CN1100326C - 新型带状软电缆 - Google Patents

新型带状软电缆 Download PDF

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CN1100326C
CN1100326C CN97125754.XA CN97125754A CN1100326C CN 1100326 C CN1100326 C CN 1100326C CN 97125754 A CN97125754 A CN 97125754A CN 1100326 C CN1100326 C CN 1100326C
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flexible cable
film
lead
pair
banded flexible
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CN1188967A (zh
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前多治
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Funai Electric Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/08Flat or ribbon cables
    • H01B7/0838Parallel wires, sandwiched between two insulating layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/363Assembling flexible printed circuits with other printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709Staggered pads, lands or terminals; Parallel conductors in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099Coating over pads, e.g. solder resist partly over pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Abstract

一种带状软电缆,其由导线排制成,其包含多根并排平行设置的纵向伸展和横向间隔的软导线。第一对耐热电绝缘膜,其位于导线排第一预选纵向部分上和下面。所述第一对膜可将导线排的预选纵向部分夹于其间地粘接在一起。第二对耐热电绝缘膜,其位于与预选纵向部分邻接的导线排第二纵向部分的上和下面。所述第二对膜将导线排的第二纵向部分夹于其间地粘接在一起。所述对膜与其间形成的接头粘接在一起。至少第一对膜中的一个限定有多个接收开口,用于导线排的各导线。

Description

新型带状软电缆
技术领域
本发明涉及一种新型带状软电缆。
背景技术
带状软电缆是众所周知的,如可用作由旋转变压器定子到位于印刷电路板上的前置放大器的引出线。该电缆可由其上淀积有导电膜的伸长电绝缘基膜制成。通过公知的光刻技术,可将导电膜进行蚀刻以制成导电图形,其由一排纵向延伸、横向间隔的导电带组成的。换句话说,可通过印刷技术制成该排列。软电绝缘覆膜可粘接固定到导电图形上。众所周知,带状软电缆还可由许多纵向延伸横向间隔的金属导体组成,该金属导体具有在其上部和下部上的软电绝缘覆膜,其通过加热和加压来粘接固定,以便有效地封装金属导体。
后者所述的带状软电缆将会比蚀刻或印刷带状软电缆更便宜地制成,但在有必要焊接到导线上的情况下,由于覆膜是低温材料并且焊接工艺会引起相邻导线的短路,所以其仍具有不实用的缺点。因此,该后一种类型的带状软电缆不适用于需要进行焊接的场合。
发明内容
因此,本发明的目的就是提供一种便宜的带状软电缆,其以新型方式设计,使得能够使用焊接技术将电缆导线正确地连接到的各引线或导线上。
本发明是通过提供一种带状软电缆来实现上述目的的,其中带状软电缆包括导线排,其具有许多纵向延伸的并排平行并横向间隔形式排列的软导线,第一对耐热电绝缘膜,其位于导线排第一预选纵向部分的上和下部,所述第一对膜与导线排的预选纵向部分粘接在一起并使其粘接在其间,第二对电绝缘软膜,其位于导线排的第二纵向部分上和下部,其邻接于预选纵向部分,所述第二对膜与导线排的第二纵向部分粘接在一起并使其粘接在其间,和至少一个第一对的膜,其限定了多个向导线排的导体敞开的槽。
特别是,新型带状软电缆结构包括导线排,其是由许多伸长的金属导体组成的,如以并排平行方式横向间隔形式设置的铜线,其封装在一对柔软电绝缘膜之间,如低成本、低温、阻燃聚酯,其不到间隔导线的一端。层状结构是通过将膜与其间的导线加热并压在一起而制成。一对特定高温耐热绝缘膜即聚酰亚胺可使用公知的阻燃粘接剂来固定封装所述导线的一端。耐热膜形成与聚酯电绝缘膜的搭接或接合,以保证完全覆盖导线。耐热聚酰亚胺膜中的至少一个限定了多个设置好的开槽,其用以接收并露出金属导线,其开槽与纵向偏移或偏差的相邻导线设置在一起。导线可以露出,或开槽可以接收用于导线的公知焊剂覆层或导线的公知初始SuPb焊料,其为特别焊接存在于导线上,以缩短连接到印刷电路板上的时间。
电绝缘膜可以是适用的便宜的聚酯材料,其具有低熔化温度,而耐热绝缘膜具有相对高的熔化点,其不受常规焊接温度的影响。聚酰亚胺特别适用于耐热绝缘膜,并且其会比电绝缘聚酯膜更有刚性的附加优点。本发明的基本优点就在于,使用了有限量的聚酰亚胺(高价格材料),并主要使用了低价格的聚酯。
通过参照附图对本发明优选实施例的详细描述将使本发明的其它和进一步的目的和优点更加清楚。
附图的简要说明
图1是本发明一优选实施例的顶视平面图;
图2是图1实施例的侧视图;
图3是图1实施例一端的放大顶视平面图;
图4是图1实施例另一端的放大底视平面图;
图5是沿图3的线A-A所截的截面图;
图6是沿图3的线B-B所截的截面图;
图7是沿图3的线C-C所截的截面图;
图8是图3所示一端的端视图,其表示对接;
图9是图4所示另一端的颠倒侧视图;
图10是第二实施例的顶视平面图;
图11是图10所示实施例的侧视图;
图12是第三实施例的顶视平面图;
图13是图12所示实施例的侧视图;
图14是类似图9的视图,其表示一种改型。
具体实施方式
参见附图,图1-7和9表示本发明的一个优选实施例。新型带状软电缆是由一排多条伸长的软金属导线20组成的,其共面地相互平行且横向分开间隙22地设置。导线20的上部由伸长的柔软低熔聚酯膜24所覆盖,其在图的右部上由端部26伸出,其在图的左侧上,终止在点28处,并与端部30间隔。第二伸长柔软低熔聚酯膜32覆盖在导线20的底部上,并且由点28向端部26延伸,而终止在与端部26间隔的部分34处。膜24和32是由公知低成本、低温、阻燃聚酯材料制成的。导线20的部分36由朝下的膜32而露出,并且可用作接触排以便插入到公知的连接器中,如在PC板上所见到的。一段刚性聚酯膜38由端部26伸出,在膜24上部,并终止在点40处。所有所述膜以及导线可通过公知的所述加热和加压的方式连接在一起。参考标号42可用于表示填充间隙22的材料。槽44是在点34和40之间的电缆侧上切入的。金属导线20是由铜带组成的,其可用适用的SuPb焊料覆盖其整个长度。
使用公知阻燃粘接剂应用于电缆端部30上的是上部和下部的耐热聚酯薄膜52和46,其由端部30向点48延伸,使得薄膜52和46分别搭接在膜24和32上,以形成搭接(无任何间隙或导线20的暴露)。膜52和46可通过粘接剂粘接到导线20和膜24和32上。膜52上带有许多通孔或开孔50,其每个与导线20之一对齐或对准,导线20具有的相邻的孔50为纵向错开或偏移的,使得两个相邻的孔50不会横向搭接或对齐。
在图1-7和9的实施例中,膜和导线20为0.1mm厚,导线20为椭圆形1mm宽,间隙22为0.25mm宽。孔50为1mm宽×2mm长。在端部26处的导线20露出部分即点34为约4mm。点28距端部30约为9mm。点40距端部26约为10mm。电缆的总长度约为65mm,而这要取决于连接点之间的距离。如图所示,接收孔50只存在在端部30上,并存在在一侧上。如果需要,也可在底膜46上提供孔50。还有,完成端部26的处理,将其插入公知的连接器中,并通过在槽44中啮合的弹簧夹将其保持在其中。端部26和30可以类似于端部30或类似于端部26相同地完成。
接收孔50与露出的导线20部分留有空,还可以通过为露出的导线20提供公知的焊剂层,或如图所示在焊剂层上用最初公知的SuPb焊剂54填充孔50,而完成孔50,其中焊剂54将适用于并缩短进行连续焊接连接的时间。放入孔50中的焊剂的量足以进行与PCB的连接。还有,电缆中导线20的数量可由约三根至约三十根进行变化。如果使用四根导线的话,电缆约为6.25mm宽。
如图8所示,聚酰亚胺膜52和46与聚酯膜24和32之间的连接可以分别为对接连接60,而不是图1-7和9中所示的搭接连接。重点在于,在连接下的金属导线20必须完全被覆盖而不会在将会露出金属导线20的连接60处具有任何空隙。
参见图14,端部26可以进行改型,以便去除膜24的部分,并使膜38直接位于导线20的下面。在膜38与膜24之间形成搭接。
现参见图10和11,其中示出了一个实施例,其中在端部30上,在膜52上形成圆孔54,其以立体图形排列,两个相邻或连续的孔不会横向对齐。在某种情况下,两个孔会出现于所选择的导线处,但两个孔纵向上间隔与孔的直径加必要的误差相等的距离,用以避免横向对齐或搭接。在所示的孔排中,提供四列孔C1-C4,以便在横向和纵向上获得所需的距离。象先前所述实施例那样完成端部26,只是露出导线面向端部30上的焊剂填充孔。
在图12和13所示实施例中,聚酰亚胺膜70和72可插入到电缆的中间的其端部上。电缆的左端74如图12和1 3所示象图1实施例中的端部26一样来完成,其带有面向下的露出导线20。导线20通过膜70和72并一直到端部76。附加聚酯膜78或80可覆盖在膜70和72与端部76之间。在该实施例中,膜70和72形成与膜24和32的搭接84,并且与膜78和80形成另外的搭接86。填充有焊剂54的孔50形成在面朝下的膜70上,并且如上所述地纵向交错排列或错开排列。还有,对于一些导线20,孔50可成对地纵向略有间隙地设置,以备一定误差。
虽然参照特定优选实施例对本发明进行了示出和描述,但对其的各种变形和改型通过其指导对于本技术领域的普通专业人员来说将是明显的。明显的其各种变形和改型均会被认为落入了后续权利要求所限定的本发明的精神、范围中。

Claims (19)

1、一种带状软电缆,其包括:
导线排,其包含
多根并排平行设置的纵向伸展和横向间隔的软导线;
第一对耐热电绝缘膜,其位于导线排第一预选纵向部分上和下面,所述第一对膜将导线排的预选纵向部分夹于其间地粘接在一起;
第二对柔软电绝缘膜,其位于与预选纵向部分邻接的导线排第二纵向部分的上和下面,所述第二对膜将导线排的第二纵向部分夹于其间地粘接在一起;
所述对膜与其间形成的接头配合在一起;和
至少第一对膜中的一个限定有多个接收开口,用于导线排的各导线。
2、按照权利要求1的带状软电缆,其中至少一个接收开口含有焊剂,其提供给通过所述的该接收开口所接收的各导线上。
3、按照权利要求1的带状软电缆,其中至少一接收开口含有焊剂,该焊剂施加在通过所述开口的各导线上。
4、按照权利要求1的带状软电缆,其中预选纵向部分为导线排的端部。
5、按照权利要求1的带状软电缆,其中预选纵向部分为导线排的中部。
6、按照权利要求1的带状软电缆,其中第一对膜是由聚酰亚胺组成的。
7、按照权利要求1的带状软电缆,其中第二对膜是由聚酯组成的。
8、按照权利要求1的带状软电缆,其中接头为第一对膜与第二对膜搭接的搭接接头。
9、按照权利要求1的带状软电缆,其中接头为对接的。
10、按照权利要求1的带状软电缆,其中多个接收开口是如此设置的,使得横向相邻的开口为纵向偏移的。
11、按照权利要求1的带状软电缆,其中多个接收开口为纵向交错排列的。
12、按照权利要求1的带状软电缆,其中至少两个接收开口为相同导线提供入口。
13、按照权利要求1的带状软电缆,其中接收开口为椭圆形的,其具有沿纵向延伸的主轴。
14、按照权利要求1的带状软电缆,其中第二对膜为耐热的。
15、按照权利要求1的带状软电缆,其中第二对膜延伸到导线排的一端上,其膜中的一个与所述该端间隔地终止,以使导线露出,并且进一步包括粘接于电缆另一侧上的刚性塑料膜,其使所述该端具有刚性。
16、按照权利要求15的带状软电缆,其中在所述一端的附近的电缆边缘上提供一凹槽。
17、按照权利要求15的带状软电缆,其中露出的导线相对地面向接收开口。
18、按照权利要求15的带状软电缆,其中露出的导线与接收开口的朝向相同。
19、按照权利要求1的带状软电缆,其中第一对的两膜带有接收开口
CN97125754.XA 1996-12-02 1997-12-02 新型带状软电缆 Expired - Fee Related CN1100326C (zh)

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US6020559A (en) 2000-02-01
HK1011577A1 (en) 1999-07-16
CN1188967A (zh) 1998-07-29

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