CN110488177A - A kind of semiconductor probe testboard probe - Google Patents

A kind of semiconductor probe testboard probe Download PDF

Info

Publication number
CN110488177A
CN110488177A CN201910767291.XA CN201910767291A CN110488177A CN 110488177 A CN110488177 A CN 110488177A CN 201910767291 A CN201910767291 A CN 201910767291A CN 110488177 A CN110488177 A CN 110488177A
Authority
CN
China
Prior art keywords
syringe needle
probe
ring
casing
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910767291.XA
Other languages
Chinese (zh)
Other versions
CN110488177B (en
Inventor
施林荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN SENMEI XIEER TECHNOLOGY Co.,Ltd.
Original Assignee
施林荣
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 施林荣 filed Critical 施林荣
Priority to CN201910767291.XA priority Critical patent/CN110488177B/en
Publication of CN110488177A publication Critical patent/CN110488177A/en
Application granted granted Critical
Publication of CN110488177B publication Critical patent/CN110488177B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06722Spring-loaded
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06794Devices for sensing when probes are in contact, or in position to contact, with measured object
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Abstract

The present invention relates to technical field of integrated circuits, and disclose a kind of semiconductor probe testboard probe, including casing, syringe needle, syringe needle is mounted on the bottom of casing, the inside of described sleeve pipe is fixedly installed with locating piece, the end of the syringe needle is fixedly connected with the sliding shoe positioned inside pipe casing, is equipped with spring between the locating piece and sliding shoe.So that when impact dynamics of the syringe needle by plummer, it can shrink inwardly moment, so that syringe needle is optimized for Elastic Contact by traditional hard contact, enable the position of the adaptive wafer of syringe needle, so that syringe needle is in use, automatically shrink or expand different positions, syringe needle can contact the different position of wafer simultaneously, when syringe needle is impacted, automatic shrink slows down the impact force being subject to, utilize the effect of elastic force, slow down the distortion power of syringe needle, so that syringe needle is in use, remain vertical state, the different position of wafer can be contacted simultaneously, to improve accuracy of the wafer in test.

Description

A kind of semiconductor probe testboard probe
Technical field
The present invention relates to technical field of integrated circuits, specially a kind of semiconductor probe testboard probe.
Background technique
Probe station is mainly used in semicon industry, photovoltaic industry, integrated circuit and the test of encapsulation, is widely used in The research and development of complicated, high speed device Precise Electric Measurement, it is intended to ensure quality and reliability, and reduce research and development time and device system Make the cost of technique.
In IC industrial chain, integrated circuit testing is that only one is produced through integrated circuit and using overall process Industry, IC design can put into volume production not over the validation test of prototype: in volume production, if wafer does not have By the middle survey of Probe test station, can not be just packaged in next process;And the finished product test after encapsulating is at survey The finishing operation of IC products, the circuit of only test passes is likely to dispatch from the factory as formal IC products, existing There is the working principle of Probe test station semiconductor probe are as follows: in test, wafer is adsorbed on plummer by vacuum chuck, and It is aligned with probe electroprobe, then probe is in contact with each pad of chip, electroprobe side view electricity under the driving of power supply Road simultaneously records test result, judges wafer quality degree, probe in use for some time, due to probe processing and use process In fine difference, cause probe that cannot lead to wafer during the test in same level, the difference by position height Different, the lower probe of portion can directly contact wafer, and the higher probe of portion can not contact wafer, lead to wafer In test, there is difference in test result, and part wafer is unable to test, and when the higher probe contact wafer in position, causes position Lower probe direct collision wafer is set, probe tip is caused to stab surface layer, causes finished product pin welding matter after chip and encapsulation It is poor to measure, and easily causes short circuit, influences final testing result, while position is not added in same level, operator will hold The speed mode that microscope carrier rises is too fast, and wafer directly hits probe, and the end stress of probe is caused to be bent, be broken, part probe It directly cracks, and after wafer stress, surface is directly stabbed, further influences the test of wafer, the result measured can not accomplish Precision, influences the normal judgement of wafer.
Summary of the invention
For the deficiency of above-mentioned background technique, the present invention provides a kind of semiconductor probe testboard probes, have survey Stable, adaptable advantage is tried, solves the problems, such as background technique proposition.
The invention provides the following technical scheme: a kind of semiconductor probe testboard probe, including casing, syringe needle, syringe needle It is mounted on the bottom of casing, the inside of described sleeve pipe is fixedly installed with locating piece, and the end of the syringe needle, which is fixedly connected with, to be located at The sliding shoe of inside pipe casing is equipped with spring between the locating piece and sliding shoe, magnetic patch is equipped on the sliding shoe, described The support rod positioned at magnetic patch two sides is fixedly connected at the top of sliding shoe, the side of the support rod is fixedly connected with positioning seat, The inside of the positioning seat is fixedly connected with locating rod, and the end of the locating rod is fixedly connected with positioning plate, the positioning plate End be fixedly connected with magnet ring, the magnet ring and magnetic patch are different grade attracting state.
Preferably, the elastic force of the spring is greater than magnetic patch and the attracting dynamics of magnet ring, and the quantity of the magnet ring is two, and two The shape of a magnet ring is semicircle, and is formed after two magnet rings merging round.
Preferably, sliding bar is fixedly connected on the outside of the magnet ring, the end of the sliding bar is rotatably connected to positioning Ring is fixedly connected with cutting ferrule at the top of the positioning ring, and the two sides of the cutting ferrule are fixedly connected with support plate, the support plate End is fixedly connected with the side of casing, and the bottom of the support plate is equipped with buffer stopper, and the material of the buffer stopper is rubber Block, and the shape of buffer stopper bottom is semicircle shape.
Preferably, the bottom of described sleeve pipe is fixedly connected with correcting ring, the diameter of the correcting ring inner ring and syringe needle outer ring Diameter match, the end thread of the locating rod is connected with the nut outside positioning seat, and the diameter of the nut is big In the diameter of positioning seat and locating rod joint.
The present invention have it is following the utility model has the advantages that
1, semiconductor probe testboard probe, by the cooperation between sliding shoe and spring, so that syringe needle is held It when the impact dynamics of microscope carrier, can shrink inwardly moment, so that syringe needle is optimized for Elastic Contact by traditional hard contact, so that needle Different positions is shunk or expanded automatically, while syringe needle can so that syringe needle is in use in the position of the adaptive wafer of head energy To contact the different position of wafer, when syringe needle is impacted, automatic shrink slows down the impact force being subject to, and utilizes the work of elastic force With slowing down the distortion power of syringe needle, so that syringe needle is in use, remain vertical state, while it is different to contact wafer Position, to improve accuracy of the wafer in test.
2, semiconductor probe testboard probe, by the cooperation between support rod, locating rod and magnet ring, so that syringe needle In contraction process, magnet ring is jacked up and is restored to steady state, is attracted each other so that being converted between magnet ring and magnetic patch, so that magnetic The dynamics adsorbed between block offsets the elastic force of spring, so that speed slows down when syringe needle is expanded downwards, so that the end of syringe needle is slow Wafer is contacted, on the one hand to slow down the downward dynamics of syringe needle, on the other hand prevents syringe needle and stab wafer, so that wafer is being tested When, remain that efficient, stable state is tested.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention;
Fig. 2 is the partial structural diagram of Fig. 1;
Fig. 3 is the overlooking structure diagram of positioning ring;
Fig. 4 is existing structure schematic diagram.
In figure: 1, casing;2, syringe needle;3, correcting ring;4, locating piece;5, sliding shoe;6, spring;7, magnetic patch;8, support rod; 9, positioning seat;10, locating rod;11, positioning plate;12, magnet ring;13, sliding bar;14, positioning ring;15, nut;16, cutting ferrule;17, Support plate;18, buffer stopper.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
It please refers to Fig. 1-3, a kind of semiconductor probe testboard probe, including casing 1, syringe needle 2, syringe needle 2 and is mounted on set The bottom of pipe 1, the inside of described sleeve pipe 1 are fixedly installed with locating piece 4, and the inner wall of locating piece 4 is to be slidably connected with syringe needle 2, make Different positions can be slided by obtaining syringe needle 2, and the end of the syringe needle 2 is fixedly connected with the sliding shoe 5 inside casing 1, sliding The outer wall of motion block 5 and the inner wall of casing 1 are slidably connected, and sliding shoe 5 is allowed to move different positions, the locating piece 4 with Spring 6 is installed, spring 6 is to be pulled up state, drives syringe needle 2 flexible using the rebound of spring 6, described between sliding shoe 5 Magnetic patch 7 is installed, the top of the sliding shoe 5 is fixedly connected with the support rod 8 positioned at 7 two sides of magnetic patch, the branch on sliding shoe 5 The side of strut 8 is fixedly connected with positioning seat 9, and the inside of the positioning seat 9 is fixedly connected with locating rod 10, the locating rod 10 End be fixedly connected with positioning plate 11, the end of the positioning plate 11 is fixedly connected with magnet ring 12, the magnet ring 12 and magnetic patch 7 For different grade attracting state, the screen resilience of spring 6 is offset using attracting magnetic force, is slowed down the dynamics of the downslide of syringe needle 2, is avoided syringe needle 2 Stress bending, influences the normal use of syringe needle 2.
Wherein, the elastic force of the spring 6 is greater than magnetic patch 7 and the attracting dynamics of magnet ring 12, and the quantity of the magnet ring 12 is two A, the shape of two magnet rings 12 is semicircle, can also be by support rod 8 using the dynamics repelled each other between two magnet rings 12 It is jacked up after certain position, the movement of bar 8 easy to support, and two magnet rings 12 merge upwards and forms circle, by two magnet rings 12 Between magnetic force be overlapped mutually, increase magnet ring 12 magnetic force, while by the magnetic force of magnet ring 12 offset spring 6 elastic force, same to hour hands First 2 can also slowly move down.
Wherein, the outside of the magnet ring 12 is fixedly connected with sliding bar 13, and the end of the sliding bar 13 is rotatably connected to Positioning ring 14, the top of the positioning ring 14 are fixedly connected with cutting ferrule 16, and the two sides of the cutting ferrule 16 are fixedly connected with support plate 17, the end of the support plate 17 is fixedly connected with the side of casing 1, and the bottom of the support plate 17 is equipped with buffer stopper 18, The bottom of buffer stopper 18 is in contact with the end of support rod 8, and the material of the buffer stopper 18 is rubber block, and 18 bottom of buffer stopper Shape be semicircle shape, allow magnet ring 12 to move different angles, while limiting to support rod 8, control syringe needle 2 Trend.
Wherein, the bottom of described sleeve pipe 1 is fixedly connected with correcting ring 3, outside the diameter and syringe needle 2 of 3 inner ring of correcting ring The diameter of circle matches, and the end thread of the locating rod 10 is connected with the nut 15 outside positioning seat 9, the nut 15 Diameter be greater than the diameter of positioning seat 9 and 10 joint of locating rod, syringe needle 2 can remain vertical state by correcting ring 3, The syringe needle 2 of slight curves simultaneously can exert oneself to calibrate syringe needle 2 by correcting ring 3, so that syringe needle 2 remains vertical State.
Working principle, syringe needle 2 move down, and by syringe needle 2 and wafer contacts, in the moment of contact, syringe needle 2 is connect by wafer The dynamics of touching jacks up upwards, and sliding shoe 5 is moved up to certain position, and sliding shoe 5 drives support rod 8 to moving up again at this time Dynamic, then support rod 8 drives positioning plate 11 to tilt down, then sliding bar 13 is driven to rotate, and two magnet rings 12 are become parallel shape State, then magnet ring 12 is converted to magnetic patch 7 and is attracted each other, and offsets the elastic force of spring 6, and it is brilliant that syringe needle 2 is slowly moved down to contact Circle.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding And modification, the scope of the present invention is defined by the appended.

Claims (4)

1. a kind of semiconductor probe testboard probe, including casing (1), syringe needle (2), syringe needle (2) are mounted on the bottom of casing (1) Portion, it is characterised in that: the inside of described sleeve pipe (1) is fixedly installed with locating piece (4), and the end of the syringe needle (2) is fixedly connected Have and be located at casing (1) internal sliding shoe (5), spring (6), the cunning are installed between the locating piece (4) and sliding shoe (5) It is equipped on motion block (5) magnetic patch (7), the support rod positioned at magnetic patch (7) two sides is fixedly connected at the top of the sliding shoe (5) (8), the side of the support rod (8) is fixedly connected with positioning seat (9), and the inside of the positioning seat (9) is fixedly connected with positioning The end of bar (10), the locating rod (10) is fixedly connected with positioning plate (11), and the end of the positioning plate (11) is fixedly connected Have magnet ring (12), the magnet ring (12) and magnetic patch (7) are different grade attracting state.
2. a kind of semiconductor probe testboard probe according to claim 1, it is characterised in that: the spring (6) Elastic force is greater than magnetic patch (7) and magnet ring (12) attracting dynamics, and the quantity of the magnet ring (12) is two, two magnet rings (12) Shape be semicircle, and two magnet rings (12) merge after form it is round.
3. a kind of semiconductor probe testboard probe according to claim 1, it is characterised in that: the magnet ring (12) Outside is fixedly connected with sliding bar (13), and the end of the sliding bar (13) is rotatably connected to positioning ring (14), the positioning ring (14) it is fixedly connected at the top of cutting ferrule (16), the two sides of the cutting ferrule (16) are fixedly connected with support plate (17), the support The end of plate (17) is fixedly connected with the side of casing (1), and the bottom of the support plate (17) is equipped with buffer stopper (18), described The material of buffer stopper (18) is rubber block, and the shape of buffer stopper (18) bottom is semicircle shape.
4. a kind of semiconductor probe testboard probe according to claim 1, it is characterised in that: described sleeve pipe (1) Bottom is fixedly connected with correcting ring (3), and the diameter of correcting ring (3) inner ring and the diameter of syringe needle (2) outer ring match, described The end thread of locating rod (10) is connected with the nut (15) external positioned at positioning seat (9), and the diameter of the nut (15) is greater than The diameter of positioning seat (9) and locating rod (10) joint.
CN201910767291.XA 2019-08-20 2019-08-20 Probe for semiconductor probe test board Active CN110488177B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910767291.XA CN110488177B (en) 2019-08-20 2019-08-20 Probe for semiconductor probe test board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910767291.XA CN110488177B (en) 2019-08-20 2019-08-20 Probe for semiconductor probe test board

Publications (2)

Publication Number Publication Date
CN110488177A true CN110488177A (en) 2019-11-22
CN110488177B CN110488177B (en) 2021-06-22

Family

ID=68552221

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910767291.XA Active CN110488177B (en) 2019-08-20 2019-08-20 Probe for semiconductor probe test board

Country Status (1)

Country Link
CN (1) CN110488177B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU447654A1 (en) * 1972-06-09 1974-10-25 Харьковский Институт Радиоэлектроники Heat metering line
CN201514424U (en) * 2009-07-09 2010-06-23 安拓锐高新测试技术(苏州)有限公司 Spring probe (3) for testing semiconductor chip
CN202326868U (en) * 2011-11-09 2012-07-11 宁波德科门机器人有限公司 Electromagnetic buffer
CN103926487A (en) * 2014-04-01 2014-07-16 南京飞腾电子科技有限公司 Detection device of dipolar electronic component
CN105403826A (en) * 2016-01-04 2016-03-16 京东方科技集团股份有限公司 Test tool
CN209086291U (en) * 2018-09-24 2019-07-09 河北西五科技有限公司 A kind of test semiconductor wafer needle of solenoid actuated

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU447654A1 (en) * 1972-06-09 1974-10-25 Харьковский Институт Радиоэлектроники Heat metering line
CN201514424U (en) * 2009-07-09 2010-06-23 安拓锐高新测试技术(苏州)有限公司 Spring probe (3) for testing semiconductor chip
CN202326868U (en) * 2011-11-09 2012-07-11 宁波德科门机器人有限公司 Electromagnetic buffer
CN103926487A (en) * 2014-04-01 2014-07-16 南京飞腾电子科技有限公司 Detection device of dipolar electronic component
CN105403826A (en) * 2016-01-04 2016-03-16 京东方科技集团股份有限公司 Test tool
CN209086291U (en) * 2018-09-24 2019-07-09 河北西五科技有限公司 A kind of test semiconductor wafer needle of solenoid actuated

Also Published As

Publication number Publication date
CN110488177B (en) 2021-06-22

Similar Documents

Publication Publication Date Title
CN102435787B (en) Testing method and testing probe platform for image sensor chip
CN101249630B (en) Automatically cleaning mechanism of test interface of integrated circuit test jack and cleaning method thereof
CN110488177A (en) A kind of semiconductor probe testboard probe
CN105953695A (en) Extension height testing fixture
CN206618832U (en) A kind of floating type circuit board testing jig
CN207366601U (en) A kind of measurement jig with automatic positoning test function
TW201516413A (en) Point measurement method capable of improving detection efficiency
CN204925180U (en) A test socket for two -sided pin array semiconductor chip
TW201833562A (en) Prober and method for positioning probe tip and obtaining probe and polishing sheet contact data
CN207114648U (en) A kind of automobile electronics powered measurement jig
CN207132981U (en) A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment
CN203364957U (en) Porcelain brace insulator vibration acoustics detection test stand
CN102222632B (en) Wafer testing method and device
CN202150448U (en) Wafer supporting stage for wafer test machine
CN202196084U (en) Test probe table of image sensor chip
CN205091432U (en) The detection unit and LED chip test equipment who has this the detection unit
CN101653767B (en) Automatic sorting device of ferrules lack of machining
CN204630611U (en) A kind of integration test test unit
CN107389442A (en) Clipping anti-secondary pulse device and shock machine
CN102645145A (en) Drawn cup wall thickness detection device
CN207472528U (en) A kind of directional drop tester
CN205919770U (en) Replace broken away from experimental environment three -coordinate measuring machine of micrometer
CN209296871U (en) Semiconductor chip detection device
CN204989257U (en) Probe card
CN212989566U (en) Bidirectional semiconductor wafer test fixture

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20210528

Address after: 518000 Room 301, building C1, Hengfeng Industrial City, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province

Applicant after: SHENZHEN SENMEI XIEER TECHNOLOGY Co.,Ltd.

Address before: No. 82, yuanmengyuan Xiangmeng, Yanggong village, Jianggan District, Hangzhou City, Zhejiang Province, 310016

Applicant before: Shi Linrong

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant