CN110473848A - Heat sink and cooling system - Google Patents

Heat sink and cooling system Download PDF

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Publication number
CN110473848A
CN110473848A CN201910729195.6A CN201910729195A CN110473848A CN 110473848 A CN110473848 A CN 110473848A CN 201910729195 A CN201910729195 A CN 201910729195A CN 110473848 A CN110473848 A CN 110473848A
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China
Prior art keywords
module
groove
heat transfer
microchannel
hole
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CN201910729195.6A
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CN110473848B (en
Inventor
刘源
汤博杰
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Tsinghua University
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Tsinghua University
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Abstract

The invention discloses a kind of heat sinks, including closed heat transfer ontology, microchannel module and foam metal module, groove body is equipped in the closed heat transfer ontology, the both ends of the extending direction of the groove body are respectively equipped with and the external opening being connected to of the closed heat transfer ontology, the groove body is for the heat transfer medium that circulates, the microchannel module and the foam metal module are set in the groove body, multiple through-holes are equipped in the microchannel module, the through-hole extends along the extending direction of the groove body, multiple foam holes are equipped in the foam metal module, the at least partly described foam hole in the multiple foam hole is interconnected.The invention also discloses a kind of cooling systems.

Description

Heat sink and cooling system
Technical field
The present invention relates to thermal control technical fields, more particularly to a kind of heat sink and cooling system.
Background technique
Core of the electronic chip as processor, in the devices such as high-performance computer, radar, high power laser transmitter Play key player.In precision instrument, such as space industry, novel spacecraft is constantly to miniaturization, integrated and modular Direction is developed, and the power density of various spaceborne devices constantly increases, the thermal control problem of high heat flux density and microminiature Primary Component Become important topic urgently to be solved.
Conventional air-cooled radiator (is less than 80W/cm since heat-sinking capability is limited2), it is close to can no longer meet higher hot-fluid The cooling requirements of electronic component device are spent, and currently used heat pipe heat radiation technology is in deep space exploration, spaceborne High-Power Microwave, star It carries the fields such as laser and also receives certain restrictions.
Summary of the invention
Based on this, it is necessary to which providing a kind of has relative to traditional heat-dissipating device with the high coefficient of heat transfer and high heat exchange efficiency Heat sink and cooling system.
A kind of heat sink, including closed heat transfer ontology, microchannel module and foam metal module, the closed heat transfer is originally Groove body is equipped in body, the both ends of the extending direction of the groove body are respectively equipped with opens with what the outside of the closed heat transfer ontology was connected to Mouthful, the groove body is set in the groove body for the heat transfer medium that circulates, the microchannel module and the foam metal module, Multiple through-holes are equipped in the microchannel module, the through-hole extends along the extending direction of the groove body, the foam metal mould Multiple foam holes are equipped in block, at least partly described foam hole in the multiple foam hole is interconnected.
The quantity of the microchannel module is multiple, the quantity of the foam metal module in one of the embodiments, To be multiple, multiple microchannel modules and multiple foam metal modules are arranged along the extending direction interval of the groove body.
Multiple extending directions perpendicular to the groove body are equipped in the microchannel module in one of the embodiments, to prolong The slot segmentation stretched, the slot segmentation will be perpendicular to the groove body extending direction arrangement multiple through-holes between be connected to.
The inside and/or surface of the microchannel module is arranged in the slot segmentation in one of the embodiments,.
In one of the embodiments, on the extending direction of the groove body, the width of the slot segmentation and described micro- logical The ratio of the length of road module is (0.3~1): (25~35);On the depth direction of the slot segmentation, the depth of the slot segmentation The ratio of degree and the length of the microchannel module is (3~6): (20~30);It is described on the length direction of the slot segmentation The ratio of the length of slot segmentation and the height of the microchannel module is (0.7~1): 1.
The microchannel module and/or the foam metal module pass through diffusion welding (DW) mode in one of the embodiments, It is connect with the inner surface of the groove body.
The material of the closed heat transfer ontology is selected from one of copper and aluminium or a variety of, institute in one of the embodiments, The material for stating microchannel module is selected from one of copper and aluminium or a variety of, and the material of the foam metal module is in copper and aluminium It is one or more.
The aperture of the through-hole is 300 μm to 600 μm in one of the embodiments, is circulated in the groove body described Heat transfer medium is water and/or alcohols;Or
The aperture of the through-hole is 600 μm to 900 μm, and the heat transfer medium to circulate in the groove body is liquid metal liquid Or liquid alloy.
The porosity of the microchannel module is 30% to 60% in one of the embodiments, the foam metal mould The porosity of block is 60% to 96%, and the hole density of the foam metal module is 10ppi to 40ppi.
A kind of cooling system, including heat sink, liquid cooling apparatus, tube body and water pump, the water pump are set to the heat absorption Between device and the liquid cooling apparatus, the liquid cooling apparatus is described for the cooling heat transfer medium entered in the liquid cooling apparatus Heat sink, the liquid cooling apparatus and the water pump connect to form close access by the tube body, and the heat sink is upper The heat sink stated.
The heat sink of the invention includes microchannel module and foam metal module, to radiating element can with it is closed The outer surface of heat transfer ontology contradicts or connection, by realizing circulation of the heat transfer medium in the groove body of heat sink to radiator Part, it is closed heat transfer ontology and heat transfer medium between heat exchange, thus by the heat transfer of radiating element to heat transfer medium reality Now to the cooling of radiating element.Multiple through-holes being extended along groove body extending direction, foam metal are equipped in microchannel module Module is foam cavernous structure, can increase the contact area of heat sink and heat transfer medium, improves heat sink unit volume Interior heat exchange amount, to improve the heat exchange efficiency of heat sink.The through-hole of microchannel module is arranged along groove body extending direction, so that Losing along stroke pressure for heat transfer medium is small;Foam metal module is in foam cavernous structure, and structure is complicated, can effectively change biography The flow regime of thermal medium, it is easier to form turbulent flow, heat transfer medium and foam metal module or slot can be reinforced under turbulent condition The contact and collision on internal surface, and then reinforce the effect of heat convection, improve the heat exchange efficiency of heat sink.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the heat sink of one embodiment of the invention;
Fig. 2 is the decomposition diagram of the heat sink of one embodiment of the invention;
Fig. 3 is the cross-sectional view of the heat sink of one embodiment of the invention;
Fig. 4 is the structural schematic diagram of the microchannel module of one embodiment of the invention;
Fig. 5 is the structural schematic diagram of the cooling system of one embodiment of the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, by the following examples, it and combines attached Figure, is further elaborated heat sink 100 of the invention and cooling system.It should be appreciated that tool described herein Body embodiment only to explain the present invention, is not intended to limit the present invention.
Fig. 1-4 is please referred to, the embodiment of the present invention provides a kind of heat sink, including closed heat transfer ontology 110, microchannel mould Block 120 and foam metal module 130 are equipped with groove body 114, the extension of the groove body 114 in the closed heat transfer ontology 110 of ontology The both ends in direction are respectively equipped with the external opening being connected to the ontology, and the groove body 114 is used for the heat transfer medium 500 that circulates, The microchannel module 120 and the foam metal module 130 are set in the groove body 114, in the microchannel module 120 Equipped with multiple through-holes 122, the through-hole 122 extends along the extending direction of the groove body 114, in the foam metal module 130 Equipped with multiple foam holes 132, at least partly described foam hole 132 in the multiple foam hole 132 is interconnected.
The heat sink 100 of the embodiment of the present invention includes microchannel module 120 and foam metal module 130, wait dissipate Thermal device (not shown) can be contradicted or be connect with the outer surface of closed heat transfer ontology 110, by the way that heat transfer medium 500 is absorbing heat Circulation in the groove body 114 of device 100 is realized to changing between radiating element, closed heat transfer ontology 110 and heat transfer medium 500 Heat, thus by the cooling to radiating element is realized to heat transfer medium 500 to the heat transfer of radiating element.Microchannel module Multiple through-holes 122 along the setting of 114 extending direction of groove body are equipped in 120, foam metal module 130 is 132 shape structure of foam hole, The contact area of heat sink 100 Yu heat transfer medium 500 can be increased, improve the heat exchange amount in 100 unit volume of heat sink, To improve the heat exchange efficiency of heat sink 100.The through-hole 122 of microchannel module 120 is arranged along 114 extending direction of groove body, makes It is small to obtain losing along stroke pressure for heat transfer medium 500;Foam metal module 130 is in 132 shape structure of foam hole, and structure is complicated, can be with The effective flow regime for changing heat transfer medium 500, it is easier to form turbulent flow, heat transfer medium 500 can be reinforced under turbulent condition With the contact and collision of 114 inner surface of foam metal module 130 or groove body, and then reinforce heat convection effect, improve dissipate inhale The heat exchange efficiency of thermal 100.
In one embodiment, the closed heat transfer ontology 110 may include the pedestal 112 and cover board 116 being fixedly connected, bottom For the downward concave shape in a surface of seat 112 at groove body 114, one end equipped with groove body 114 of pedestal 112 is arranged in cover board 116, is used for Groove body 114 is covered, so that groove body 114 is only equipped with opening (inlet and outlet) at the both ends of the extending direction, so that heat transfer Medium 500 circulates in closed space substantially, improves the leakproofness of heat sink 100.It the middle part of cover board 116 can be opposite It is recessed inwardly in edge, is conducive to the contact and fixation of cover board 116 with microchannel module 120 and foam metal module 130.It is described The opening at the both ends of groove body 114 can have the tube body 200 of heat transfer medium 500 to be connected with circulation respectively, 100 upstream of heat sink Heat transfer medium 500 in tube body 200 enters heat sink 100 by the import of groove body 114, will be wait dissipate by heat sink 100 The heat of thermal device is taken away, and then the outlet through groove body 114 flows into the downstream tube body 200 of heat sink 100 and realizes wait radiate The heat dissipation of device.The size and shape of cover board 116 can be adapted with the size and shape of pedestal 112, assemble heat absorption dress When setting 100, first microchannel module 120 and foam metal module 130 can be fixed in groove body 114, then by cover board 116 with Pedestal 112 connects, and can preferably be connected by diffusion welding (DW), diffusion welding (DW) can guarantee the leakproofness of entire heat sink 100.
Pedestal 112 may include central part and the edge part around center, and the surface opposed edge portions of the central part are inside Recess forms the groove body 114.Edge part can be used for connecting with cover board 116 or to radiating element.The shape of groove body 114 can be with For cuboid slot or U-lag.To radiating element can by fixed contact of lateral surface with closed heat transfer ontology 110 realize to The heat transfer of radiating element and heat sink 100.In one embodiment, the material of the closed heat transfer ontology 110 can be selected from One of copper and aluminium are a variety of.In one embodiment, the thickness of central part, the i.e. thickness of the bottom surface of groove body 114 can be 0.5mm~1mm.
It in one embodiment, can be by between thermal interfacial material (not shown) to radiating element and closed heat transfer ontology 110 Be used to closed heat transfer ontology 110 to reduce the heat transfer to radiating element to radiating element every, thermal interfacial material and The thermal contact resistance of closed heat transfer ontology 110, improves heat dissipation performance.Thermal interfacial material can be selected from heat conductive silica gel and/or thermal conductive silicon One of rouge is a variety of.To which between radiating element and closed heat transfer ontology 110 one can be fixed as by fixture (not shown) Body structure avoids so that being fitted tightly over the outer surface of closed heat transfer ontology 110 to radiating element to radiating element and closed biography Disengaging between hot ontology 110, such as card interface is being respectively set to radiating element and closed heat transfer ontology 110, pass through bolt It is connected across two card interfaces.Certainly, closed heat transfer ontology 110 and the connection type to radiating element are without being limited thereto.
In one embodiment, the quantity of the microchannel module 120 is multiple, the quantity of the foam metal module 130 To be multiple, the extending direction of multiple microchannel modules 120 and multiple foam metal modules 130 along the groove body 114 Interval setting.Foam metal module 130 is arranged at intervals between adjacent microchannel module 120 being capable of balanced adjacent microchannel mould The temperature of heat transfer medium 500 between block 120, be conducive to the through-hole 122 of heat transfer medium 500 and microchannel module 120 hole wall it Between heat convection, improve heat sink 100 overall heat exchange efficiency.In one embodiment, it can be set in the end of groove body 114 Microchannel module 120 is set, the middle part of groove body 114 can be arranged in foam metal module 130 relative to microchannel module 120, from And the flowing velocity that heat transfer medium 500 enters heat exchange outflow groove body 114 can be improved.Microchannel module 120 and foam metal mould Block 130 can substantially fill up the volume of groove body 114, improve the effective heat exchange area of heat transfer medium 500, improve heat transfer effect.
The extending direction of the through-hole 122 of microchannel module 120 can be consistent with the extending direction of groove body 114 or basic one It causes, it is so-called almost the same that is heat transfer medium 500 is in the flow direction in groove body 114 and the flow direction in through-hole 122 It is essentially identical.In one embodiment, the through-hole 122 of microchannel module 120 can be cylindrical hole or Polygonal column shape hole, preferably Cylindrical hole.The smooth velocity of liquid assets that heat transfer medium 500 can be improved in through-hole 122 of the inner surface of cylindrical hole is improved and is passed The thermal efficiency.It can be arranged in parallel between through-hole 122, be conducive to arrangement of the through-hole 122 in microchannel module 120, improved micro- logical 122 quantity of through-hole in road module 120.Multiple through-holes 122 can be uniformly distributed in microchannel module 120, to guarantee micro- The heat transfer uniformity of each position in channel module 120.The porosity of microchannel module 120 can be 30% to 60%.
In one embodiment, the microchannel module 120 and/or the foam metal module 130 can pass through diffusion welding (DW) Mode is connect with the inner surface of the groove body 114, to realize microchannel module 120 or foam metal module 130 and closed biography The direct heat transfer of hot ontology 110.Diffusion welding (DW) connection can make in the case where not adding other materials microchannel module 120 or The weld seam with higher-strength is formed between foam metal module 130 and closed heat transfer ontology 110, and weld seam is relatively narrow, can incited somebody to action Microchannel module 120 or foam metal module 130 and the thermal resistance of closed heat transfer 110 junction of ontology reduce, to improve heat transfer Efficiency reaches better heat dissipation effect.Similarly, the microchannel module 120 and/or the foam metal module 130 can be with It is connect by diffusion welding (DW) mode with the inner surface of the cover board 116.
In one embodiment, the material of the microchannel module 120 can be selected from one of copper and aluminium or a variety of.It is described The material of foam metal module 130 can be selected from one of copper and aluminium or a variety of.
Due to the limitation of through-hole 122 technology of preparing level, the length of especially through-hole 122 is longer, and 122 aperture of through-hole is smaller When, through-hole 122 may will not be completely through on length direction (i.e. the extending direction of through-hole 122), such as form lotus root shape hole, Through-hole 122, which does not penetrate through, to be likely to result in heat transfer medium 500 and can not pass through and be trapped in through-hole 122 from through-hole 122, 122 number of through-hole for reducing actual participation convection action, reduces circulation and the heat exchange efficiency of transfer medium.In an embodiment In, the slot segmentation 124 that multiple extending directions perpendicular to the groove body 114 are extended is equipped in the microchannel module 120, It is connected between multiple through-holes 122 that the extending direction that the slot segmentation 124 will be perpendicular to the groove body 114 is arranged, also It is to say that slot segmentation 124 makes on the extending direction perpendicular to the groove body 114, heat transfer medium 500 can be from a through-hole 122 It flows directly into another through-hole 124.Slot segmentation 124 can be set in the inside and/or surface of microchannel module 120.Slot segmentation Through-hole 122 is divided into multiple subsegments by 124 in the longitudinal direction, and the setting of slot segmentation 124 is so that prolonging in slot segmentation 124 It stretches between the different through-holes 122 of direction arrangement real (namely perpendicular to the different through-holes 122 of the extending direction arrangement of through-hole 122) It is now connected to, to guarantee that the through-hole 122 in substantially each subsegment all realizes perforation, the through-hole 122 of more is made to participate in convection current Effect improves the convection current performance and heat exchange efficiency of heat sink 100.Slot segmentation 124 can be located at the surface of microchannel module 120 Or/or it is internal.The shape of slot segmentation 124 can be cuboid slot, arc groove or wave-shaped groove, and arc groove or wave-shaped groove can be with The turbulent flow of heat transfer medium 500 is improved, conductivity of heat is increased.Through-hole 122 in the microchannel module 120 can pass through metal-gas Body eutectic directional solidification processes obtain.Slot segmentation 124 can be obtained by wire cutting technology.
In one embodiment, on the extending direction of groove body 114, the width of slot segmentation 124 and the length of microchannel module 120 The ratio of degree can be (0.3~1): (25~35);On the depth direction of slot segmentation 124, the depth of slot segmentation 124 is led to micro- The ratio of the length of road module 120 can be (3~6): (20~30);On the length direction of slot segmentation 124, slot segmentation 124 Length and microchannel module 120 height ratio be (0.7~1): 1.
In one embodiment, the heat transfer medium 500 can be selected from water, alcohols, low melting point liquid metal and low melting point liquid One of state alloy is a variety of.The water can be deionized water, and the alcohols can be ethyl alcohol, and the low-melting-point metal can Think that gallium, the low-melting alloy can be selected from one of gallium-indium alloy, gallium-indium-tin alloy and Na-K alloy or a variety of.
Inventor calculates the microchannel module 120 for showing the embodiment of the present invention with experimental results by a large amount of simulations Heat exchange property be affected by the aperture of through-hole 122, and the setting of the pore size of through-hole 122 and heat transfer medium 500 Type it is related.Such as the aperture of through-hole 122 is 300 μm to 600 μm, preferably 300 μm to 500 μm, more preferably 400 μm, Heat transfer medium 500 can achieve preferable heat-transfer effect when being water and/or alcohols.Or the aperture of through-hole 122 be 600 μm extremely 900 μm, preferably 700 μm to 500 μm, more preferably 800 μm, when heat transfer medium 500 is liquid metal liquid or liquid alloy It can achieve preferable heat-transfer effect.
There is the foam hole 132 of labyrinth, basic mutually interconnection between different foam hole 132 in foam metal module 130 It is logical, allow heat transfer medium 500 to circulate between the different foam hole 132 of foam metal module 130 and realize heat transfer medium Heat transfer between 500 and foam metal module 130.Foam metal module 130 can pass through investment casting, particle THROUGH METHOD The methods of be prepared.Heat transfer medium 500 passes through and changes flow direction in multiple foam holes 132, and labyrinth Foam hole 132 can change the flow direction that heat transfer medium 500 enters microchannel module 120, be conducive to the effect of heat transfer.One In embodiment, the porosity of the foam metal module 130 can be 60% to 95%, the hole of the foam metal module 130 Density can be 10ppi to 40ppi.
Referring to Fig. 5, the embodiment of the present invention also provides a kind of cooling system, including heat sink 100, liquid cooling apparatus 400, Tube body 200 and water pump 300, the water pump 300 are set between the heat sink 100 and the liquid cooling apparatus 400, the liquid Device for cooling 400 is for the cooling heat transfer medium 500 for entering the liquid cooling apparatus 400, the heat sink 100, liquid cooling dress Set 400 and the water pump 300 by the tube body 200 connection form close access.
When cooling system of the invention is for treating radiating element heat dissipation, it can be fixed to radiating element and be attached to heat absorption dress It sets on 100 closed heat transfer ontology 110, the heat issued to radiating element is conducted by heat exchange pattern to closed heat transfer ontology 110, heat transfer medium 500 enters the groove body 114 of closed heat transfer ontology 110 under the driving of water pump 300, in microchannel module 120 Through-hole 122 and foam metal module 130 foam hole 132 in flow and collided with through-hole 122 and the inner wall of foam hole 132, Carry out the closed outflow of heat transfer ontology 110 after heat convection with microchannel module 120 and foam metal module 130, then into Enter liquid cooling apparatus 400 to be cooled down, reenters next round circulation from the outflow of liquid cooling apparatus 400 through cooling heat transfer medium 500. In this process, heat transfer medium 500 is absorbed from the heat issued to radiating element, and temperature increases, the heat transfer medium of high fever 500 shed heat in liquid cooling apparatus 400, realize the heat dissipation to radiating element by closed circuit.The water pump 300 and described Liquid cooling apparatus 400 connects to power supply respectively.
In one embodiment, the tube body 200 can be selected from least one of copper tube, rubber tube and plastic tube.
Liquid cooling apparatus 400 can be the Control device of liquid cooling in traditional CPU water-cooled radiator.In one embodiment, institute Stating liquid cooling apparatus 400 can be the water tank equipped with heat transfer medium 500, and water tank can be used for connections such as fan assembly, cooling fins The heat dissipation of heat transfer medium 500 in water tank.Carry heat heat transfer medium 500 enter water tank in the heat transfer medium in water tank 500 progress heat exchanges are changed into cooling heat transfer medium 500 and flow out.Control device of liquid cooling is without being limited thereto, as long as being able to achieve Liquid is cooling.
In a specific implementation, the cooling system of the embodiment of the present invention is used to radiate to i7-6960X model C PU.The heat absorption The material of closed heat transfer ontology 110 and cover board 116 in device 100 is fine aluminium, microchannel module 120 and foam metal module 130 materials are fine copper.Heat sink 100 includes 2 microchannel module 120 and 2 foam metal modules 130, microchannel module 120 and foam metal module 130 interval setting.The size of microchannel module 120 is 25mm × 32mm × 5mm, the microchannel mould The porosity of block 120 is 48%, and average pore size is 600 μm, and the through-hole 122 of microchannel module 120 is the cylinder of parallel arrangement Hole forms 3 slot segmentations 124 with wire cutting mode in the length direction of through-hole 122, by 120 quartering of microchannel module, segmentation 124 width 0.4mm of slot, 124 depth 4mm of slot segmentation.The porosity of foam metal module 130 is 90%, hole density 20ppi.It is micro- logical Road module 120 and foam metal module 130 and 114 inner surface of groove body are diffused weldering connection.It is micro- using water as heat transfer medium 500 Channel module 120 is when groove body 114 inlet flow rate is 60mL/s, it can be achieved that when power consumption reaches 300W under the conditions of CPU is in overclocking Good heat radiating, CPU surface temperature is only 70 DEG C at this time, works normally permitted maximum temperature far below CPU.The cooling system It is equally applicable to the heat dissipation of the server CPU of other models.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.

Claims (10)

1. a kind of heat sink, which is characterized in that described including closed heat transfer ontology, microchannel module and foam metal module Groove body is equipped in closed heat transfer ontology, the both ends of the extending direction of the groove body are respectively equipped with outer with the closed heat transfer ontology The opening of portion's connection, for the heat transfer medium that circulates, the microchannel module and the foam metal module are set to the groove body In the groove body, multiple through-holes are equipped in the microchannel module, the through-hole extends along the extending direction of the groove body, described Multiple foam holes are equipped in foam metal module, at least partly described foam hole in the multiple foam hole is interconnected.
2. heat sink according to claim 1, which is characterized in that the quantity of the microchannel module be it is multiple, it is described The quantity of foam metal module be it is multiple, multiple microchannel modules and multiple foam metal modules are along the groove body The setting of extending direction interval.
3. heat sink according to claim 1 or 2, which is characterized in that be equipped in the microchannel module multiple vertical In the slot segmentation that the extending direction of the groove body extends, the slot segmentation will be perpendicular to the more of the extending direction arrangement of the groove body It is connected between a through-hole.
4. heat sink according to claim 3, which is characterized in that the microchannel module is arranged in the slot segmentation Internal and/or surface.
5. heat sink according to claim 4, which is characterized in that on the extending direction of the groove body, the segmentation The ratio of the length of the width of slot and the microchannel module is (0.3~1): (25~35);In the depth side of the slot segmentation Upwards, the ratio of the depth of the slot segmentation and the length of the microchannel module is (3~6): (20~30);In the segmentation On the length direction of slot, the ratio of the height of the length of the slot segmentation and the microchannel module is (0.7~1): 1.
6. heat sink described in any one of according to claim 1~2 and 4~5, which is characterized in that the microchannel mould Block and/or the foam metal module are connect by diffusion welding (DW) mode with the inner surface of the groove body.
7. heat sink described in any one of according to claim 1~2 and 4~5, which is characterized in that the closed heat transfer The material of ontology is selected from one of copper and aluminium or a variety of, and the material of the microchannel module is selected from one of copper and aluminium or more Kind, the material of the foam metal module is selected from one of copper and aluminium or a variety of.
8. heat sink described in any one of according to claim 1~2 and 4~5, which is characterized in that the hole of the through-hole Diameter is 300 μm to 600 μm, and the heat transfer medium to circulate in the groove body is water and/or alcohols;Or
The aperture of the through-hole is 600 μm to 900 μm, and the heat transfer medium to circulate in the groove body is liquid metal liquid or liquid State alloy.
9. heat sink described in any one of according to claim 1~2 and 4~5, which is characterized in that the microchannel mould The porosity of block is 30% to 60%, and the porosity of the foam metal module is 60% to 96%, the foam metal module Hole density be 10ppi to 40ppi.
10. a kind of cooling system, which is characterized in that including heat sink, liquid cooling apparatus, tube body and water pump, the water pump setting Between the heat sink and the liquid cooling apparatus, the liquid cooling apparatus is for the cooling heat transfer entered in the liquid cooling apparatus Medium, the heat sink, the liquid cooling apparatus and the water pump connect to form close access by the tube body, the heat absorption Device is such as the described in any item heat sinks of claim 1-9.
CN201910729195.6A 2019-08-08 2019-08-08 Heat absorbing device and heat dissipation system Active CN110473848B (en)

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DE10346423A1 (en) * 2003-10-07 2005-05-19 M.Pore Gmbh Modular heat exchanger for e.g. hot water boiler, electronic assemblies has heat conducting rods embedded within a metal foam structure
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CN109768020A (en) * 2018-11-26 2019-05-17 清华大学 A kind of novel microchannel cold plates

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CN109768020A (en) * 2018-11-26 2019-05-17 清华大学 A kind of novel microchannel cold plates

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