CN110239947B

CN110239947B - A wafer automatic testing machine

Info

Publication number: CN110239947B
Application number: CN201910607617.2A
Authority: CN
Inventors: 范群意
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-07-04
Filing date: 2019-07-04
Publication date: 2024-12-13
Anticipated expiration: 2039-07-04
Also published as: CN110239947A

Abstract

The invention discloses an automatic wafer testing machine, and belongs to the technical field of wafer testing. The wafer automatic testing machine comprises a plurality of tray devices, a testing device and a transferring device, wherein the tray devices are provided with a tray device to be tested and a sorting tray device, the tray device to be tested is configured to bear a tray on which wafers to be tested are placed, the sorting tray device is configured to bear a tray on which wafers to be tested are placed, the transferring device can transfer the wafers to be tested of the tray device to be tested to the testing device to complete testing, and the transferring device can also transfer the wafers to be tested to the sorting tray device from the testing device. The automatic testing machine provided by the invention realizes automatic testing of the wafer, improves the efficiency and the yield of the wafer testing, and reduces the labor intensity of production of operators.

Description

Automatic wafer testing machine

Technical Field

The invention relates to the technical field of wafer testing, in particular to an automatic wafer testing machine.

Background

After the wafer is manufactured, the wafer is cut to form chips, so that in order to avoid damaging the chips in the cutting process and producing unqualified products, quality test is required to be carried out on the single chips, the qualification rate of the products before packaging the chips is ensured, and the increase of the post repair cost is avoided. The wafer test is carried out by adopting a test board, and probes on the test board are contacted with the wafer to finish the program test. The traditional wafer tester all needs to adopt manual feeding and taking materials, so that the labor intensity of personnel is improved, and meanwhile, the production efficiency and the productivity are not improved.

Accordingly, it is desirable to provide an automatic wafer tester that solves the above-mentioned problems.

Disclosure of Invention

The invention aims to provide an automatic wafer testing machine which can improve the efficiency of wafer testing.

In order to achieve the above object, the following technical scheme is provided:

The wafer automatic testing machine comprises a material tray device, a testing device and a transferring device, wherein a plurality of material tray devices are arranged; the plurality of tray devices comprise a tray device to be tested and a sorting tray device, wherein the tray device to be tested is configured to bear a tray on which wafers to be tested are placed;

The transfer device can transfer the wafers to be tested of the tray device to the testing device to finish testing, and can transfer the tested wafers from the testing device to the sorting tray device.

Preferably, the tray device further comprises an empty tray device, wherein the empty tray device is configured to bear empty trays without wafers, the transfer device can transfer the empty trays of the tray device to be tested to the empty tray device, and the transfer device can also transfer the empty trays borne by the empty tray device to the sorting tray device.

Preferably, the empty tray device and the tray device to be tested are at least one.

Preferably, the classifying tray device is provided with a plurality of wafers, the test results of the wafers are classified into a plurality of grades, each grade corresponds to one classifying tray device, and the tested wafers are transferred to the trays of the classifying tray device representing the corresponding grade according to the test results.

Preferably, twelve tray devices are arranged, and the twelve tray devices are distributed in a matrix, wherein ten sorting tray devices are arranged.

Preferably, the system further comprises a display device configured to be able to display the operation state of each device and the test result.

Preferably, the wafer automatic test machine further comprises an electronic control device, wherein the electronic control device is configured to control time sequence actions of each device of the wafer automatic test machine.

Preferably, a plurality of the test devices are provided, and the plurality of the test devices are arranged linearly along the first direction.

Preferably, the wafer automatic testing machine further comprises a frame, wherein the frame comprises a main body and a bearing platform arranged on the upper portion of the main body, and the bearing platform is used for bearing the transfer device and the tray device.

Preferably, a U-shaped baffle is arranged on the outer side of the bearing platform to cover the tray device and the transfer device, and the testing device is arranged at the opening end of the U-shaped baffle.

Compared with the prior art, the invention has the beneficial effects that:

The automatic testing machine provided by the invention realizes automatic testing of the wafer, improves the efficiency and the yield of the wafer testing, and reduces the labor intensity of production of operators.

Drawings

FIG. 1 is a schematic diagram of an automatic wafer tester according to an embodiment of the present invention;

FIG. 2 is a front view of an automatic wafer tester according to an embodiment of the present invention;

FIG. 3 is a schematic view of a frame according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a tray apparatus according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a tray according to an embodiment of the present invention;

FIG. 6 is an enlarged partial schematic view of FIG. 4A;

fig. 7 is a schematic structural diagram of a transfer device according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of a transfer device according to an embodiment of the present invention after removing a second substrate;

FIG. 9 is an enlarged partial schematic view at B in FIG. 8;

FIG. 10 is a schematic diagram of a testing device according to an embodiment of the present invention;

FIG. 11 is a side view of a testing device in accordance with an embodiment of the present invention;

FIG. 12 is an enlarged partial schematic view of FIG. 10 at C;

FIG. 13 is a schematic diagram of a portion of a testing device according to an embodiment of the present invention;

FIG. 14 is a schematic diagram showing a part of a testing apparatus according to a second embodiment of the present invention;

fig. 15 is a schematic diagram of a portion of a testing device according to an embodiment of the present invention.

Reference numerals:

100-material tray, 101-groove;

1-frame, 11-main body, 12-bearing platform, 121-through groove, 13-baffle plate and 14-bearing plate;

2-tray device, 21-mounting top plate, 211-correlation sensor, 22-mounting bottom plate, 23-connecting rod, 24-tray supporting block, 25-first driving mechanism, 251-lifting table, 2511-first light shielding plate, 252-driving motor, 26-first photoelectric switch, 27-positioning block, 28-guiding block, 281-connecting part, 282-guiding part, 2821-first guiding surface, 2822-second guiding surface and 2823-positioning surface;

3-transferring device, 31-first substrate, 311-first sliding rail, 312-second photoelectric switch, 32-second substrate, 321-second sliding rail, 322-third photoelectric switch, 323-holding groove, 33-first driving component, 331-first driving source, 332-first driving wheel, 333-first driven wheel, 334-first conveying belt, 335-first belt connector, 3351-first fixing plate, 3352-second fixing plate, 336-first mounting frame, 34-second driving component, 341-second driving source, 342-second driving wheel, 343-second driven wheel, 344-second conveying belt, 345-second belt connector, 346-second mounting frame, 35-first sliding block, 36-second sliding block, 361-fourth shading plate, 37-suction nozzle component, 371-cylinder, 372-suction nozzle fixing plate, 373-suction nozzle body, 374-pneumatic control valve, 375-second guide rod;

4-testing device, 40-angle adjusting mechanism, 401-rotating workbench, 402-adjusting block, 4021-strip groove, 403-adjusting column, 404-adjusting rod, 405-first spiral differential head, 406-first locking bolt, 407-locking nut, 41-supporting mechanism, 411-supporting top plate, 412-supporting bottom plate, 413-supporting vertical plate, 4131-fourth photoelectric switch, 414-supporting support plate, 415-supporting rod, 42-lifting mechanism, 421-lifting driving source, 422-first connecting plate, 43-testing table component, 431-testing table, 432-carrier, 433-positioning strip, 434-pushing structure, 4341-pushing cylinder, 4342-pushing plate, 4343-pushing thimble, 4344-third guiding rod, 44-testing plate component, 441-testing plate, 442-pressing plate, 443-spring plate, 444-limiting baffle, 45-buffering structure, 451-buffering connecting block, 452-buffer, 46-linear guide structure, 461-third sliding block, 462-third sliding rail, 47-carrier, 433-positioning strip, 434-pushing structure, 4342-pushing plate, 4344-pushing bolt, 4344-third spiral differential head, 4344-third guiding bolt, 441-testing plate, 442-sliding guide plate, 443-spring plate, 444-limiting baffle, and seat;

5-display device.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present invention, it should also be noted that, unless explicitly stated and limited otherwise, the terms "disposed" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, or electrically connected. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.

Example 1

Referring to fig. 1 and 2, the embodiment discloses an automatic wafer tester, which comprises a frame 1, a transfer device 3 arranged on the frame 1, a tray device 2, a testing device 4 and a display device 5. The frame 1 is also provided with an electric control device which mainly comprises a PLC module and is used for controlling and integrating the time sequence actions of each device of the automatic wafer testing machine so as to realize the automatic operation of wafer testing. The display device 5 is configured to display the operation state of each device and the test result, so as to facilitate manual real-time monitoring of the test flow.

Specifically, referring to fig. 3, the rack 1 includes a main body 11 and a carrying platform 12 disposed on an upper portion of the main body 11, wherein the main body 11 is used for accommodating an electronic control device, the carrying platform 12 is used for carrying the transfer device 3 and the tray device 2, and optionally, the carrying platform 12 is made of marble material to stably support the transfer device 3 and the tray device 2. The rack 1 further comprises a baffle 13 which is arranged on the outer side of the bearing platform 12 in a surrounding mode, the baffle 13 is of a U-shaped structure, the whole bearing platform, the transfer device 3 and the tray device 2 on the whole bearing platform can be surrounded by the baffle 13, the transfer device 3 is prevented from being interfered by the outside to operate or touching the tray device 2, the testing device 4 is arranged at the opening end of the U-shaped baffle 13, and the transfer device 3 can conveniently transfer wafers on the tray device 2 to the testing device 4 at the opening end for testing. Optionally, the rack 1 further comprises a carrier plate 14, and the testing device 4 is disposed on the carrier plate 14. One end of the bearing plate 14 is detachably connected with the main machine body 11, and the other end of the bearing plate is detachably connected with the bearing platform 12, so that the stability of the position relationship between the testing device 4 and the material tray device 2 is ensured. Further, the bearing plate 14 is connected with the bearing platform 12 through a wedge-shaped reinforcing plate, so that the bearing stability of the bearing plate 14 is improved. Optionally, the display device 5 is provided on the side wall of the main body 11 by a gimbal, so that it does not affect the testing process of the whole automatic testing machine and can flexibly change the placement position.

In order to improve the efficiency of wafer testing, the testing device 4 is provided with a plurality of testing devices 4, and the plurality of testing devices 4 are arranged linearly along the first direction. In this embodiment, the number of the test devices 4 is five, so that the test of five wafers can be performed simultaneously, and the efficiency of testing the wafers is significantly improved, and of course, in some other embodiments, the number of the test devices 4 or the test devices 4 in use may be limited according to the test time of each wafer and the limitation of the moving speed of the transfer device 3.

The tray device 2 is used for carrying a tray 100, and wafers are placed on the tray 100. The tray device 2 is provided with a plurality of tray devices, the plurality of tray devices 2 can be divided into three types, the first type is an empty tray device for carrying empty trays without wafers, the second type is a tray device to be tested, the trays 100 carried by the empty tray device are provided with untested wafers, the third type is a sorting tray device, since the test results of the wafers can be divided into a plurality of grades, the sorting tray device is also divided into a plurality of grades according to the test results, each grade corresponds to one sorting tray device, and the tested wafers are placed on the trays 100 representing the sorting tray device of the corresponding grade according to the test results. The three types of tray devices 2 are arranged, so that the automatic tester can automatically sort and store wafers according to test results, and the automation and intelligent degree of wafer testing are effectively improved. In this embodiment, twelve tray devices 2 are provided, and twelve tray devices 2 are optionally distributed in a matrix on the carrying platform 12, where one empty tray device, one tray device to be tested, and ten sorting tray devices are provided. Of course, in the implementation, the number of the sorting tray devices may be limited according to the grading of the wafer test result, and the number of the empty tray devices and the tray devices to be tested may be at least one, and the number of the empty tray devices and the tray devices to be tested may be multiple according to the number of the trays 100 that each tray device 2 can carry, the number of the wafers that each tray 100 can place, the transfer mode of the transfer device 3, and the like.

In this embodiment, after all the wafers of the tray 100 carried on the tray device to be tested are taken out, the remaining empty tray is transferred to the empty tray device by the transfer device 3, and for the empty tray device, the empty tray carried on the empty tray device can be transferred to the corresponding sorting tray device by the transfer device 3 for sorting and storing the wafers subjected to the test, thereby realizing the turnover utilization of the empty tray in the wafer testing process, improving the utilization rate of the tray 100, and further improving the testing efficiency and the intelligent degree of the automatic wafer testing. In specific implementation, when the automatic testing machine is started initially, the empty tray device is ensured to be provided with a plurality of empty trays, and the continuity of transferring the empty trays among different tray devices 2 is realized.

Example two

The present embodiment is to provide a tray device 2 that can be used in the wafer automatic test machine in the first embodiment. Specifically, referring to fig. 4, the tray device 2 includes a mounting top plate 21 and a mounting bottom plate 22, and alternatively, the mounting top plate 21 is disposed at a distance from the mounting bottom plate 22 and is connected by a connecting rod 23, and the connecting rod 23 is vertically disposed between the mounting top plate 21 and the mounting bottom plate 22. Further, in order to enable the automatic tester to perform testing of more wafers, each tray device 2 is configured to allow a plurality of trays 100 to be stacked in the vertical direction in the space between the mounting top plate 21 and the mounting bottom plate 22, and the transfer device 3 completes the reciprocating movement of the wafers located on the uppermost tray 100 between the tray device 2 and the testing device 4 or the transfer of empty trays between the tray device to be tested and the empty tray device and between the empty tray device and the sort tray device according to the instruction. Further alternatively, the carrying platform 12 is provided with through grooves 121 with the same number as the tray devices 2, the through grooves 121 penetrate through the whole carrying platform 12 and are communicated with the inside of the main machine body 11, and each through groove 121 is internally provided with one tray device 2 correspondingly, so that trays 100 stacked between the mounting top plate 21 and the mounting bottom plate 22 can be stored in the main machine body 11, the space of the frame 1 is fully utilized, and the size of the whole wafer automatic tester is compressed. Wherein, the installation roof 21 is fixedly connected with the bearing platform 12 to realize the fixation of the tray device 2 and the bearing platform 12. Alternatively, the fixing manner may be bolt fixing or clamping, but is not limited to the above manner. The mounting top plate 21 is of a frame structure, the tray 100 is of a plate-shaped structure, the uppermost tray 100 is arranged in the frame structure of the mounting top plate 21, the centers of the tray 100 and the frame structure of the mounting top plate 21 are mutually overlapped, alternatively, the tray 100 and the inner frame of the mounting top plate 21 are of rectangular structures, and four sides of the tray 100 are arranged in parallel with four sides of the inner frame of the mounting top plate 21 one by one. Further, referring to fig. 5, a plurality of grooves 101 are formed in the tray 100, and the grooves 101 are used for storing wafers. Further, the wafers on the tray 100 are arranged in a matrix, so that the transferring device 3 can obtain the specific position of the wafer and the position to which the wafer needs to be moved according to the rectangular coordinates.

Further, since the tray device 2 is provided with a plurality of stacked trays 100, when the trays 100 are turned out or turned into one tray 100, the overall height of the stacked trays 100 on the tray device 2 will be changed, so that the uppermost tray 100 of each tray device 2 should be kept at the same level in order to ensure that the transfer device 3 transfers wafers or trays 100 of each tray device 2 in the same level, the tray device 2 further comprises a tray supporting block 24 for supporting the tray 100 and a first driving mechanism 25 for driving the tray supporting block 24 to lift, and the trays 100 are stacked on the tray supporting block 24 along the vertical direction and all trays 100 are driven to lift integrally by the first driving mechanism 25. In particular, when the uppermost tray 100 of the tray device 2 is transferred, the first driving mechanism 25 drives the tray 100 to move up by one tray 100, so that the next tray 100 is moved to the position of the transferred tray 100, the transfer device 3 is convenient for performing the subsequent operation on the new tray 100 at the same position, when the transfer device 3 transfers one new tray 100 to a certain tray device 2, the first driving mechanism 25 drives the tray 100 to move down by one tray 100, the original uppermost tray 100 is stored in the space between the mounting top plate 21 and the mounting bottom plate 22, and the transfer device 3 completes the subsequent operation on the new uppermost tray 100. Further, when a lot of wafers have been completely inspected and need to be taken out by the automatic tester, the tray support 24 is lifted to the highest height by the first driving mechanism 25, so that all stacked trays 100 can be taken out by the automatic tester. In this embodiment, the plane on which the optional carrying platform 12 is located is a transfer plane.

Alternatively, still referring to fig. 4, the first driving mechanism 25 includes a lifting table 251 and a driving motor 252, the tray supporting block 24 is disposed on the lifting table 251, a main body of the driving motor 252 is disposed on the mounting base plate 22, an output shaft of the driving motor 252 extends out of the mounting base plate 22 and is connected with the lifting table 251 through a screw nut structure, a nut of the screw nut structure is fixed with the lifting table 251, a screw of the screw nut is connected with an output shaft of the driving motor 252, and through threaded connection between the screw and the nut, conversion from rotary motion to linear motion is achieved, and then up-down lifting of the lifting table 251 is achieved, so that the tray supporting block 24 can freely move between the mounting top plate 21 and the mounting base plate 22. In some other embodiments, the first driving mechanism 25 may also adopt a cylinder lifting structure or a rack and pinion lifting structure, etc. Optionally, in order to improve the accuracy of lifting of the lifting table 251, a first guide through hole is provided on the lifting table 251, a first guide rod is provided on at least one of the mounting top plate 21 and the mounting bottom plate 22, the first guide rod is provided in the first guide through hole, and a guiding effect is achieved by the relative sliding of the first guide rod in the first guide through hole. Further optionally, a first guide sleeve is arranged in the first guide through hole so as to ensure smoothness in the guide process. Alternatively, in the present embodiment, the connection rod 23 may serve as the first guide rod. Optionally, the lifting platform 251 and the tray supporting block 24 are integrally formed, so as to realize the synchronism of lifting driving.

In order to limit the descending height of the tray support 24, the mounting base 22 is provided with a first photoelectric switch 26, the lower part of the lifting table 251 is provided with a first light shielding plate 2511, and when the lifting table 251 descends to a position between the transmitting end and the receiving end of the first photoelectric switch 26, the first photoelectric switch 26 is triggered to generate a signal for the lifting table 251 to descend to a limit position, so that the lifting table 251 is prevented from further descending.

Further, a first positioning protrusion is arranged on the upper surface of the tray 100, a first positioning groove is arranged on the lower surface of the tray 100, the tray 100 is clamped with the first positioning groove of the tray 100 above the tray 100 through the first positioning protrusion, and is clamped with the first positioning protrusion of the tray 100 below the tray 100 through the first positioning groove, so that stable stacking of two adjacent trays 100 is realized. Further, the first positioning protrusion and the first positioning groove of the tray 100 may have a rectangular structure adapted to the tray 100, and accordingly, the groove 101 for accommodating the wafer is formed on the first positioning protrusion. Of course, in other embodiments, the upper surface of the tray 100 may be provided with a first positioning groove, the lower surface of the tray 100 is provided with a first positioning protrusion, the groove 101 is formed in the first positioning groove, and the stable stacking of the tray 100 is realized in a manner of mutually clamping. Further, the positioning block 27 is disposed on the upper surface of the tray supporting block 24, and when the first positioning groove is disposed on the lower surface of the tray 100, the outer contour shape of the positioning block 27 is adapted to the inner contour shape of the first positioning groove, so that the tray 100 at the lowest position can be stably placed on the tray supporting block 24, and the tray 100 is positioned to prevent shaking. When the lower surface of the tray 100 is provided with the first positioning protrusion, the positioning block 27 is provided with a positioning clamping groove, and the inner contour shape of the positioning clamping groove is matched with the outer contour shape of the first positioning protrusion, so that the function of positioning the lowermost tray 100 is still achieved. Optionally, the positioning block 27 may be integrally formed with the tray support 24, or may be detachably connected, so that the positioning block 27 may be conveniently replaced according to the specific structure of the tray 100.

When more trays 100 are stacked in the vertical direction, due to accumulation of assembly errors and existence of deflection of the trays, the whole tray 100 cannot be kept vertical, but is inclined or twisted to a certain extent, so that the uppermost tray 100 is shifted, and the accuracy of taking and placing wafers by the transfer device 3 is affected by the shifted tray 100, and continuity of a test flow is affected. In order to solve the above problems, referring to fig. 4 and 6, a guide block 28 is disposed on the side edge of the inner frame of the mounting top plate 21, the guide block 28 includes a vertically disposed connection portion 281 and a guide portion 282, the connection portion 281 is connected with the mounting top plate 21, a first guide surface 2821 and a positioning surface 2823 which are sequentially connected from bottom to top are disposed on one side of the guide portion 282 far away from the mounting top plate 21, the positioning surface 2823 is parallel to the vertical direction, the first guide surface 2821 is obliquely disposed relative to the positioning surface 2823, that is, one end of the first guide surface 2821, which is not connected with the positioning surface 2823, is closer to the mounting top plate 21 than one end of the first guide surface 2821, which is connected with the positioning surface 2823, so that when the tray 100 rises from the bottom, the tray 100 is subjected to position correction under the guide action of the first guide surface 2821, gradually moves toward the center of the inner frame until the tray 100 rises to the space defined by the positioning surface 2823, further, a second guide surface 2822 connected to the upper side of the positioning surface 2823 is disposed on the side wall of the side of the mounting top plate 21, which is further, the second guide surface 2822 connected to the upper side of the positioning surface 2823 is disposed on the side wall of the mounting top plate 28, which is opposite to the positioning surface 2823, and the second guide surface 2822 is gradually moves toward the second guide surface 2823, which is located toward the opposite to the second guide surface 2823, and is located in the position of the upper end of the first guide surface 2822. Further alternatively, when the mounting top plate 21 has a rectangular structure, the guide blocks 28 are arranged on the four sides of the inner frame, so that the tray 100 can shift to the middle under the guidance of the guide blocks 28 at four different positions when lifting, the position correction is performed, the accuracy of the position of the tray 100 in the inner frame of the mounting top plate 21 is ensured, and the efficiency of the position correction of the tray 100 is improved. Alternatively, when only one guide block 28 is provided per side, the guide block 28 is provided at an intermediate position of a certain side of the mounting top plate 21. Further, in some other embodiments, each side of the inner frame of the mounting plate 21 is not limited to only one guide block 28, and two or more guide blocks may be provided.

The mounting top plate 21 is provided with a mounting groove, the connecting portion 281 of the guide block 28 is connected in the mounting groove, and the guide portion 282 of the guide block 28 is arranged outside the mounting groove. Alternatively, the connection portion 281 is fixedly connected with the mounting top plate 21 by a first bolt. Specifically, a first through hole is formed in the wall of the mounting groove, a second through hole is formed in the connecting portion 281, and after the first bolt passes through the second through hole and the first through hole in sequence, the fixing of the guide block 28 and the mounting top plate 21 is completed by using a nut. Further, the second through hole is a long hole, and the second through hole extends along the direction perpendicular to the side edge of the corresponding guide block 28, by changing the position of the first bolt in the long hole, the distance between the positioning surface 2823 of the guide block 28 and the side edge provided with the guide block 28 can be adjusted, the applicability of the tray device 2 is improved, personnel can reasonably adjust the installation position of the guide block 28 according to the size of the actual tray 100 or the difference of gap errors between the tray 100 and the positioning surface 2823, the size of the space surrounded by the positioning surface 2823 is reasonably set, the center of the tray 100 positioned in the space can coincide with the center of the installation top plate 21, the larger deviation of the position of the tray 100 is avoided, and the accurate transfer of the transfer device 3 is ensured.

In order to be able to monitor whether the uppermost tray 100 is placed in the frame structure of the mounting plate 21, the opposite-type sensor 211 is provided on the inner frame of the mounting plate 21, and still referring to fig. 4 and 6, specifically, the opposite-type sensor 211 is structurally separated from each other, and the emitter and the receiver with optical axes opposite to each other are respectively located on two opposite sides of the inner frame, and light emitted from the emitter directly enters the receiver. When the tray 100 is placed in the frame structure of the mounting plate 21, light between the emitter and the receiver is blocked by the tray 100, and the correlation sensor 211 generates a signal that the tray 100 is positioned in the inner rim of the frame of the mounting plate 21.

Example III

The present embodiment provides a transfer device 3 for an automatic wafer tester in the first embodiment, where the transfer device 3 is configured to implement movement of a tray 100 between different tray devices 2 and between the tray device 2 and the testing device 4, so as to perform a material taking or discharging operation. Specifically, referring to fig. 7 and 8, the transfer device 3 includes a first slide rail 311, a first driving assembly 33, a second slide rail 321, a second driving assembly 34, and a nozzle assembly 37, the nozzle assembly 37 includes a nozzle body 373 for directly sucking the material tray 100 or the wafer, the first driving assembly 33 is configured to drive the nozzle assembly 37 to move along the first slide rail 311, the second driving assembly 34 is configured to drive the nozzle assembly 37 and the first slide rail 311 to move integrally along the second slide rail 321, and the extending directions of the first slide rail 311 and the second slide rail 321 are perpendicular to each other. In this embodiment, the extending directions of the first sliding rail 311 and the second sliding rail 321 can be respectively understood as an X axis and a Y axis in a rectangular coordinate system of the transferring plane, the driving assembly can receive a system command, and the suction nozzle assembly 37 is driven to move along the X axis and the Y axis to the corresponding coordinate positions of the transferring plane, so as to suck the tray 100 or the wafer at the positions. In this embodiment, let the X-axis be the first direction and the Y-axis be the second direction. Further, the transfer device 3 further includes a first substrate 31 provided with a first sliding rail 311 and a second substrate 32 provided with a second sliding rail 321, the first driving assembly 33 is disposed on the first substrate 31, the second driving assembly 34 is disposed on the second substrate 32, and the second driving assembly 34 directly drives the first substrate 31 to move relative to the second substrate 32, so as to realize movement of the first sliding rail 311 relative to the second sliding rail 321. Further alternatively, the load bearing platform 12 may be provided directly as the second substrate 32.

Specifically, the first driving assembly 33 includes a first driving source 331, a first driving wheel 332, a first driven wheel 333, a first belt 334 wound on the first driving wheel 332 and the second driven wheel 343, and a first belt connector 335 fixed on the first belt 334, wherein a first slider 35 is disposed on a side of the first belt connector 335 close to the first sliding rail 311, a suction nozzle body 373 is disposed on a side of the first belt connector 335 far away from the first sliding rail 311, the first driving source 331 and the first driving wheel 332 are disposed at one end of the first sliding rail 311, the first driven wheel 333 is disposed at the other end of the first sliding rail 311, the first driving source 331 drives the first belt 334 to rotate, the first belt connector 335 moves synchronously along with the first belt 334, and simultaneously the suction nozzle body 373 can move synchronously along with the first belt connector 335 to realize displacement of the suction nozzle body 373 in the first direction. Alternatively, the first driving source 331 includes a servo motor and a speed reducer, and an output end of the speed reducer is connected to the first driving wheel 332. Optionally, in order to improve the stability of the movement of the suction nozzle assembly 37 along the first slide rail 311, referring to fig. 8, two first slide rails 311 are disposed on the first base 31 and are distributed at intervals, two first sliding blocks 35 are disposed on the corresponding first belt connecting member 335, each first sliding block 35 is correspondingly slidably disposed on one first slide rail 311, and the stability of the movement of the suction nozzle assembly 37 is improved and the accuracy of transferring along the first direction is also improved due to the two first slide rails 311. Of course, in the embodiment, the number of the first sliding rails 311 is not limited to two in the present embodiment, and more may be provided. Alternatively, the first driving source 331 is fixed to the first base 31 by a first mounting plate, and the first driven wheel 333 is fixed to the first base 31 by a first mounting frame 336, so as to satisfy the conveying operation of the first conveyor 334. Optionally, the first substrate 31 may be a profile, a chute along the first direction is formed in the profile, the first mounting frame 336 is provided with a first threaded through hole, the first threaded through hole and the chute are sequentially screwed into each other through a second bolt, the first mounting frame 336 is fixed on the first substrate 31, and the tension of the first conveyor belt 334 can be adjusted by fine-adjusting the position of the first mounting frame 336 on the profile, so that the smooth conveying process is ensured.

The second driving assembly 34 includes a second driving source 341, a second driving wheel 342, a second driven wheel 343, a second conveyor belt 344 wound around the second driving wheel 342 and the second driven wheel 343, and a second belt connector 345 fixed on the second conveyor belt 344, where the second belt connector 345 is connected to the first substrate 31, so that the second conveyor belt 344 can drive the entire first substrate 31 to move when the second driving source 341 drives the second conveyor belt 344 to rotate. In order to ensure that the first base 31 and the suction nozzle body 373 thereon move along the second direction, a second slide rail 321 is disposed at the upper portion of the second base 32, a second slide block 36 is disposed at the lower portion of the first base 31, and precise guiding of the first base 31 along the second direction is achieved by sliding fit of the second slide block 36 on the second slide rail 321. Optionally, in this embodiment, the second driving assembly 34 is disposed at a middle position of the second substrate 32, and two second sliding rails 321 are disposed symmetrically on two sides of the second driving assembly 34, so that driving force can be uniformly transmitted, and the whole first substrate 31 can uniformly and synchronously move along the second direction, so as to avoid a certain side of offset. Alternatively, the second driving source 341 has the same structure as the first driving source 331, and generates driving force using a servo motor and a speed reducer. Optionally, the second base 32 is provided with a receiving groove 323, and the second driving component 34 is disposed in the receiving groove 323 to conceal the second driving component 34, so that interference with the suction nozzle component 37 moving along the first sliding rail 311 can be avoided, and the size of the automatic wafer tester can be reduced. Further alternatively, the second driving source 341 is fixed to the second base 32 by a second mounting plate, and the second driven wheel 343 is fixed to the second base 32 by a second mounting frame 346, so as to satisfy the conveying operation of the second conveyor belt 344. Optionally, a second threaded through hole is formed on the second substrate 32, an adjusting strip hole is formed on the second mounting frame 346, the third bolt is sequentially screwed into the adjusting strip hole and the second threaded through hole, the second mounting frame 346 is fixed on the second substrate 32, and the tension of the second conveyor belt 344 can be changed by fine adjusting the position of the third bolt in the adjusting strip hole, so that the conveying efficiency is improved.

Further, referring to fig. 8 and 9, the suction nozzle assembly 37 includes a suction nozzle cylinder 371, a suction nozzle fixing plate 372 and a suction nozzle body 373 provided on the suction nozzle fixing plate 372, wherein an output end of the suction nozzle cylinder 371 is connected with the suction nozzle fixing plate 372 to drive the suction nozzle fixing plate 372 and the suction nozzle body 373 to lift, thereby completing the material taking and discharging of the tray 100 or the wafer, and further, the suction nozzle assembly 37 further includes a pneumatic control valve 374, an input end of the suction nozzle cylinder 371 is connected with the pneumatic control valve 374, the pneumatic control valve 374 is connected with an electric control device of the tester in a communication manner to receive signals of the electric control device, thereby controlling the action of the suction nozzle cylinder 371. Optionally, a first fixing plate 3351 is arranged above the first belt connecting piece 335, a second fixing plate 3352 is arranged below the first belt connecting piece 335, the second fixing plate 3352 is optionally vertically connected with the first belt connecting piece 335, an air control valve 374 is connected to the first fixing plate 3351, a suction nozzle cylinder 371 is arranged on the second fixing plate 3352, the output end of the suction nozzle cylinder 371 vertically extends downwards to the second fixing plate 3352 and then is connected with the suction nozzle fixing plate 372, the suction nozzle fixing plate 372 is driven to approach or separate from the second fixing plate 3352, and the first fixing plate 3351 and the second fixing plate 3352 are arranged to enable the whole suction nozzle assembly 37 to synchronously move along the first belt connecting piece 335 along the first sliding rail 311, so that stability and consistency of the suction nozzle assembly 37 during operation are guaranteed. Further, one of the suction nozzle fixing plate 372 and the second fixing plate 3352 is provided with a second guide rod 375, the other one is provided with a second guide through hole, and the second guide rod 375 is inserted into the second guide through hole, so that the suction nozzle cylinder 371 can realize the guide function when driving the suction nozzle fixing plate 372 to lift, the suction nozzle body 373 is prevented from being deviated, and the material cannot be precisely taken and discharged. In this embodiment, the second guide rod 375 is disposed on the nozzle fixing plate 372, and the second guide through hole is disposed on the second fixing plate 3352. Optionally, a second guide sleeve is disposed on the second fixing plate 3352, and the second guide sleeve is sleeved on the periphery of the second guide rod 375, so as to ensure the guiding function of the second guide rod 375.

In this embodiment, the suction nozzle body 373 is provided with a plurality of suction nozzle bodies, which can be classified into three types according to the different sucked objects, one type is a tray suction nozzle body for sucking the tray 100 and moving the tray 100 from the tray device to be tested to the empty tray device or from the empty tray device to the sorting tray device, the second type is a material suction nozzle body for sucking the wafer to be tested on the tray 100 in the tray device to be tested and moving it to the testing device 4, and the third type is a blanking suction nozzle body for sucking the wafer to be tested on the testing device 4 and moving it to the tray 100 of the corresponding sorting tray device according to the test result. Further, the number of each type of nozzle body 373 is not particularly limited, but each type of nozzle body 373 is provided with a nozzle fixing plate 372 and a nozzle cylinder 371, so that the actions of the nozzle bodies 373 of different types are not interfered. In particular, in this embodiment, since the tray device 2 has a rectangular structure, four tray nozzle bodies are disposed, and the four tray nozzle bodies are rectangular on their corresponding nozzle fixing plates 372, and each tray nozzle body can correspond to one side edge of the suction tray 100, so that powerful suction of the tray 100 is ensured, and further, the transfer process is smoothly performed. Optionally, at least two second guide through holes are provided on each nozzle fixing plate 372 to realize the guiding of the corresponding nozzle body 373.

Optionally, in this embodiment, protective covers are covered on the outer sides of the first driving wheel 332, the first driven wheel 333, the second driving wheel 342 and the second driven wheel 343, so as to maintain the aesthetic appearance of the whole testing machine, and avoid the personnel touching the driving assembly. Further, referring to fig. 7, two second photoelectric switches 312 are disposed on the first substrate 31, the two second photoelectric switches 312 are disposed at intervals along the first direction, and the positions of the two second photoelectric switches are respectively representative of two limit positions that can be reached by the suction nozzle assembly 37 along the first direction, correspondingly, a second light shielding plate is disposed on the first fixing plate 3351, and when the first conveyor belt 334 drives the first fixing plate 3351 to move along the first direction, the second light shielding plate can be located at the transmitting end and the receiving end of the second photoelectric switch 312 to generate a signal that the suction nozzle assembly 37 moves to the position and transmit the signal to the electronic control device. Similarly, two third photoelectric switches 322 are also arranged on the second base 32 at intervals and are arranged beside the second slide rail 321 to respectively represent two limit positions which can be reached by the suction nozzle assembly 37 along the second direction, correspondingly, a third light shielding plate is arranged on the second slide block 36, and when the second conveyor belt 344 drives the second slide block 36 to move along the second direction, the third light shielding plate can be positioned at the transmitting end and the receiving end of the third photoelectric switch 322 to generate signals for the suction nozzle assembly 37 to move to and transmit the signals to the electric control device.

Example IV

The present embodiment provides a testing device 4 that can be used in the automatic wafer tester of the first embodiment to complete the testing of wafers. Specifically, referring to fig. 10 and 11, the test apparatus 4 includes a supporting mechanism 41, a lifting mechanism 42, a test table assembly 43 and a test board assembly 44, wherein the supporting mechanism 41 plays a role of supporting the entire test apparatus 4, the test table assembly 43 includes a test table 431 for placing a wafer to be tested, and the test board assembly 44 includes a test board 441, and the lifting mechanism 42 is used for driving the test table 431 to lift so that the wafer to be tested placed thereon contacts the test board 441 to complete the test. Further, the testing device 4 may output the testing result to the electronic control device, and the electronic control device determines the classification level of the wafer according to the testing result and transmits a signal to the transferring device 3, and the transferring device 3 transfers the tested wafer to the tray 100 of the corresponding classification tray device according to the signal instruction.

Further, the test bench assembly 43 further comprises a carrier 432, the test bench 431 is disposed on the upper portion of the carrier 432, the upper surface of the test bench 431 is provided with a test plane, and the wafer is placed on the test plane. Since the position of the test plate 441 remains relatively fixed during testing, the placement position of each wafer under test on the test plane should remain fixed in order to ensure that the wafer is in full contact with the test plate 441 each time. In order to solve the above problem, referring to fig. 12, the test bench assembly 43 further includes a positioning bar 433 disposed on the test plane and a pushing structure 434 disposed on the test bench 431, where the positioning bar 433 protrudes out of the test plane, and after the wafer to be tested is placed on the test plane, the pushing structure 434 can push the wafer to be tested until it abuts against the sidewall of the positioning bar 433, so as to complete the positioning of the wafer to be tested. Further, the shape structure of the wafer to be tested is adapted to the shape structure enclosed by the side wall of the positioning strip 433, so as to ensure the sufficient contact between the wafer and the side wall of the positioning strip 433, and maintain the stability of the wafer position. Optionally, in this embodiment, the wafer is set to be in a regular rectangular structure, so that a first positioning strip 433 and a second positioning strip 433 perpendicular to each other may be disposed on the test plane, both protrude out of the test plane by a certain height, and one end of the first positioning strip 433 abuts against a side wall of the second positioning strip 433, so that the first positioning strip 433 and the side wall of the second positioning strip 433 form a right-angle structure, when the wafer is placed on the test plane, the pushing structure 434 is utilized to repeatedly push the wafer to be tested multiple times, so that two sides perpendicular to each other can abut against the side walls of the first positioning strip 433 and the second positioning strip 433, respectively, the wafer to be tested reaches a fixed position, and the wafer to be tested at the position can fully contact with the test board 441 after rising, so as to ensure smooth test. Further, the first positioning bar 433 extends along the fourth direction, the second positioning bar 433 extends along the fifth direction, and the fifth direction is perpendicular to the fourth direction. In this embodiment, the fourth direction and the fifth direction are parallel to the horizontal plane.

Specifically, referring to fig. 12 again, the pushing structure 434 includes a pushing cylinder 4341, a pushing plate 4342 connected to an output end of the pushing cylinder 4341, and a plurality of pushing pins 4343 disposed on the pushing plate 4342, wherein a free end of the pushing pins 4343 can be abutted against a wafer to be tested placed on the test bench 431. In specific implementation, the pushing cylinder 4341 acts to drive the pushing plate 4342 and the pushing thimble 4343 thereon to move along a specific direction until the wafer to be tested on the testing plane is pushed to abut against the side wall of the positioning strip 433. Optionally, in order to increase the accuracy of the pushing direction, the pushing structure 434 further includes a third guiding rod 4344 disposed on the test bench 431 and a third guiding through hole disposed on the pushing plate 4342, where the third guiding rod 4344 is disposed in the third guiding through hole, so as to realize the sliding guiding of the pushing plate 4342. Optionally, a third guide sleeve is disposed in the third guide through hole, so as to ensure smoothness of relative sliding of the third guide rod 4344. Further, the pushing structure 434 includes two pushing structures, namely a first pushing structure and a second pushing structure, which are used for pushing the wafer to be tested along the fourth direction and the fifth direction respectively. Therefore, the pushing directions of the pushing cylinders 4341 of the first pushing structure and the second pushing structure are respectively kept identical to the fourth direction and the fifth direction, and the extending directions of the pushing pins 4343 and the third guide rods 4344 are also kept identical to the pushing directions. Alternatively, in this embodiment, the test bench 431 has a rectangular structure, and the first pushing structure and the second pushing structure are respectively disposed on two sides of the test bench 431 that are perpendicular to each other. Further alternatively, in order to ensure the stability of the movement of the pushing thimble 4343 along the fourth direction or the fifth direction, a thimble groove may be formed on the test plane, the thimble groove extends along the fourth direction or the fifth direction, the pushing thimble 4343 is disposed in the thimble groove, the offset of the pushing thimble 4343 is further limited, the pushing thimble 4343 is ensured to be able to move along a specific direction, and the pushing thimble 4343 protrudes out of the test plane to a certain height so as to contact with the wafer to be tested to complete the pushing. Optionally, the number of pushing pins 4343 of each pushing structure 434 may be two, three or more depending on the size of the wafer, so as to achieve the effect of fully contacting the wafer and uniformly pushing the wafer.

Referring to fig. 11 and 13, the supporting mechanism 41 includes a supporting top plate 411 and a supporting bottom plate 412 which are parallel to each other and are arranged at intervals, and a supporting riser 413 which is vertically provided between the supporting top plate 411 and the supporting bottom plate 412, the supporting bottom plate 412 is connected with the carrier plate 14, the test board assembly 44 is provided on the supporting top plate 411, and the test board assembly 43 is provided between the supporting top plate 411 and the supporting bottom plate 412. Further, in order to improve the stability of the supporting mechanism 41, the supporting riser 413 is further provided with a supporting support plate 414 parallel to the supporting bottom plate 412, and the supporting support plate 414 is connected with the supporting bottom plate 412 through a supporting rod 415, so as to enhance the supporting function of the supporting mechanism 41. Optionally, the test bench assembly 43 and the support bar 415 are respectively located at different sides of the support riser 413, so that interference between the support bar 415 and the test bench assembly 43 can be prevented, and stability of the support riser 413 can be further improved.

Referring to fig. 10 and 13, the lifting mechanism 42 includes a lifting driving source 421 and a first connection plate 422 connected to an output end of the lifting driving source 421, where the first connection plate 422 is connected to a carrier 432 of the test board assembly 43 through a second connection plate 49, and the lifting driving source 421 drives the first connection plate 422, the second connection plate 49 and the carrier 432 to lift along a third direction, so as to achieve the approaching and separating of the test board assembly 43 and the test board assembly 44. In this embodiment, the third direction is a vertical direction, which is perpendicular to the horizontal plane, and can be understood as a Z axis in a rectangular coordinate system. Optionally, the lifting driving source 421 adopts a rodless cylinder, a main body of the rodless cylinder is fixed on the supporting riser 413, a lifting sliding block of the rodless cylinder is connected with the first connecting plate 422, and the lifting sliding block drives the first connecting plate 422 to move. In some other embodiments, the lift driving source 421 may also employ a screw nut lift structure or a rack and pinion lift structure. Further, the lifting mechanism 42 and the test bench assembly 43 are disposed on opposite sides of the support riser 413, i.e., the lifting mechanism 42 is disposed between the support bracket 414 and the support base 412, such that the lifting mechanism 42 does not interfere with the operation of the test bench assembly 43. Optionally, two second connection plates 49 are provided, and the two second connection plates 49 are symmetrically distributed relative to the supporting riser 413, so that the test bench assembly 43 is uniformly stressed and lifted. Optionally, referring to fig. 13, in order to prevent the test bench assembly 43 from being damaged by the device caused by the rise or fall of the height exceeding the preset range, two fourth photoelectric switches 4131 are respectively disposed at the upper and lower parts of the supporting riser 413, which respectively represent the limit positions where the test bench 431 can rise and fall, and a fourth light shielding plate 361 is disposed on the second connection plate 49, and when the second connection plate 49 drives the test bench assembly 43 to rise and fall until the fourth light shielding plate 361 is located between the transmitting end and the receiving end of the fourth photoelectric switch 4131, the fourth photoelectric switch 4131 is triggered to generate a signal to prevent the test bench 431 from further rising and falling. Further, in order to buffer the impact of the contact between the test board 441 and the wafer, a buffer structure 45 is disposed at each of the upper and lower portions of the first connection board 422, and when the first connection board 422 is about to rise or about to fall to the extreme position, the buffer structure 45 can contact the supporting bottom board 412 or the supporting top board 411 to play a role of buffering. Alternatively, the buffer structure 45 includes a buffer connection block 451 and a buffer 452 vertically provided on the buffer connection block 451, and the buffer connection block 451 is connected to the first connection plate 422. Optionally, the second connection plate 49 may be directly connected to the buffer connection block 451 to achieve synchronous driving of the buffer 452 and the test bench assembly 43 by the first connection plate 422. In this embodiment, the damper 452 is selected from ACA-1007 type hydraulic dampers of Adam.

Further, in order to improve the accuracy of the lifting mechanism 42 driving the test bench 431 to lift along the third direction, a linear guide structure 46 is further disposed between the test bench assembly 43 and the supporting riser 413, specifically, referring to fig. 10, 11 and 15, the linear guide structure 46 includes a third slider 461 disposed on the carrier 432 and a third sliding rail 462 disposed on the supporting riser 413, the third sliding rail 462 extends along the third direction, and the third slider 461 is slidably disposed on the third sliding rail 462 to realize sliding guiding of the test bench assembly 43 in the third direction. Optionally, the carrier 432 is connected to the third slider 461 through a third connecting plate, and meanwhile, the third connecting plate is vertically connected to the second connecting plate 49, so as to improve the lifting stability of the test bench 431.

Specifically, referring to fig. 11, the test board assembly 44 further includes two pressing boards 442 disposed below the supporting top board 411, the pressing boards 442 are disposed on two sides of the supporting top board 411 along the length direction, a spring board 443 is disposed below each pressing board 442, the spring board 443 clamps the test board 441 between the pressing boards 442 and 443 by using self-elasticity, and the pressing boards 442 have a certain thickness, so that a gap is disposed between the test board 441 and the supporting top board 411 to buffer the impact generated when the wafer contacts the test board 441, so as to achieve uniform and full contact between the wafer and the test board 441. Optionally, a limiting stop 444 is further disposed on a side edge of the top support plate 411 to serve as a limiting function when the test board 441 is installed.

In order to improve the test precision, before each use, the test bench 431 needs to be calibrated and adjusted, so that the pre-placement position of the wafer to be tested on the test plane can correspond to the test board 441 as much as possible, and the wafer to be tested and the test board 441 are fully contacted after the test bench 431 rises. Specifically, referring to fig. 10, 14 and 15, the testing apparatus 4 includes an angle adjusting mechanism 40, the angle adjusting mechanism 40 includes a rotary table 401 rotatably provided on a stage 432, the rotary table 401 is rotatably connected with the stage 432 through a bearing structure, while a test table 431 is provided on an upper portion of the rotary table 401, and the test table 431 can rotate with respect to the stage 432 along with the rotary table 401 to adjust an angle of the test table 431 in a horizontal plane. Further, the angle adjusting mechanism 40 further comprises an adjusting column 403 vertically arranged at the bottom of the rotary workbench 401, the adjusting column 403 vertically penetrates through the whole carrying platform 432 and is in rotary connection with the carrying platform 432 through the bearing structure, the adjusting column 403 is optionally in a cylindrical structure, an adjusting rod 404 is arranged at the bottom of the adjusting column 403, and the adjusting rod 404 is pushed to drive the adjusting column 403 and the rotary workbench 401 to rotate, so that the operation of workers is facilitated. Further, the axis of the adjusting rod 404 is perpendicular to the axis of the adjusting post 403, so that the adjusting post 403 and the rotating table 401 can be pushed to rotate by adopting smaller thrust. optionally, the adjusting rod 404 vertically penetrates through the whole adjusting column 403 to increase the acting area between the adjusting rod 404 and the adjusting column 403, so that the pushing of the adjusting rod 404 to the adjusting column 403 is more convenient and labor-saving. Further, in order to make the angle adjustment of the test bench 431 be performed within a certain range, to avoid the excessive deflection of the test bench 431, an adjusting block 402 is disposed on the side of the carrier 432, and a bar-shaped groove 4021 is disposed on the side wall of the adjusting block 402 near the adjusting post 403 (refer to fig. 14 specifically), the extending direction of the bar-shaped groove 4021 is located in the horizontal plane, the free end of the adjusting post 404 is disposed in the bar-shaped groove 4021, the free end of the adjusting post 404 is located at a different position in the bar-shaped groove 4021, the adjusting post 403 and the rotary table 401 rotate by different angles until the free end of the adjusting post 404 abuts against the groove wall at the end of the bar-shaped groove 4021, so as to block the further movement of the adjusting post 404, so that the rotary table 401 performs the angle adjustment within a limited angle range, and the occurrence of the excessive adjustment phenomenon is avoided. Further, in order to quantify the angle adjustment, a first spiral differential head 405 is disposed on the adjusting block 402, a measuring rod of the first spiral differential head 405 extends into the adjusting block 402 and abuts against a side wall of the adjusting rod 404, a fine tuning knob of the first spiral differential head 405 is rotated to change the extending length of the measuring rod, the adjusting rod 404 is driven to move in the bar groove 4021, the adjusting angle of the adjusting rod 404 can be known through the reading of the first spiral differential head 405, and the quantification of the angle adjustment is achieved. Further, the measuring rod of the first spiral differential head 405 is vertically abutted against the adjusting rod 404. Further, the adjusting block 402 is further provided with a first locking bolt 406, and after the angle adjustment is finished, the first locking bolt 406 locks the adjusting rod 404 to limit the recurrent movement of the adjusting rod, so as to keep the angle of the test bench 431 fixed. Optionally, an external thread is further provided on the side wall of the adjusting column 403 between the lower part of the carrier 432 and the upper part of the adjusting rod 404, and the locking nut 407 locks the adjusting column 403 with the bearing structure through a threaded connection, so as to ensure that the adjusting column 403 can drive the rotary table 401 to rotate on the same horizontal plane without deviation.

Further, referring to fig. 10, 11 and 12, the testing device 4 further includes a displacement adjustment mechanism 47, the displacement adjustment mechanism 47 includes a cross rail displacement platform 471 arranged between the rotary table 401 and the testing table 431, the cross rail displacement platform 471 is integrally arranged on the rotary table 401 and can synchronously rotate along with the rotary table 401, and a carrier surface of the cross rail displacement platform 471 is connected with a bottom surface of the testing table 431, so as to drive the testing table assembly 43 to synchronously move along with the carrier surface. Alternatively, the cross rail displacement platform 471 in the present embodiment is mainly used for realizing displacement of the test bench 431 in the fourth direction and the fifth direction, and therefore, the second spiral differential 472 head and the second spiral differential 472 head are respectively disposed on two mutually perpendicular sidewalls of the cross rail displacement platform 471, so as to realize quantification of displacement of the test bench 431 in two directions. Further, the two side walls of the cross rail displacement platform 471, which are perpendicular to each other, are respectively provided with a second locking bolt 473 and a third locking bolt, and after the platform 431 to be tested is adjusted to the lower alignment position of the cross rail displacement platform 471, the object carrying surface of the cross rail displacement platform 471 is locked by the second locking bolt 473 and the third locking bolt, so that the object carrying surface of the cross rail displacement platform 471 can not move any more.

By the above-described arrangement of the angle adjustment mechanism 40 and the displacement adjustment mechanism 47, the test stand 431 is enabled to rotate in the horizontal plane and perform displacement adjustment in the fourth direction and the fifth direction so that the test board 441 corresponds to the wafer to be tested. However, in the third direction, because the thicknesses between different wafers and different test boards 441 are different, before a lot of tests, the heights between the top support plate 411 and the bottom support plate 412 of the test device 4 need to be calibrated and adjusted, so that the lifting mechanism 42 can always fully contact the wafer to be tested with the test board 441 under the lifting driving of a specific lifting distance in a cyclic manner, therefore, the test device 4 further includes the height adjusting mechanism 48, referring to fig. 10 and 14, the height adjusting mechanism 48 includes the third spiral differential head 481 disposed on the top support plate 411, the measuring rod of the third spiral differential head 481 extends along the third direction, and abuts against the top surface of the vertical support plate 413 after passing through the top support plate 411, the fine adjustment knob of the third spiral differential head is rotated, the extension length of the measuring rod is changed, and the top support plate 411 is driven to approach or separate from the bottom support plate 412 along the third direction, so that the distance between the test board 441 disposed on the top support plate 411 and the test board 431 is changed, until the wafer to be tested can fully contact the test board 441 under the specific lifting displacement is ensured. Further, the supporting top plate 411 is slidably connected with the supporting riser 413 through a cross rail structure 482, the cross rail structure 482 can achieve high-precision and stable linear motion of the supporting top plate 411 relative to the supporting riser 413, accuracy of movement of the supporting top plate 411 along a third direction is improved, and further, the cross rail structure 482 comprises a fourth sliding rail arranged on the supporting riser 413 and a fourth sliding block arranged on the supporting top plate 411, and the fourth sliding rail extends along the third direction to achieve guiding of the supporting top plate 411 in the third direction. Alternatively, two cross rail structures 482 are provided and are provided on both sides of the support top plate 411, respectively. Further, the height adjustment mechanism 48 further includes a fourth locking bolt 483 to lock the cross rail structure 482 after the height adjustment of the top support plate 411 is completed, thereby preventing the fourth slider from sliding with respect to the fourth rail.

Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.

Claims

1. The wafer automatic testing machine is characterized by comprising a material tray device (2), a testing device (4) and a transferring device (3);

The tray device (2) comprises a mounting top plate (21) and a mounting bottom plate (22) which are arranged at intervals and connected through a connecting rod (23), the connecting rod (23) is vertically arranged between the mounting top plate (21) and the mounting bottom plate (22), and the trays (100) are stacked in a space between the mounting top plate (21) and the mounting bottom plate (22) along the vertical direction; the tray (100) can be driven by a first driving mechanism (25) to lift, the mounting top plate (21) is of a frame structure, guide blocks (28) are arranged on the side edges of the inner frame of the mounting top plate (21), when the tray (100) lifts, the guide blocks (28) can be abutted against the tray (100) to correct the position of the tray (100) in the inner frame of the mounting top plate (21), the tray device (2) is provided with a plurality of tray devices (2) which comprise tray devices to be tested and sorting tray devices, the tray devices to be tested are configured to bear the tray (100) on which wafers to be tested are placed, and the sorting tray devices are configured to bear the tray (100) on which the wafers to be tested are placed;

The mounting top plate (21) is of a rectangular structure, the four side edges of the inner frame of the mounting top plate (21) are respectively provided with the guide blocks (28), so that the material tray (100) can shift towards the middle under the guide of the guide blocks (28) at four different positions when in lifting, the guide blocks (28) comprise positioning surfaces (2823) parallel to the vertical direction, the positions of the guide blocks (28) on the mounting top plate (21) are adjustable, and the size of a space surrounded by the positioning surfaces (2823) of the guide blocks (28) is adjusted, so that the center of the material tray (100) positioned in the space can coincide with the center of the mounting top plate (21);

The transfer device (3) can transfer the wafers to be tested of the tray device to be tested to the test device (4) to complete the test, and the transfer device (3) can also transfer the wafers to be tested from the test device (4) to the sorting tray device;

The test device (4) comprises a lifting mechanism (42), a supporting mechanism (41), a test board assembly (43) and a test board assembly (44), wherein the supporting mechanism (41) comprises a supporting top board (411), a supporting bottom board (412) and a supporting vertical board (413) arranged between the supporting top board (411) and the supporting bottom board (412), the test board assembly (44) is arranged on the supporting top board (411), the test board assembly (44) comprises a test board (441), a pressing board (442) and a spring board (443), the pressing board (442) is arranged below the supporting top board (411), the test board (441) is clamped between the pressing board (442) and the spring board (443), a gap is arranged between the test board (441) and the supporting top board (411), the test board assembly (43) is arranged between the supporting top board (411) and the supporting bottom board (412), and the lifting mechanism (42) is configured to drive the test board assembly (43) to lift.

The testing device (4) further comprises a height adjusting mechanism (48), the height adjusting mechanism (48) comprises a third spiral differential head (481) and a fourth locking bolt (483), the third spiral differential head (481) is arranged on the supporting top plate (411), a measuring rod of the third spiral differential head (481) extends along a third direction and penetrates through the supporting top plate (411) to be in butt joint with the top surface of the supporting vertical plate (413), the supporting top plate (411) is in sliding connection with the supporting vertical plate (413), and the fourth locking bolt (483) is used for locking the supporting top plate (411) and the supporting vertical plate (413).

2. The automatic wafer test machine according to claim 1, wherein the tray device (2) further comprises an empty tray device configured to carry an empty tray without wafer placement, the transfer device (3) is capable of transferring an empty tray of the tray device to be tested onto the empty tray device, and the transfer device (3) is also capable of transferring an empty tray carried by the empty tray device onto the sorting tray device.

3. The automatic wafer tester according to claim 2, wherein at least one empty tray device and at least one tray device to be tested are provided.

4. The automatic wafer tester according to claim 3, wherein the sorting tray means is provided in plurality, the test results of the wafers are classified into a plurality of classes, each class corresponds to one of the sorting tray means, and the tested wafers are transferred to the trays (100) representing the sorting tray means of the corresponding class according to the test results.

5. The automatic wafer tester according to claim 4, wherein twelve of the tray devices (2) are provided, and twelve of the tray devices (2) are arranged in a matrix, and wherein ten of the sorting tray devices are provided.

6. Wafer automatic tester according to claim 1, characterized in that it further comprises a display device (5), said display device (5) being configured to be able to display the operating status of the respective device and the test results.

7. The automated wafer test machine of claim 1, further comprising an electronic control device configured to control timing actions of individual devices of the automated wafer test machine.

8. Wafer automatic tester according to claim 1, characterized in that the testing device (4) is provided in a plurality, a plurality of the testing devices (4) being arranged linearly in a first direction.

9. Wafer automatic test machine according to any of claims 1-8, characterized in that the wafer automatic test machine further comprises a frame (1), the frame (1) comprises a main body (11) and a carrying platform (12) arranged at the upper part of the main body (11), and the carrying platform (12) is used for carrying the transfer device (3) and the tray device (2).

10. The automatic wafer testing machine according to claim 9, wherein a U-shaped baffle plate (13) is provided on the outer periphery of the carrying platform (12) so as to cover the tray device (2) and the transfer device (3), and the testing device (4) is provided at an opening end of the baffle plate (13).