CN110265811A - Earphone connector, mobile terminal and manufacturing process of earphone connector - Google Patents
Earphone connector, mobile terminal and manufacturing process of earphone connector Download PDFInfo
- Publication number
- CN110265811A CN110265811A CN201910577841.1A CN201910577841A CN110265811A CN 110265811 A CN110265811 A CN 110265811A CN 201910577841 A CN201910577841 A CN 201910577841A CN 110265811 A CN110265811 A CN 110265811A
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- terminal
- connector
- connector body
- solder
- headset
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000007789 sealing Methods 0.000 claims abstract description 78
- 238000003466 welding Methods 0.000 claims abstract description 36
- 238000001746 injection moulding Methods 0.000 claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims description 118
- 230000000712 assembly Effects 0.000 claims description 70
- 238000000429 assembly Methods 0.000 claims description 70
- 239000000565 sealant Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 13
- 239000003292 glue Substances 0.000 abstract description 21
- 238000000465 moulding Methods 0.000 abstract description 5
- 230000011218 segmentation Effects 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 23
- 230000000694 effects Effects 0.000 description 18
- 230000008569 process Effects 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 239000011265 semifinished product Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 230000001737 promoting effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/111—Resilient sockets co-operating with pins having a circular transverse section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
- H01R13/504—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5213—Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
The invention relates to the technical field of connectors, and provides an earphone connector, which comprises: the terminal assembly comprises a contact terminal and a first welding terminal; the connector body is formed by injection molding by taking the first welding terminal as an insert, the welding pin of the first welding terminal penetrates out of the surface of the connector body, the connector body is provided with a jack for plugging an earphone plug and a first through hole communicated with the jack, the contact terminal is arranged on the connector body and is abutted against the first welding terminal, and one end part of the contact terminal penetrates through the first through hole; the sealing structure is arranged on the connector body and used for sealing the terminal component. A mobile terminal is also provided that includes an earphone connector. Also provides a manufacturing process of the earphone connector, which comprises the following steps: providing a terminal assembly, taking the first welding terminal as an insert molding connector body, installing the contact terminal, and arranging a sealing structure. Through setting up the terminal subassembly segmentation, avoid the high temperature to lead to terminal subassembly and glue separation, improve earphone connector waterproof performance.
Description
Technical field
The present invention relates to connector technique fields, especially provide a kind of headset connector, mobile terminal and headset connector
Manufacture craft.
Background technique
With the development of science and technology, electronic equipment has become, to integrate amusement and leisure, multimedia interaction etc. multi-functional
Mobile terminal while more and more fashion personages are intended to swim in the water or dive under water, can be transferred through electronic equipment realization
It listens to music, see video, taking pictures and making and receiving calls etc.;Meanwhile to adapt to the ultrathin development trend of the electronic equipments such as mobile phone, electronics
The connecting element requirement of equipment is increasingly accurate tiny, and whole height requires more and more thinner.
To make electronic equipment while meeting better product quality and service performance requirement, occurs waterproof currently on the market
Earphone base, and waterproof earphone jack realizes that the mode of waterproof includes: (one) using surface mounting technology, meets life waterproof;(2)
Flexible circuit board drags weldering plus mode for dispensing glue, meets depth waterproof.However under conditions of needing to realize depth waterproof, by dragging
Welding the fixed flexible circuit board of glue of adding some points, wherein the metal terminal of waterproof earphone jack usually realizes sealing and fixation by glue,
It is too fast that metal terminal with respect to plastic cement crosses high temperature endothermic, is easy to appear the case where separating with glue at high temperature to influence earphone base
Waterproof effect, and the manufacture craft is complex, and the shaping efficiency of earphone base is lower and higher cost, is unfavorable for promoting.
Summary of the invention
The purpose of the present invention is to provide the manufacture craft of a kind of headset connector, mobile terminal and headset connector, purports
It is solving in the prior art, by dragging solder joint glue mode fixing circuit board that the waterproof action of headset connector is caused to hold at high temperature
Vulnerable technical problem.
To solve the above problems, the embodiment of the invention provides a kind of headset connectors, comprising:
Terminal assemblies, including contact terminal and the first solder terminal;
Connector body, the connector body passes through injection molding using first solder terminal as inserts, described
The welding foot of first solder terminal is pierced by the surface of the connector body, and the connector body has for headset plug grafting
Jack and the first via hole for being connected to the jack, the contact terminal be installed on the connector body and be connected to institute
The first solder terminal is stated so that the contact terminal is connected with first solder terminal, and the one end of the contact terminal is worn
Cross first via hole;
Sealing structure, on the connector body and for sealing the terminal assemblies.
Further, the connector body has the mounting groove for accommodating the contact terminal, in the contact jaw
When son is placed in the mounting groove, the contact terminal is connected to first solder terminal.
Further, first solder terminal includes contact portion for abutting with the contact terminal and is connect by described
Contact portion bends the position limit arm extended to form, and the position limit arm protrudes into the connector body, the weldering of first solder terminal
Pin is connected with the contact portion.
Further, the contact terminal include substrate, by the substrate side projection protrusion, and by described
The edge of substrate bends the elastic arm extended to form, and the substrate is inserted in the mounting groove, and the protrusion presses on described
The end of contact portion, the elastic arm passes through first via hole.
Further, the terminal assemblies further include the second solder terminal being disposed adjacent with first solder terminal,
The connector body passes through injection molding as inserts using first solder terminal and second solder terminal, and described the
The welding foot of two solder terminals is pierced by the surface of the connector body, and the connector body has to be connected to the jack
The opening of second via hole, second via hole close to the jack is arranged, and the one end of second solder terminal passes through institute
State the second via hole.
Further, first solder terminal is set as five, and second solder terminal is set as one, wherein three
A first solder terminal is arranged side by side and is distributed in a side of the connector body, other two described first welding
Terminal and second solder terminal are arranged side by side and are distributed in the other side of the connector body.
Further, the sealing structure includes sealant and the sealing cover that is covered on the terminal assemblies, described close
Sealing is filled in the gap between the sealing cover and connector body and forms sealant layer.
Further, limiting slot is offered on the connector body, the sealing cover includes cover board and by the cover board
End projection limited block, the cover plate lid is set on the terminal assemblies, and the limited block is corresponding to be inserted into the limiting slot.
The beneficial effect of headset connector provided by the invention is: compared with prior art, the present invention is by by terminal
Component subsection setup is insert injection molding on connector body using the first solder terminal, contacts on connector body
Terminal is set on connector body and is connected to the first solder terminal, realizes the conducting of contact terminal and solder terminal, so that end
Sub-component, which does not need dispensing, to be fixed on connector body, while sealing structure is sealed on terminal assemblies, avoid ear
Machine connector causes to separate between terminal assemblies and glue since terminal assemblies temperature is excessively high and heat absorption is too fast in use
The case where so as to cause waterproof effect failure, improve the waterproof performance of headset connector;And the subsection setup of terminal assemblies, and lead to
Sealing structure sealing is crossed, material is simple and cost is relatively low.
The embodiment of the invention also provides a kind of mobile terminals, including above-mentioned headset connector.
Mobile terminal provided by the invention, by using the setting of the above headset connector, so that terminal assemblies do not need
It is fixed on connector body by mode for dispensing glue, avoids headset connector in use due to terminal assemblies temperature mistake
High and heat absorption is too fast to lead to the case where being separated between terminal assemblies and glue so as to cause waterproof effect failure, improves mobile terminal
Waterproof performance, and material is simple, and cost is relatively low.
The present invention also provides a kind of manufacture craft of headset connector, for example above-mentioned earphone connection of the headset connector
Device, comprising the following steps:
Terminal assemblies are provided;
Pass through connector body described in injection molding using first solder terminal as inserts;
The contact terminal is installed on the connector body, the contact terminal is made to be connected to first welding
Terminal, and the one end of the contact terminal passes through first via hole;
The sealing structure is set on the connector body, so that the terminal assemblies seal.
The manufacture craft of headset connector provided by the invention, by by terminal assemblies subsection setup in connector body
On, sealing structure is sealed in terminal assemblies, so that terminal assemblies do not need to be fixed on connector body by mode for dispensing glue,
Connector is avoided to cause to divide between terminal assemblies and glue since terminal assemblies temperature is excessively high and heat absorption is too fast in use
The case where from failing so as to cause waterproof effect, improves the waterproof performance of connector;And the subsection setup of terminal assemblies, and pass through
Sealing structure sealing, simple process and cost is relatively low.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the three-dimensional structure diagram of headset connector provided in an embodiment of the present invention;
Fig. 2 is the schematic perspective view of the connector body of headset connector provided in an embodiment of the present invention;
Fig. 3 is the fit structure schematic diagram of the terminal assemblies of headset connector provided in an embodiment of the present invention;
Fig. 4 is the schematic perspective view of the first solder terminal of headset connector provided in an embodiment of the present invention;
Fig. 5 is the schematic perspective view of the contact terminal of headset connector provided in an embodiment of the present invention;
Fig. 6 is the schematic perspective view of the sealant layer of headset connector provided in an embodiment of the present invention;
Fig. 7 is the schematic perspective view of the sealing cover of headset connector provided in an embodiment of the present invention;
Fig. 8 is the partial structure diagram of headset connector provided in an embodiment of the present invention;
Fig. 9 is the schematic perspective view of the sealing ring of headset connector provided in an embodiment of the present invention;
Figure 10 is the moulding process figure of connector body in headset connector provided in an embodiment of the present invention;
Figure 11 is connector body obtained in the technique of Figure 10;
Figure 12 is the mounting process figure of contact terminal in headset connector provided in an embodiment of the present invention;
Figure 13 is the semi-finished product figure one of headset connector obtained in the technique of Figure 12;
Figure 14 is the mounting process figure of the sealing cover of headset connector provided in an embodiment of the present invention;
Figure 15 is the semi-finished product figure two of headset connector obtained in the technique of Figure 14;
Figure 16 is the setting artwork of the sealant layer of headset connector provided in an embodiment of the present invention;
Figure 17 is the semi-finished product figure three of headset connector obtained in the technique of Figure 16;
Figure 18 is the mounting process figure of the sealant of headset connector provided in an embodiment of the present invention;
Figure 19 is headset connector obtained in the technique of Figure 18.
Wherein, each appended drawing reference in figure:
100- connector body;200- terminal assemblies;300- sealant layer/sealant;400- sealing cover;500- sealing
Circle;600- framework;700- material bag;11- jack;The first via hole of 12-;13- mounting groove;14- limiting slot;The first side 15-;16-
Two sides;17- third side;18- groove;19- step;21- contact terminal;The first solder terminal of 22-;The second solder terminal of 23-;
41- cover board;42- limited block;211- substrate;212- protrusion;213- elastic arm;221- contact portion;222- position limit arm;223-
The welding foot of one solder terminal;224- technical gaps;The welding foot of the second solder terminal of 231-;232- conducting portion.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " length ", " width ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the invention
System.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;It can be mechanical connect
It connects, is also possible to be electrically connected;It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
Also referring to Fig. 1 to Fig. 9, headset connector provided in an embodiment of the present invention includes connector body 100, terminal
Component 200 and sealing structure are applied in mobile terminal, solve in the prior art by dragging solder joint glue mode fixing circuit board
The technical issues of causing the waterproof action of headset connector to be easy failure at high temperature.
Specifically, terminal assemblies 200 include contact terminal 21 and the first solder terminal 22;Connector body 100 is with first
Solder terminal 22 is formed as inserts by injection molding, and the welding foot 223 of the first solder terminal 22 is pierced by connector body 100
Surface, connector body 100 has jack 11 and the first via hole 12 for be connected to jack 11 for headset plug grafting, contacts
Terminal 21 is installed on connector body 100 and is connected to the first solder terminal 22 so that contact terminal 21 and the first solder terminal
22 conductings, and the one end of contact terminal 21 passes through the first via hole 12 and is electrically connected with headset plug;Sealing structure is set to connection
On device ontology 100 and for being sealed in terminal assemblies 200 in connector body 100, external moisture is avoided to enter terminal group
To influence the waterproof effect of headset connector in part 200, and glue is not needed inside terminal assemblies 200 and is fixed.
In the embodiment of the present invention, by the way that 200 subsection setup of terminal assemblies on connector body 100, i.e., is welded with first
Connecting terminal 22 is insert injection molding on connector body 100, and contact terminal 21 is set on connector body 100 and is connected to
First solder terminal 22 realizes the conducting of contact terminal 21 and solder terminal, so that terminal assemblies 200 do not need dispensing
It is fixed on connector body 100, while sealing structure is sealed on terminal assemblies 200, headset connector is avoided to use
Cause to be separated between terminal assemblies 200 and glue so as to cause anti-since 200 temperature of terminal assemblies is excessively high and heat absorption is too fast in journey
The case where water effect fails, improves the waterproof performance of headset connector;And the subsection setup of terminal assemblies 200, and pass through sealing
Sealing structure, material is simple and cost is relatively low.
Specifically, in the present embodiment, headset connector is applied to electronic equipment internal, and is electrically connected to electronic equipment internal
Circuit board realize being electrically connected for electronic equipment and earphone for connecting external headset plug.Here electronic equipment leads to
It is often mobile terminal, including the removable electronic equipment used such as mobile phone, plate and notebook.
Specifically, in the present embodiment, contact terminal 21 is connected to the first solder terminal 22, realizes contact terminal 21 and first
22 mutual conduction of solder terminal, contact terminal 21 partially pass through the first via hole 12 and are contacted with the plug of external headphones, the first weldering
Connecting terminal 22 is electrically connected to the circuit board inside mobile terminal, so that external headphones are electrically connected to the circuit board of mobile terminal, it is real
The use of existing earphone.
Specifically, in the present embodiment, connector body 100 is formed using the first solder terminal 22 as insert injection molding,
So that the connection very simple of the first solder terminal 22 and connector body 100 is convenient, and cost is relatively low, while the first welding ends
The injection molding of son 22, and contact terminal 21 is connected on the first solder terminal 22, is avoided in the prior art directly by first
Solder terminal 22 is assembled in the mode of connector body 100, and connector body 100 is equipped with the first solder terminal 22 of installation
Keeping away a hole leads between connector body 100 and the first solder terminal 22 that there are gaps, therefore 300 water of sealant is caused to be easy to seep
Thoroughly to outside product to influence beauty.Meanwhile the mode of injection molding realizes the fixation of the first solder terminal 22, it can be ensured that the
The size of one solder terminal 22 can be opposite it is accurate, improve the precision of headset connector.
Specifically, in the present embodiment, 200 subsection setup of terminal assemblies, i.e. the first solder terminal 22 and 21 phase of contact terminal
It is mutually connected and subsection setup, contact terminal 21 is resiliently attached to the first solder terminal 22, enables contact terminal 21 more smart
It really is electrically connected with the realization of the first solder terminal 22, i.e., does not need setting glue between contact terminal 21 and the first solder terminal 22
Water is sealed on terminal assemblies 200 to realize fixation by sealing structure, avoids what glue was permeated to terminal assemblies 200
May, thus can to avoid 200 temperature of terminal assemblies raising when be easy separated with glue the case where cause waterproof effect failure
Situation.Wherein, terminal assemblies 200 are set as metalwork.
Also referring to Fig. 1 and Fig. 2, in the present embodiment, headset connector is set as rectangular-shape, and connector body
100 are made of plastic material, but do not do unique restriction.
Also referring to Fig. 1 to Fig. 4, in the present embodiment, connector body 100 has the first side 15 being oppositely arranged and the
Two sides 16, and the third side 17 being disposed adjacent respectively with the first side 15 and second side 16, i.e. third side 17 are set to the first side
Between 15 and second side 16.Wherein, the opening of jack 11 is arranged on third side 17 and jack 11 stretches out connector body 100
Inside, contact terminal 21 are located on the first side 15 and are connected to the first solder terminal 22, and the welding foot of the first solder terminal 22
223 pass through second side 16 from the first side 15 of connector body 100.
Specifically, referring to Fig. 1, in the present embodiment, second side 16 and both ends for being located at jack 11 offer step 19, the
The welding foot 223 of one solder terminal 22 stretches out step 19, and the external circuit board is arranged on the step 19 at both ends, and the external circuit board
On be provided with connecting hole, the welding foot 223 of the first solder terminal 22 protrudes into the connecting hole electrical property realized with the external circuit board
Connection, and connecting hole and welding foot are realized by welding and are fixed.Wherein, in the present embodiment, which is set as mobile
Circuit board in terminal.
Further, also referring to Fig. 1 to Fig. 4, in the present embodiment, connector body 100 has for accommodating contact
The mounting groove 13 of terminal 21, when contact terminal 21 is placed in mounting groove 13, contact terminal 21 is connected to the first solder terminal 22.
One inner sidewall of mounting groove 13 is the first solder terminal 22, and contact terminal 21 is installed in mounting groove 13 and is connected to mounting groove 13
An inner sidewall, the first via hole 12 is located at side opposite with the position of the first solder terminal 22 on mounting groove 13, the first via hole
12 are respectively communicated with mounting groove 13 and jack 11.
Further, also referring to Fig. 1 to Fig. 4, in the present embodiment, the first solder terminal 22 include contact portion 221 and
The welding foot 223 of the welding foot 223 of first solder terminal 22, the first solder terminal 22 is connected with contact portion 221, i.e., the first weldering
The welding foot 223 of connecting terminal 22 is extended by the bending of contact portion 221.
In the present embodiment, the first solder terminal 22 further includes position limit arm 222, and position limit arm 222 is bent by contact portion 221 to be extended
It is formed, position limit arm 222 protrudes into connector body 100, reinforces consolidating between the first solder terminal 22 and connector body 100
It is fixed, and a technical gaps 224 are also provided in position limit arm 222, it is conducive in 100 forming process of connector body to the first welding section
Terminal 22 grips, convenient for the injection molding work of connector body 100.
Specifically, in the present embodiment, contact portion 221 is set as the inner sidewall of mounting groove 13, and contact terminal 21 is installed on
In tankage 13 and it is connected to contact portion 221, which has communication function, realizes the first solder terminal 22 and contact jaw
The conducting of son 21.The welding foot 223 of first solder terminal 22 has mounting groove 13 to stretch out the surface of connector body 100, that is, stretches out
The step 19 of connector body 100, for the welding circuit board in mobile terminal.
Further, also referring to Fig. 1 to Fig. 5, in the present embodiment, contact terminal 21 includes substrate 211, protrusion
212 and elastic arm 213, protrusion 212 formed by the side projection of substrate 211, elastic arm 213 is curved by the edge of substrate 211
Folding extends to form, and substrate 211 is inserted in mounting groove 13 and is arranged in parallel with contact portion 221, and 212 elasticity of protrusion presses on contact
Portion 221, to realize the electric connection with the first solder terminal 22;213 part of elastic arm is connected in mounting groove 13 and contact portion
On 221 inner sidewalls being oppositely arranged, and the end of elastic arm 213 passes through the first via hole 12 and is contacted with the plug of external headphones,
To realize the electric connection of external headphones Yu the first solder terminal 22.
Further, also referring to Fig. 1 to 3, in the present embodiment, terminal assemblies 200 further include and the first solder terminal
22 the second solder terminals 23 being disposed adjacent, connector body 100 using the first solder terminal 22 and the second solder terminal 23 as
Inserts is positioned close to one end of third side 17, the welding of the second solder terminal 23 by injection molding, the second solder terminal 23
Foot 231 is pierced by the surface of connector body 100, and connector body 100 has the second via hole (not shown) being connected to jack 11,
The opening of second via hole close to jack 11 is arranged, and the one end of the second solder terminal 23 passes through the second via hole and and external headphones
Plug be in contact, realize the electric connection of the second solder terminal 23 with external headphones.
Specifically, in the present embodiment, the welding foot 231 of the second solder terminal 23 equally stretches out the platform of connector body 100
Rank 19, for being welded with the connecting hole of circuit board.
Specifically, the one end across the second via hole of the second solder terminal 23 is set as conducting portion 232, partially passes through
Two via holes and the opening for also extending through jack 11, the conducting portion 232 also elasticity are connected to external headphones, realize the plug of external headphones
With the electric connection of the second solder terminal 23.
Specifically, in the present embodiment, the second solder terminal 23 is set as microphone terminal, i.e. MIC terminal.
Specifically, in the present embodiment, connector body 100 is also by regarding the second solder terminal 23 as insert injection molding
It forms, the mode of injection molding makes the relatively simple convenience of the molding of headset connector, and cost is relatively low, avoids in the prior art
The fixation that the second solder terminal 23 is realized by the second solder terminal of via hole oblique cutting 23 causes technique more difficult and is difficult to reality
The automatic production of existing machine, therefore its simple process, are relatively easy to volume production.
Further, referring to Figure 2 together to Fig. 5, in the present embodiment, the first solder terminal 22 is set as five, and second
Solder terminal 23 is set as one, wherein three the first solder terminals 22 are arranged side by side and are distributed in the one of connector body 100
Side, other two first solder terminal 22 and the second solder terminal 23 are arranged side by side and are distributed in the another of connector body 100
One side, and relatively and be arranged in a one-to-one correspondence with three the first solder terminals 22.
Corresponding, contact terminal 21 and mounting groove 13 are disposed as five, the first solder terminal 22 and the second solder terminal
23 are respectively arranged at the two sides of jack 11.
Specifically, in the present embodiment, connection and shape are abutted between five the first solder terminals 22 and five contact terminals 21
At the terminal of five entirety, which respectively includes ground terminal, L channel terminal, right channel terminal and switch terminal
It is microphone terminal Deng, the second solder terminal 23.
Further, referring to Figure 2 together, Fig. 6 and Fig. 7, in the present embodiment, sealing structure includes sealant 300 and lid
Sealing cover 400 on terminal assemblies 200, sealing cover 400 is covered on mounting groove 13 and hermetic terminal assembly 200, avoids
Terminal assemblies 200 it is exposed, sealant 300 is filled in the gap between sealing cover 400 and connector body 100 and forms sealing
Glue-line 300.The main waterproof effect of headset connector in the present embodiment be embodied in sealant 300 be filled in sealing cover 400 with
Between connector body 100, sealing cover 400 and sealant 300 are respectively positioned on the outside of terminal assemblies 200, connector body 100,
Sealing cover 400 and sealant 300 form the waterproof layer of protection terminal assemblies 200, and sealant 300 does not need to infiltrate into terminal
On component 200, therefore, needs not move through sealant 300 and be set up directly on realization terminal assemblies 200 on terminal assemblies 200
Waterproof effect.
Wherein, sealing cover 400 is set as plastic parts.And sealant 300 is connected to sealing cover 400 and connector body 100
Between gap, and be layed in the surface of sealing cover 400 also to realize the whole sealing effect of connector body 100, meanwhile,
Sealant 300 not in contact with or infiltrate on terminal assemblies 200, which is connected only to the sealing cover as plastic parts
400 and connector body 100, due to can be easily separated between metalwork and sealant 300 when temperature is higher, sealant 300
Avoid the contact of terminal assemblies 200 with sealant 300 so that sealing effect of the sealant 300 between sealing cover 400 it is stronger and
It is not readily separated, improves the waterproof effect of headset connector.In the present embodiment, connector body 100, sealing cover 400 and close
Sealing 300 forms main waterproof layer, even if sealant 300 infiltrates on terminal assemblies 200, terminal assemblies when the temperature is excessively high
200 with sealant 300 when separating, the waterproof layer that connector body 100, sealing cover 400 and sealant 300 are formed not by
To interference, therefore have no effect on the waterproof of terminal assemblies 200.Therefore, the waterproof result in the present embodiment is not vulnerable.
Further, referring to Figure 2 together, Fig. 6 and Fig. 7, in the present embodiment, limit is offered on connector body 100
Slot 14, sealing cover 400 include the limited block 42 of cover board 41 and the end projection by cover board 41, and cover board 41 is covered on terminal assemblies
On 200, the corresponding insertion limiting slot 14 of limited block 42.
Specifically, in the present embodiment, the outside on connector body 100 and being located at mounting groove 13 is arranged in limiting slot 14,
And limiting slot 14 and mounting groove 13 are interconnected, and are arranged in a one-to-one correspondence between the limiting slot 14 and mounting groove 13, limiting slot 14
Square groove is opened up but be not limited to, is open and is arranged towards the outside of connector body 100.
Wherein, sealing cover 400 includes the limited block 42 of cover board 41 and the end projection by cover board 41, and cover board 41 is covered on peace
On tankage 13, in the corresponding insertion limiting slot 14 of limited block 42, to realize the limit of cover board 41, so that cover board 41 is fixed on mounting groove
On 13, the sealing function of terminal assemblies 200 is realized.Meanwhile sealant 300 be filled in sealing cover 400 and connector body 100 it
Between gap, due to the sealing function of cover board 41 so that sealant 300 is not easy to infiltrate on terminal assemblies 200, sealant 300
And the combination of connector body 100, sealing cover 400 so that sealing cover 400 with the entirety that sealant layer 300 is formed is firm consolidates
It is scheduled on connector body 100, that is, is not required to directly be sealed in terminal assemblies 200 with sealant 300, be not easy to fail at high temperature,
Improve the sealed waterproof effect of headset connector.
Further, also referring to Fig. 8 and Fig. 9, in the present embodiment, on connector body 100 and it is located at jack 11
Open outer side is convexly equipped with hollow framework 600, framework 600 is located at the third side 17 of connector body 100, and the jack 11 is opened
Mouth is set as the middle position of framework 600, which stretches out outside third side 17, framework 600 and connector body 100
It is enclosed the groove 18 of circle shape, is embedded with sealing ring 500 in groove 18, the inner sidewall of sealing ring 500 is connected to framework 600
Lateral wall, so that 500 part of sealing ring is stretched out outside third side 17, to reinforce the sealing effect of headset connector.
Specifically, in the present embodiment, mobile terminal includes the interior shell for setting accommodating cavity, and headset connector is arranged in the accommodating
It is intracavitary, and sealing ring 500 is connected to the inner sidewall setting of shell, forms interference between sealing ring 500 and the shell of mobile phone, is formed
The sealing in the gap between headset connector and handset shell, so that mobile phone in use, is not needed using special
The waterproof plug of door, i.e. mobile phone are placed under certain water pressure for a long time, are all not in that water by headset connector enters movement
The sealing effect of headset connector is improved in the inside of terminal.
Further, the present invention also provides a kind of mobile terminals, including terminal body, further include headset connector,
Headset connector is set in terminal body, and headset connector here is above-mentioned headset connector, and details are not described herein again.
Specifically, in the present embodiment, circuit board is set in mobile terminal, the circuit board electrical connection headset connector.Specifically,
Connecting hole is offered on circuit board, the welding foot 223 and the second solder terminal 23 of the first solder terminal 22 in headset connector
Welding foot 231 protrude into the connecting hole and achieve a fixed connection by welding.
In the present embodiment, mobile terminal is set as mobile phone and does not limit uniquely.
The mobile terminal of offer of the invention, by using the setting of the above headset connector, so that terminal assemblies 200 are not
It needs to be fixed on connector body 100 by mode for dispensing glue, avoids headset connector in use due to terminal group
200 temperature of part is excessively high and heat absorption is too fast causes to separate the feelings so as to cause waterproof effect failure between terminal assemblies 200 and glue
Condition improves the waterproof performance of mobile terminal, and material is simple, and cost is relatively low.
Further, also referring to Figure 10 to Figure 19, the present invention also provides a kind of production of above-mentioned headset connector
Technique, wherein headset connector here is identical as above-mentioned headset connector, and details are not described herein again.The system of headset connector
Make technique the following steps are included:
Terminal assemblies 200 are provided;
Also referring to Figure 10 to Figure 12, in the present embodiment, terminal assemblies 200 include the weldering of the first solder terminal 22, second
Connecting terminal 23 and contact terminal 21, wherein the first solder terminal 22 and the second solder terminal 23 are arranged in a material bag simultaneously
On 700.
It please refers to the moulding process figure of Figure 10, in this step, passes through injection molding using the first solder terminal 22 as inserts
Connector body 100;
Also referring to Figure 10 and Figure 11, in the present embodiment, also pass through injection molding using the second solder terminal 23 as inserts
Mode formed connectors ontology 100, obtains connector body 100 shown in Figure 11;Wherein, the first solder terminal 22 and
Two welding sections are disposed adjacent, and limiting slot 14, jack 11, mounting groove 13, first have been offered on obtained connector body 100
Via hole 12 and the second via hole etc..
It please refers to the moulding process figure of Figure 12, in this step, contact terminal 21 is installed on connector illustrated in fig. 11
On ontology 100, contact terminal 21 is set to be connected to the first solder terminal 22, and the one end of contact terminal 21 passes through the first via hole
12, obtain the semi-finished product figure of headset connector illustrated in fig. 13;
Please with reference to the artwork of Figure 14 and Figure 16, in the step, sealing structure is set to connection illustrated in fig. 13
On device ontology 100, so that terminal assemblies 200 seal.
Specifically, the technique for please referring to Figure 14 in this step, is pacified on the semi-finished product of headset connector illustrated in fig. 13
Sealing cover 400 is filled, and is limited in limited block 42 on limiting slot 14, obtains the semi-finished product of headset connector illustrated in fig. 15.
It please refers to the technique in Figure 16, in this step, is arranged on the semi-finished product of headset connector illustrated in fig. 15 close
Adhesive layer 300 specifically, sealant 300 is arranged on gap between sealing cover 400 and connector body 100, and makes close
The solidification of sealing 300 forms sealant layer 300, obtains the semi-finished product of headset connector shown in Figure 17.
Technique shown in please referring to 18 in this step, is arranged on the semi-finished product of the headset connector obtained in Figure 17
Sealing ring 500 obtains headset connector shown in Figure 19.In the present embodiment, headset connector is being installed on mobile terminal
When interior, sealing ring 500 is used to be connected to the inner sidewall of the shell of mobile terminal, reinforces sealing water-proof function.
In the present embodiment, above processing step does not do unique restriction, as long as headset connector can be completed.
The manufacture craft of headset connector provided by the invention, by by 200 subsection setup of terminal assemblies in connector sheet
On body 100, sealing structure is sealed in terminal assemblies 200, so that terminal assemblies 200 do not need to be fixed on company by mode for dispensing glue
It connects on device ontology 100, headset connector is avoided to cause in use since 200 temperature of terminal assemblies is excessively high and heat absorption is too fast
The case where being separated between terminal assemblies 200 and glue so as to cause waterproof effect failure, improves the waterproof performance of headset connector;
And the subsection setup of terminal assemblies 200, and sealed by sealing structure, simple process and cost is relatively low.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of headset connector characterized by comprising
Terminal assemblies, including contact terminal and the first solder terminal;
Connector body, the connector body using first solder terminal as inserts by injection molding, described first
The welding foot of solder terminal is pierced by the surface of the connector body, and the connector body has inserting for headset plug grafting
Hole and the first via hole being connected to the jack, the contact terminal are installed on the connector body and are connected to described
One solder terminal is so that the contact terminal is connected with first solder terminal, and the one end of the contact terminal passes through institute
State the first via hole;
Sealing structure, on the connector body and for sealing the terminal assemblies.
2. headset connector as described in claim 1, which is characterized in that the connector body has for accommodating described connect
The mounting groove of contravention, when the contact terminal is placed in the mounting groove, the contact terminal is connected to first weldering
Connecting terminal.
3. headset connector as claimed in claim 2, which is characterized in that first solder terminal includes for connecing with described
The contact portion and bend the position limit arm extended to form by the contact portion that contravention abuts, the position limit arm protrudes into the connector
In ontology, the welding foot of first solder terminal is connected with the contact portion.
4. headset connector as claimed in claim 3, which is characterized in that the contact terminal includes substrate, by the substrate
Side projection protrusion, and the elastic arm that extends to form is bent by the edge of the substrate, the substrate is inserted in institute
Mounting groove is stated, the protrusion presses on the contact portion, and the end of the elastic arm passes through first via hole.
5. headset connector as described in claim 1, which is characterized in that the terminal assemblies further include and described first welds
The second solder terminal that terminal is disposed adjacent, the connector body is with first solder terminal and second solder terminal
As inserts by injection molding, the welding foot of second solder terminal is pierced by the surface of the connector body, the company
Connecing device ontology has the second via hole being connected to the jack, and the opening of second via hole close to the jack is arranged, institute
The one end for stating the second solder terminal passes through second via hole.
6. headset connector as claimed in claim 5, which is characterized in that first solder terminal is set as five, described
Second solder terminal is set as one, wherein three first solder terminals are arranged side by side and are distributed in the connector body
A side, other two described first solder terminal and second solder terminal are arranged side by side and are distributed in the connector
The other side of ontology.
7. headset connector as claimed in any one of claims 1 to 6, which is characterized in that the sealing structure include sealant and
The sealing cover being covered on the terminal assemblies, the sealant are filled in the gap between the sealing cover and connector body
And form sealant layer.
8. headset connector as claimed in claim 7, which is characterized in that offer limiting slot, institute on the connector body
The limited block that sealing cover includes cover board and the end projection by the cover board is stated, the cover plate lid is set on the terminal assemblies,
The limited block is corresponding to be inserted into the limiting slot.
9. a kind of mobile terminal, which is characterized in that including such as described in any item headset connectors of claim 1-8.
10. a kind of manufacture craft of headset connector, which is characterized in that any one of described headset connector such as claim 1-8
The headset connector, comprising the following steps:
Terminal assemblies are provided;
Pass through connector body described in injection molding using first solder terminal as inserts;
The contact terminal is installed on the connector body, the contact terminal is made to be connected to first welding ends
Son, and the one end of the contact terminal passes through first via hole;
The sealing structure is set on the connector body, so that the terminal assemblies seal.
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CN201921013041.9U Active CN209948113U (en) | 2019-06-24 | 2019-06-28 | Earphone connector and mobile terminal |
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CN209948113U (en) | 2020-01-14 |
CN110265811B (en) | 2024-09-03 |
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