CN110137106A - A kind of glue sprayer for semiconductor machining - Google Patents
A kind of glue sprayer for semiconductor machining Download PDFInfo
- Publication number
- CN110137106A CN110137106A CN201910309925.7A CN201910309925A CN110137106A CN 110137106 A CN110137106 A CN 110137106A CN 201910309925 A CN201910309925 A CN 201910309925A CN 110137106 A CN110137106 A CN 110137106A
- Authority
- CN
- China
- Prior art keywords
- glue
- pin
- semiconductor machining
- edge
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Abstract
The invention discloses a kind of glue sprayers for semiconductor machining, its structure includes processing case, protective door, operate board, lower case, pillar, processing case is welded vertically in the top of lower case, operation board is locked at the front of lower case by rivet, extension can be passed through, davit makes entire injected rubber hose fall to the top of each pin, again by directly contact pin of nodding, make by including such one of gap conveying glue of column, entire pin is allowed not glued other pins for bonding to surrounding while full by uniform covering, make the sealing more safety of pin close, lower tube sealing can be passed through, glue is injected along conduit, grip shank is allowed to fix the link position of each pin Yu chip shell, make wherein to leave no gaps, glue is allowed uniformly to squeeze into glue by the dispensing end of all directions again, seal up glue link position completely , pin connect with chip shell it is closer, more safety be not easy to be broken off.
Description
Technical field
The present invention relates to a kind of semiconductor processing equipment more particularly to a kind of glue sprayers for semiconductor machining.
Background technique
Semiconductor chip is to pass through a series of a kind of chip that processes are produced out by semiconductor material, is mostly pros
Shape or rectangle, it is also corresponding different according to the different size of achievable function, often occur on some smart machines, but
Be semiconductor material surface when carrying out sealing since its pin and guide post are excessive, trouble more, technology considers at present
Not comprehensively, it has the following drawbacks:
When the edge pin of semiconductor carries out sealing, the gap between pin is too small, when sealing carries out
It waits glue to become easily infected by together, leads to not intercommunication between two pins, chip can not normal input and output.
Summary of the invention
In view of the deficienciess of the prior art, it is an object of the present invention to provide a kind of glue sprayer for semiconductor machining, with
The gap solved when the edge pin of semiconductor carries out sealing, between pin is too small, glue when sealing carries out
Liquid becomes easily infected by together, leads to not intercommunication between two pins, chip can not normal input and output the problem of.
To achieve the goals above, the present invention is to realize by the following technical solutions: one kind is for semiconductor machining
Glue sprayer, structure includes processing case, protective door, operation board, lower case, pillar, and the processing case is welded under vertically
The top of cabinet, the operation board are locked at the front of lower case by rivet, and the protective door is hinged on by hinge to be added
The surface of work case, the pillar set there are four and vertical welding lower case below four angles.
To optimize above-mentioned technical proposal, the measure further taken are as follows:
According to a kind of embodiment, the processing case is described by promoting faucet, Glass cement squeezing device, drying gun, frame object platform to form
Frame object platform is locked at the top of lower case, the left and right two that the drying gun sets there are two and is located above frame object platform by rivet
End, the Glass cement squeezing device are set to the top of frame object platform and are installed in the centre of two drying guns, and the propulsion faucet is threadedly coupled
In the top of Glass cement squeezing device.
According to a kind of embodiment, the Glass cement squeezing device is by edge glue injecting film, center glue conveying box, electrodeless adjustment unit group
At the center glue conveying box glue connection is movably connected in center glue conveying box in the lower section for promoting faucet, the electrodeless adjustment unit
Outer surface, the edge glue injecting film set there are four and be mechanically connected to electrodeless adjustment unit up and down.
According to a kind of embodiment, there are four the edge glue injecting film is set, the edge glue injecting film of upper end by a rolling tube,
Edge sealing frame, focusing piece composition, the focusing piece are movably connected in the top of electrodeless adjustment unit, and the edge sealing frame is tightly attached to focusing
The top of piece and interpenetrate, described pair of point rolling tube electric welding edge sealing frame top and interpenetrate.
According to a kind of embodiment, the electrodeless adjustment unit controls machine, adapter cavity group by adjusting rod, hydraulic cavities, angle
At, the adapter cavity around glue connection center glue conveying box outer surface and axle center it is conllinear, there are four the angle control machine is set
And it is welded on the outer surface of adapter cavity, the angle control machine and adapter cavity constitute square structure, and the hydraulic cavities are nested in
Angle control machine outer surface, the adjusting rod set there are four and vertical mechanical be connected to hydraulic cavities up and down.
According to a kind of embodiment, described pair of point rolling tube by upper tube sealing, extension, davit, to nodding, include column group
The inside embedded in davit is inserted at, the upper tube sealing and is interpenetrated, and the extension glue connection is described on the right side of upper tube sealing
Davit is threaded in the lower section of extension, nods for described pair and welds the lower section of davit, and the column of including is locked in nodding
The center in portion.
According to a kind of embodiment, the edge sealing frame is formed by lower tube sealing, along conduit, grip shank, dispensing end, under described
Tube sealing is tightly attached to the lower section of tube sealing and equal length, and the suitable conduit is equipped with more than two and is vertically welded in lower tube sealing
Lower section, the grip shank, which has been damaged, to be connected to the bottom along conduit and interpenetrates, the dispensing end be equipped with it is more than two simultaneously
And the equidistant uniform inside for being embedded in grip shank.
Beneficial effect
A kind of glue sprayer for semiconductor machining of the present invention, rationally, functional has the advantages that for design
The present invention can make entire injected rubber hose fall to each pin by being equipped with to a rolling tube by extension, davit
Top, then by directly contact pin of nodding, making to make entire pin equal by including such one of gap conveying glue of column
Even covering will not glue other pins for bonding to surrounding while full, make the sealing more safety of pin close.
The present invention passes through the edge sealing frame being equipped with, and can inject glue by lower tube sealing, along conduit, allow grip shank to fix each
The link position of pin and chip shell makes wherein to leave no gaps, then makes glue by the dispensing end of all directions that glue is uniform
Squeeze into, seal up glue link position completely, pin connect with chip shell it is closer, more safety be not easy
It is broken off.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, the attached drawing in describing below to embodiment is made in detail
It carefully introduces, allows other features, purposes and advantages of the invention will become more apparent with this:
Fig. 1 is a kind of structural schematic diagram of the glue sprayer for semiconductor machining of the present invention.
Fig. 2 is the structural schematic diagram that a kind of glue spraying for semiconductor machining of the present invention machines case inner plane.
Fig. 3 is that a kind of glue sprayer Glass cement squeezing device for semiconductor machining of the present invention overlooks static structural schematic diagram.
Fig. 4 is that a kind of glue sprayer Glass cement squeezing device for semiconductor machining of the present invention overlooks the structural schematic diagram for adjusting expansion.
Fig. 5 is a kind of glue sprayer for semiconductor machining of the present invention to the detailed structural schematic diagram of rolling tube.
Fig. 6 is a kind of structural schematic diagram of the glue sprayer edge sealing frame for semiconductor machining of the present invention.
Description of symbols: processing case 1, operation board 3, lower case 4, pillar 5, promotes leading 11, injecting glue at protective door 2
Cylinder 12, drying gun 13, frame object platform 14, edge glue injecting film 121, center glue conveying box 122, electrodeless adjustment unit 123, to a rolling tube
1211, edge sealing frame 1212, focusing piece 1213, adjusting rod 1231, hydraulic cavities 1232, angle control machine 1233, adapter cavity 1234, upper envelope
Pipe 12111, extension 12112, davit 12113, to nod 12114, include column 12115, lower tube sealing 12121, along conduit
12122, grip shank 12123, dispensing end 12124.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment, the present invention is further explained.
Referring to Fig. 1, the present invention provides a kind of glue sprayer for semiconductor machining: its structure includes processing case 1, protection
Door 2, operation board 3, lower case 4, pillar 5, the processing case 1 are welded in the top of lower case 4, the operation board 3 vertically
The front of lower case 4 is locked at by rivet, the protective door 2 is hinged on the surface of processing case 1, the pillar 5 by hinge
There are four and if four angles of 4 lower section of vertical welding lower case.
Referring to Fig. 2, the processing case 1 is by promoting faucet 11, Glass cement squeezing device 12, drying gun 13, frame object platform 14 to form, it is described
Frame object platform 14 is locked at the top of lower case 4 by rivet, and the drying gun 13 sets there are two and is located at 14 top of frame object platform
Left and right ends, the Glass cement squeezing device 12 is set to the top of frame object platform 14 and is installed in the centres of two drying guns 13, described to push away
The top of Glass cement squeezing device 12 is threaded in into faucet 11, drying gun 13 can rapidly be dried after the completion of sealing, make glue
It is more firm, 14 bottom of frame object platform have the function of absorption, can allow carry out processing chip sky will not be run when injecting glue, make
The position of injecting glue is more accurate.
Referring to Fig. 3, the Glass cement squeezing device 12 is by edge glue injecting film 121, center glue conveying box 122,123 groups of electrodeless adjustment unit
At, 122 glue connection of center glue conveying box in the lower section for promoting faucet 11, during the electrodeless adjustment unit 123 is movably connected in
The outer surface of heart glue conveying box 122, the edge glue injecting film 121 set there are four and are mechanically connected to electrodeless adjustment unit 123
Up and down, edge glue injecting film 121 is just identical as the contour structures of chip equipped with four, closer to the shape more aspect of chip
It agrees with each position.
Referring to Fig. 4, the edge glue injecting film 121 of upper end is by a rolling tube there are four the edge glue injecting film 121 sets
1211, edge sealing frame 1212, focusing piece 1213 form, and the focusing piece 1213 is movably connected in the top of electrodeless adjustment unit 123,
The edge sealing frame 1212 is tightly attached to the top of focusing piece 1213 and interpenetrates, and the described pair of electric welding of point rolling tube 1211 is in edge sealing frame
It 1212 top and interpenetrates, the inside of rolling tube 1211 can be closed, in the chip for having pin to only both sides
When can close the mechanism on other both sides, prevent the waste for causing material.
Referring to Fig. 4, the electrodeless adjustment unit 123 controls machine 1233, mistake by adjusting rod 1231, hydraulic cavities 1232, angle
Cross chamber 1234 composition, the adapter cavity 1234 around glue connection center glue conveying box 122 outer surface and axle center it is conllinear, it is described
Angle control machine 1233 sets there are four and is welded on the outer surface of adapter cavity 1234, the angle control machine 1233 and adapter cavity 1234
Square structure is constituted, the hydraulic cavities 1232 are nested in the outer surface of angle control machine 1233, and the adjusting rod 1231 is equipped with four
A and vertical mechanical is connected to hydraulic cavities 1232 up and down, and four angle control machines 1233 control four adjusting rods respectively
1231, make that it drives apart from size, the shape for allowing whole device to constitute is square every time, more accurately.
Referring to Fig. 5, described pair of point rolling tube 1211 by upper tube sealing 12111, extension 12112, davit 12113, to nodding
12114, the composition of column 12115 is included, the upper tube sealing 12111 inserts the inside embedded in davit 12113 and interpenetrates, described to prolong
12112 glue connection of pipe is stretched on the right side of upper tube sealing 12111, the davit 12113 is threaded in the lower section of extension 12112,
The lower section of described pair of 12114 welding davits 12113 of nodding, the column 12115 of including are locked to nodding in inside 12114
The heart, to nodding, 12114 tip just touches the top of pin, and point-to-point contact is more accurate, and column 12115 is included in inside
Opening it is small, spread the glue gone out will not, but be directly diffused on pin, the pin of surrounding will not be bonded to,
Extension 12112 has certain curvature, can be bent in injection a period of time, makes the front end of pin can be more to rear end
It is uniform capped.
Referring to Fig. 6, the edge sealing frame 1212 is by lower tube sealing 12121, suitable conduit 12122, grip shank 12123, dispensing end
12124 compositions, the lower tube sealing 12121 are tightly attached to lower section and the equal length of tube sealing 12111, the suitable conduit 12122
Equipped with two or more and it is vertically welded in the lower section of lower tube sealing 12121, the grip shank 12123, which has been damaged, to be connected to along conduit
It 12122 bottom and interpenetrates, the dispensing end 12124 is equipped with more than two and equidistant is uniformly embedded in grip shank
The concave structure of 12123 inside, grip shank 12123 can clamp and be close to each pin, allow pin and chip shell
More close, circular dispensing end 12124 is even more multi-direction to feed glue, keeps bond effect more preferable.
It when needing to carry out glue spraying to semiconductor chip, is fixed on frame object platform 14 and fixes, then make propulsion leading
11 are advanced to the top of frame object platform 14, by promoting faucet 11 to start that glue is perfused, and pass through grip shank 12123 for each pin
It clamps, starting angle controls machine 1233, and angle control machine 1233 is allowed to drive hydraulic cavities 1232 that adjusting rod 1231 is pushed to start to be expanded
, allow focusing piece 1213 be unfolded, the shape size formed after expansion is identical as the semiconductor chip of processing, after by the defeated glue in center
Pipe 122 export glue, respectively by upper tube sealing 12111, lower tube sealing 12121 enter, first pass through lower tube sealing 12121 uniformly flow into it is suitable
In conduit 12122, the dispensing end 12124 by grip shank 12123 exports glue, allows pin to fix with link position, then pass through
The extension 12112 for crossing tube sealing 12111 enters davit 12113, and davit 12113, which is transferred to, 12114 includes column to nodding
It on 12115, is uniformly applied on pin, passing through drying gun 13 after the completion of glue spraying is dried, and allows its quick dry glue, glue spraying
The fast effect of speed is good.
The present invention is combined with each other by above-mentioned component, can make entire injected rubber hose by extension 12112, davit 12113
The top of each pin is fallen to, then by making by including the such seam of column 12115 to 12114 direct contact pins of nodding
Gap conveys glue, and entire pin is allowed not glued other pins for bonding to surrounding while full by uniform covering, allows the envelope of pin
Glue more safety is close, can inject glue by lower tube sealing 12121, along conduit 12122, grip shank 12123 is allowed to fix often
The link position of a pin and chip shell makes wherein to leave no gaps, then allows glue by the dispensing ends 12124 of all directions by glue
Liquid is uniformly squeezed into, and seals up glue completely link position, pin connect with chip shell it is closer, it is more safe
It is not easy to be broken off.
Specific embodiment described herein is only to give an example to the present invention.The technical field of the invention
Technical staff can make various modifications or additions to the described embodiments or be substituted in a similar manner, but
Without departing from of the invention or beyond the scope of the appended claims.
Claims (7)
1. a kind of glue sprayer for semiconductor machining, structure include processing case (1), protective door (2), operation board (3), under
Cabinet (4), pillar (5), it is characterised in that:
Processing case (1) is fixed on the top of lower case (4) vertically, before the operation board (3) is mounted on lower case (4)
Side, the protective door (2) are installed in the surface of processing case (1), and the pillar (5) sets there are four and is vertical at lower case
(4) lower section.
2. a kind of glue sprayer for semiconductor machining according to claim 1, it is characterised in that: the processing case (1)
By promoting leading (11), Glass cement squeezing device (12), drying gun (13), frame object platform (14) to form, the frame object platform (14) is installed in lower machine
The top of case (4), the left and right ends that the drying gun (13) sets there are two and is located above frame object platform (14), the Glass cement squeezing device
(12) top of frame object platform (14), the top for promoting leading (11) to be threaded in Glass cement squeezing device (12) are set to.
3. a kind of glue sprayer for semiconductor machining according to claim 2, it is characterised in that: the Glass cement squeezing device (12)
It is made of edge glue injecting film (121), center glue conveying box (122), electrodeless adjustment unit (123), center glue conveying box (122) dress
It is located at the lower section for promoting leading (11), the electrodeless adjustment unit (123) is movably connected in the appearance of center glue conveying box (122)
Face, the edge glue injecting film (121) set there are four and are fitted in the outer surface of electrodeless adjustment unit (123).
4. a kind of glue sprayer for semiconductor machining according to claim 3, it is characterised in that: the edge glue injecting film
(121) there are four setting, the edge glue injecting film (121) of upper end is by a rolling tube (1211), edge sealing frame (1212), focusing piece (1213)
Composition, focusing piece (1213) are movably connected in the top of electrodeless adjustment unit (123), and the edge sealing frame (1212) is installed in
The top of focusing piece (1213), described pair of point rolling tube (1211) are mounted on the top of edge sealing frame (1212).
5. a kind of glue sprayer for semiconductor machining according to claim 3, it is characterised in that: the electrodeless adjustment machine
Group (123) is made of adjusting rod (1231), hydraulic cavities (1232), angle control machine (1233), adapter cavity (1234), the adapter cavity
(1234) it is looped around the outer surface of center glue conveying box (122), angle control machine (1233) is equipped with more than two and is distributed in
The outer surface of adapter cavity (1234), the hydraulic cavities (1232) are nested in the outer surface of angle control machine (1233), the adjusting rod
(1231) it sets there are four and is vertically installed in hydraulic cavities (1232) up and down.
6. a kind of glue sprayer for semiconductor machining according to claim 4, it is characterised in that: described pair of point rolling tube
(1211) by upper tube sealing (12111), extension (12112), davit (12113), to nodding (12114), include column (12115) group
At the upper tube sealing (12111) is inserted embedded in the inside of davit (12113), and the extension (12112) is embedded in upper tube sealing
(12111) right side, the davit (12113) are fixed on the lower section of extension (12112), described pair nod (12114) be set to
The lower section of davit (12113), the column (12115) of including are mounted on to (12114) internal center of nodding.
7. a kind of glue sprayer for semiconductor machining according to claim 4, it is characterised in that: the edge sealing frame
(1212) it is formed by lower tube sealing (12121), along conduit (12122), grip shank (12123), dispensing end (12124), the lower envelope
Pipe (12121) is tightly attached to the lower section of tube sealing (12111), and the suitable conduit (12122) is equipped with more than two and vertically fixes
In the lower section of lower tube sealing (12121), the grip shank (12123) is connected to the bottom along conduit (12122), the dispensing end
(12124) it is equipped with inside that is more than two and being embedded in grip shank (12123).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910309925.7A CN110137106B (en) | 2019-04-17 | 2019-04-17 | Glue sprayer for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910309925.7A CN110137106B (en) | 2019-04-17 | 2019-04-17 | Glue sprayer for semiconductor processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110137106A true CN110137106A (en) | 2019-08-16 |
| CN110137106B CN110137106B (en) | 2020-12-22 |
Family
ID=67570307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910309925.7A Active CN110137106B (en) | 2019-04-17 | 2019-04-17 | Glue sprayer for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110137106B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101504495A (en) * | 2009-03-03 | 2009-08-12 | 友达光电（苏州）有限公司 | Glue dispensing machine with visual inspection function, and method thereof |
| CN201969660U (en) * | 2010-12-14 | 2011-09-14 | 厦门特盈自动化科技股份有限公司 | High-speed and high-precision nordson with visual and on-line calibration functions |
| CN205020333U (en) * | 2015-09-21 | 2016-02-10 | 张铁猛 | Automatic dispensing machine |
| CN107225060A (en) * | 2017-07-31 | 2017-10-03 | 望江县精美欣钢构有限公司 | A kind of self-interacting type surface of steel plate spraying colloid system |
| CN208695458U (en) * | 2018-07-31 | 2019-04-05 | 广州正奇科技有限公司 | The bull glue-spreading head of the ipsilateral disengaging glue of the connector that converges |
-
2019
- 2019-04-17 CN CN201910309925.7A patent/CN110137106B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101504495A (en) * | 2009-03-03 | 2009-08-12 | 友达光电（苏州）有限公司 | Glue dispensing machine with visual inspection function, and method thereof |
| CN201969660U (en) * | 2010-12-14 | 2011-09-14 | 厦门特盈自动化科技股份有限公司 | High-speed and high-precision nordson with visual and on-line calibration functions |
| CN205020333U (en) * | 2015-09-21 | 2016-02-10 | 张铁猛 | Automatic dispensing machine |
| CN107225060A (en) * | 2017-07-31 | 2017-10-03 | 望江县精美欣钢构有限公司 | A kind of self-interacting type surface of steel plate spraying colloid system |
| CN208695458U (en) * | 2018-07-31 | 2019-04-05 | 广州正奇科技有限公司 | The bull glue-spreading head of the ipsilateral disengaging glue of the connector that converges |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110137106B (en) | 2020-12-22 |
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Effective date of registration: 20201204 Address after: Taizhou City, Zhejiang province 317500 Wenling Zeguo Zhen Ni Qiao Cun Ze Chu Road No. 688 Applicant after: WENLING DONGLING MOTOR Co.,Ltd. Address before: 350001 Provincial Institute of Electronic Technology, No. 104 Fufei Road, Gulou District, Fuzhou City, Fujian Province Applicant before: Qi Jinfa |
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Denomination of invention: A glue sprayer for semiconductor processing Effective date of registration: 20220718 Granted publication date: 20201222 Pledgee: Zhejiang Tyrone commercial bank Limited by Share Ltd. Taizhou Wenling branch Pledgor: WENLING DONGLING MOTOR Co.,Ltd. Registration number: Y2022980010593 |