface and the edge of the second part of the heat transmission device under the condition that the temperature reduction device is at a first angle so as to connect the connecting surface and the second part of the heat transmission device.

Drawings

For a more complete understanding of the present disclosure and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:

fig. 1 schematically illustrates an application scenario of a heat dissipation system according to an embodiment of the present disclosure;

FIG. 2 schematically illustrates a structural schematic of a heat dissipation system according to an embodiment of the disclosure;

fig. 3 schematically shows a schematic view of a heat transport device according to an embodiment of the present disclosure;

fig. 4 schematically shows a structural schematic view of a heat transport device according to an embodiment of the present disclosure;

FIG. 5A schematically illustrates an exploded view of a first cooling device according to an embodiment of the present disclosure;

FIG. 5B schematically illustrates a second cooling device according to an embodiment of the disclosure;

fig. 6 schematically illustrates a partial structural view of a heat dissipation system according to another embodiment of the present disclosure;

fig. 7 schematically illustrates a partial structural view of a heat dissipation system according to another embodiment of the present disclosure; and

fig. 8 schematically shows a partial structural view of a heat dissipation system according to another embodiment of the present disclosure.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.

All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. It is noted that the terms used herein should be interpreted as having a meaning that is consistent with the context of this specification and should not be interpreted in an idealized or overly formal sense.

Where a convention analogous to "A, B, at least one of C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a component having at least one of A, B and C" would include but not be limited to components having a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.). Where a convention analogous to "A, B or at least one of C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B or C" would include but not be limited to components having a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.).

An embodiment of the present disclosure provides a heat dissipation system, which includes a body, a cooling device, and a heat transfer device. The body is used for accommodating the computing device and at least comprises a first opening and a second opening which are opposite, wherein the air flow from the first opening to the second opening can dissipate heat of the computing device. A temperature reduction device is disposed at the second opening for reducing the temperature of the airflow reaching the second opening. A first portion of the heat transfer device is in thermally conductive contact with the computing device, and a second portion of the heat transfer device is in thermally conductive contact with the cooling device for dissipating heat from the computing device.

The cooling system of the embodiment of the disclosure can not only exchange heat with the air flow flowing through the computing equipment through the cooling device to provide air-cooled heat dissipation for the computing equipment, but also dissipate heat for the computing equipment through the heat conduction function of the heat transmission device, and the cooling system can form two heat dissipation modes through multiplexing of the cooling device, so that the heat dissipation efficiency of the computing equipment can be improved.

Fig. 1 schematically illustrates an application scenario of a heat dissipation system according to an embodiment of the present disclosure. It should be noted that fig. 1 is only an example of a scenario in which the embodiments of the present disclosure may be applied to help those skilled in the art understand the technical content of the present disclosure, but does not mean that the embodiments of the present disclosure may not be applied to other devices, systems, environments or scenarios.

As shown in fig. 1, the heat dissipation system of the embodiment of the present disclosure may be applied to a computer room 100 as a cabinet 101 in the computer room, for example.

The cabinet 101 may include a body, a cooling device, and a heat transfer device, where the body has a plurality of accommodation spaces arranged up and down, and the computing devices such as servers may be placed in the accommodation spaces. The heat sink can set up in the rear side of body, and the air gets into by the front side of body, and the air takes away the heat of computing equipment after, reachs the heat sink, and the heat sink can include the liquid cooling pipeline for example, and the air can carry out the heat transfer in cooling device department, discharges again after the air temperature reduces. The cooled gas can be conveyed back to the front side of the body through an air circulation system outside the cabinet to form circulation. The heat transmission device can be arranged between the computing equipment and the cooling device, heat conduction is carried out between the computing equipment and the cooling device, and the effect of reducing the temperature of the computing equipment is further achieved. Based on the above mode, the cooling system of the embodiment of the disclosure can not only dissipate heat of the computing device through air heat dissipation, but also dissipate heat of the computing device through the heat conduction function of the heat conduction piece, thereby improving cooling efficiency.

Fig. 2 schematically illustrates a structural schematic diagram of a heat dissipation system 200 according to an embodiment of the present disclosure.

As shown in fig. 2, the heat dissipation system 200 includes a body 210, a temperature reduction device 220, and a heat transmission device (not shown).

The body 210 may house the computing device 201, the body 210 having at least first and second opposing openings, wherein airflow from the first opening to the second opening is capable of dissipating heat from the computing device.

The heat dissipation system 200 may be, for example, a cabinet, and the body 210 may be, for example, a cabinet body of the cabinet, where the cabinet body has a plurality of accommodating spaces arranged up and down, and the computing device 201 may be flatly placed in the accommodating spaces. The first opening may be, for example, a front side opening of the body 210, and the second opening may be, for example, a rear side opening of the body 210.

The heat dissipation system 200 may further include an airflow heat dissipation device 202, where the airflow heat dissipation device 202 may be, for example, a fan, and the airflow heat dissipation device 202 may be disposed at a second opening of the body 210, and the second opening may be, for example, a rear opening of the body 210. The airflow heat sink 202 may push the air around the cabinet to circulate and generate a negative pressure at the first opening of the cabinet, so as to generate an airflow from the first opening of the cabinet to the second opening, i.e., the airflow is made to flow in from the first opening of the body 210 and flow out from the second opening, which may be, for example, a rear opening of the body 210. The airflow, while flowing through the computing device 201, may carry away heat from the computing device 201, dissipating heat away from the computing device 201.

A temperature reduction device 220 is provided at the second opening for reducing the temperature of the airflow reaching the second opening.

The cooling device 220 may include a liquid cooling radiator, for example, the liquid cooling radiator may include a plurality of liquid cooling pipelines arranged side by side, and the liquid cooling pipeline may be internally filled with a liquid having a lower circulating temperature, for example, cold water, and a plurality of fins may be arranged between the liquid cooling pipelines, and the fins may increase the heat exchange area of the cooling device 220. The temperature reduction device 220 has a plurality of holes, e.g., gaps between the liquid cooling pipes and between the fins, through which the airflow reaching the second opening can flow through the temperature reduction device. The air current that reaches heat sink 220 department can carry out the heat transfer with heat sink 220, and gaseous liquid in with heat transfer to liquid cooling pipeline, the air current temperature reduction then discharges. The cooled gas can be conveyed to the front side of the body through an air circulation system outside the cabinet to form circulation.

Fig. 3 schematically shows a schematic view of a heat transport device 230 according to an embodiment of the present disclosure.

As shown in connection with fig. 2 and 3, the heat transport device 230 may include a first portion 231 and a second portion 232, the first portion 231 may be in heat conductive contact with the computing device 201, and the second portion 232 may be in heat conductive contact with the temperature reduction device 220 for dissipating heat to the computing device 201.

The heat conduction contact may refer to direct contact between surfaces of two objects, and heat conduction is performed through the contact surfaces, or may refer to filling a heat conduction medium between the surfaces of the two objects, and implementing heat conduction between the surfaces of the two objects through the heat conduction medium, where the heat conduction medium may be, for example, heat conduction silica gel.

The heat dissipation system 200 may include a plurality of heat transport devices 230, and one heat transport device 230 may be disposed for each computing device 201.

Based on the above mode, the cooling system of the embodiment of the disclosure can not only cool the computing device through low-temperature air circulation, but also cool the computing device through the heat conduction function of the heat transmission device, thereby improving the cooling efficiency of the computing device.

According to the embodiment of the disclosure, the cooling device is connected with the body in a relatively movable manner.

For example, one side of the cooling device can be connected with one side of the body through a rotating shaft, so that the cooling device can rotate relative to the body, and the cooling device is equivalent to a door on the rear side of the body. The heat sink can rotate to great angle to make the rear side opening of body open, the staff can arrange the line and maintenance work through the rear side opening. Or, the cooling device and the body can be connected in a detachable mode, for example, the cooling device and the body are connected through a buckle structure or a fastener, and the cooling device can be detached from the body when the wires are required to be arranged or maintained.

The second portion of the heat transport device 230 may be detachably connected to the temperature reduction device, wherein the detachable connection may be, for example, a fastening connection, a snap connection, or the like, and the first portion of the heat transport device 230 may be fixedly connected to the computing device 201. In the case where the temperature reducing device 220 is located at the second opening of the body, the second part of the heat transport device and the temperature reducing device 220 may be connected together, both forming a heat conducting contact. Before the cooling device 220 is rotated to be opened, the second part needs to be disconnected from the cooling device 220, and then the cooling device is rotated or detached from the body.

Or, the second part of the heat transmission device 230 may be fixedly connected to the temperature reduction device 220, the first part of the heat transmission device 230 may be detachably connected to the computing device 201, before the temperature reduction device is to be rotated to open or detach, the first part may be disconnected from the computing device 201, and then the temperature reduction device may be rotated or detached from the body, and since the second part of the heat transmission device 230 is fixed to the temperature reduction device, the heat transmission device 230 may be rotated together with the temperature reduction device 220 or detached together.

Fig. 4 schematically shows a structural schematic view of a heat transport device 230 according to an embodiment of the present disclosure.

As shown in fig. 4, according to an embodiment of the present disclosure, the heat transport device 230 may include at least one heat conductive pipe 233, for example, the heat transport device 230 shown in fig. 4 includes four heat conductive pipes 233. Each heat conducting pipe 233 includes a first pipe portion and a second pipe portion connected, the first part of the heat transport device 230 includes the first pipe portion of at least one heat conducting pipe, and the second part of the heat transport device includes the second pipe portion of at least one heat conducting pipe.

The first pipe portion extends in a first direction including a direction from the first opening to the second opening of the body. For example, the first direction may be a front-to-back direction of the body, i.e., the first tube portion may extend in the front-to-back direction of the body to better fit the computing device within the body, increasing the contact area with the computing device.

The first tube portion may be connected to a surface of the computing device, such as an upper surface of the computing device, or the first tube portion may electrically extend into the computing device and be in thermally conductive contact with a heat generating device, such as a CPU, within the computing device.

The second pipe part extends along a second direction, and the second direction comprises any direction which meets the parallel condition with the connecting surface of the cooling device. Wherein, the connection face of the cooling device can be the surface of the cooling device facing the second opening, and the second part of the heat transmission device can be in heat conduction contact with the connection face of the cooling device.

Satisfying the parallelism condition may refer to being parallel or approximately parallel. Because the heat sink can move for the body or detach with the body under a condition, and the second part of heat transmission device is connected with the heat sink with the detachable mode, consequently under this condition, the aforesaid second pipe portion satisfies parallel condition with the face of being connected of heat sink means that the second pipe portion satisfies parallel condition with the face of being connected of heat sink under the condition that the heat sink is located body second opening to make second pipe portion can laminate the face of being connected of heat sink better, under the condition that the heat sink leaves the second opening, the second pipe portion probably is arbitrary angle with the face of being connected of heat sink.

Because the heat sink can be vertically arranged at the rear opening of the body, the second direction can be parallel to the vertical plane. For example, the second direction may be a width direction of the body, and the second pipe portion may extend left and right in the width direction of the body; or the second direction may be a height direction of the body, and the second pipe portion may extend up and down in the height direction of the body.

The first pipe portion and the second pipe portion may satisfy a vertical condition, and satisfying the vertical condition may mean that the first pipe portion and the second pipe portion are perpendicular or approximately perpendicular to each other.

Based on above mode, this internal computational equipment can be laminated better to first pipe portion, increase and computational equipment's area of contact, and heat sink can be laminated better to second pipe portion, and the area of contact of increase and heat sink can reach better heat-conduction effect.

The first pipe portion and the second pipe portion may be integrally formed, that is, the first pipe portion and the second pipe portion belong to the same pipe material, and the pipe material is formed into the first pipe portion and the second pipe portion through a processing method such as a bending process, or the first pipe portion and the second pipe portion may be formed separately and then connected together through a welding method or the like.

According to an embodiment of the present disclosure, the cooling device includes opposite first and second sides, the first side being, for example, a left side of the cooling device shown in fig. 3, and the second side being, for example, a right side of the cooling device shown in fig. 3. Alternatively, the first side may refer to an upper side of the cooling device and the second side may refer to a lower side of the cooling device.

The heat transport device includes a plurality of heat pipes, for example, four heat pipes, wherein the second pipe portion of a part of the plurality of heat pipes extends from the first end of the second pipe portion to a direction close to the first side of the temperature reduction device, and the second pipe portion of a part of the heat pipes extends from the first end of the second pipe portion to a direction close to the second side of the temperature reduction device, wherein the first end of the second pipe portion is an end connected to the first pipe portion.

For example, two of the four heat pipes extend from the first end to the left side, and two of the four heat pipes extend from the first end to the right side.

Based on above mode, the second pipe portion of many heat pipes can extend to opposite both sides dispersedly, avoids concentrating on one side, improves the radiating efficiency.

As shown in fig. 4, according to the embodiment of the present disclosure, the heat transport device 230 may further include at least one plate-shaped heat conduction block 234, each heat conduction block 234 is connected to the second pipe portion of at least one heat conduction pipe 233, and a plate-shaped surface of the heat conduction block 234 is opposite to a connection surface of the temperature reduction device to increase a contact area of the second pipe portion with the temperature reduction device.

For example, two heat conduction blocks may be provided on two second tube portions extending to the left side, and both heat conduction blocks may be provided between the two second tube portions. Two second tube portions extending to the right may be provided with a heat conducting block.

The plate-shaped surface of the heat conduction block can be opposite to the connecting surface of the cooling device, and heat conduction contact is formed, so that the contact area between the second pipe part and the cooling device is increased, and the heat conduction effect is enhanced.

As shown in fig. 4, the first pipe portion may also be provided with a heat conduction block, for example, the first pipe portions of four heat conduction pipes are connected together to one heat conduction block, and the plate-shaped surface of the heat conduction block at the first pipe portion may be opposed to the surface of the computing device and brought into heat conduction contact to increase the contact area of the first pipe portion with the computing device.

As described above, in one aspect, the cooling device is connected to the body in a relatively rotatable manner, and the second portion of the heat transmission device is detachably connected to the cooling device, specifically, the second portion of the heat transmission device may be detachably connected to the connection surface of the cooling device. When the heat transfer device rotates to the second opening of body, can couple together the second part of heat transfer device and the face of being connected of heat transfer device, when needs rotate the heat transfer device and open, can remove with being connected the face of being connected of the second part of heat transfer device and heat transfer device earlier and be connected, then rotate the heat transfer device and open. After accomplishing maintenance work with the staff, can rotate the second opening part of body with the heat sink back, then can be connected the second part of heat transmission device with the heat sink again. Wherein, the heat sink is located the second opening part of body when being in first angle, and the heat sink is in first angle for example can mean that the contained angle of heat sink and the plane of the second opening place of body is 0 degree.

Fig. 5A schematically illustrates an exploded view of a first cooling device according to an embodiment of the disclosure.

As shown in fig. 5A, the first cooling device may include a liquid-cooled heat sink 321 and a connecting plate 322, and the connecting plate 322 may be stacked on the surface of the liquid-cooled heat sink 321 and connected together by welding or the like.

First liquid cooling radiator 321 can include many first liquid cooling pipelines 3211 that set up side by side, and first liquid cooling pipeline 3211 can be cylindric pipe or flat pipe, can circulate the lower liquid of circulation temperature in the first liquid cooling pipeline 3211, for example cold water, can set up fin 3212 between the first liquid cooling pipeline 3211. Because first liquid cooling pipeline 321 is cylindric pipe or flat pipe, liquid cooling radiator 321 is not convenient for connect heat transmission device's second pipe portion, consequently, for being connected heat transmission device's second pipe portion and heat sink better, can be at a connecting plate 322 of the surface stack of first liquid cooling radiator 321, the connecting plate 322 can regard as heat sink's the face of being connected to the one side of body. The connection plate 322 may be a porous plate so as not to affect the circulation of air. Thus, after the first liquid-cooled heat sink 321 is stacked on the connecting plate 322, the cooling device may still have a plurality of holes, and the airflow reaching the second opening may flow through the cooling device through the plurality of holes without affecting the circulation of the air.

In addition, the connection surface of the cooling device may also refer to the surface of the cooling device itself.

Fig. 5B schematically illustrates a structural schematic diagram of a second cooling device according to an embodiment of the disclosure.

As shown in fig. 5B, the second cooling device may include a second liquid-cooled heat sink 322, the second liquid-cooled heat sink 322 may include a plurality of second liquid-cooled pipes 3221 arranged side by side, and fins 3222 may also be arranged between the pipes 3221.

The second liquid-cooled duct 3211 may be, for example, a square tube, and the width of the surface of the side of the second liquid-cooled duct 3211 facing the body is wide, which may provide a sufficient connection area for the second part of the heat transfer device without overlapping the connection plates. The surface of the second liquid cooling pipeline 3211 facing the body may serve as a connection surface of the temperature reducing device.

Three ways of connecting the second part of the heat transport device to the cooling device are described below by taking the first cooling device as an example.

Fig. 6 schematically shows a partial structural view of a heat dissipation system 400 according to another embodiment of the present disclosure. Wherein (a) is a schematic diagram of cooling device 420 and heat transport device 430 being in a connected state, and (b) is a schematic diagram of cooling device 420 and heat transport device 430 being in a disconnected state.

As shown in fig. 6, according to the embodiment of the present disclosure, in a case where the temperature reducing device 420 is at the first angle, that is, in a case where the temperature reducing device 420 is located at the second opening of the body 410, the temperature reducing device 420 can move in the height direction of the body 410 to be raised to the first height or lowered to the second height.

As shown in fig. 6 (a), in the case where the temperature reducing device 420 is raised to the first height, the connection face of the temperature reducing device 420 and the second part of the heat transfer device 430 are in a connected state. As shown in fig. 6 (b), in the case where the temperature reducing device 420 is lowered to the second height, the connection face is in a non-connection state with the second part of the heat transport device 430.

For example, according to the embodiment of the present disclosure, the connection surface of the temperature reduction device 420 is provided with the connection piece 423, a connection groove with an opening facing the top of the temperature reduction device is formed between the connection piece 423 and the connection surface, that is, the opening of the connection groove faces to the upper side shown in fig. 6, and the connection groove may be filled with a heat conducting medium, which may be, for example, heat conducting silica gel. The second part of the heat transfer device 430 may extend toward the bottom of the temperature reducing device 420, for example, the second pipe portion of the heat transfer device 430 is bent downward as shown in fig. 6. When the temperature reducing device 420 is raised to the first height, the second portion of the heat transfer device 430 extends into the connecting groove, and the second portion of the heat transfer device 430 is in heat-conductive contact with the temperature reducing device 420. Under the condition that heat transfer device 430 drops to the second height, the second part of heat transfer device 430 breaks away from the connecting groove, and under this condition, heat transfer device 430 can rotate for body 410 to open the second opening of body 410, and the staff can carry out work such as maintenance or reason line, and after the staff accomplished work, can rotate heat transfer device 430 back to the second opening department, and rise heat transfer device 430 upwards, makes heat transfer device 430 and the second part heat conduction contact of heat transfer device 430.

The two sides of the body 410 can be provided with guide rails, the two sides of the cooling device 430 can be provided with sliders matched with the guide rails, and the cooling device 430 can move up and down relative to the body under the action of external force through the guide rail slider mechanism. For example, an eccentric circle may be disposed at the bottom of the cooling device 430, and the cooling device 430 may be lifted and lowered by rotating the eccentric circle. Alternatively, other lifting structures may be used to accomplish the lifting of the cooling device 430.

Fig. 7 schematically illustrates a partial structural view of a heat dissipation system 500 according to another embodiment of the present disclosure.

As shown in fig. 7, according to an embodiment of the present disclosure, the connection surface is provided with a first connection hole penetrating through the connection surface, for example, a through hole penetrating through the connection plate is provided on the connection plate, and the second part of the heat transfer device 530 is provided with a second connection hole penetrating through the second part, which may be a threaded hole having an internal thread. Under the condition that heat sink 520 is in first angle, namely under the condition that heat sink 520 is located the second opening part of body, first connecting hole is relative with the second connecting hole.

The cabinet further includes a fastener 540, and the fastener 540 is configured to penetrate the first connection hole and the second connection hole when the temperature reducing device 520 is at the first angle, and connect the connection surface and the second part of the heat transmission device 530 to form a heat conductive contact. The fasteners 540 may be, for example, bolts.

Since the cooling device 430 may include a liquid-cooled heat sink and a connecting plate, when the fastening member 540 is used for connection, the fastening member 540 may be first inserted through the hole of the liquid-cooled heat sink and then connected to the connecting plate and the heat transfer device 530.

Fig. 8 schematically shows a partial structural view of a heat dissipation system 600 according to another embodiment of the present disclosure.

As shown in fig. 8, according to an embodiment of the present disclosure, the second part of the heat transport device 630 extends to the edge of the connection plate 622 in the width direction of the connection surface. For example, the heat transport device 630 may include four heat conductive pipes, of which the second pipe portions of two heat conductive pipes are bent leftward and extend horizontally leftward with respect to the respective first pipe portions, and the second pipe portions of the other two heat conductive pipes are bent rightward and extend horizontally rightward with respect to the respective first pipe portions.

The cabinet may further comprise a clamp 650, wherein the clamp 650 is configured to clamp an edge of the connection board and an edge of the second portion of the heat transport device when the temperature reduction device is at the first angle, so as to connect the connection board and the second portion of the heat transport device to form a heat conductive contact. The second partial connection of the connection plate and the heat transport device is released by the jig, and the connection and the detachment are easy.

Those skilled in the art will appreciate that various combinations and/or combinations of features recited in the various embodiments and/or claims of the present disclosure can be made, even if such combinations or combinations are not expressly recited in the present disclosure. In particular, various combinations and/or combinations of the features recited in the various embodiments and/or claims of the present disclosure may be made without departing from the spirit or teaching of the present disclosure. All such combinations and/or associations are within the scope of the present disclosure.

While the disclosure has been shown and described with reference to certain exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents. Accordingly, the scope of the present disclosure should not be limited to the above-described embodiments, but should be defined not only by the appended claims, but also by equivalents thereof.

Claims

1. A heat dissipation system, comprising:

a body for receiving a computing device, the body having at least first and second opposing openings, wherein airflow from the first opening to the second opening is capable of dissipating heat from the computing device;

the temperature reducing device is arranged at the second opening and used for reducing the temperature of the airflow reaching the second opening;

and the heat transmission device is in heat conduction contact with the computing equipment in a first part, and is in heat conduction contact with the cooling device in a second part, and is used for dissipating heat for the computing equipment.

2. The system of claim 1, wherein:

the cooling device is connected with the body in a relatively movable manner;

the second part is detachably connected with the cooling device.

3. The system of claim 1, wherein:

the heat transport device comprises at least one heat conduction pipe, each heat conduction pipe comprises a first pipe part and a second pipe part which are connected, the first pipe part extends along a first direction, the first direction comprises a direction from a first opening of the body to a second opening, the second pipe part extends along a second direction, and the second direction comprises any direction which meets a parallel condition with a connection surface of the cooling device;

the first part of the heat transport device comprises a first tube part of the at least one heat conductive tube;

the second part of the heat transport device comprises a second tube part of the at least one heat conducting tube.

4. The system of claim 3, wherein:

the cooling device comprises a first side edge and a second side edge which are opposite;

the heat transfer device comprises a plurality of heat conduction pipes, wherein second pipe parts of partial heat conduction pipes in the plurality of heat conduction pipes extend from the first ends of the second pipe parts to the direction close to the first side edge of the cooling device, second pipe parts of partial heat conduction pipes extend from the first ends of the second pipe parts to the direction close to the second side edge of the cooling device, and the first ends of the second pipe parts are the ends, connected with the first pipe parts, of the second pipe parts.

5. The system of claim 3, wherein:

the heat transfer device further comprises at least one plate-shaped heat conduction block, each heat conduction block is connected to the second pipe part of at least one heat conduction pipe, and the plate-shaped surface of each heat conduction block is opposite to the connecting surface of the cooling device so as to increase the contact area of the second pipe part and the cooling device.

6. The system of claim 2, wherein:

the cooling device can rotate relative to the body, and is positioned at the second opening of the body under the condition that the cooling device is positioned at the first angle;

the cooling device is provided with a plurality of holes, and the airflow reaching the second opening can flow through the cooling device through the plurality of holes;

the cooling device further comprises a connecting surface, the connecting surface faces the second opening, and the second part of the heat transmission device is connected with the connecting surface in a detachable mode.

7. The system of claim 6, wherein:

under the condition that the cooling device is at a first angle, the cooling device can move along the height direction of the body so as to be raised to a first height or lowered to a second height;

when the temperature reduction device is raised to a first height, the connecting surface and the second part of the heat transmission device are in a connecting state;

and under the condition that the temperature reduction device is lowered to the second height, the connecting surface and the second part of the heat transmission device are in a non-connecting state.

8. The system of claim 7, wherein:

a connecting piece is arranged on the connecting surface, a connecting groove with an opening facing the top of the cooling device is formed between the connecting piece and the connecting surface, and a heat-conducting medium is filled in the connecting groove;

the second part of the heat transmission device extends towards the bottom of the cooling device;

under the condition that the temperature reduction device is raised to a first height, a second part of the heat transmission device extends into the connecting groove;

and under the condition that the temperature reduction device is lowered to the second height, the second part of the heat transmission device is separated from the connecting groove.

9. The system of claim 6, wherein:

the connecting surface is provided with a first connecting hole penetrating through the connecting surface;

a second part of the heat transmission device is provided with a second connecting hole penetrating through the second part;

under the condition that the cooling device is at a first angle, the first connecting hole is opposite to the second connecting hole;

the cabinet further comprises a fastener, wherein the fastener is used for penetrating the first connecting hole and the second connecting hole under the condition that the cooling device is at a first angle, and the connecting surface is connected with the second part of the heat transmission device.

10. The system of claim 6, wherein:

the second part of the heat transport device extends to the edge of the connection surface along the width direction of the connection surface;

the cabinet further comprises a clamp, wherein the clamp is used for clamping the edge of the connecting surface and the edge of the second part of the heat transmission device under the condition that the temperature reduction device is at a first angle so as to connect the connecting surface and the second part of the heat transmission device.