CN110085542A - The equipment and its polishing process of automatically grinding diode chip for backlight unit superficial oxidation layer - Google Patents

Abstract

The invention discloses a device and a grinding method for automatically grinding the oxide layer on the surface of a diode chip, which belong to the technical field of electronic devices and solve the problems of low efficiency, high labor intensity, and large pollution of the working environment in traditional diode chip grinding, and mainly include drilling machines , Die carrier rotation mechanism, millstone movement mechanism. The invention realizes the automatic grinding and processing of the diode chip with ingenious structural design, greatly reduces the labor intensity of the workers, the workshop environment is significantly improved, the physical and mental health of the workers is effectively guaranteed, the social benefits are obvious, it is suitable for batch operations, and the production efficiency is improved. 60%-70%, creating considerable economic benefits for the enterprise, good grinding effect, stable performance of the rectifier module, independent innovation on the basis of the existing drilling machine, very practical, in the rectifier module and other needs to use diode chips The field of manufacturing electronic devices is of great significance.

Description

Equipment and method for automatically polishing oxide layer on surface of diode chip

technical field

The invention belongs to the technical field of electronic device processing tooling, and specifically relates to a tool that greatly reduces labor intensity, effectively improves the production environment in the workshop, effectively guarantees the physical and mental health of workers, realizes automated batch operations, and greatly improves production efficiency. A device and a polishing method for automatically polishing the oxide layer on the surface of a diode chip with good polishing effect.

Background technique

The diode chip is round and is the core component of the rectifier module. It is electrically connected to each electrode piece by soldering. In order to ensure good soldering performance of the chip surface, it is necessary to polish and remove the oxide layer on the surface of the diode chip before assembly. Previously, the company has been using the most traditional operation method, that is, manually using a file to manually polish the die, which is not only time-consuming and labor-intensive, but also has a high labor intensity and low production efficiency. Moreover, the working environment is very poor, and workers' hands and bodies are all polished. The waste is mainly solder, which contains lead, which will pose a certain hazard to the physical and mental health of workers.

SUMMARY OF THE INVENTION

The purpose of the present invention is to address the deficiencies of the existing technology, and provide a method that greatly reduces labor intensity, effectively improves the workshop production environment, effectively guarantees the physical and mental health of workers, realizes automated batch operations, doubles production efficiency, and polishes A device and a polishing method for automatically polishing the oxide layer on the surface of a diode chip with good effect.

The present invention is achieved through the following technical solutions:

A device for automatically polishing the oxide layer on the surface of a diode chip, including a drilling machine, and the device also includes a die carrier rotation mechanism and a grinding disc movement mechanism;

The die carrier rotating mechanism includes a support platform arranged on the drill machine base, a die carrier provided with a plurality of die stations, the die carrier is supported on the support platform, and Under the action of a stepping motor, it can perform intermittent rotational movement relative to the support platform; one side of the die carrier is provided with a micro switch, and the micro switch is activated when the die carrier rotates The millstone movement mechanism;

The moving mechanism of the grinding disc includes a grinding disc and a stepping motor of the grinding disc; The micro switch is electrically connected, and the rotating shaft of the stepper motor of the grinding disc moves the main shaft support in the axial direction of the main shaft of the drilling machine through the screw, and the main shaft support is fixedly connected with the main shaft sleeve of the main shaft of the drilling machine.

Preferably, the main motor of the drilling machine is connected to the main shaft of the drilling machine through a frequency converter.

Preferably, the die carrier is in the shape of a disc, and its circumference is provided with a plurality of hollow holes as the die stations, and the periphery of the die carrier is provided with the same number of anti-corrosion holes as the die stations. anti-reverse notch, and the anti-reverse notch and the die station maintain the same pitch angle; one side of the die carrier is provided with a resettable anti-reverse stopper, and the anti-reverse stopper is movably connected On the support platform and against the anti-reverse notch, the anti-reverse stopper can trigger the action reed of the micro switch when the die carrier rotates.

Preferably, the anti-reverse stopper is reset through a tension spring.

Preferably, a finished product discharge hole is provided on the support platform, and a discharge chute for leading out the processed product is provided below the discharge hole.

Preferably, the grinding disc includes a grinding disc connector, a grinding disc body, and a grinding disc cutter body fixed to the bottom of the grinding disc body, and the surface of the grinding disc cutter body is an uneven surface with interlaced teeth.

Preferably, the disc cutter body is in the shape of a circle or a regular polygon, and a plurality of alternately distributed chip grooves are formed on its surface.

Preferably, a chip removal device for cleaning waste chips is also provided on the support platform.

Preferably, the chip removal device includes a ring-shaped brush body arranged below the grinding table, the ring-shaped brush body is fixed on the support platform, and a waste chip discharge port is provided on the support platform at its inner ring position.

A method for automatically polishing an oxide layer on the surface of a diode chip, comprising the following steps:

a. Use the frequency converter to pre-set the rotational speed of the rotating spindle of the drilling machine;

b. Use the controller of the stepping motor of the grinding disc to pre-set the descending stroke of the rotating spindle, the holding time of the falling point and the rising stroke;

c. Use the controller of the carrier stepping motor to pre-set the rotation range and rotation gap time of the die carrier;

d. Start the drilling machine, and the grinding disc fixed on the rotating spindle will rotate at the set speed;

e. On the die carrier, load the die station that needs to be loaded;

f. Start the stepping motor of the carrier, and the stepping motor of the carrier drives the die carrier to make intermittent rotational movement relative to the support table, and rotate the diode chip to the right below the grinding disc cutter body, and move slightly while the die carrier rotates The switch is triggered, and the controller of the disc stepper motor is powered on to start the program;

g. Under the control of the millstone stepper motor controller, the millstone stepper motor rotates, its rotating shaft drives the screw to rotate, the rotation of the screw drives the spindle bracket to move downward, and the spindle bracket is fixed to the spindle sleeve of the drilling machine spindle. As a result, the main shaft sleeve is driven to move downward, and the downward movement of the main shaft sleeve drives the rotating main shaft to move downward, thereby driving the grinding disc to move downward until reaching the preset descending stroke; at this time, the grinding disc cutter body is attached to the diode chip, The grinding disc that has been in the rotating state plays a role in grinding and removing the oxide layer on the diode chip;

h. When the preset holding time of the falling point is reached, the stepping motor controller of the grinding disc controls the stepping motor of the grinding disc to reverse, and the stepping motor of the grinding disc moves upward until reaching the preset rising stroke, and the stepping motor of the grinding disc stops, waiting for the next trigger signal ;At the same time, the stepper motor of the carrier controls the rotation of the die carrier, and moves the next station to the directly below the grinding disc cutter body, and the finished product is synchronously rotated to the unloading position to be removed, and so on and on;

i. If the work is completed, disconnect the stepping motor of the carrier, the stepping motor of the grinding disc, and the power supply of the drilling machine.

Compared with the prior art, the beneficial effects of the present invention are:

1. The present invention realizes the automatic grinding and processing of diode chips with ingenious structural design, which greatly reduces the labor intensity of workers, and the workshop environment is significantly improved. Obvious benefits;

2. The invention is especially suitable for batch operations, and the production efficiency is increased by 60%-70%, creating considerable economic benefits for the enterprise;

3. The grinding effect of the present invention is good, the welding quality of the diode chip is effectively guaranteed, the grinding degree is consistent, and the performance of the rectifier module is stable;

4. The present invention is independently innovated on the basis of the existing drilling machine, and has strong practicability, and has very important significance in the field of manufacturing rectifier modules and other electronic devices that need to use diode chips.

Description of drawings

Fig. 1 is a structural representation of the present invention (feeding chute is not shown);

Fig. 2 is a partial enlarged view of Fig. 1 of the present invention;

Fig. 3 is a partial enlarged view one of Fig. 2 of the present invention;

Fig. 4 is a partial enlarged view 2 of Fig. 2 of the present invention;

Fig. 5 is a schematic diagram of the top view direction of Fig. 4 of the present invention (including the blanking chute);

Fig. 6 is a schematic diagram of the structure in the side view direction of Fig. 5 of the present invention;

Fig. 7 is a schematic diagram of the structure of the disc bottom of the present invention.

In the figure: 1. Drilling machine; 2. Drilling machine base; 3. Support table; 4. Die core station; 5. Die core carrier; 6. Micro switch; 7. Grinding disc; Stepper motor; 10. Lead screw; 11. Main shaft bracket; 12. Main shaft sleeve; 13. Main motor; 14. Anti-reverse notch; 15. Anti-reverse block; 16. Tension spring; 18. Blanking chute; 19. Grinding disc connector; 20. Grinding disc body; 21. Grinding disc cutter body; 22. Diode chip; 23. Ring brush body; 24. Waste chip discharge port; 25. Carrier stepping Motor; 26. chip groove; 27. finished product collection box.

Detailed ways

Below in conjunction with accompanying drawing, the present invention is further described:

A device for automatically polishing the oxide layer on the surface of a diode chip, including a drilling machine 1, and the device also includes a die carrier rotating mechanism and a grinding disc moving mechanism;

The die carrier rotation mechanism includes a support platform 3 arranged on the drilling machine base 2, a die carrier 5 provided with a plurality of die stations 4, and the die carrier 5 is supported on the support platform 3, and under the action of the stepping motor 25 of the carrier, it can perform intermittent rotational movement relative to the support table 3; one side of the die carrier 5 is provided with a micro switch 6, and the die When the carrier 5 rotates, the micro switch 6 activates the millstone moving mechanism;

Described grinding disc movement mechanism comprises grinding disc 7, grinding disc stepper motor 9; Described grinding disc 7 is used for polishing and is placed on the diode chip 22 on described pipe core station 4, and it is affixed with the rotating main shaft 8 of drilling machine main shaft; The millstone stepper motor 9 is electrically connected with the micro switch 6, and the rotating shaft of the millstone stepper motor 9 makes the main shaft support 11 move in the axial direction of the main shaft of the drilling machine through the lead screw 10, and the main shaft support 11 and the The main shaft sleeve 12 of the main shaft of the drilling machine is fixedly connected.

Preferably, the main motor 13 of the drilling machine 1 is connected to the main shaft of the drilling machine 1 via a frequency converter.

Preferably, the die carrier 5 is disc-shaped, and its circumference is provided with a plurality of hollow holes as the die station 4, and the periphery of the die carrier 5 is provided with the die station 4. The same number of anti-reverse notches 14, and the anti-reverse notches 14 and the die station 4 maintain the same pitch angle; one side of the die carrier 5 is provided with a resettable anti-reverse stopper 15 , the anti-reverse stopper 15 is movably connected to the support table 3 and abuts against the anti-reverse notch 14, and the anti-reverse stopper 15 can trigger the The action reed of micro switch 6 is described above.

Preferably, the anti-reverse stopper 15 is reset via a tension spring 16 .

Preferably, the support platform 3 is provided with a finished product discharge hole 17 , and a discharge chute 18 for leading the processed product out is provided below the discharge hole 17 .

Preferably, the grinder 7 includes a grinder connector 19, a grinder body 20, and a grinder body 21 affixed to the bottom of the grinder body 20. The surface of the grinder body 21 is an uneven surface with staggered teeth.

Preferably, the disc cutter body 21 is in the shape of a circle or a regular polygon, and a plurality of chip grooves 26 distributed alternately are formed on its surface.

Preferably, the support platform 3 is also provided with a chip removal device for cleaning up waste.

Preferably, the dandruff removal device includes an annular brush body 23 arranged below the grinding disc 7, the annular brush body 23 is fixed on the support platform 3, and the support platform 3 at its inner ring position is opened waste discharge port 24.

A method for automatically polishing an oxide layer on the surface of a diode chip, comprising the following steps:

a. Utilize the frequency converter to pre-set the rotating speed of the rotating spindle 8 of the drilling machine 1;

b. Use the controller of the grinding disc stepping motor 9 to pre-set the descending stroke of the rotating main shaft 8, the holding time of the falling point and the ascending stroke;

c. Use the controller of the carrier stepping motor 25 to pre-set the rotation range and rotation gap time of the die carrier 5;

d. Start the drilling machine 1, and the grinding disc 7 fixed on the rotating spindle 8 rotates at a set speed;

e. On the die carrier 5, feed the die station 4 that needs to be loaded;

f. Start the carrier stepping motor 25, and the carrier stepping motor 25 drives the die carrier 5 to perform intermittent rotational motion relative to the support table 3, and the diode chip 22 is rotated to the right below the grinding disc cutter body 21, and the die carrier While the tool 5 is rotating, the micro switch 6 is triggered, and the controller of the disc stepper motor 9 is powered to start the program;

g. Under the control of the millstone stepper motor 9 controller, the millstone stepper motor 9 rotates, and its rotating shaft drives the lead screw 10 to rotate, and the rotation of the lead screw 10 drives the main shaft support 11 to move downward, and the main shaft support 11 is connected to the main shaft of the drilling machine. The main shaft sleeve 12 is fixedly connected, thereby driving the main shaft sleeve 12 to move downward, and the downward movement of the main shaft sleeve 12 drives the rotating main shaft 8 to move downward, thereby driving the grinding disc 7 to move downward until reaching the preset descending stroke; When the grinding disc cutter body 21 is attached to the diode chip 22, the grinding disc 7 in the rotating state plays the role of grinding and removing the oxide layer on the diode chip 22;

h. When the preset holding time of the falling point is reached, the controller of the grinding disc stepping motor 9 controls the grinding disc stepping motor 9 to reverse, and the grinding disc 7 moves upward until it reaches the preset rising stroke. The grinding disc stepping motor 9 stops and waits The next trigger signal; at the same time, the carrier stepper motor 25 controls the rotation of the die carrier 5, and moves the next station to the bottom of the grinding disc cutter body 21, and the finished product is synchronously rotated to the unloading position is removed, and the cycle repeats;

i. If the operation is completed, disconnect the power supply of the stepping motor 25 of the carrier, the stepping motor 9 of the grinding disc, and the drilling machine 1.

Example 1:

This embodiment includes a drilling machine 1, a die carrier rotating mechanism, and a millstone moving mechanism;

The die carrier rotating mechanism comprises a support platform 3 arranged on the drilling machine base 2, a die carrier 5 provided with a plurality of die stations 4, the die carrier 5 is supported on the support platform 3, and Under the action of a stepping motor 25, it can perform intermittent rotational movement relative to the support platform 3; one side of the die carrier 5 is provided with a micro switch 6, and the micro switch 6 starts the movement of the grinding disc when the die carrier 5 rotates mechanism;

The millstone movement mechanism comprises a millstone 7, a millstone stepper motor 9; the millstone 7 is used to polish the diode chip 22 placed on the tube core station 4, and it is fixedly connected with the rotating main shaft 8 of the drilling machine main shaft; the millstone stepper motor 9 and the micro-motion Switch 6 is electrically connected, and the rotating shaft of millstone stepper motor 9 makes main shaft support 11 move on the axial direction of drilling machine main shaft through leading screw 10, and main shaft support 11 is affixed with the main shaft sleeve 12 of drilling machine main shaft.

The specific action process of this embodiment is as follows: first start the drilling machine 1, the grinding disc 7 fixed on the rotating spindle 8 rotates synchronously, and the worker stands beside the supporting platform to load the tube core station 4 that needs to be loaded, such as as shown in the attached manual As shown in FIG. 5 , the worker stands at position A to load materials, starts the carrier stepping motor 25 , and the carrier stepping motor 25 drives the die carrier 5 to perform intermittent rotational motion relative to the supporting platform 3 . Taking four stations as an example, each time the die carrier rotates 90°, the die carrier 5 will touch the action reed of the micro switch 6 when it rotates, and the micro switch 6 is connected to the circuit so that the stepper motor of the grinding disc The controller of 9 gets the signal, and under the control of the controller of the grinding disc stepping motor 9, the grinding disc stepping motor 9 rotates, and the rotation of the grinding disc stepping motor 9 drives the screw 10 to rotate, and the rotation of the leading screw 10 makes the main shaft support 11 move downward . We know that the spindle of a drilling machine can be divided into a rotating spindle and a spindle sleeve. The rotating spindle is assembled into the spindle sleeve through a bearing. The sleeve cannot rotate but can only move up and down. One side of the sleeve is made into a rack, and the gear drives the teeth. The bar moves the sleeve, and then drives the rotating shaft to move together to realize axial feeding. There is a very long spline shaft at the end of the rotating main shaft. The gear is sleeved on the spline shaft, which drives the rotating main shaft to rotate. The spline shaft moves with the main shaft and slides in the spline hole of the gear, and can still transmit rotation and torque normally. This is The current design is briefly introduced. Therefore, under the premise that the shaft support 11 is fixedly connected to the main shaft sleeve 12 of the drilling machine main shaft, the downward movement of the main shaft support 11 will drive the rotating main shaft 8 to move downward, and accordingly drive the grinding disc 7 to move downward until reaching the preset value. Descending stroke: At this time, the grinding disc cutter body 21 is bonded to the diode chip 22, and the grinding disc 7 in the rotating state plays the role of grinding and removing the oxide layer on the diode chip 22.

When the preset descending point holding time is reached, the millstone stepping motor 9 controller controls the millstone stepping motor 9 to reverse, and the millstone 7 moves upward until reaching the preset rising stroke. The millstone stepping motor 9 stops and waits for the next step. Trigger signal; at the same time, the carrier stepper motor 25 controls the rotation of the die carrier 5, and the next station is moved to just below the grinding disc cutter body 21, and the finished product after being ground is synchronously rotated to the blanking position by the worker Take it out or slide it out through the unloading mechanism, and so on.

The rotating speed of the rotating main shaft 8 of drilling machine 1 utilizes existing technology, as utilizes frequency converter to pre-set; Parameters such as the holding time, the rising stroke, the rotation range of the die carrier 5 , and the rotation gap time are all set by using the existing program.

This embodiment realizes the automatic grinding and processing of diode chips with ingenious structural design, greatly reduces the labor intensity of workers, the workshop environment is significantly improved, workers do not need to directly contact large areas of waste, workers' physical and mental health is effectively guaranteed, and social benefits obvious;

This embodiment is especially suitable for batch operations, and the production efficiency is increased by 60%-70%, creating considerable economic benefits for the enterprise;

In this embodiment, the grinding effect is good, the welding quality of the diode chip is effectively guaranteed, the grinding degree is consistent, and the performance of the rectifier module is stable;

This embodiment is an independent innovation based on the existing drilling machine, which is very practical and has very important significance in the field of manufacturing rectifier modules and other electronic devices that require diode chips.

Example 2:

This embodiment includes a drilling machine 1, a die carrier rotating mechanism, and a millstone moving mechanism;

The die carrier rotating mechanism comprises a support platform 3 arranged on the drilling machine base 2, a die carrier 5 provided with a plurality of die stations 4, the die carrier 5 is supported on the support platform 3, and Under the action of a stepping motor 25, it can perform intermittent rotational movement relative to the support platform 3; one side of the die carrier 5 is provided with a micro switch 6, and the micro switch 6 starts the movement of the grinding disc when the die carrier 5 rotates mechanism;

The millstone movement mechanism comprises a millstone 7, a millstone stepper motor 9; the millstone 7 is used to polish the diode chip 22 placed on the tube core station 4, and it is fixedly connected with the rotating main shaft 8 of the drilling machine main shaft; the millstone stepper motor 9 and the micro-motion Switch 6 is electrically connected, and the rotating shaft of millstone stepper motor 9 makes main shaft support 11 move on the axial direction of drilling machine main shaft through leading screw 10, and main shaft support 11 is affixed with the main shaft sleeve 12 of drilling machine main shaft.

The main motor 13 of the drilling machine 1 in this embodiment is connected to the main shaft of the drilling machine 1 through a frequency converter.

In this embodiment, the die carrier 5 is disc-shaped, and its circumference is provided with a plurality of hollow holes as the die station 4, and the periphery of the die carrier 5 is provided with the same number of anti-reverse notches 14 as the die station 4, And the anti-reverse notch 14 and the die station 4 maintain the same pitch angle, pitch angle=360°/number of die stations; one side of the die carrier 5 is provided with a resettable anti-reverse stopper 15 The anti-reverse block 15 is movably connected to the support platform 3 and leans against the anti-reverse notch 14. The anti-reverse block 15 can trigger the action reed of the micro switch 6 when the die carrier 5 rotates. This structure is an anti-reverse structure, and the structural design is simple and ingenious, which can prevent anti-reverse and can control the stepper motor 9 of the grinding disc through the micro switch.

In this embodiment, the anti-reverse block 15 is reset through the tension spring 16 .

In the present embodiment, the support platform 3 is provided with a blanking hole 17 for the finished product, and a blanking chute 18 for leading the finished product is provided below the blanking hole 17 . This structure is a blanking structure, the structure design is simple, and it is easy to realize.

The grinding disc 7 in this embodiment includes a grinding disc connector 19, a disc body 20, and a disc cutter body 21 affixed to the bottom of the disc body 20. The surface of the disc cutter body 21 is an uneven surface with interlaced teeth. The profile of teeth on the surface of the grinding disc cutter body 21 is just consistent with the file.

In this embodiment, the disc cutter body 21 is in the shape of a circle or a regular polygon, and a plurality of chip grooves 26 distributed alternately are provided on its surface. The solder is soft and easy to stick chips, and the design of the chip outlet groove 26 is conducive to the discharge of waste chips on the grinding disc cutter body.

In the present embodiment, the support table 3 is also provided with a chip removal device for cleaning up waste chips. The device further plays the role of cleaning up the waste debris on the grinding disc cutter body 21 in time, so as to ensure the consistency of the grinding degree of the product.

The chip removal device of this embodiment includes an annular brush body 23 arranged under the grinding disc 7 , the annular brush body 23 is fixed on the support platform 3 , and the support platform 3 at its inner ring position has a waste chip discharge port 24 . The millstone cutter body moves relative to the annular brush body, and the ruins brushed are discharged through the ruin discharge port 24 .

First start the drilling machine 1, the grinding disc 7 fixed on the rotating spindle 8 rotates synchronously, and the worker stands next to the support platform to load the tube core station 4 that needs to be loaded, such as shown in Figure 5 of the accompanying drawing of the specification, the worker stands Material is loaded at position A, the carrier stepping motor 25 is started, and the carrier stepping motor 25 drives the die carrier 5 to perform intermittent rotational motion relative to the supporting platform 3 . Assuming that the carrier stepper motor 25 drives the die carrier 5 to move clockwise, taking four stations as an example, the die carrier rotates 90° clockwise each time. In order to prevent the grinding disc 7 from rotating during the grinding process, the position of the die carrier 5 will change. The rotation direction of the grinding disc 7 is opposite to that of the die carrier 5 during design, and it is necessary to place the die carrier 5 in the opposite direction. 5. An anti-reverse structure is designed to prevent the position change of the die carrier in the reverse direction. In addition, the anti-reverse design of this embodiment can also control the grinding disc stepper motor 9 via a micro switch. The specific action process is: when the die carrier 5 rotates, the anti-reverse block 15 is pushed out of the anti-reverse notch 14, and is squeezed to the action reed of the micro switch 6 arranged on the side, and the micro switch 6 is connected to the loop to make the grinding disc The controller of the stepper motor 9 obtains the signal. During the rotation, the anti-reverse block 15 slides along the periphery of the die carrier until it slides to the next anti-reverse notch, and is pulled into the next anti-reverse notch under the action of the spring, at which time the carrier stepper motor 25 stops Rotate, the anti-reverse block 15 just stays in the anti-reverse gap, when the grinding disc 7 rotates counterclockwise, the position of the die carrier 5 will not change in the counterclockwise direction due to the existence of the anti-reverse stop.

Under the control of the millstone stepper motor 9 controllers, the millstone stepper motor 9 rotates, and the rotation of the millstone stepper motor 9 drives the leading screw 10 to rotate, and the rotation of the leading screw 10 makes the main shaft support 11 move downward. On the premise that the shaft bracket 11 is fixedly connected to the spindle sleeve 12 of the drilling machine spindle, the downward movement of the spindle bracket 11 will drive the rotating spindle 8 to move downward, and accordingly drive the grinding disc 7 to move downward until reaching the preset descending stroke At this time, the grinding disc cutter body 21 is attached to the diode chip 22, and the grinding disc 7 in the rotating state plays the role of grinding and removing the oxide layer on the diode chip 22.

After grinding, the controller of the millstone stepper motor 9 controls the millstone stepper motor 9 to reverse, and the millstone 7 moves upward until reaching the preset rising stroke, and the millstone stepper motor 9 stops, waiting for the next trigger signal; at the same time, The carrier stepping motor 25 controls the rotation of the die carrier 5, and moves the next station to the directly below the grinding disc cutter body 21, and the finished product after grinding is synchronously rotated to the position of the feeding hole 17, and the finished product is passed through the feeding hole. 17 falls and slides to the finished product collection box 27 through the blanking chute 18, and so on.

This embodiment realizes the automatic grinding and processing of diode chips with ingenious structural design, greatly reduces the labor intensity of workers, the workshop environment is significantly improved, workers do not need to directly contact large areas of waste, workers' physical and mental health is effectively guaranteed, and social benefits obvious;

This embodiment is especially suitable for batch operations, and the production efficiency is increased by 60%-70%, creating considerable economic benefits for the enterprise;

In this embodiment, the grinding effect is good, the welding quality of the diode chip is effectively guaranteed, the grinding degree is consistent, and the performance of the rectifier module is stable;

This embodiment carries out independent innovation on the basis of the existing drilling machine, which is very practical and has very important significance in the field of rectification modules and other electronic devices that need to use diode chips.

In summary, it is only a preferred embodiment of the present invention, and is not used to limit the scope of the present invention. All equivalent changes and modifications made in accordance with the shape, structure, characteristics and spirit of the scope of the claims of the present invention shall include within the scope of the claims of the present invention.

Claims (10)

1. An equipment for automatically polishing the oxide layer on the surface of a diode chip, comprising a drilling machine, characterized in that: the equipment also includes a die carrier rotating mechanism and a grinding disc moving mechanism; The die carrier rotating mechanism includes a support platform arranged on the drill machine base, a die carrier provided with a plurality of die stations, the die carrier is supported on the support platform, and Under the action of a stepping motor, it can perform intermittent rotational movement relative to the support platform; one side of the die carrier is provided with a micro switch, and the micro switch is activated when the die carrier rotates The millstone movement mechanism; The moving mechanism of the grinding disc includes a grinding disc and a stepping motor of the grinding disc; The micro switch is electrically connected, and the rotating shaft of the stepper motor of the grinding disc moves the main shaft support in the axial direction of the main shaft of the drilling machine through the screw, and the main shaft support is fixedly connected with the main shaft sleeve of the main shaft of the drilling machine. 2. The device for automatically polishing the oxide layer on the surface of the diode chip according to claim 1, wherein the main motor of the drilling machine is connected to the main shaft of the drilling machine through a frequency converter. 3. The device for automatically polishing the oxide layer on the surface of a diode chip according to claim 1 or 2, characterized in that: the die carrier is disc-shaped, and its circumference is provided with a plurality of hollow holes as the die station , the periphery of the die carrier is provided with the same number of anti-reversal notches as the die station, and the anti-reverse notch and the die station maintain the same pitch angle; the die carrier One side of the tool is provided with a resettable anti-reverse stopper, the anti-reverse stopper is movably connected on the support platform, and leans against the anti-reverse notch, and the anti-reverse stopper is on the tube The action reed of the micro switch can be triggered when the core carrier rotates. 4. The device for automatically polishing the oxide layer on the surface of the diode chip according to claim 3, characterized in that: the anti-reverse stopper is reset by a tension spring. 5. The equipment for automatically polishing the oxide layer on the surface of diode chips according to claim 3, characterized in that: the support table is provided with a hole for the finished product, and a hole for leading the finished product is provided under the hole. unloading chute. 6. The device for automatically polishing the oxide layer on the surface of a diode chip according to claim 1 or 2, wherein the grinding disc includes a grinding disc connector, a grinding disc body and a grinding disc cutter body fixed at the bottom of the grinding disc body , The surface of the grinding disc cutter body is an uneven surface with staggered tooth shapes. 7. The device for automatically grinding the oxide layer on the surface of the diode chip according to claim 6, characterized in that: the grinding disc cutter body is circular or regular polygonal, and the surface layer is provided with a plurality of alternately distributed chip removal grooves. 8. The equipment for automatically polishing the oxide layer on the surface of the diode chip according to claim 1 or 2, characterized in that: the support table is also provided with a chip removal device for cleaning waste chips. 9. The device for automatically polishing the oxide layer on the surface of a diode chip according to claim 8, wherein the chip removal device comprises an annular brush body arranged below the grinding disc, and the annular brush body is fixed on the On the above-mentioned support platform, the support platform located at its inner ring position has a waste discharge port. 10. a method utilizing the equipment for polishing the oxide layer of the diode chip surface layer automatically according to any one of claims 1 to 9, characterized in that, comprising the following steps: a. Use the frequency converter to pre-set the rotational speed of the rotating spindle of the drilling machine; b. Use the controller of the stepping motor of the grinding disc to pre-set the descending stroke of the rotating spindle, the holding time of the falling point and the rising stroke; c. Use the controller of the carrier stepping motor to pre-set the rotation range and rotation gap time of the die carrier; d. Start the drilling machine, and the grinding disc fixed on the rotating spindle will rotate at the set speed; e. On the die carrier, load the die station that needs to be loaded; f. Start the stepping motor of the carrier, and the stepping motor of the carrier drives the die carrier to make intermittent rotational movement relative to the support table, and rotate the diode chip to the right below the grinding disc cutter body, and move slightly while the die carrier rotates The switch is triggered, and the controller of the disc stepper motor is powered on to start the program; g. Under the control of the millstone stepper motor controller, the millstone stepper motor rotates, its rotating shaft drives the screw to rotate, the rotation of the screw drives the spindle bracket to move downward, and the spindle bracket is fixed to the spindle sleeve of the drilling machine spindle. As a result, the main shaft sleeve is driven to move downward, and the downward movement of the main shaft sleeve drives the rotating main shaft to move downward, thereby driving the grinding disc to move downward until reaching the preset descending stroke; at this time, the grinding disc cutter body is attached to the diode chip, The grinding disc that has been in the rotating state plays a role in grinding and removing the oxide layer on the diode chip; h. When the preset holding time of the falling point is reached, the stepping motor controller of the grinding disc controls the stepping motor of the grinding disc to reverse, and the stepping motor of the grinding disc moves upward until reaching the preset rising stroke, and the stepping motor of the grinding disc stops, waiting for the next trigger signal ;At the same time, the stepper motor of the carrier controls the rotation of the die carrier, and moves the next station to the directly below the grinding disc cutter body, and the finished product is synchronously rotated to the unloading position to be removed, and so on and on; i. If the work is completed, disconnect the stepping motor of the carrier, the stepping motor of the grinding disc, and the power supply of the drilling machine.