A kind of semiconductor probe testboard probe
The present invention relates to technical field of integrated circuits, specially a kind of semiconductor probe testboard probe.
Probe station is mainly used in semicon industry, photovoltaic industry, integrated circuit and the test of encapsulation, is widely used in
The research and development of complicated, high speed device Precise Electric Measurement, it is intended to ensure quality and reliability, and reduce research and development time and device system
Make the cost of technique.
In IC industrial chain, integrated circuit testing is that only one is produced through integrated circuit and using overall process
Industry, IC design can put into volume production not over the validation test of prototype: in volume production, if wafer does not have
By the middle survey of Probe test station, can not be just packaged in next process；And the finished product test after encapsulating is at survey
The finishing operation of IC products, the circuit of only test passes is likely to dispatch from the factory as formal IC products, existing
There is the working principle of Probe test station semiconductor probe are as follows: in test, wafer is adsorbed on plummer by vacuum chuck, and
It is aligned with probe electroprobe, then probe is in contact with each pad of chip, electroprobe side view electricity under the driving of power supply
Road simultaneously records test result, judges wafer quality degree, probe in use for some time, due to probe processing and use process
In fine difference, cause probe that cannot lead to wafer during the test in same level, the difference by position height
Different, the lower probe of portion can directly contact wafer, and the higher probe of portion can not contact wafer, lead to wafer
In test, there is difference in test result, and part wafer is unable to test, and when the higher probe contact wafer in position, causes position
Lower probe direct collision wafer is set, probe tip is caused to stab surface layer, causes finished product pin welding matter after chip and encapsulation
It is poor to measure, and easily causes short circuit, influences final testing result, while position is not added in same level, operator will hold
The speed mode that microscope carrier rises is too fast, and wafer directly hits probe, and the end stress of probe is caused to be bent, be broken, part probe
It directly cracks, and after wafer stress, surface is directly stabbed, further influences the test of wafer, the result measured can not accomplish
Precision, influences the normal judgement of wafer.
Summary of the invention
For the deficiency of above-mentioned background technique, the present invention provides a kind of semiconductor probe testboard probes, have survey
Stable, adaptable advantage is tried, solves the problems, such as background technique proposition.
The invention provides the following technical scheme: a kind of semiconductor probe testboard probe, including casing, syringe needle, syringe needle
It is mounted on the bottom of casing, the inside of described sleeve pipe is fixedly installed with locating piece, and the end of the syringe needle, which is fixedly connected with, to be located at
The sliding shoe of inside pipe casing is equipped with spring between the locating piece and sliding shoe, magnetic patch is equipped on the sliding shoe, described
The support rod positioned at magnetic patch two sides is fixedly connected at the top of sliding shoe, the side of the support rod is fixedly connected with positioning seat,
The inside of the positioning seat is fixedly connected with locating rod, and the end of the locating rod is fixedly connected with positioning plate, the positioning plate
End be fixedly connected with magnet ring, the magnet ring and magnetic patch are different grade attracting state.
Preferably, the elastic force of the spring is greater than magnetic patch and the attracting dynamics of magnet ring, and the quantity of the magnet ring is two, and two
The shape of a magnet ring is semicircle, and is formed after two magnet rings merging round.
Preferably, sliding bar is fixedly connected on the outside of the magnet ring, the end of the sliding bar is rotatably connected to positioning
Ring is fixedly connected with cutting ferrule at the top of the positioning ring, and the two sides of the cutting ferrule are fixedly connected with support plate, the support plate
End is fixedly connected with the side of casing, and the bottom of the support plate is equipped with buffer stopper, and the material of the buffer stopper is rubber
Block, and the shape of buffer stopper bottom is semicircle shape.
Preferably, the bottom of described sleeve pipe is fixedly connected with correcting ring, the diameter of the correcting ring inner ring and syringe needle outer ring
Diameter match, the end thread of the locating rod is connected with the nut outside positioning seat, and the diameter of the nut is big
In the diameter of positioning seat and locating rod joint.
The present invention have it is following the utility model has the advantages that
1, semiconductor probe testboard probe, by the cooperation between sliding shoe and spring, so that syringe needle is held
It when the impact dynamics of microscope carrier, can shrink inwardly moment, so that syringe needle is optimized for Elastic Contact by traditional hard contact, so that needle
Different positions is shunk or expanded automatically, while syringe needle can so that syringe needle is in use in the position of the adaptive wafer of head energy
To contact the different position of wafer, when syringe needle is impacted, automatic shrink slows down the impact force being subject to, and utilizes the work of elastic force
With slowing down the distortion power of syringe needle, so that syringe needle is in use, remain vertical state, while it is different to contact wafer
Position, to improve accuracy of the wafer in test.
2, semiconductor probe testboard probe, by the cooperation between support rod, locating rod and magnet ring, so that syringe needle
In contraction process, magnet ring is jacked up and is restored to steady state, is attracted each other so that being converted between magnet ring and magnetic patch, so that magnetic
The dynamics adsorbed between block offsets the elastic force of spring, so that speed slows down when syringe needle is expanded downwards, so that the end of syringe needle is slow
Wafer is contacted, on the one hand to slow down the downward dynamics of syringe needle, on the other hand prevents syringe needle and stab wafer, so that wafer is being tested
When, remain that efficient, stable state is tested.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Fig. 2 is the partial structural diagram of Fig. 1；
Fig. 3 is the overlooking structure diagram of positioning ring；
Fig. 4 is existing structure schematic diagram.
In figure: 1, casing；2, syringe needle；3, correcting ring；4, locating piece；5, sliding shoe；6, spring；7, magnetic patch；8, support rod；
9, positioning seat；10, locating rod；11, positioning plate；12, magnet ring；13, sliding bar；14, positioning ring；15, nut；16, cutting ferrule；17,
Support plate；18, buffer stopper.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It please refers to Fig. 1-3, a kind of semiconductor probe testboard probe, including casing 1, syringe needle 2, syringe needle 2 and is mounted on set
The bottom of pipe 1, the inside of described sleeve pipe 1 are fixedly installed with locating piece 4, and the inner wall of locating piece 4 is to be slidably connected with syringe needle 2, make
Different positions can be slided by obtaining syringe needle 2, and the end of the syringe needle 2 is fixedly connected with the sliding shoe 5 inside casing 1, sliding
The outer wall of motion block 5 and the inner wall of casing 1 are slidably connected, and sliding shoe 5 is allowed to move different positions, the locating piece 4 with
Spring 6 is installed, spring 6 is to be pulled up state, drives syringe needle 2 flexible using the rebound of spring 6, described between sliding shoe 5
Magnetic patch 7 is installed, the top of the sliding shoe 5 is fixedly connected with the support rod 8 positioned at 7 two sides of magnetic patch, the branch on sliding shoe 5
The side of strut 8 is fixedly connected with positioning seat 9, and the inside of the positioning seat 9 is fixedly connected with locating rod 10, the locating rod 10
End be fixedly connected with positioning plate 11, the end of the positioning plate 11 is fixedly connected with magnet ring 12, the magnet ring 12 and magnetic patch 7
For different grade attracting state, the screen resilience of spring 6 is offset using attracting magnetic force, is slowed down the dynamics of the downslide of syringe needle 2, is avoided syringe needle 2
Stress bending, influences the normal use of syringe needle 2.
Wherein, the elastic force of the spring 6 is greater than magnetic patch 7 and the attracting dynamics of magnet ring 12, and the quantity of the magnet ring 12 is two
A, the shape of two magnet rings 12 is semicircle, can also be by support rod 8 using the dynamics repelled each other between two magnet rings 12
It is jacked up after certain position, the movement of bar 8 easy to support, and two magnet rings 12 merge upwards and forms circle, by two magnet rings 12
Between magnetic force be overlapped mutually, increase magnet ring 12 magnetic force, while by the magnetic force of magnet ring 12 offset spring 6 elastic force, same to hour hands
First 2 can also slowly move down.
Wherein, the outside of the magnet ring 12 is fixedly connected with sliding bar 13, and the end of the sliding bar 13 is rotatably connected to
Positioning ring 14, the top of the positioning ring 14 are fixedly connected with cutting ferrule 16, and the two sides of the cutting ferrule 16 are fixedly connected with support plate
17, the end of the support plate 17 is fixedly connected with the side of casing 1, and the bottom of the support plate 17 is equipped with buffer stopper 18,
The bottom of buffer stopper 18 is in contact with the end of support rod 8, and the material of the buffer stopper 18 is rubber block, and 18 bottom of buffer stopper
Shape be semicircle shape, allow magnet ring 12 to move different angles, while limiting to support rod 8, control syringe needle 2
Wherein, the bottom of described sleeve pipe 1 is fixedly connected with correcting ring 3, outside the diameter and syringe needle 2 of 3 inner ring of correcting ring
The diameter of circle matches, and the end thread of the locating rod 10 is connected with the nut 15 outside positioning seat 9, the nut 15
Diameter be greater than the diameter of positioning seat 9 and 10 joint of locating rod, syringe needle 2 can remain vertical state by correcting ring 3,
The syringe needle 2 of slight curves simultaneously can exert oneself to calibrate syringe needle 2 by correcting ring 3, so that syringe needle 2 remains vertical
Working principle, syringe needle 2 move down, and by syringe needle 2 and wafer contacts, in the moment of contact, syringe needle 2 is connect by wafer
The dynamics of touching jacks up upwards, and sliding shoe 5 is moved up to certain position, and sliding shoe 5 drives support rod 8 to moving up again at this time
Dynamic, then support rod 8 drives positioning plate 11 to tilt down, then sliding bar 13 is driven to rotate, and two magnet rings 12 are become parallel shape
State, then magnet ring 12 is converted to magnetic patch 7 and is attracted each other, and offsets the elastic force of spring 6, and it is brilliant that syringe needle 2 is slowly moved down to contact
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.