CN110190005B - Semiconductor eutectic and dispensing integrated chip mounter - Google Patents
Semiconductor eutectic and dispensing integrated chip mounter Download PDFInfo
- Publication number
- CN110190005B CN110190005B CN201910561813.0A CN201910561813A CN110190005B CN 110190005 B CN110190005 B CN 110190005B CN 201910561813 A CN201910561813 A CN 201910561813A CN 110190005 B CN110190005 B CN 110190005B
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- dispensing
- linear motor
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- eutectic
- feeding mechanism
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- 230000005496 eutectics Effects 0.000 title claims abstract description 38
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 147
- 238000010438 heat treatment Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 13
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 13
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/76—Apparatus for connecting with build-up interconnects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/76—Apparatus for connecting with build-up interconnects
- H01L2224/7625—Means for applying energy, e.g. heating means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to the field of semiconductor packaging equipment, in particular to a semiconductor eutectic and dispensing integrated chip mounter, which comprises a cabinet, a feeding mechanism, a track mechanism, a swing arm mechanism, a dispensing mechanism and a chip feeding mechanism, wherein the feeding mechanism is arranged at one corner of the top of the cabinet, the track mechanism is arranged at the side edge of the feeding mechanism, the dispensing mechanism is arranged above the side of the track mechanism, the chip feeding mechanism is arranged at one side edge of the track mechanism, the swing arm mechanism is arranged between the track mechanism and the chip feeding mechanism, a control system is arranged in the cabinet, and the feeding mechanism, the track mechanism, the swing arm mechanism, the dispensing mechanism and the chip feeding mechanism are respectively connected with the control system. Compared with the prior art, the two die bonding processes of the eutectic semiconductor, the adhesive dispensing integrated chip mounter can be freely switched to meet the requirements of different products, the universality of equipment is high, multiple pieces of equipment are not needed, the cost is saved, and the efficiency is improved.
Description
[ Field of technology ]
The invention relates to the field of semiconductor packaging equipment, in particular to a semiconductor eutectic and dispensing integrated chip mounter.
[ Background Art ]
In the packaging process of semiconductor devices such as ICs and LEDs, die bonding is an extremely important link; the die bonder is a machine type specially used for die bonding of products, adopts computer control and is provided with a CCD image sensing system, the CCD image sensing system firstly scans to determine a correct path, then inputs a set programming program, and easily presses a button to realize the whole working flow; the process of die bonding is as follows: firstly, a feeding system conveys a die-bonding support in a storage device to a feeding channel, then the die-bonding support moves along the feeding channel and stays at a determined position, at the moment, a dispensing module on a frame automatically dispenses a bonding substance, namely, the bonding substance is dispensed on a die-bonding area of the die-bonding support, then an automatic picking and placing device is used for picking chips from a die disc, and the chips are bonded to the die-bonding area of the die-bonding support, so that die bonding is completed.
The die bonder in the prior art generally has a dispensing function and no eutectic function, and when the die bonder needs to be produced by using a eutectic process, different equipment can be used for meeting production requirements, so that the die bonder is poor in universality; the positioning accuracy is not high during chip supply, and the productivity is affected.
[ Invention ]
In order to overcome the problems, the invention provides a semiconductor eutectic and dispensing integrated chip mounter capable of effectively solving the problems.
The technical scheme provided by the invention for solving the technical problems is as follows: the utility model provides a integrative chip mounter is glued to semiconductor eutectic, point, including rack, feeding mechanism, track mechanism, swing arm mechanism, point gum machine construct and chip feeding mechanism, feeding mechanism sets up in rack top one corner, and track mechanism sets up in the feeding mechanism side, track mechanism's side top is provided with the point gum machine constructs, track mechanism's a side is provided with chip feeding mechanism, is provided with swing arm mechanism between track mechanism and the chip feeding mechanism, be provided with control system in the rack, feeding mechanism, track mechanism, swing arm mechanism, point gum machine construct and chip feeding mechanism are connected with control system respectively.
Preferably, the track mechanism comprises a first linear motor, a supporting body, a heating layer and a cover plate, wherein the supporting body is arranged above the first linear motor, the supporting body is driven by the first linear motor to move back and forth, the heating layer is fixed at the top of the supporting body, the top of the heating layer is covered by the cover plate, and a channel is formed between the cover plate and the heating layer.
Preferably, a plurality of heating rods are arranged in the heating layer.
Preferably, a plurality of protective gas inlets, a plurality of thermocouples and a temperature controller are further arranged in the heating layer, the protective gas inlets are communicated with the channels, and the temperature controller is respectively connected with the heating rod and the thermocouples.
Preferably, the swing arm mechanism comprises a swing arm motor, a Z-axis motor, a rotating shaft, a mounting seat, a swing arm and a suction nozzle, wherein the swing arm motor is arranged at the top of the mounting seat, the Z-axis motor is arranged at the side part of the mounting seat, the rotating shaft is vertically connected with the swing arm motor, the swing arm motor drives the rotating shaft to rotate back and forth, the front end of the rotating shaft is provided with a sliding block, the sliding block can slide up and down along the rotating shaft and rotate back and forth along with the rotating shaft, the sliding block is connected with the Z-axis motor through a connecting block, the Z-axis motor drives the connecting block to move up and down and drives the sliding block to move up and down, the swing arm is horizontally arranged at the outer side of the sliding block, and the suction nozzle is vertically arranged at the outer end of the swing arm.
Preferably, the dispensing mechanism comprises a base, a driving device and at least two groups of dispensing arms, the driving device is arranged on the base, a rotating rod is arranged on the driving device and can horizontally rotate relative to the base, the at least two groups of dispensing arms are respectively arranged on two sides of the rotating rod and synchronously rotate along with the rotating rod, each group of dispensing arms is respectively provided with a dispensing head, and each group of dispensing arms is also provided with a driving mechanism.
Preferably, the driving mechanism comprises a rotary cylinder, a fixing part and an eccentric runner, the fixing part is arranged at the top of the dispensing arm, one end of the rotary cylinder is connected with the eccentric runner, a fixing hole is formed in the fixing part, the eccentric runner is movably arranged in the fixing hole, and the rotary cylinder drives the eccentric runner to rotate so as to drive the dispensing arm to move along the vertical direction.
Preferably, the chip feeding mechanism comprises a second linear motor, a third linear motor, a sliding seat, a supporting plate, a material disc and a thimble mechanism, wherein the third linear motor is connected to the second linear motor in a sliding and vertical mode, the third linear motor can slide back and forth on the second linear motor, the sliding seat is connected to the third linear motor in a sliding mode, the sliding seat can slide back and forth on the third linear motor, the supporting plate is horizontally fixed to the top of the sliding seat, one end of the supporting plate is fixed to the material disc, and the thimble mechanism is arranged under the material disc.
Preferably, the first linear motor is a 400W linear motor.
Preferably, the second and third linear motors are 400W linear motors.
Compared with the prior art, the integrated chip mounter for eutectic and dispensing of the semiconductor is provided with the track mechanism and the dispensing mechanism, and when the eutectic process is needed to be carried out for die bonding, the track mechanism can be started to work, and the dispensing mechanism is closed; when the dispensing process is needed for die bonding, only the dispensing mechanism can be started to work, the heating function of the track mechanism is closed, the two die bonding processes can be freely switched to meet the requirements of different products, the equipment universality is strong, a plurality of pieces of equipment are not needed, the cost is saved, and the efficiency is improved; the first linear motor, the second linear motor and the third linear motor are high in positioning precision and high in speed, can correspondingly improve the productivity of equipment, and are high in stability, difficult to wear and long in service life.
[ Description of the drawings ]
Fig. 1 is a perspective view of a semiconductor eutectic and dispensing integrated chip mounter according to the present invention;
fig. 2 is a top view of a semiconductor eutectic and dispensing integrated chip mounter according to the present invention;
FIG. 3 is a diagram showing the structure of a track mechanism of a semiconductor eutectic and dispensing integrated chip mounter according to the present invention;
fig. 4 is a diagram showing a swing arm mechanism structure of a semiconductor eutectic and dispensing integrated chip mounter according to the present invention;
fig. 5 is a structural diagram of a dispensing mechanism of the integrated chip mounter for eutectic and dispensing of semiconductor according to the present invention;
fig. 6 is a diagram showing a chip feeding mechanism of a semiconductor eutectic and dispensing integrated chip mounter according to the present invention.
[ Detailed description ] of the invention
The present invention will be described in further detail with reference to the accompanying drawings and examples of implementation in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It should be noted that in embodiments of the present invention, all directional indications (such as up, down, left, right, front, back … …) are limited to relative positions on a given view, not absolute positions.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
Referring to fig. 1 to 6, the integrated chip mounter for eutectic and dispensing of the present invention includes a cabinet 10, a feeding mechanism 20, a rail mechanism 30, a swing arm mechanism 40, a dispensing mechanism 50 and a chip feeding mechanism 60, wherein the feeding mechanism 20 is disposed at a corner of the top of the cabinet 10, the rail mechanism 30 is disposed at a side of the feeding mechanism 20, the feeding mechanism 20 is used for storing a chip support 392 and outputting the chip support 392 to the rail mechanism 30, and the rail mechanism 30 can heat the chip to perform eutectic die bonding. The side upper part of the track mechanism 30 is provided with a dispensing mechanism 50, and the dispensing mechanism 50 can perform dispensing and die bonding on the chip placed in the chip support 392. Because the integrated chip mounter for eutectic and dispensing of the semiconductor is provided with the track mechanism 30 and the dispensing mechanism 50, when the eutectic process is needed for die bonding, the track mechanism 30 can be started only to work, and the dispensing mechanism 50 is closed; when the dispensing process is needed to carry out die bonding, the dispensing mechanism 50 can be started to work, the heating function of the track mechanism 30 is closed, the two die bonding processes can be freely switched to meet the requirements of different products, the equipment universality is strong, a plurality of pieces of equipment are not needed, the cost is saved, and the efficiency is improved. A chip feeding mechanism 60 is arranged at one side of the track mechanism 30 and used for providing chips, a swing arm mechanism 40 is arranged between the track mechanism 30 and the chip feeding mechanism 60, and the swing arm mechanism 40 is used for sucking chips from the chip feeding mechanism 60 and conveying the chips to the track mechanism 30 for die bonding. A control system is arranged in the cabinet 10, and the feeding mechanism 20, the track mechanism 30, the swing arm mechanism 40, the dispensing mechanism 50 and the chip feeding mechanism 60 are respectively connected with the control system, and the control system is used for overall control.
The track mechanism 30 includes a first linear motor 31, a support body 32, a heating layer 33, and a cover plate 37, where the support body 32 is disposed above the first linear motor 31, and the first linear motor 31 drives the support body 32 to move back and forth, so as to adjust the placement position of the chip. The heating layer 33 is fixed on the top of the supporting body 32, the top of the heating layer 33 is covered by the cover plate 37, and a channel is formed between the cover plate 37 and the heating layer 33 for the chip support 392 to pass through. One end of the rail mechanism 30 is provided with a transporting device 39, and the transporting device 39 is used for transporting the chip support 392 to the rail mechanism 30. The middle part of the cover plate 37 is broken to form a processing station 38, and chips are placed into the chip support 392 from the processing station 38. A plurality of heating rods 35 are arranged in the heating layer 33, and the heating rods 35 can raise the temperature in the channel to provide conditions for eutectic solidification. The heating layer 33 is further provided with a plurality of protective gas inlets 34 and a plurality of thermocouples 36, the protective gas inlets 34 are communicated with the channels, protective gas can be input into the channels through the protective gas inlets 34, oxidation is prevented during eutectic crystal solidification process, eutectic crystal solidification quality is ensured, and the thermocouples 36 are used for sensing the temperature of the heating layer 33. The track mechanism 30 further comprises a temperature controller (not shown) and a gas flow regulating valve (not shown), the temperature controller is respectively connected with the heating rod 35 and the thermocouple 36, the thermocouple 36 transmits temperature information to the temperature controller, the temperature controller controls the heating rod 35 to start and stop, and the gas flow regulating valve is used for controlling the flow of protective gas in the input channel. Wherein, the first linear motor 31, the temperature controller and the gas flow regulating valve are respectively connected with a control system.
The swing arm mechanism 40 comprises a swing arm motor 41, a Z-axis motor 42, a rotating shaft 43, a mounting seat 44, a swing arm 45 and a suction nozzle 46, wherein the swing arm motor 41 is arranged at the top of the mounting seat 44, the Z-axis motor 42 is arranged at the side part of the mounting seat 44, the rotating shaft 43 is vertically connected to the swing arm motor 41, and the swing arm motor 41 drives the rotating shaft 43 to rotate back and forth. The front end of the rotating shaft 43 is provided with a sliding block 431, the sliding block 431 can slide up and down along the rotating shaft 43, and the sliding block 431 rotates back and forth along the rotating shaft 43. The sliding block 431 is connected with the Z-axis motor 42 through a connecting block 432, and the Z-axis motor 42 drives the connecting block 432 to move up and down and drives the sliding block 431 to move up and down. The outside of the sliding block 431 is horizontally provided with a swinging arm 45, and the outer end of the swinging arm 45 is vertically provided with a suction nozzle 46 for sucking the chip. The swing arm motor 41 and the Z-axis motor 42 are respectively connected with a control system.
The dispensing mechanism 50 comprises a base 51, a driving device 52 and at least two groups of dispensing arms 53, wherein the driving device 52 is arranged on the base 51, the driving device 52 is provided with a rotating rod 521, and the rotating rod 521 can horizontally rotate relative to the base 51. The at least two sets of dispensing arms 53 are respectively disposed at two sides of the rotating rod 521 and synchronously rotate along with the rotating rod 521. Each group of dispensing arms 53 is provided with a dispensing head 531, each group of dispensing arms 53 is further provided with a driving mechanism, and each driving mechanism is used for driving the corresponding dispensing arm 53 to independently move along the vertical direction. Preferably, the driving mechanism includes a rotary cylinder 54, a fixing portion 541, and an eccentric runner 543, the fixing portion 541 is disposed at the top of the dispensing arm 53, one end of the rotary cylinder 54 is connected to the eccentric runner 543, a fixing hole 542 is disposed on the fixing portion 541, the eccentric runner 543 is movably mounted in the fixing hole 542, the rotary cylinder 54 drives the eccentric runner 543 to rotate, so as to drive the dispensing arm 53 to move along the vertical direction, and the lifting of the dispensing arm 53 is controlled by controlling the rotation amount of the rotary cylinder 54. The bottom of the fixing portion 541 is provided with a chute, the top of the dispensing arm 53 is provided with a slide rail, and the slide rail is mounted in the chute, so that the dispensing arm 53 can move in a horizontal direction relative to the fixing portion 541, and when the dispensing arm 53 is used, the rotary cylinder 54 drives the dispensing arm 53 to move vertically and the driving device 52 drives the dispensing arm 53 to rotate horizontally, so that mutual interference is not generated. A glue tray (not shown) is disposed on one side of the dispensing arm 53, and the glue tray is used for storing glue, and the driving device 52 can drive the dispensing arm 53 to rotate so that the dispensing head 531 moves to a position corresponding to the glue tray. The driving device 52 and the rotary cylinder 54 are respectively connected with a control system, and the control system realizes overall control.
The chip feeding mechanism 60 comprises a second linear motor 61, a third linear motor 62, a sliding seat 63, a supporting plate 64, a material tray 65 and a thimble mechanism 66, wherein the third linear motor 62 is slidingly and vertically connected to the second linear motor 61, the third linear motor 62 can slide back and forth on the second linear motor 61, the sliding seat 63 is slidingly connected to the third linear motor 62, and the sliding seat 63 can slide back and forth on the third linear motor 62. The supporting plate 64 is horizontally fixed on the top of the sliding seat 63, one end of the supporting plate 64 is fixed on the material tray 65, and the material tray 65 is used for placing chips. Through setting up second linear motor 61 and third linear motor 62, can adjust the position of material dish 65 in a flexible way to second linear motor 61 and third linear motor 62 positioning accuracy is high, fast, can correspondingly improve equipment productivity, and stability is strong, difficult wearing and tearing, long service life. And a thimble mechanism 66 is arranged right below the material tray 65, and the thimble mechanism 66 is used for jacking up the chip in the material tray 65 so as to facilitate the suction nozzle 46 to suck the chip. The second linear motor 61, the third linear motor 62 and the thimble mechanism 66 are respectively connected with a control system, and the control system realizes overall control. The first, second and third linear motors 31, 61 and 62 are 400W linear motors.
During operation, the chip mounter can realize that one of two processing technologies of eutectic die bonding and dispensing die bonding is finished, the feeding mechanism 20 outputs the chip support 392 to the track mechanism 30, when the eutectic die bonding is needed, the control system closes the dispensing mechanism 50, starts the heating function of the track mechanism 30, the swing arm 45 of the swing arm mechanism 40 swings to the upper part of the material disc 65, the chip is sucked and then driven to swing to the processing station 38 of the track mechanism 30, the chip is placed in the chip support 392, and the track mechanism 30 carries out eutectic die bonding on the chip placed in the chip support 392 through heating and temperature control; when dispensing and die bonding are needed, the control system turns off the heating function of the track mechanism 30, starts the dispensing mechanism 50, and after the chip is placed on the chip support 392, the dispensing mechanism 50 dispenses the chip to realize dispensing and die bonding.
Compared with the prior art, the integrated chip mounter for eutectic and dispensing of the semiconductor is provided with the track mechanism 30 and the dispensing mechanism 50, and when the eutectic process is needed to be carried out for die bonding, the track mechanism 30 can be started to work, and the dispensing mechanism 50 is closed; when the dispensing process is needed for die bonding, only the dispensing mechanism 50 can be started to work, the heating function of the track mechanism 30 is closed, the two die bonding processes can be freely switched to meet the requirements of different products, the equipment universality is strong, a plurality of pieces of equipment are not needed, the cost is saved, and the efficiency is improved; the first linear motor 31, the second linear motor 61 and the third linear motor 62 have high positioning accuracy and high speed, can correspondingly improve the productivity of equipment, and have strong stability, difficult abrasion and long service life.
The foregoing description of the preferred embodiments of the invention is not intended to limit the scope of the invention, but is intended to cover any modifications, equivalents, and improvements within the spirit of the invention.
Claims (9)
1. The utility model provides a semiconductor eutectic, integrative chip mounter of point gum, its characterized in that includes rack, feeding mechanism, track mechanism, swing arm mechanism, point gum mechanism and chip feeding mechanism, feeding mechanism sets up in rack top one corner, and track mechanism sets up in feeding mechanism side, track mechanism's side top is provided with point gum mechanism, track mechanism's one side is provided with chip feeding mechanism, is provided with swing arm mechanism between track mechanism and the chip feeding mechanism, be provided with control system in the rack, feeding mechanism, track mechanism, swing arm mechanism, point gum mechanism and chip feeding mechanism are connected with control system respectively;
The track mechanism comprises a heating layer, and a plurality of heating rods are arranged in the heating layer.
2. The integrated chip mounter for eutectic and dispensing according to claim 1, wherein the track mechanism comprises a first linear motor, a supporting body and a cover plate, the supporting body is arranged above the first linear motor, the supporting body is driven by the first linear motor to move back and forth, the heating layer is fixed at the top of the supporting body, the top of the heating layer is covered by the cover plate, and a channel is formed between the cover plate and the heating layer.
3. The integrated chip mounter for eutectic and dispensing according to claim 1, wherein a plurality of protective gas inlets, a plurality of thermocouples and a temperature controller are further arranged in the heating layer, the protective gas inlets are communicated with the channels, and the temperature controller is respectively connected with the heating rod and the thermocouples.
4. The integrated chip mounter for semiconductor eutectic and dispensing according to claim 1, wherein the swing arm mechanism comprises a swing arm motor, a Z-axis motor, a rotating shaft, a mounting seat, a swing arm and a suction nozzle, the swing arm motor is arranged at the top of the mounting seat, the Z-axis motor is arranged at the side part of the mounting seat, the rotating shaft is vertically connected to the swing arm motor, the swing arm motor drives the rotating shaft to rotate back and forth, a sliding block is arranged at the front end of the rotating shaft, the sliding block can slide up and down along the rotating shaft and rotate back and forth along with the rotating shaft, the sliding block is connected with the Z-axis motor through a connecting block, the Z-axis motor drives the connecting block to move up and down and drives the sliding block to move up and down, the swing arm is horizontally arranged at the outer side of the sliding block, and the suction nozzle is vertically arranged at the outer end of the swing arm.
5. The integrated chip mounter for eutectic and dispensing of semiconductors according to claim 1, wherein the dispensing mechanism comprises a base, a driving device and at least two groups of dispensing arms, the driving device is arranged on the base, a rotating rod is arranged on the driving device and can horizontally rotate relative to the base, the at least two groups of dispensing arms are respectively arranged on two sides of the rotating rod and synchronously rotate along with the rotating rod, a dispensing head is respectively arranged on each group of dispensing arms, and a driving mechanism is also arranged on each group of dispensing arms.
6. The integrated chip mounter for eutectic and dispensing of semiconductor according to claim 5, wherein the driving mechanism comprises a rotary cylinder, a fixing part and an eccentric runner, the fixing part is arranged at the top of the dispensing arm, one end of the rotary cylinder is connected with the eccentric runner, a fixing hole is formed in the fixing part, the eccentric runner is movably arranged in the fixing hole, and the rotary cylinder drives the eccentric runner to rotate so as to drive the dispensing arm to move in the vertical direction.
7. The integrated chip mounter for eutectic and dispensing of semiconductor according to claim 1, wherein said chip feeding mechanism comprises a second linear motor, a third linear motor, a sliding seat, a supporting plate, a material tray and a thimble mechanism, said third linear motor is slidingly and vertically connected to said second linear motor, said third linear motor is slidingly connected to said third linear motor back and forth on said second linear motor, said sliding seat is slidingly connected to said third linear motor, said sliding seat is slidingly moved back and forth on said third linear motor, said supporting plate is horizontally fixed to the top of said sliding seat, one end of said supporting plate is fixed to said material tray, and said thimble mechanism is disposed under said material tray.
8. The integrated semiconductor eutectic and dispensing die attach machine of claim 2, wherein the first linear motor is a 400W linear motor.
9. The integrated semiconductor eutectic and dispensing die attach machine of claim 7, wherein the second and third linear motors are 400W linear motors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910561813.0A CN110190005B (en) | 2019-06-26 | 2019-06-26 | Semiconductor eutectic and dispensing integrated chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910561813.0A CN110190005B (en) | 2019-06-26 | 2019-06-26 | Semiconductor eutectic and dispensing integrated chip mounter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110190005A CN110190005A (en) | 2019-08-30 |
| CN110190005B true CN110190005B (en) | 2024-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910561813.0A Active CN110190005B (en) | 2019-06-26 | 2019-06-26 | Semiconductor eutectic and dispensing integrated chip mounter |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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