CN110328890A - A kind of RFID label tag hot-press solidifying device with overturning and fine adjustment function - Google Patents
A kind of RFID label tag hot-press solidifying device with overturning and fine adjustment function Download PDFInfo
- Publication number
- CN110328890A CN110328890A CN201910324230.6A CN201910324230A CN110328890A CN 110328890 A CN110328890 A CN 110328890A CN 201910324230 A CN201910324230 A CN 201910324230A CN 110328890 A CN110328890 A CN 110328890A
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- plate
- adsorption plate
- thermal head
- adsorption
- connective
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- 238000009826 distribution Methods 0.000 claims abstract description 5
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 210000001138 Tears Anatomy 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 9
- 238000007731 hot pressing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 241000220259 Raphanus Species 0.000 description 2
- 235000006140 Raphanus sativus var sativus Nutrition 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001105 regulatory Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B9/00—Presses specially adapted for particular purposes
Abstract
The present invention provides a kind of with the RFID label tag hot-press solidifying device overturn with fine adjustment function, including at least bottom support plate, top support plate, column, linear bearing, upper driving motor, lower driving motor, upper adsorption plate component and lower adsorption plate component, the thermal head in rectangular distribution is provided in upper adsorption plate component and lower adsorption plate component；The upper adsorption plate component includes upper connective plate, adsorption plate, thermal head situation template and micro-adjusting mechanism, and wherein adsorption plate is mounted on the lower section of upper connective plate and can slide laterally；Dragging plate mechanism is additionally provided in the RFID label tag hot-press solidifying device, dragging plate mechanism includes support, rollover stand and carriage rack.It is placed in this patent with modularization, solves the inaccuracy put；And the upper hot-press solidifying head being inversely installed is moved integrally, is overturn by turn over function, to facilitate operation.
Description
Technical field
The present invention provides a kind of hot-press solidifying device in RFID label tag production, more particularly to it is a kind of with turning over
Turn the hot-press solidifying device with regulatory function, belongs to machinery manufacturing technology field.
Background technique
Hot pressing head assembly is that RFID label tag falls sealed in unit a --- key components during patch, by right
Effective combination of RFID antenna substrate and chip is completed in the hot pressing of RFID chip.In recent years, rapid with RFID label tag market
Expanding, RFID label tag production equipment is quickly grown, patch hot pressing module --- the requirement that thermal head is bonded chip is higher and higher, no
Being bonded for realization of High Speed chip and RFID antenna substrate is only wanted, also to guarantee that the RFID label tag produced is consistent, reliable.
In actual production, hot pressing typically is carried out using in two groups of thermal heads up and down of rectangular distribution.However,
The actual production stage, since the antenna substrate of carrying RFID label tag is there are different specifications, i.e. ranks between label away from inconsistent,
This requires that need to adjust the ranks spacing that thermal head is put when the product to different size carries out hot pressing, and it is existing
Adjustment mode is mostly put manually, is placed with the significant disadvantage of following two manually: 1, due to narrow space, manual errors compared with
Greatly, therefore the accuracy put of thermal head is difficult to control.2, narrow space causes operation extremely inconvenient, pacifies especially for being inverted
The upper hot-press solidifying head of dress, is even more difficult to operate.
Summary of the invention
The present invention solves above-mentioned deficiency in the prior art, provides a kind of RFID mark with overturning and fine adjustment function
Hot-press solidifying device is signed, modularization is had in the device and places function, solve the inaccuracy put；And pass through overturning function
The upper hot-press solidifying head being inversely installed can be moved integrally, be overturn, to facilitate operation.
Realize technical solution used by above-mentioned purpose of the present invention are as follows:
A kind of RFID label tag hot-press solidifying device with overturning and fine adjustment function, includes at least bottom support plate, top
Support plate, column, linear bearing, upper driving motor, lower driving motor, upper adsorption plate component and lower adsorption plate component, upper drive
Adsorption plate component moves downward in dynamic motor driven, and lower driving motor drives lower adsorption plate component to move upwards, upper absorption board group
The thermal head in rectangular distribution is provided in part and lower adsorption plate component；
The upper adsorption plate component includes upper connective plate, adsorption plate, thermal head situation template and micro-adjusting mechanism, wherein adsorbing
Plate is mounted on the lower section of upper connective plate and can slide laterally, and thermal head situation template is fixedly connected on the lower section of adsorption plate, hot pressing
Head is connected to the lower section of thermal head situation template by magnet absorption, and micro-adjusting mechanism is installed on the edge of adsorption plate, for adjusting
The position of thermal head situation template；The structure of the lower adsorption plate component is the inverted structure of upper adsorption plate component；
Be additionally provided with dragging plate mechanism in the RFID label tag hot-press solidifying device, dragging plate mechanism include support, rollover stand with
And carriage rack, wherein support is fixed in top support plate, and one end of rollover stand is articulated on support, the other end of rollover stand with
Carriage rack is hinged；When rollover stand is overturn to bottom, carriage rack and upper connective plate be in same plane, pass through that tear can at this time
Adsorption plate and thermal head situation template are pulled out from the lower section of upper connective plate jointly and are fixed on the two the lower section of carriage rack, then
Adsorption plate is overturn by the rotation of rollover stand and carriage rack.
The micro-adjusting mechanism includes pin nut, position plate, screw rod, knob and locking nut, one end of screw rod and absorption
The T-slot connection being arranged on plate, the other end is connect with knob, and locking nut can prevent knob from loosening, and screw rod passes through position plate,
Position plate is fixed by pin nut, the push-and-pull to adsorption plate can be realized when rotating knob, thus the position of fine adjustment thermal head.
Guiding panel is provided with below the lower section of the carriage rack and upper connective plate, the upper surface of adsorption plate is provided with
With the sliding slot that matches of guiding panel, adsorption plate can be under the cooperation of guiding panel and sliding slot along upper connective plate and carriage rack
Lower section sliding.
It is provided with pin hole on the upper connective plate and adsorption plate, is provided in pin hole and prevents the detachable of sliding
Bolt.
The side of the adsorption plate is provided with the knob for pulling out adsorption plate below upper connective plate.
Compared with prior art, the RFID label tag hot-press solidifying device provided by the invention with overturning and fine adjustment function has
It has the advantage that in the 1, present invention and is provided with thermal head situation template in upper adsorption plate component and lower adsorption plate component,
The template respectively corresponds the antenna substrate of different size, when needing correspondence to put thermal head again when replacing antenna substrate,
Corresponding thermal head situation template can be directly selected, is realized according to the position setting in template by a thermal head " radish one
Putting for a hole " formula, it is simple and fast.2, for upper adsorption plate component, knob can be utilized upper absorption when being put again
Adsorption plate and thermal head situation template and thermal head in board group part pull out from the lower section of upper connective plate jointly and are fixed to carriage rack
It on the guiding panel of lower section, and is overturn using rollover stand, it is whole upward to make thermal head, consequently facilitating staff carries out weight
Thermal head is newly put or replaced, is returned in adsorption plate component again after end of operation.3, set micro-adjusting mechanism is installed on
The edge of adsorption plate, for adjusting the position of thermal head situation template, micro-adjusting mechanism is adjusted using screw thread, and precision is high, rotation
One encloses mobile 0.8mm.
Detailed description of the invention
Fig. 1 is the overall structure diagram of RFID label tag hot-press solidifying device provided by the invention；
Fig. 2 is the structural schematic diagram of dragging plate mechanism；
Fig. 3 is the sectional view along A-A in Fig. 2；
Fig. 4 is the structural schematic diagram of upper adsorption plate component；
Fig. 5 is the structural schematic diagram of micro-adjusting mechanism；
In figure: 10- bottom support plate, 20- linear bearing, 30- column, the upper driving motor of 40-, 50- top support plate,
60- dragging plate mechanism, the upper adsorption plate component of 70-, adsorption plate component under 80-, driving motor under 90-, 61- support, 62- rollover stand,
63- carriage rack, 64- are oriented to panel, and 65- shakes hands, 71- upper connective plate, 72- adsorption plate, 73- thermal head situation template, and 74- precision is micro-
Regulating mechanism, 741- pin nut, 742- position plate, 743- screw rod, 744- knob, 745- locking nut.
Specific embodiment
With reference to the accompanying drawing and specific embodiment does detailed specific description to the present invention, but protection scope of the present invention
It is not limited to following embodiment.
The overall structure of RFID label tag hot-press solidifying device provided by the invention as shown in Figure 1, include bottom support plate 10,
Top support plate 50, column 30, linear bearing 20, upper driving motor 40, lower driving motor 90, upper adsorption plate component 70 and under
Adsorption plate component 80, central post is set between bottom support plate and top support plate, and upper driving motor drives upper adsorption plate
Component moves downward, and lower driving motor drives lower adsorption plate component to move upwards, upper adsorption plate component and lower adsorption plate component
It is provided with the thermal head in rectangular distribution, this part-structure and current conventional hot-press device are essentially identical, in this patent
No longer it is described in detail.
The structure of the upper adsorption plate component is as shown in figure 4, include upper connective plate 71, adsorption plate 72, thermal head situation template
73 and micro-adjusting mechanism 74, wherein adsorption plate is mounted on the lower section of upper connective plate and can slide laterally, the lower section setting of upper connective plate
Have a guiding panel, the upper surface of adsorption plate is provided with the sliding slot to match with guiding panel, adsorption plate can in guiding panel and
It is slided under the cooperation of sliding slot along the lower section of upper connective plate.Pin hole, pin hole are provided on the upper connective plate and adsorption plate
It is inside provided with the detachable bolt for preventing sliding, bolt is removed when needing to slide, plugs bolt when not needing sliding.
The side of the adsorption plate is provided with the knob 65 for pulling out adsorption plate below upper connective plate.The thermal head situation template
It is fixedly connected on the lower section of adsorption plate, thermal head is connected to the lower section of thermal head situation template, micro-adjusting mechanism by magnet absorption
It is installed on the edge of adsorption plate, for adjusting the position of thermal head situation template；The structure of the lower adsorption plate component is upper suction
The inverted structure of attached plate component.The structure of the micro-adjusting mechanism is as shown in figure 5, include pin nut 741, position plate 742, screw rod
743, knob 744 and locking nut 745, the T-slot connection being arranged on one end of screw rod and adsorption plate, the other end and knob connect
It connects, and locking nut can prevent knob from loosening, screw rod passes through position plate, and position plate is fixed by pin nut, can when rotating knob
The push-and-pull to adsorption plate is realized, thus the position of fine adjustment thermal head.
It is additionally provided with dragging plate mechanism in the RFID label tag hot-press solidifying device, structure is as shown in Figures 2 and 3, including
Support 61, rollover stand 62, carriage rack 63, guiding panel 64, wherein support is fixed in top support plate, one end hinge of rollover stand
It is connected on support, the other end and carriage rack of rollover stand are hinged, and guiding panel is installed on the lower section of carriage rack；When rollover stand is overturn
When to bottom, carriage rack and upper connective plate be in same plane, pass through that tear can be by adsorption plate and thermal head position mould at this time
Plate pulls out from the lower section of upper connective plate jointly and is fixed on the two the lower section of carriage rack, then passes through turn of rollover stand and carriage rack
It is dynamic to overturn adsorption plate.
The workflow of RFID label tag hot-press solidifying device provided by the invention with overturning and fine adjustment function is as follows: institute
The antenna substrate that template respectively corresponds different size is stated, it, will when needing correspondence to put thermal head again when replacing antenna substrate
Rollover stand is put down, and carriage rack is directed at upper adsorption plate component, then holds knob, by upper adsorption plate component adsorption plate and hot pressing
Head situation template and thermal head are pulled out jointly on the guiding panel being fixed to below carriage rack, and are overturn using rollover stand,
Keep thermal head whole upward, consequently facilitating staff operates.Staff directly selects corresponding thermal head position mould
Plate realizes putting thermal head " steady and reliable " formula according to the position setting in template, simple and fast.For lower suction
Thermal head is put again in attached plate component, is realized also according to the position setting in template by thermal head " one radish one
Hole " formula is put.Then utilize carriage rack and knob by the adsorption plate and thermal head situation template and heat in upper adsorption plate component
Pressure head is pushed into the lower section of upper connective plate jointly.Before the work that needs to be switched on, need to realize thermal head and antenna substrate in two steps
Alignment, the first step is walked by control antenna substrate expects feeding to determine away the positioning on material direction on direction；Second step is then
The positioning being determined perpendicular to away on material direction by the fine tuning of micro-adjusting mechanism.Micro-adjusting mechanism is adjusted using screw thread, and precision is high,
Revolve the mobile 0.8mm that turns around.
Claims (5)
1. a kind of RFID label tag hot-press solidifying device with overturning and fine adjustment function, includes at least bottom support plate, top branch
Fagging, column, linear bearing, upper driving motor, lower driving motor, upper adsorption plate component and lower adsorption plate component, upper driving
Adsorption plate component moves downward in motor driven, and lower driving motor drives lower adsorption plate component to move upwards, upper adsorption plate component
And the thermal head in rectangular distribution is provided in lower adsorption plate component；
It is characterized by: the upper adsorption plate component includes upper connective plate, adsorption plate, thermal head situation template and micro-adjusting mechanism,
Wherein adsorption plate is mounted on the lower section of upper connective plate and can slide laterally, and thermal head situation template is fixedly connected under adsorption plate
Side, thermal head are connected to the lower section of thermal head situation template by magnet absorption, and micro-adjusting mechanism is installed on the edge of adsorption plate, use
In the position for adjusting thermal head situation template；The structure of the lower adsorption plate component is the inverted structure of upper adsorption plate component；
Dragging plate mechanism is additionally provided in the RFID label tag hot-press solidifying device, dragging plate mechanism includes support, rollover stand and drags
Grillage, wherein support is fixed in top support plate, and one end of rollover stand is articulated on support, the other end and planker of rollover stand
Frame is hinged；When rollover stand is overturn to bottom, carriage rack and upper connective plate be in same plane, pass through at this time and tear and can will inhale
Attached plate and thermal head situation template pull out from the lower section of upper connective plate jointly and are fixed on the two the lower section of carriage rack, then pass through
The rotation of rollover stand and carriage rack overturns adsorption plate.
2. the RFID label tag hot-press solidifying device according to claim 1 with overturning and fine adjustment function, it is characterised in that:
The micro-adjusting mechanism includes pin nut, position plate, screw rod, knob and locking nut, is arranged on one end of screw rod and adsorption plate
T-slot connection, the other end connect with knob, and locking nut can prevent knob from loosening, and across position plate, position plate leads to screw rod
It crosses pin nut to fix, the push-and-pull to adsorption plate can be realized when rotating knob, thus the position of fine adjustment thermal head.
3. the RFID label tag hot-press solidifying device according to claim 1 with overturning and fine adjustment function, it is characterised in that:
Guiding panel is provided with below the lower section of the carriage rack and upper connective plate, the upper surface of adsorption plate is provided with inlays with guiding
The sliding slot that item matches, adsorption plate can be sliding along the lower section of upper connective plate and carriage rack under the cooperation of guiding panel and sliding slot
It is dynamic.
4. the RFID label tag hot-press solidifying device according to claim 3 with overturning and fine adjustment function, it is characterised in that:
It is provided with pin hole on the upper connective plate and adsorption plate, the detachable bolt for preventing sliding is provided in pin hole.
5. the RFID label tag hot-press solidifying device according to claim 1 with overturning and fine adjustment function, it is characterised in that:
The side of the adsorption plate is provided with the knob for pulling out adsorption plate below upper connective plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910324230.6A CN110328890B (en) | 2019-04-22 | 2019-04-22 | RFID label hot pressing solidification equipment with upset and fine setting function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910324230.6A CN110328890B (en) | 2019-04-22 | 2019-04-22 | RFID label hot pressing solidification equipment with upset and fine setting function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110328890A true CN110328890A (en) | 2019-10-15 |
| CN110328890B CN110328890B (en) | 2020-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910324230.6A Active CN110328890B (en) | 2019-04-22 | 2019-04-22 | RFID label hot pressing solidification equipment with upset and fine setting function |
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| Country | Link |
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| CN (1) | CN110328890B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1034254A (en) * | 1996-07-29 | 1998-02-10 | Amada Co Ltd | Die exchanging device in punch press |
| CN102814471A (en) * | 2011-06-07 | 2012-12-12 | 贵州华科铝材料工程技术研究有限公司 | Process and equipment for casting large-size aluminum ingots |
| CN104842405A (en) * | 2015-05-18 | 2015-08-19 | 瑞安市中泰科技设备有限公司 | Cutting-board overturn die replacing device for die-cutting machine |
| CN205255331U (en) * | 2015-12-07 | 2016-05-25 | 中山市天键电声有限公司 | Reduce die set of wearing and tearing on hand beer mould |
| KR20170026745A (en) * | 2015-08-27 | 2017-03-09 | 주식회사 구영테크 | Mold replacement device for press molding machine and mold replacement system using the same |
| CN207043938U (en) * | 2017-06-07 | 2018-02-27 | 苏州麦克韦尔自动化设备有限公司 | A kind of semi-automatic part scraps machine |
| CN207327634U (en) * | 2017-09-15 | 2018-05-08 | 烟台通岳汽车零部件有限公司 | A kind of hot plate welding machine hot plate die-changing apparatus |
| CN207954076U (en) * | 2017-11-21 | 2018-10-12 | 东莞市东电机械设备有限公司 | A kind of knife plate for die-cutting machine quickly overturns mould changing device |
| CN109570366A (en) * | 2018-11-26 | 2019-04-05 | 武汉宏升鑫汽车部件有限公司 | A kind of one point press |
-
2019
- 2019-04-22 CN CN201910324230.6A patent/CN110328890B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1034254A (en) * | 1996-07-29 | 1998-02-10 | Amada Co Ltd | Die exchanging device in punch press |
| CN102814471A (en) * | 2011-06-07 | 2012-12-12 | 贵州华科铝材料工程技术研究有限公司 | Process and equipment for casting large-size aluminum ingots |
| CN104842405A (en) * | 2015-05-18 | 2015-08-19 | 瑞安市中泰科技设备有限公司 | Cutting-board overturn die replacing device for die-cutting machine |
| KR20170026745A (en) * | 2015-08-27 | 2017-03-09 | 주식회사 구영테크 | Mold replacement device for press molding machine and mold replacement system using the same |
| CN205255331U (en) * | 2015-12-07 | 2016-05-25 | 中山市天键电声有限公司 | Reduce die set of wearing and tearing on hand beer mould |
| CN207043938U (en) * | 2017-06-07 | 2018-02-27 | 苏州麦克韦尔自动化设备有限公司 | A kind of semi-automatic part scraps machine |
| CN207327634U (en) * | 2017-09-15 | 2018-05-08 | 烟台通岳汽车零部件有限公司 | A kind of hot plate welding machine hot plate die-changing apparatus |
| CN207954076U (en) * | 2017-11-21 | 2018-10-12 | 东莞市东电机械设备有限公司 | A kind of knife plate for die-cutting machine quickly overturns mould changing device |
| CN109570366A (en) * | 2018-11-26 | 2019-04-05 | 武汉宏升鑫汽车部件有限公司 | A kind of one point press |
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| CN110328890B (en) | 2020-11-20 |
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