CN110429153A - 一种叠片组件互联结构及其制作方法 - Google Patents
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Abstract
本发明公开了一种叠片组件互联结构,叠瓦小片的正面电极与相邻叠瓦小片的背面电极通过锡膏连接,所述锡膏采用间隔方式涂设或印刷在正面电极和背面电极之间,锡膏的熔点小于160°;所述锡膏为铟锡银合金,其中,铟含量占铟锡银总质量的40‑60%,锡含量占铟锡银总质量的40‑60%,银含量占铟锡银总质量的0.5‑3.9%。本发明设计的低熔点的锡膏,采用高电导率焊锡合金低熔点锡膏,增强组件的可靠性,锡膏采用铟锡银、锡铋、锡银或铟锡中的一种或者多种合金成分制成,其独特的成分配比,使得锡膏制作成本较含有贵金属银的导电胶低,大大降低了生产成本,提升企业的产品竞争力。
Description
技术领域
本发明涉及太阳能电池组件封装制造应用技术领域,具体为一种叠片组件互联结构及其制作方法。
背景技术
随着全球煤炭、石油、天然气等常规化石能源消耗速度加快,生态环境不断恶化,特别是温室气体排放导致日益严峻的全球气候变化,人类社会的可持续发展已经受到严重威胁。考虑到不可再生能源的存量有限,并且常规化石能源带来严重的环境污染,世界各国纷纷制定各自的能源发展战略,以应对常规化石能源资源的有限性和开发利用带来的环境问题。在这种世界潮流之下,太阳能凭借其可靠性、安全性、广泛性、长寿性、环保性、资源充足性的特点已成为最重要的可再生能源之一,有望成为未来全球电力供应的主要支柱。
在大力推广和使用太阳能绿色能源的背景下,经科研人员研究发现,叠片组件技术能明显提升组件功率。叠片技术通过特殊图形设计,将整片太阳能电池重新切割成小的图形,再将相邻或效率及外观等一致性较好的电池若干片利用导电胶粘合起来或由电池片表面载流子传输通道直接物理贴合,从而制造成组件。叠片技术通过对组件结构的优化,减少互联条,能够降低组件损耗,提升组件的输出功率。
当前叠片组件主流工艺使用导电胶粘剂互联切割后的电池片,导电胶主要由导电相和粘接相构成并完成互联电池间的电流传输。其中导电相主要由贵金属组成,如纯银颗粒或银包铜、银包镍、银包玻璃等颗粒。颗粒形状和分布以满足最优的电传导为基准,目前更多采用D50<10um级的片状或类球型组合银粉居多。粘接相主要有具有耐候性的高分子树脂类聚合物构成,通常根据粘接强度和耐候稳定性选择丙烯酸树脂、有机硅树脂、环氧树脂、聚氨酯等。为了使导电胶粘接达到较低的接触电阻和较低的体积电阻率及高粘接并且保持长期优良的耐候特性,一般导电胶厂家会通过导电相和粘接相配方的设计完成,从而保证叠片组件在初始阶段环境侵蚀测试和长期户外实际应用下性能的稳定性。叠片组件相比于常规合金化互联的组件实际规模化应用年数较少,当前属于一种全新的组件产品,产品自身的可靠性需要长期户外综合老化后才能得到验证。
目前,叠片组件中电池片的电极之间的导电材料包括导电胶、焊带或锡膏等材料。其中,焊带主要为锡铅焊带,该类焊带焊接温度高且对环境有害,易导致电池片隐裂和破片;导电胶主要由导电相和粘接相构成,其中粘接相主要有具有耐候性的高分子树脂类聚合物构成,通常根据粘接强度和耐候稳定性选择丙烯酸树脂、有机硅树脂、环氧树脂、聚氨酯等,导电相主要由贵金属组成,如纯银颗粒或银包铜、银包镍、银包玻璃等颗粒。但由于银是一种贵金属,导致导电胶成本十分昂贵,而传统锡膏需要焊接温度高,同时韧性差,热应力较大,降低了电池的可靠性。
发明内容
本发明的目的在于提供一种叠片组件互联结构及其制作方法,以解决上述背景技术中提出的问题。
为实现上述目的,本发明提供如下技术方案:
一种叠片组件互联结构,包括叠瓦小片,所述叠瓦小片的小片正面印刷有正面电极,所述叠瓦小片的小片背面印刷有背面电极,叠瓦小片的正面电极与相邻叠瓦小片的背面电极通过锡膏连接,所述锡膏采用间隔方式涂设或印刷在正面电极和背面电极之间,锡膏的熔点小于160°;
所述锡膏为铟锡银合金,铟锡银合金由铟、锡、银三种合金元素组成,其中,铟含量占铟锡银总质量的40-60%,锡含量占铟锡银总质量的40-60%,银含量占铟锡银总质量的0.5-3.9%。
优选的,所述锡膏通过锡铋合金替代铟锡银合金,其中,锡含量占锡铋总质量的40-42%,铋含量占锡铋总质量的58-59%。
优选的,所述锡膏通过锡银合金替代铟锡银合金,其中,锡含量占锡银总质量的96-97%,银含量占锡银总质量的3-4%。
优选的,所述锡膏通过铟锡合金替代铟锡银合金,其中,铟含量占铟锡总质量的52-54%,锡含量占铟锡总质量的45-48%。
优选的,所述锡膏通过铟锡银、锡铋、锡银或铟锡中任意两种或两种以上进行组合形成。
优选的,所述锡膏的横截面设置为椭圆形、梯形或方形。
一种叠片组件制作方法,包括以下步骤:
S1、对经过正常工序制作的电池片进行丝网印刷,在电池片的正面印刷上多根正面电极和正面栅线,在电池片的背面印刷上多根背面电极;
S2、经过丝网印刷完成正、背面印刷后,使得印刷图形在电池片切割后,保证每块叠瓦小片的正面电极、背面电极分别印刷在正、背面的交错位置;
S3、采用间隔定量涂布或者丝网印刷的方式,通过锡膏将叠瓦小片的正面电极和背面电极进行分区域连接,实现叠瓦小片的互联组串。
与现有技术相比,本发明的有益效果是:
本发明设计的低熔点的锡膏,在低温条件下进行电池片电极之间的互联,同时设计不同焊接点的形状,增加叠片后电池串的柔韧性,降低热应力,采用高电导率焊锡合金低熔点锡膏,通过丝网印刷或者定量涂布方式,实现锡膏分区域使小片间合金化互联,增强组件的可靠性,锡膏采用铟锡银、锡铋、锡银或铟锡中的一种或者多种合金成分制成,其独特的成分配比,使得锡膏制作成本较含有贵金属银的导电胶低,大大降低了生产成本,提升企业的产品竞争力。
附图说明
图1为本发明的互联结构示意图;
图2为本发明的叠瓦组件互联示意图;
图3为本发明的叠瓦小片的小片背面结构示意图。
图中:1叠瓦小片、2小片正面、3正面电极、4锡膏、5小片背面、6背面电极。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
请参阅图1-3,本发明提供一种技术方案:
一种叠片组件互联结构,包括多块通过切割获得的叠瓦小片1,叠瓦小片1的小片正面2印刷有一根正面电极3,以及正面栅线,叠瓦小片1的小片背面5印刷有一根背面电极6,如说明书附图2所示,每一块叠瓦小片1的正面电极3与相邻另一块叠瓦小片1的背面电极6通过锡膏4连接,锡膏4采用间隔方式涂设或印刷在正面电极3和背面电极6之间,按照非连续低应力进行设计,锡膏4可以涂设或印刷在正面电极3上或者背面电极6上,锡膏4的横截面设置为椭圆形、梯形或者方形,其中椭圆形的设置,使得锡膏4在两块叠瓦小片1的接触互联过程中,相比较常用锡膏的设置,本申请椭圆形的互联效果更好,锡膏4的熔点小于160°,使用低熔点的锡膏4,在低温条件下进行电池片电极之间的互联,可以增加叠片后电池串的柔韧性,降低热应力。
其中,锡膏4通过铟锡银、锡铋、锡银或铟锡中的一种或者多种组成。
实施例1:锡膏4为铟锡银合金,铟锡银合金由铟、锡、银三种合金元素组成,其中;铟含量占铟锡银总质量的50%,锡含量占铟锡银总质量的48%,银含量占铟锡银总质量的2%。
实施例1-1:锡膏4为铟锡银合金,铟锡银合金由铟、锡、银三种合金元素组成,其中;铟含量占铟锡银总质量的40%,锡含量占铟锡银总质量的59%,银含量占铟锡银总质量的1%。
实施例1-2:锡膏4为铟锡银合金,铟锡银合金由铟、锡、银三种合金元素组成,其中;铟含量占铟锡银总质量的58%,锡含量占铟锡银总质量的40.5%,银含量占铟锡银总质量的1.5%。
实施例2:锡膏4为锡铋合金,锡铋合金由锡、铋合金元素组成,其中,锡含量占锡铋总质量的42%,铋含量占锡铋总质量的58%。
实施例3:锡膏4通过锡银合金,锡银合金由锡、银合金元素组成,其中,锡含量占锡银总质量的96.5%,银含量占锡银总质量的3.5%。
实施例4:锡膏4通过铟锡合金替代铟锡银合金,其中,铟含量占铟锡总质量的52%,锡含量占铟锡总质量的48%。
实施例5:锡膏4为铟锡银合金和锡铋合金的组合,其中,铟锡银合金为实施例一中相同配比的合金,锡铋合金为实施例二中相同配比的合金,铟锡银合金和锡铋合金各占总质量的50%。
实施例6:锡膏4铟锡银合金、锡银合金和铟锡合金的组合,其中,铟锡银合金为实施例一中相同配比的合金,锡银合金为实施例三中相同配比的合金,铟锡合金为实施例四中相同配比的合金,铟锡银合金占总质量的50%,锡银合金和铟锡合金分别占总质量的25%。
上述实施例1至6中的锡膏4在制作完成后,均可以很好的实现增加叠片后电池串的柔韧性,并且增强组件的可靠性。
制作一种带有上述互联结构的叠片组件,即叠片组件的制作方法,需要经过以下步骤:
S1、采用单晶硅片经过表面制绒获得良好的绒面结构,从而实现增大比表面积可以接受更多光子,同时减少入射光的反射;
S2、清洗制绒时残留的液体,减少酸性和碱性物质对电池制结的影响;
S3、通过三氯氧磷和硅片进行反应,得到磷原子,经过一定时间,磷原子进入硅片的表面层,并且通过硅原子之间的空隙向硅片内部渗透扩散,形成了N型半导体和P型半导体的交界面,完成扩散制结工序,实现光能到电能的转换;
S4、由于扩散制结在硅片边缘形成了短路通道,PN结的正面所收集到的光生电子会沿着边缘扩散有磷的区域流到PN结的背面,而造成短路,经过等离子刻蚀将边缘PN结刻蚀去除,避免边缘造成短路,可以增加SE工艺步骤;
S5、由于扩散制结工序会使硅片表面形成一层磷硅玻璃,通过去磷硅玻璃工序减少对叠瓦电池效率的影响;
S6、对刻蚀后的硅片,然后通过一定温度下,通过氧气高温炉对电池片正、背面生产一层二氧化硅层;
S7、然后通过ALD或者PECVD方式层积一层三氧化二铝钝化膜层;
S8、在三氧化二铝钝化膜层上层积一层氮化硅膜层,正面氮化硅膜层用来减少反射及钝化作用,背面氮化硅膜层用来保护三氧化二铝钝化膜层;
S9、对镀膜后的硅片背面进行激光开槽;
S10、经过丝网印刷完成背面和正面印刷,使得印刷图形切割后的叠瓦小片1的正面电极3、背面电极6印刷在正、背面的交错位置,然后进行烧结工艺;
S11、通过光衰炉或者电注入炉,减少电池的光致衰减;
S12、最后进行电池测试分档;
S13、对于烧结好的整片叠瓦电池片增加在线激光切割划片工序,烧结好的叠瓦电池片进入划片检测位进行外观检查并对OK片进行视觉定位,根据在线生产节拍可以自由设置多轨划片机或预设缓存堆栈区,以实现在线连续进料作业,按照切割划片最优效果设定激光器相关参数,以实现较快的切割速度、较窄的切割热影响区和切割线宽、更优的均匀性以及预定的切割深度,完成自动切割后通过在线激光划片机自动掰片机构完成切割位置处裂片实现叠瓦小电池片自然分离,完成切割;
其中,激光切割面为远离PN结侧,避免PN结受损出现漏电流,需要划片上料前确认电池片正反面方向,若方向相反需增加单独的180°换向装置;
S14、通过间隔定量涂布或者丝网印刷的方式,通过锡膏4将叠瓦小片1的正面电极3和背面电极6进行分区域连接;
S15、然后对叠瓦小片1进行互联组串,通过固化炉或者热板进行合金化;
S16、做串后并经过串自动排版汇流、胶膜和背板敷设、中检、层压、修边、装框、中间位接线盒、固化、清洗、测试等环节完成叠瓦光伏组件封装。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。
Claims (7)
1.一种叠片组件互联结构,包括叠瓦小片(1),所述叠瓦小片(1)的小片正面(2)印刷有正面电极(3),所述叠瓦小片(1)的小片背面(5)印刷有背面电极(6),其特征在于:叠瓦小片(1)的正面电极(3)与相邻叠瓦小片(1)的背面电极(6)通过锡膏(4)连接,所述锡膏(4)采用间隔方式涂设或印刷在正面电极(3)和背面电极(6)之间,锡膏(4)的熔点小于160°;
所述锡膏(4)为铟锡银合金,铟锡银合金由铟、锡、银三种合金元素组成,其中,铟含量占铟锡银总质量的40-60%,锡含量占铟锡银总质量的40-60%,银含量占铟锡银总质量的0.5-3.9%。
2.根据权利要求1所述的一种叠片组件互联结构,其特征在于:所述锡膏(4)通过锡铋合金替代铟锡银合金,其中,锡含量占锡铋总质量的40-42%,铋含量占锡铋总质量的58-59%。
3.根据权利要求1所述的一种叠片组件互联结构,其特征在于:所述锡膏(4)通过锡银合金替代铟锡银合金,其中,锡含量占锡银总质量的96-97%,银含量占锡银总质量的3-4%。
4.根据权利要求1所述的一种叠片组件互联结构,其特征在于:所述锡膏(4)通过铟锡合金替代铟锡银合金,其中,铟含量占铟锡总质量的52-54%,锡含量占铟锡总质量的45-48%。
5.根据权利要求1-4中任意一项所述的一种叠片组件互联结构,其特征在于:所述锡膏(4)通过铟锡银、锡铋、锡银或铟锡中任意两种或两种以上进行组合形成。
6.根据权利要求1所述的一种叠片组件互联结构,其特征在于:所述锡膏(4)的横截面设置为椭圆形、梯形或方形。
7.一种叠片组件制作方法,其特征在于,包括以下步骤:
S1、对经过正常工序制作的电池片进行丝网印刷,在电池片的正面印刷上多根正面电极(3)和正面栅线,在电池片的背面印刷上多根背面电极(6);
S2、经过丝网印刷完成正、背面印刷后,使得印刷图形在电池片切割后,保证每块叠瓦小片(1)的正面电极(3)、背面电极(6)分别印刷在正、背面的交错位置;
S3、采用间隔定量涂布或者丝网印刷的方式,通过锡膏(4)将叠瓦小片(1)的正面电极(3)和背面电极(6)进行分区域连接,实现叠瓦小片(1)的互联组串。
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