CN110137106B - Glue sprayer for semiconductor processing - Google Patents

Glue sprayer for semiconductor processing Download PDF

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Publication number
CN110137106B
CN110137106B CN201910309925.7A CN201910309925A CN110137106B CN 110137106 B CN110137106 B CN 110137106B CN 201910309925 A CN201910309925 A CN 201910309925A CN 110137106 B CN110137106 B CN 110137106B
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China
Prior art keywords
glue
sealing
pin
injection
tube
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Active
Application number
CN201910309925.7A
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Chinese (zh)
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CN110137106A (en
Inventor
祁金发
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WENLING DONGLING MOTOR Co.,Ltd.
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Wenling Dongling Motor Co ltd
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Priority to CN201910309925.7A priority Critical patent/CN110137106B/en
Publication of CN110137106A publication Critical patent/CN110137106A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like

Abstract

The invention discloses a glue sprayer for semiconductor processing, which structurally comprises a processing box, a protective door, an operating machine table, a lower case and a support column, wherein the processing box is vertically and electrically welded above the lower case, the operating machine table is locked in front of the lower case through rivets, a whole glue injection pipe can be enabled to be hung on the top of each pin through an extension pipe and a suspension post, then a point head is directly contacted with the pin, glue is delivered through a gap such as a covering post, the whole pin is uniformly covered and cannot be adhered to other surrounding pins, the glue of the pin is safer and more compact, the glue can be injected through a lower sealing pipe and a guide channel, a clamping handle is used for fixing the connecting position of each pin and a chip shell, no gap is reserved in the connecting position, the glue is uniformly extruded through injection ends in all directions, and the connecting position is completely sealed, the pin is connected with the chip shell more closely, and is safer and not easy to break.

Description

Glue sprayer for semiconductor processing
Technical Field
The invention relates to semiconductor processing equipment, in particular to a glue sprayer for semiconductor processing.
Background
Semiconductor chip is a chip of preparing through a series of flows through semiconductor material, and it is mostly square or rectangle, according to the also corresponding difference of equidimension that can realize the function, often appears on some smart machine, but the semiconductor material surface is being sealed when gluing because its pin and guide pillar are too much, comparatively trouble, and the current technical consideration is not comprehensive, has following drawback:
when the edge pins of the semiconductor are sealed, gaps among the pins are too small, glue solution is easily contaminated together when the sealing is carried out, so that the two pins are not communicated with each other, and the chip can not normally input and output.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a glue sprayer for semiconductor processing, which aims to solve the problems that when edge pins of a semiconductor are subjected to glue sealing, gaps among the pins are too small, glue solution is easily stained together when the glue sealing is carried out, so that the two pins are not communicated with each other, and a chip cannot normally input and output.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a spout machine of glue for semiconductor processing, its structure includes processing case, guard gate, operation board, lower quick-witted case, pillar, the vertical electric welding in the top of quick-witted case down of processing case, the operation board passes through the place ahead of rivet locking at quick-witted case down, the guard gate passes through the hinge and articulates the surface at the processing case, the pillar is equipped with four and four angles of machine case below under the vertical welding.
In order to optimize the technical scheme, the method further comprises the following steps:
according to one implementation mode, the processing box comprises a pushing faucet, a glue injection cylinder, two drying guns and a shelf table, wherein the shelf table is locked above the lower case through rivets, the two drying guns are arranged at the left end and the right end above the shelf table, the glue injection cylinder is arranged above the shelf table and is arranged in the middle of the two drying guns, and the pushing faucet is in threaded connection with the glue injection cylinder.
According to one implementation mode, the glue injection barrel is composed of edge glue injection sheets, a central glue conveying pipe and a stepless adjusting unit, the central glue conveying pipe is connected below the pushing faucet in a gluing mode, the stepless adjusting unit is movably connected to the outer surface of the central glue conveying pipe, and the four edge glue injection sheets are mechanically connected to the upper portion, the lower portion, the left portion and the right portion of the stepless adjusting unit.
According to one implementation mode, the number of the edge glue injection sheets is four, the edge glue injection sheet at the upper end is composed of a pair of binding pipes, an edge sealing frame and a focusing sheet, the focusing sheet is movably connected above the electrodeless adjusting unit, the edge sealing frame is tightly attached to the upper side of the focusing sheet and is communicated with the focusing sheet, and the pair of binding pipes are electrically welded to the upper side of the edge sealing frame and are communicated with the focusing sheet.
According to one implementation mode, the stepless adjusting unit is composed of an adjusting rod, a hydraulic cavity, an angle control machine and a transition cavity, the transition cavity is connected to the outer surface of a central rubber conveying pipe in a surrounding mode through rubber and is collinear with the axis, the angle control machine is provided with four parts and welded to the outer surface of the transition cavity, the angle control machine and the transition cavity form a square structure, the hydraulic cavity is nested on the outer surface of the angle control machine, and the adjusting rod is provided with four parts and is vertically and mechanically connected to the upper portion, the lower portion, the left portion and the.
According to one embodiment, the alignment tube is composed of an upper sealing tube, an extension tube, a hanging column, an alignment head and a capsule column, the upper sealing tube is inserted and embedded inside the hanging column and penetrates through the upper sealing tube, the extension tube is connected to the right side of the upper sealing tube in an adhesive mode, the hanging column is connected to the lower portion of the extension tube in a threaded mode, the alignment head is welded to the lower portion of the hanging column, and the capsule column is locked to the center of the inner portion of the alignment head.
According to one embodiment, the edge sealing frame comprises a lower sealing tube, a guiding channel, a clamping handle and an injection end, wherein the lower sealing tube is tightly attached to the lower portion of the upper sealing tube and is equal in length, the guiding channel is provided with more than two and is vertically welded to the lower portion of the lower sealing tube, the clamping handle is damaged and connected to the bottom of the guiding channel and penetrates through the guiding channel, and the injection end is provided with more than two and is embedded in the clamping handle in an equal distance.
Advantageous effects
The glue sprayer for semiconductor processing is reasonable in design, strong in functionality and has the following beneficial effects:
according to the invention, through the arrangement of the counter-pricking pipe, the whole glue injection pipe can be hung to the top of each pin through the extension pipe and the hanging column, and then the counter-pricking head directly contacts the pins, so that glue solution is delivered through the gap of the inclusion column, the whole pins are uniformly covered, and meanwhile, the glue solution cannot be adhered to other surrounding pins, and the glue sealing of the pins is safer and more compact.
According to the invention, through the arranged edge sealing frame, glue solution can be injected through the lower sealing tube and the guide channel, the clamping handle is used for fixing the connecting position of each pin and the chip shell, no gap is reserved in the connecting position, the glue solution is uniformly extruded through the injection ends in all directions, the connecting position is completely sealed by the glue solution, the pins and the chip shell are connected more tightly, and the pins are safer and are not easy to break.
Drawings
Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of the embodiments of the invention when taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural diagram of a glue sprayer for semiconductor processing according to the present invention.
Fig. 2 is a schematic structural diagram of an internal plane of a glue-spraying machine processing box for semiconductor processing according to the present invention.
Fig. 3 is a schematic top-view static structure diagram of a glue injection cylinder of a glue sprayer for semiconductor processing according to the present invention.
Fig. 4 is a schematic structural diagram of a glue injection cylinder of a glue sprayer for semiconductor processing according to the invention, which is adjusted and unfolded in a top view.
Fig. 5 is a detailed structural diagram of a roll pipe to a glue sprayer for semiconductor processing according to the present invention.
Fig. 6 is a schematic structural diagram of an edge sealing frame of a glue spraying machine for semiconductor processing according to the present invention.
Description of reference numerals: the device comprises a processing box 1, a protective door 2, an operating machine table 3, a lower case 4, a support column 5, a pushing tap 11, a glue injection cylinder 12, a drying gun 13, a shelf table 14, an edge glue injection sheet 121, a central glue delivery pipe 122, an electrodeless adjusting unit 123, a counter-bundling pipe 1211, a sealing frame 1212, a focusing sheet 1213, an adjusting rod 1231, a hydraulic cavity 1232, an angle controller 1233, a transition cavity 1234, an upper sealing pipe 12111, an extension pipe 12112, a hanging column 12113, a counter-tap 12114, a capsule-included column 12115, a lower sealing pipe 12121, a smooth guide 12122, a clamping handle 12123 and an injection end 12124.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1, the present invention provides a glue sprayer for semiconductor processing: the structure of the machine comprises a processing box 1, a protective door 2, an operating machine table 3, a lower machine case 4 and pillars 5, wherein the processing box 1 is vertically welded above the lower machine case 4, the operating machine table 3 is locked in front of the lower machine case 4 through rivets, the protective door 2 is hinged to the surface of the processing box 1 through hinges, and the pillars 5 are provided with four corners which are vertically welded below the lower machine case 4.
Referring to fig. 2, the processing box 1 is composed of a push faucet 11, a glue injection barrel 12, two drying guns 13 and a rack table 14, the rack table 14 is locked above the lower case 4 through rivets, the two drying guns 13 are arranged at the left end and the right end above the rack table 14, the glue injection barrel 12 is arranged above the rack table 14 and is arranged between the two drying guns 13, the push faucet 11 is connected above the glue injection barrel 12 in a threaded manner, the drying guns 13 can rapidly dry after glue injection is completed, glue solution is firmer, the bottom of the rack table 14 has an adsorption effect, a processed chip cannot run out during glue injection, and the glue injection position is more accurate.
Referring to fig. 3, the glue injection barrel 12 is composed of edge glue injection sheets 121, a central glue conveying pipe 122 and a stepless adjusting unit 123, the central glue conveying pipe 122 is connected below the pushing faucet 11, the stepless adjusting unit 123 is movably connected to the outer surface of the central glue conveying pipe 122, four edge glue injection sheets 121 are arranged and mechanically connected to the upper side, the lower side, the left side and the right side of the stepless adjusting unit 123, the four edge glue injection sheets 121 are exactly the same as the shape structure of the chip, and the shape of the chip is closer to the shape of the chip and more closely fits each part.
Referring to fig. 4, the edge glue injection sheets 121 are four, the edge glue injection sheet 121 at the upper end is composed of a pair of bundling tubes 1211, an edge sealing frame 1212 and a focusing sheet 1213, the focusing sheet 1213 is movably connected above the electrodeless adjusting unit 123, the edge sealing frame 1212 is closely attached to and penetrates through the focusing sheet 1213, the pair of bundling tubes 1211 is electrically welded above the edge sealing frame 1212 and penetrates through each other, the interior of the bundling tubes 1211 can be sealed, and when a chip with pins on two sides is used, mechanisms on the other two sides can be closed, so that waste of materials is prevented.
Referring to fig. 4, the stepless adjusting unit 123 comprises an adjusting rod 1231, a hydraulic cavity 1232, four corner controllers 1233 and a transition cavity 1234, wherein the transition cavity 1234 is connected to the outer surface of the central rubber delivery pipe 122 around the rubber and the axes of the transition cavity are collinear, the four corner controllers 1233 are welded to the outer surface of the transition cavity 1234, the corner controllers 1233 and the transition cavity 1234 form a square structure, the hydraulic cavity 1232 is nested on the outer surface of the corner controller 1233, the four adjusting rods 1231 are vertically and mechanically connected to the upper, the lower, the left and the right of the hydraulic cavity 1232, the four corner controllers 1233 respectively control the four adjusting rods 1231, the driving distance of the four adjusting rods 1231 is increased, and the shape of the whole device is square at each time, so that the.
Referring to fig. 5, the ligation tube 1211 is composed of an upper sealing tube 12111, an extension tube 12112, a hanging pillar 12113, a pair of point contacts 12114, and a covering pillar 12115, wherein the upper sealing tube 12111 is inserted into the hanging pillar 12113 and penetrates each other, the extension tube 12112 is glued to the right side of the upper sealing tube 12111, the hanging pillar 12113 is screwed under the extension tube 12112, the pair of point contacts 12114 are welded under the hanging pillar 12113, the covering pillar 12115 is locked to the center inside the point contacts 12114, the tip of the point contacts 12114 just contacts the top of the pin, the point-to-point contact is more precise, the opening of the inner covering pillar 12115 is small, so that the punched glue does not spread directly on the pin and does not stick to the surrounding pin, the extension tube 12112 has a certain curvature and can be bent after injection for a period of time, so that the front end to the rear end of the pin can be covered more uniformly.
Referring to fig. 6, the edge sealing frame 1212 includes a lower sealing tube 12121, a guiding channel 12122, a clamping handle 12123, and an injection end 12124, the lower sealing tube 12121 is tightly attached to the lower portion of the upper sealing tube 12111 and has the same length, the guiding channel 12122 has two or more clamping handles 12121 and is vertically welded to the lower portion of the lower sealing tube 12121, the clamping handles 12123 are connected to the bottom of the guiding channel 12122 and are connected to each other, the injection end 12124 has two or more clamping handles 12123, which are uniformly embedded in the inner portion of the clamping handles, the concave structure of the clamping handle 12123 can clamp and tightly attach to each pin, so that the pin and the chip case are more tightly connected, and the surrounding injection end 12124 is more adhesive liquid-filled in multiple directions, so that the bonding effect is better.
When the semiconductor chip needs to be sprayed with glue, the semiconductor chip is fixed on a rack 14 and then fixed, a push faucet 11 is pushed to the upper side of the rack 14, glue is filled through the push faucet 11, each pin is clamped through a clamping handle 12123, an angle controller 1233 is started, the angle controller 1233 drives a hydraulic cavity 1232 to push a regulating rod 1231 to expand, a focusing sheet 1213 is unfolded to form the same shape and size as the processed semiconductor chip, the glue is output through a central glue conveying pipe 122 and enters through an upper sealing pipe 12111 and a lower sealing pipe 12121 respectively, the glue uniformly flows into a forward guide channel 12122 through the lower sealing pipe 12121, the glue is output through an injection end 12124 of a clamping handle 12123, the pins and the connecting positions are fixed, the glue enters a hanging column 12113 through an extension pipe 12112 of the upper sealing pipe 12111, the hanging column 12113 is conveyed to a bag-including column 12115 of the head point 12114 and is uniformly coated on the pins, after glue spraying is finished, drying is carried out through the drying gun 13, so that the glue is quickly dried, and the glue spraying speed is high and the effect is good.
By combining the components, the whole glue injection tube can be hung on the top of each pin through the extension tube 12112 and the hanging column 12113, and then the opposite ends 12114 are in direct contact with the pins, so that glue is delivered through a gap such as the inclusion column 12115, the whole pins are uniformly covered and cannot be adhered to other surrounding pins, the glue of the pins is more safely and tightly sealed, the glue can be injected through the lower sealing tube 12121 and the forward guide channel 12122, the connecting position of each pin and the chip shell is fixed by the clamping handle 12123, no gap is left in the connecting position, the glue is uniformly extruded through the injection ends 12124 in all directions, the connecting position of the glue is completely sealed, the pins and the chip shell are more tightly connected, and the pins are safer and are not easy to break.
The specific embodiments described herein are merely illustrative of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the scope of the invention or exceeding the scope of the claims appended hereto.

Claims (1)

1. The utility model provides a spout machine of glue for semiconductor processing, its structure includes process tank (1), guard gate (2), operation board (3), lower quick-witted case (4), pillar (5), its characterized in that: the processing box (1) is vertically fixed above the lower case (4), the operation machine table (3) is installed in front of the lower case (4), the protective door (2) is installed on the surface of the processing box (1), and the four supporting columns (5) are vertically arranged below the lower case (4); the processing box (1) consists of a pushing faucet (11), a glue injection barrel (12), a drying gun (13) and a shelf table (14), the shelf table (14) is arranged above the lower case (4), the drying gun (13) is provided with two left ends and two right ends which are positioned above the shelf table (14), the glue injection barrel (12) is arranged above the shelf table (14), and the pushing faucet (11) is in threaded connection with the glue injection barrel (12); the glue injection barrel (12) is composed of edge glue injection sheets (121), a central glue conveying pipe (122) and an electrodeless adjusting unit (123), the central glue conveying pipe (122) is arranged below the pushing faucet (11), the electrodeless adjusting unit (123) is movably connected to the outer surface of the central glue conveying pipe (122), and the four edge glue injection sheets (121) are mechanically connected to the upper part, the lower part, the left part and the right part of the electrodeless adjusting unit (123); the number of the edge glue injection sheets (121) is four, the edge glue injection sheet (121) at the upper end consists of a pair of bundling pipes (1211), an edge sealing frame (1212) and a focusing sheet (1213), the focusing sheet (1213) is movably connected above the electrodeless adjusting unit (123), the edge sealing frame (1212) is arranged above the focusing sheet (1213), and the pair of bundling pipes (1211) is arranged above the edge sealing frame (1212); the stepless adjusting unit (123) is composed of an adjusting rod (1231), hydraulic cavities (1232), angle controllers (1233) and transition cavities (1234), the transition cavities (1234) surround the outer surface of the central rubber delivery pipe (122), the angle controllers (1233) are provided with four parts and welded on the outer surface of the transition cavities (1234), the hydraulic cavities (1232) are nested on the outer surface of the angle controllers (1233), and the adjusting rod (1231) is provided with four parts and vertically and fixedly arranged on the upper side, the lower side, the left side and the right side of the hydraulic cavities (1232); the counter-ligation tube (1211) consists of an upper sealing tube (12111), an extension tube (12112), a hanging column (12113), a counter head (12114) and a capsule column (12115), wherein the upper sealing tube (12111) is inserted into the hanging column (12113), the extension tube (12112) is connected to the right side of the upper sealing tube (12111) in a gluing manner, the hanging column (12113) is fixed below the extension tube (12112), the counter head (12114) is arranged below the hanging column (12113), and the capsule column (12115) is arranged at the center inside the counter head (12114); the edge sealing frame (1212) consists of a lower sealing tube (12121), a smooth guide channel (12122), a clamping handle (12123) and an injection end (12124), wherein the lower sealing tube (12121) is tightly attached to the lower part of the upper sealing tube (12111), the smooth guide channel (12122) is provided with more than two and is vertically fixed to the lower part of the lower sealing tube (12121), the clamping handle (12123) is connected to the bottom of the smooth guide channel (12122), and the injection end (12124) is provided with more than two and is embedded in the clamping handle (12123);
the point-binding tube (1211) is designed by the tip of the point head (12114) and the internal inclusion column (12115), the tip of the point head (12114) is just contacted with the top of the pin, the point-to-point contact is more accurate, the opening of the internal inclusion column (12115) is small, so that the flushed glue solution is not diffused but is directly diffused on the pin and is not bonded to the surrounding pin, the extension tube (12112) is arranged to have a certain curvature and can be bent after being injected for a period of time, and the front end and the rear end of the pin can be uniformly covered; the pins can be tightly clamped through the concave structure of the clamping handle (12123) on the edge sealing frame (1212), and the injection end (12124) on the clamping handle (12123) is filled with glue from multiple directions, so that the bonding effect of the glue is improved; when spraying glue on a semiconductor chip, the semiconductor chip is fixed on a rack (14) and fixed, then a pushing faucet (11) is pushed to the upper side of the rack (14), glue is filled through the pushing faucet (11), each pin is clamped through a clamping handle (12123), an angle controller (1233) is started, the angle controller (1233) drives a hydraulic cavity (1232) to push a regulating rod (1231) to expand, a focusing sheet (1213) is unfolded and then outputs the glue through a central glue conveying pipe (122), the glue respectively enters through an upper sealing pipe (12111) and a lower sealing pipe (12121), the glue uniformly flows into a forward guide passage (12122) through the lower sealing pipe (12121), the glue is output through an injection end (12124) of the clamping handle (12123), the glue enters a suspension column (12113) through an extension pipe (12112) of the upper sealing pipe (12111), and the suspension column (12113) is transmitted to a suspension column (12115) of the bag-drawing head (12114), after glue spraying is finished, drying is carried out through the drying gun (13), so that the glue spraying speed is high and the effect is good.
CN201910309925.7A 2019-04-17 2019-04-17 Glue sprayer for semiconductor processing Active CN110137106B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910309925.7A CN110137106B (en) 2019-04-17 2019-04-17 Glue sprayer for semiconductor processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910309925.7A CN110137106B (en) 2019-04-17 2019-04-17 Glue sprayer for semiconductor processing

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CN110137106B true CN110137106B (en) 2020-12-22

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Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101504495B (en) * 2009-03-03 2011-01-05 友达光电(苏州)有限公司 Glue dispensing machine with visual inspection function, and method thereof
CN201969660U (en) * 2010-12-14 2011-09-14 厦门特盈自动化科技股份有限公司 High-speed and high-precision nordson with visual and on-line calibration functions
CN205020333U (en) * 2015-09-21 2016-02-10 张铁猛 Automatic dispensing machine
CN107225060B (en) * 2017-07-31 2019-07-19 望江县精美欣钢构有限公司 A kind of self-interacting type surface of steel plate spraying colloid system
CN208695458U (en) * 2018-07-31 2019-04-05 广州正奇科技有限公司 The bull glue-spreading head of the ipsilateral disengaging glue of the connector that converges

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