CN110290640A - A kind of equipment and its pcb board - Google Patents
A kind of equipment and its pcb board Download PDFInfo
- Publication number
- CN110290640A CN110290640A CN201910702645.2A CN201910702645A CN110290640A CN 110290640 A CN110290640 A CN 110290640A CN 201910702645 A CN201910702645 A CN 201910702645A CN 110290640 A CN110290640 A CN 110290640A
- Authority
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- China
- Prior art keywords
- wiring board
- heat sink
- metallic substrates
- face
- conducting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000002184 metal Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 20
- 239000011229 interlayer Substances 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 7
- 239000004677 Nylon Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229920001778 nylon Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 239000011324 bead Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structure Of Printed Boards (AREA)
Abstract
This application discloses a kind of equipment and its pcb board, pcb board includes metallic substrates heat sink and the wiring board for conducting wire to be arranged, and the face B of wiring board is mounted on the face A of metallic substrates heat sink, metallic substrates heat sink and circuit board electrical connection；It further include the heat sink assembly that the face A of assist side is set, heat sink assembly includes the metal fin of several stacked arrangements, is equipped with insulating layer between adjacent metal cooling fin, the surface of the surface of metal fin perpendicular to wiring board.Pcb board provided herein then by the setting of heat sink assembly, and makes each metal fin increase the heat dissipation area of heterogeneous power device perpendicular to the surface alignment of wiring board firstly, radiating by metallic substrates heat sink to realize to power device；Meanwhile the wiring of conducting wire is carried out using wiring board, it realizes 3 D stereo wiring, meets the wiring requirements of the heterogeneous power device of high density.
Description
Technical field
This application involves wiring board arts, more particularly to a kind of pcb board.In addition, the application further relates to a kind of include upper
The equipment for stating pcb board.
Background technique
In existing industrial design, the volume of power device is more and more small and exquisite, and function is more and more, and power is increasing
It has been increasingly becoming trend.However, temperature is higher for power device, the efficiency of device is lower, and the characteristic of device can also be sent out
Changing.So heat dissipation is the fatal problem for needing urgently to solve.
The heat of device itself can pass to wiring board, then be shed by radiator, wherein first have to guarantee power
The heat dissipation of device does not have apparent bottleneck, and being unlikely to heat build-up can not exhale together；Radiator generally has nature
A variety of methods such as cooling, pressure cooling.
It is in the prior art, general to use the area increased in heat dissipation path for the heat dissipating method of high-density power device,
Or increase the thermal coefficient of metal substrate to realize, however, scheme in the prior art, can only solve homogeneity power device
Heat dissipation problem can not just solve heat dissipation problem when heterogeneous power device needs more connections.
Therefore, the radiating efficiency for how improving heterogeneous power device pcb board is that those skilled in the art need to solve at present
The technical issues of.
Apply for content
The purpose of the application is to provide a kind of pcb board, which can effectively improve the radiating efficiency of itself, meets
The radiating requirements of power device.The another object of the application is to provide a kind of equipment including above-mentioned pcb board.
To achieve the above object, the application provides the following technical solutions:
A kind of pcb board, the wiring board including metallic substrates heat sink and for conducting wire to be arranged, the B of the wiring board
Face is mounted on the face A of the metallic substrates heat sink, the metallic substrates heat sink and the circuit board electrical connection；It further include setting
The heat sink assembly in the face A of the wiring board is set, the heat sink assembly includes the metal fin of several stacked arrangements, phase
It is equipped with insulating layer between the adjacent metal fin, the surface of the surface of the metal fin perpendicular to the wiring board.
Preferably, interlayer cooling fin is additionally provided between the metallic substrates heat sink and the wiring board, the interlayer dissipates
The surface of backing is parallel to the surface of the wiring board.
Preferably, it is inlayed between the adjacent metal fin and is provided with plastic insulating layer or nylon insulating layer.
Preferably, several spaced thermally conductive through-holes are also provided on the wiring board.
Preferably, the wiring board is equipped with mounting groove, and power device can be mounted on the gold after the mounting groove
Belong on substrate heat sink.
Preferably, the wiring board is glass mat；The wiring board has at least two layers, and each layer wiring board
Between be electrically connected.
Preferably, the face A of the wiring board is at least provided with the first power device conducting wire, and the face B is at least provided with the second function
Rate device conducts route, being equipped between the face A and the face B of the wiring board will the first power device conducting wire and described the
The conductive member of two power device conducting wires connection；The face the B circumference of the wiring board be additionally provided with for the metallic substrates
The wiring board of heat sink connection connects pad, and position corresponding with the circuit pads is equipped on the metallic substrates heat sink
Heat sink connects pad, after the wiring board connection pad connect pad connection with the heat sink, leading on the wiring board
The predeterminated position of electric line can be contacted with the predeterminated position of the conducting wire on the metallic substrates heat sink, to realize the two
Electrical connection.
Preferably, it is welded to connect between the metallic substrates heat sink and the wiring board, riveting or contact pilotage connect
It connects.
Preferably, position corresponding with the mounting groove of the wiring board is equipped with for installing on the metallic substrates heat sink
The device of power device installs pad, and the device installation pad is electrically connected with the conducting wire on the metallic substrates heat sink
It connects；The corresponding position of the metallic substrates heat sink and the wiring board is additionally provided with threaded hole, and the threaded hole passes through for screw
It is mounted on equipment body after wearing.
The application also provides a kind of equipment, including pcb board described in above-mentioned any one.
Pcb board provided herein, the wiring board including metallic substrates heat sink and for conducting wire to be arranged are described
The face B of wiring board is mounted on the face A of the metallic substrates heat sink, and the metallic substrates heat sink is electrically connected with the wiring board
It connects；It further include the heat sink assembly that the face A of the wiring board is set, the heat sink assembly includes the gold of several stacked arrangements
Belong to cooling fin, is equipped with insulating layer between the adjacent metal fin, the surface of the metal fin is perpendicular to the route
The surface of plate.Pcb board provided herein, by the setting of the heat sink assembly so that each metal fin perpendicular to
The surface alignment of the wiring board is improved the heat dissipation area of metal fin, while being realized using the metallic substrates heat sink
It radiates in the direction far from heat sink assembly, and carries out the wiring of conducting wire using wiring board, realize 3 D stereo cloth
Line, meets the wiring requirements of the heterogeneous power device of high density, while improving radiating efficiency.
In a preferred embodiment, the wiring board is equipped with mounting groove, and power device can run through the mounting groove
After be mounted on the metallic substrates heat sink.Above-mentioned setting passes through setting for the metallic substrates heat sink and the wiring board
It sets, and power device is mounted on the metallic substrates heat sink, so that the heat transfer that power device generates is to the gold
Belong to substrate heat sink, convenient for heat dissipation, the conducting wire of power device is arranged on the wiring board, realizes heat dissipating layer and route
The function of articulamentum separates, and product service performance is more preferably.
Equipment provided herein is equipped with above-mentioned pcb board, since the pcb board has above-mentioned technique effect, if
There is the equipment of the pcb board to should also be as that there is corresponding technical effect.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of application for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of stepped construction schematic diagram of specific embodiment of pcb board provided herein；
Fig. 2-A is a kind of face the A structural schematic diagram of specific embodiment of wiring board in pcb board provided herein；
Fig. 2-B is the face pcb board A partial enlargement structural representation shown in Fig. 2-A；
Fig. 3 is a kind of face the B structural schematic diagram of specific embodiment of wiring board in pcb board provided herein；
Fig. 4 is a kind of cross-sectional view of specific embodiment of wiring board in pcb board provided herein；
Fig. 5-A is that a kind of face the A structure of specific embodiment of metallic substrates heat sink in pcb board provided herein is shown
It is intended to；
Fig. 5-B is the face the A enlarged structure schematic diagram of pcb board shown in Fig. 5-A；
Fig. 6 is a kind of structural schematic diagram of specific embodiment of heat sink assembly in pcb board provided herein；
Wherein: metallic substrates heat sink (1), heat sink connection pad (1-1), negative terminal pad and copper foil circuit (1-2), just
Pole pad (1-3), device install pad (1-4), wiring board (2), mounting groove (2-1), the first power device conducting wire (2-
2), the second power device conducting wire (2-3), third power device conducting wire (2-4), wiring board connect pad (2-5), lead
Heat through-hole (2-6), power device (3), threaded hole (4), heat sink assembly (5), metal fin (5-1), interlayer cooling fin
(6)。
Specific embodiment
The core of the application is to provide a kind of pcb board, which can improve heat dissipation effect under the premise of constancy of volume
Rate saves cost.Another core of the application is to provide a kind of equipment including above-mentioned pcb board.
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall in the protection scope of this application.
Fig. 1 to Fig. 6 is please referred to, Fig. 1 is that a kind of stepped construction of specific embodiment of pcb board provided herein is illustrated
Figure；Fig. 2-A is a kind of face the A structural schematic diagram of specific embodiment of wiring board in pcb board provided herein；Fig. 2-B is
The face pcb board A partial enlargement structural representation shown in Fig. 2-A；Fig. 3 is a kind of tool of wiring board in pcb board provided herein
The face the B structural schematic diagram of body embodiment；Fig. 4 is a kind of specific embodiment of wiring board in pcb board provided herein
Cross-sectional view；Fig. 5-A is a kind of face A of specific embodiment of metallic substrates heat sink in pcb board provided herein
Structural schematic diagram；Fig. 5-B is the face the A enlarged structure schematic diagram of pcb board shown in Fig. 5-A；Fig. 6 is PCB provided herein
A kind of structural schematic diagram of specific embodiment of heat sink assembly in plate.
In this embodiment, pcb board includes metallic substrates heat sink 1, wiring board 2 and heat sink assembly 5, specifically,
Since the arrangement of the conducting wire of the heterogeneous power device 3 of high density is complex, which is preferably the heterogeneous power device of high density
The mounting plate of part 3.
Wherein, wiring board 2 is for being arranged conducting wire, the specially conducting wire of power device 3, to realize power device
3 normal work, specifically, the face B of wiring board 2 is mounted on the face A of metallic substrates heat sink 1, metallic substrates heat sink 1 and line
Road plate 2 is electrically connected, and conducting wire, the conducting wire on metallic substrates heat sink 1 has equally can be set in metallic substrates heat sink 1
It can connect or connect by copper post with the conducting wire on wiring board 2.
Further, the metal fin 5-1 of heat sink assembly 5 including several stacked arrangements, adjacent metal cooling fin 5-1 it
Between be equipped with insulating layer, the surface of the surface of metal fin 5-1 perpendicular to wiring board 2, i.e., several metal fin 5-1 stacking rows
After column, by its integral solder assist side 2, certainly, the heat transfer that wiring board 2 generates is metal fin 5-1, and metal dissipates
The surface of backing 5-1 sheds heat.
What needs to be explained here is that in order to improve radiating efficiency, insulating layer is preferably provided at metal fin 5-1 by near line
The bottom of road plate 2.
Pcb board provided herein, by the setting of heat sink assembly 5, so that each metal fin 5-1 is perpendicular to line
The surface alignment of road plate 2 is improved the heat dissipation area of metal fin 5-1, while being realized using metallic substrates heat sink 1 separate
The direction of heat sink assembly 5 is radiated, and the wiring of conducting wire is carried out using wiring board 2, realizes 3 D stereo wiring, full
The wiring requirements of the sufficient heterogeneous power device 3 of high density, while improving radiating efficiency.
On the basis of the respective embodiments described above, interlayer cooling fin is additionally provided between metallic substrates heat sink 1 and wiring board 2
6, the surface of interlayer cooling fin 6 is parallel to the surface of wiring board 2, and interlayer cooling fin 6 can be to metallic substrates heat sink 1 and route
The heat generated on plate 2 radiates, and further increases radiating efficiency.
Preferably, the setting position of interlayer cooling fin 6 is corresponding with the installation site of heat sink assembly 5, is located at route
The corresponding position in the face plate 2A and the face wiring board 2B improves the diverging of 2 heat of wiring board, meanwhile, convenient for the installation of power device 3.
On the basis of the respective embodiments described above, inlayed between adjacent metal cooling fin 5-1 be provided with plastic insulating layer or
The thermoplasticity of person's nylon insulating layer, plastic insulating layer or nylon insulating layer is good, high temperature resistant, and using effect is good.
On the basis of the respective embodiments described above, several spaced thermally conductive through-hole 2-6 are also provided on wiring board 2,
Specifically, opening up thermally conductive through-hole 2-6 on wiring board 2, it is laid with copper in thermally conductive through-hole 2-6, forms conduction copper hole, is conducive to wiring board
2 heat dissipation.
Further, wiring board 2 is equipped with mounting groove 2-1, and power device 3 can be mounted on Metal Substrate after mounting groove 2-1
On bottom heat sink 1, i.e., wiring board 2 is only used for being routed, and metallic substrates heat sink 1 is for radiating.
On the basis of the respective embodiments described above, wiring board 2 has at least two layers, and is electrically connected between each sandwich circuit board 2.
What needs to be explained here is that the number of plies of wiring board 2 refers to the number of plies equipped with conducting wire, the face A and B in the same wiring board 2
Conducting wire can be set in face, forms double-layered circuit board 2.
On the basis of the respective embodiments described above, the face A of wiring board 2 at least provided with the first power device conducting wire 2-2,
The face B of wiring board 2 is equipped between the face A and the face B of wiring board 2 by the first function at least provided with the second power device conducting wire 2-3
The conductive member that rate device conducts route 2-2 is connect with the second power device conducting wire 2-3, wherein conductive member can be
Conductive via.Specifically, the face A of wiring board 2 can be set the first power device conducting wire 2-2, the face B of wiring board 2 can be with
Second power device conducting wire 2-3 and third power device conducting wire 2-4 are set, wherein the first power device conductor wire
Road 2-2 can be the conducting wire of green light lamp pearl, and the second power device conducting wire 2-3 can be the conductor wire of blue-ray light pearl
Road, third power device conducting wire 2-4 can be the conducting wire of red globe lamp pearl.
Specifically, the first power device conducting wire 2-2 can be arranged successively along the length direction of wiring board 2, and occupy
One half width of wiring board 2, the second power device conducting wire 2-3 and third power device conducting wire 2-4 occupy the other half
Width, and the second power device conducting wire 2-3 and third power device conducting wire 2-4 are alternately arranged, certainly, above-mentioned row
Column mode is only a kind of embodiment, can specifically be arranged according to actual needs.
More specifically, wiring board 2 can be two or more layers wiring board 2, and every sandwich circuit board 2 can be single side or two-sided
Wiring, for the wiring board 2 of double-sided wiring, needs that via hole is arranged, to realize the conductor wire in two faces on the wiring board 2
The electrical connection on road.
Further, pcb board provided by the present embodiment can be lamp plate, be equipped with blue light lamp bead, green light lamp bead, red globe lamp
Pearl etc..
Specifically, the face A of bilayer or multilayer wiring board 2, is mainly responsible for connection, the ID resistance, connection of green light lamp bead
Connection through-hole, ID resistance position and connection pad with the face bilayer or multilayer wiring board 2B need to be arranged in pad.
On the basis of the respective embodiments described above, the face the B circumference of wiring board 2 be additionally provided with for metallic substrates heat sink 1
The wiring board of connection connects pad 2-5, and position corresponding with 2 pad of wiring board connects equipped with heat sink on metallic substrates heat sink 1
Meet pad 1-1, after wiring board connection pad 2-5 connect pad 1-1 connection with heat sink, conducting wire on wiring board 2 it is pre-
If position can be contacted with the predeterminated position of the conducting wire on metallic substrates heat sink 1, to realize the electrical connection of the two.
Specifically, boss metal part has can be set in the predeterminated position of the conducting wire on wiring board 2, likewise, golden
The predeterminated position for belonging to the conducting wire on substrate heat sink 1 is equipped with planar metal part or boss metal part, so that route
After plate 2 is bonded with metallic substrates heat sink 1, the predeterminated position of the conducting wire on wiring board 2 can be with metallic substrates heat sink 1
On conducting wire predeterminated position connect, realize electric signal conducting.Connect it is of course also possible to be contacted by other structures
Connect, alternatively, by the modes such as contact pilotage also can, can be realized the mode of electric connection.
Specifically, the face B of bilayer or multilayer wiring board 2, is mainly responsible for the connection of blue light lamp bead Yu feux rouges lamp bead, need to be arranged
The conducting wire of the wiring board connection pad 2-5, blue light lamp bead and feux rouges lamp bead that are connect with the face A of metallic substrates heat sink 1 and
The connection through-hole that is connect with the face A of bilayer or multilayer wiring board 2 and with the connection through-hole of green light solder joint.
On the basis of the respective embodiments described above, it is welded to connect between metallic substrates heat sink 1 and wiring board 2, the company of riveting
It connects or contact pilotage connects, on the one hand can be realized being bonded for the two, on the other hand realize the connection side of the electrical connection of the two
Formula, it is not limited to connection type given by the present embodiment.
It is corresponding with the mounting groove 2-1 of wiring board 2 on metallic substrates heat sink 1 on the basis of the respective embodiments described above
Position is equipped with device and installs pad 1-4, and device installs pad 1-4 and is used for installation power device 3, and device installs pad 1-4 and gold
Belong to the conducting wire electrical connection on substrate heat sink 1.
Further, metallic substrates heat sink 1 is equipped with negative terminal pad and copper foil circuit 1-2, positive terminal pad 1-3, device peace
It is electrically connected between welding equipment disk 1-4 and negative terminal pad and copper foil circuit 1-2 or positive terminal pad 1-3.
In a specific embodiment, the face the A trace arrangements of metallic substrates heat sink 1 are as shown in figure 4, copper foil thickness 3oz,
Metallic substrates heat sink 1 is mainly responsible for the heat dissipation of LED lamp bead, and positive and negative anodes are connected using the face B of solder joint mode and glass-fiber-plate dual platen
Connect, between each route spacing be 0.5mm, 72 blue light lamp beads, totally 6 simultaneously, 12 a string of lamp, 36 feux rouges lamp beads, totally 2 simultaneously, 18
A string of lamp, 36 green light lamp beads, totally 3 simultaneously, 12 a string of lamp, each lamp bead along metallic substrates heat sink 1 middle part transversely
Distribution.
On the basis of the respective embodiments described above, the corresponding position of metallic substrates heat sink 1 and wiring board 2 is additionally provided with screw thread
Hole 4, threaded hole 4 are mounted on equipment body after running through for screw, the threaded hole 4 on metallic substrates heat sink 1 and wiring board 2
Should position it is corresponding, and size is consistent, convenient for the pcb board to be installed on equipment body.
On the basis of the respective embodiments described above, wiring board 2 is glass mat.Above-mentioned setting, utilization are lower-cost
Glass mat is responsible for the arrangement of conducting wire as wiring board 2, and utilizes the good thermal diffusivity of metallic substrates heat sink 1, can
The cost of the pcb board is effectively reduced, meets the production of more batches of a small amount of medium-sized and small enterprises under the premise of guaranteeing that heat dissipation is good
Demand.
Specifically, conducting wire is first printed on according to design scheme by pcb board provided by the present embodiment in processing
It offers on the wiring board 2 of through-hole, then wiring board 2 and interlayer cooling fin 6 is mounted on metallic substrates heat sink 1, will radiate
Piece component 5 welds in assist side 2, and then power device 3 is mounted on metallic substrates heat sink 1, finally will be after combination
Wiring board 2 and metallic substrates heat sink 1 are mounted on equipment body by screw, and certainly, the above process can have sequencing
Adjustment, it is not limited to erection sequence given by the present embodiment.
Other than above-mentioned pcb board, present invention also provides a kind of equipment including above-mentioned pcb board, the equipment other
Refer to the prior art for Each part, and repeats no more herein.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
Pcb board provided herein is described in detail above.Specific case used herein is to the application
Principle and embodiment be expounded, the present processes that the above embodiments are only used to help understand and its core
Thought is thought.It should be pointed out that for those skilled in the art, under the premise of not departing from the application principle,
Can also to the application, some improvement and modification can also be carried out, these improvement and modification also fall into the protection scope of the claim of this application
It is interior.
Claims (10)
1. a kind of pcb board, which is characterized in that the wiring board including metallic substrates heat sink (1) and for conducting wire to be arranged
(2), the face B of the wiring board (2) is mounted on the face A of the metallic substrates heat sink (1), the metallic substrates heat sink (1)
It is electrically connected with the wiring board (2)；It further include heat sink assembly (5) of the setting in the face A of the wiring board (2), the heat dissipation
Piece component (5) includes the metal fin (5-1) of several stacked arrangements, is equipped between the adjacent metal fin (5-1) exhausted
Edge layer, the surface of the surface of the metal fin (5-1) perpendicular to the wiring board (2).
2. pcb board according to claim 1, which is characterized in that the metallic substrates heat sink (1) and the wiring board
(2) it is additionally provided between interlayer cooling fin (6), the surface of the interlayer cooling fin (6) is parallel to the surface of the wiring board (2).
3. pcb board according to claim 1, which is characterized in that inlay setting between the adjacent metal fin (5-1)
There are plastic insulating layer or nylon insulating layer.
4. according to claim 1 to pcb board described in 3 any one, which is characterized in that be also provided on the wiring board (2)
Several spaced thermally conductive through-holes (2-6).
5. according to claim 1 to pcb board described in 3 any one, which is characterized in that the wiring board (2) is equipped with installation
Slot (2-1), power device (3) can be mounted on the metallic substrates heat sink (1) after the mounting groove (2-1).
6. pcb board according to claim 5, which is characterized in that the wiring board (2) is glass mat；The route
Plate (2) has at least two layers, and is electrically connected between each layer wiring board (2).
7. pcb board according to claim 5, which is characterized in that the face A of the wiring board (2) is at least provided with the first power
Device conducts route (2-2), the face B is at least provided with the second power device conducting wire (2-3), the face A of the wiring board (2) and B
It is equipped between face and connect the first power device conducting wire (2-2) with the second power device conducting wire (2-3)
Conductive member；The face the B circumference of the wiring board (2) is additionally provided with the route for connecting with the metallic substrates heat sink (1)
Plate connects pad (2-5), and position corresponding with the wiring board (2) pad is equipped with heat dissipation on the metallic substrates heat sink (1)
Plate connects pad (1-1), after wiring board connection pad (2-5) connect pad (1-1) connection with the heat sink, the line
The predeterminated position of conducting wire on road plate (2) can be with the predeterminated position of the conducting wire on the metallic substrates heat sink (1)
Contact, to realize the electrical connection of the two.
8. pcb board according to claim 5, which is characterized in that the metallic substrates heat sink (1) and the wiring board
(2) it is welded to connect between, riveting or contact pilotage connect.
9. pcb board according to claim 7, which is characterized in that on the metallic substrates heat sink (1) with the wiring board
(2) the corresponding position of mounting groove (2-1), which is equipped with, installs pad (1-4) for the device of installation power device (3), the device
Installation pad (1-4) is electrically connected with the conducting wire on the metallic substrates heat sink (1)；The metallic substrates heat sink (1)
It is additionally provided with threaded hole (4) with the corresponding position of the wiring board (2), the threaded hole (4) is mounted on after running through for screw and sets
In standby main body.
10. a kind of equipment, including pcb board, which is characterized in that the pcb board is PCB described in claim 1 to 9 any one
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910702645.2A CN110290640A (en) | 2019-07-31 | 2019-07-31 | A kind of equipment and its pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910702645.2A CN110290640A (en) | 2019-07-31 | 2019-07-31 | A kind of equipment and its pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110290640A true CN110290640A (en) | 2019-09-27 |
Family
ID=68024478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910702645.2A Pending CN110290640A (en) | 2019-07-31 | 2019-07-31 | A kind of equipment and its pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110290640A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10294399A (en) * | 1997-04-22 | 1998-11-04 | Fujitsu Ltd | Packaging structure of bga package |
| CN1638114A (en) * | 2002-04-22 | 2005-07-13 | 台达电子工业股份有限公司 | Power converter package with enhanced thermal management |
| CN201425286Y (en) * | 2009-04-16 | 2010-03-17 | 华宏光电子(深圳)有限公司 | Heat dissipation structure of LED lamp |
| CN204046919U (en) * | 2014-08-12 | 2014-12-24 | 温州扬升电路板有限公司 | A kind of wiring board strengthening dispelling the heat |
| CN210328134U (en) * | 2019-07-31 | 2020-04-14 | 东莞市沃德普自动化科技有限公司 | Equipment and PCB board thereof |
-
2019
- 2019-07-31 CN CN201910702645.2A patent/CN110290640A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10294399A (en) * | 1997-04-22 | 1998-11-04 | Fujitsu Ltd | Packaging structure of bga package |
| CN1638114A (en) * | 2002-04-22 | 2005-07-13 | 台达电子工业股份有限公司 | Power converter package with enhanced thermal management |
| CN201425286Y (en) * | 2009-04-16 | 2010-03-17 | 华宏光电子(深圳)有限公司 | Heat dissipation structure of LED lamp |
| CN204046919U (en) * | 2014-08-12 | 2014-12-24 | 温州扬升电路板有限公司 | A kind of wiring board strengthening dispelling the heat |
| CN210328134U (en) * | 2019-07-31 | 2020-04-14 | 东莞市沃德普自动化科技有限公司 | Equipment and PCB board thereof |
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