CN109990632A - A kind of micropore radiator - Google Patents

A kind of micropore radiator Download PDF

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Publication number
CN109990632A
CN109990632A CN201910067817.3A CN201910067817A CN109990632A CN 109990632 A CN109990632 A CN 109990632A CN 201910067817 A CN201910067817 A CN 201910067817A CN 109990632 A CN109990632 A CN 109990632A
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China
Prior art keywords
steel plate
layer
micropore
layer steel
plate
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CN201910067817.3A
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Chinese (zh)
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CN109990632B (en
Inventor
马铁华
刘国东
郭文超
陈昌鑫
武耀艳
裴东兴
靳鸿
沈大伟
孙传猛
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North University of China
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North University of China
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06Control arrangements therefor

Abstract

The present invention relates to a kind of radiators, and capillarity and water evaporation endothermic character is specifically combined to realize the micropore radiator of heat dissipation.Including the inner layer steel plate being coated on the heat-producing device for needing to radiate, it is opened in several memorial alloy deformed areas that can store water on inner layer steel plate lateral surface, outer layer plate positioned at inner layer steel plate lateral surface side, circumferential gasket is sealed between the inner layer steel plate and outer layer plate of all memorial alloy deformed areas, it is at least provided with the water inlet being connected with one of memorial alloy deformed area on the inner layer steel plate, the waterway channel in connection adjacent memory alloy deformation area is provided on the inner layer steel plate between adjacent memory alloy deformation area.Present invention utilizes the deformations that two-way memory alloy varies with temperature, and the circulation of water is neatly controlled according to temperature;Physics principle and capillary phenomenon is utilized, structure is simple, and it is traditional by water circulation cooling to replace with water evaporation heat absorption, so that heat dissipation is more efficient.

Description

A kind of micropore radiator
Technical field
The present invention relates to a kind of radiators, and capillarity and water evaporation endothermic character is specifically combined to realize the micro- of heat dissipation Hole radiator.
Background technique
The engine of fuel combustion vehicle, the motor of electric vehicle are the important motivity devices of current vehicle, in fuel oil or The chemical energy of battery is converted into during mechanical energy, and portion of energy is converted into heat, and engine or motor overheating can shadows Self performance is rung, and heat radiation influences peripheral parts.
Conventional radiator is made of three parts such as coolant liquid intake chamber, coolant liquid liquid outtake chamber and radiator cores, coolant liquid Flowed in radiator core, air passes through outside radiator, hot coolant liquid due to air radiate and turn cold, cold air then because It heats up to absorb the heat that coolant liquid sheds, realizes heat dissipation by the heat exchange of coolant liquid and air.
Water is the most common substance, and the specific heat at constant pressure that normal pressure is lauched is 4.2kJ/ (KG. DEG C).Water is inhaled in evaporation process Heat, it will absorb heat from the object of surrounding.Then, it is reasonably absorbed heat using water evaporation, the effect of high efficiency and heat radiation can be played.
Summary of the invention
For the present invention in order to solve the heat source high-efficiencies heat dissipation problem such as engine or motor, the present invention proposes a kind of micropore heat dissipation The water of device, the physics principles consumption relatively small amount such as comprehensive utilization water evaporation heat absorption, capillarity, memorial alloy deformation carries out High efficiency and heat radiation.
The present invention is achieved by the following technical solutions: a kind of micropore radiator, needs to radiate including being coated on Inner layer steel plate on heat-producing device is opened in several memorial alloy deformed areas that can store water on inner layer steel plate lateral surface, Outer layer plate positioned at inner layer steel plate lateral surface side,
Circumferential gasket, the internal layer steel are sealed between the inner layer steel plate and outer layer plate of all memorial alloy deformed areas It is at least provided with the water inlet being connected with one of memorial alloy deformed area on plate, is located at adjacent memory alloy deformation area Between inner layer steel plate on be provided with the waterway channel in connection adjacent memory alloy deformation area, it is opposite with memorial alloy deformed area outer It is provided with the diameter of connection memorial alloy deformed area and external environment on layer steel plate in the micropore of 0.1mm, is each located at micropore Outer layer plate medial surface is equipped with fixed pivot, and fixed pivot is equipped with two-way memory alloy connecting rod, each round trip memory Alloy connection boom end is respectively and fixedly provided with the shielding plate that can cover corresponding micropore, is equipped with infiltrating material on outer layer plate lateral surface Layer, the temperature of water enable to shielding plate to leave micropore after being higher than the phase transition temperature of two-way memory alloy connecting rod.
As the further improvement of technical solution of the present invention, all memorial alloy deformed areas are arranged on inner layer steel plate in matrix Column.
As the further improvement of technical solution of the present invention, connect between circumferential gasket inner wall integrally formed at least one Gasket is connect, connection gasket is fixedly connected with inner layer steel plate and outer layer plate.
As the further improvement of technical solution of the present invention, all connection gaskets are located at the memorial alloy of adjacent column Between deformed area.
As the further improvement of technical solution of the present invention, the hemispherical shape in memorial alloy deformed area.
It is that the present invention designs the utility model has the advantages that the deformation that two-way memory alloy varies with temperature is utilized, it is flexible according to temperature Ground controls the circulation of water;Physics principle (water evaporation heat absorption) and capillary phenomenon is utilized, structure is simple, absorbs heat with water evaporation It is traditional by water circulation cooling to replace, so that heat dissipation is more efficient.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with It obtains other drawings based on these drawings.
Fig. 1 is the partial sectional view of micropore radiator.
Fig. 2 is the top view of micropore radiator.
Fig. 3 is the partial enlarged view of Fig. 2.
Fig. 4 is the semi-cutaway of Fig. 2.
Fig. 5 is circumferential gasket and the connection schematic diagram that connect gasket.
Fig. 6 is the working condition of the shielding plate that is driven by two-way memory alloy connecting rod when the temperature rises.
In figure: 1- outer layer plate, 2- memorial alloy deformed area, 3- waterway channel, 4- water inlet, 5- inner layer steel plate, 6- connect Connect gasket, 7- shielding plate, 8- two-way memory alloy connecting rod, 9- micropore, 10- circumferential direction gasket, 11- fixed pivot.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, technical solution of the present invention will be carried out below Detailed description.Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Base Embodiment in the present invention, those of ordinary skill in the art are obtained all without making creative work Other embodiment belongs to the range that the present invention is protected.
Technical solution of the present invention is described in detail with reference to the accompanying drawing.
A kind of micropore radiator is opened in internal layer including the inner layer steel plate 5 being coated on the heat-producing device for needing to radiate Several memorial alloy deformed areas 2 that can store water on 5 lateral surface of steel plate, the outer layer positioned at 5 lateral surface side of inner layer steel plate Steel plate 1,
Circumferential gasket 10 is sealed between the inner layer steel plate 5 and outer layer plate 1 of all memorial alloy deformed areas 2, it is described It is at least provided with the water inlet 4 being connected with one of memorial alloy deformed area 2 on inner layer steel plate 5, is located at adjacent memory The waterway channel 3 in connection adjacent memory alloy deformation area 2 is provided on inner layer steel plate 5 between alloy deformation area 2, with memorial alloy The micropore for being connected to the diameter of memorial alloy deformed area 2 and external environment in 0.1mm is provided on the opposite outer layer plate 1 in deformed area 2 9, each 1 medial surface of outer layer plate at micropore 9 is equipped with fixed pivot 11, and fixed pivot 11 is remembered equipped with round trip Alloy connecting rod 8, each 8 end of two-way memory alloy connecting rod are respectively and fixedly provided with the shielding plate 7 that can cover corresponding micropore 9, outside Infiltrating material layer is equipped on layer 1 lateral surface of steel plate, the temperature of water is higher than energy after the phase transition temperature of two-way memory alloy connecting rod 8 Enough so that shielding plate 7 leaves micropore 9.
In the micropore 9 that diameter is 0.1mm, the coolant liquid of distilled water etc cannot flow out naturally, can pass through additional Jie Matter (infiltrating material) mode is through capillary action sucked out water.Influence in order to avoid fixed pivot 11 to waterway channel 3, preferably The height (with direction shown in Fig. 4) of fixed pivot 11 be less than spacing between inner layer steel plate 5 and outer layer plate 1, length and Width is less than the road width of waterway channel 3.In the present invention, the infiltrating material layer is the infiltration made of infiltrating material Water is referred to when contacting with solid material, the phenomenon that extending and be attached to each other along solid material.When it is implemented, the infiltration Cotton can be used in material, and cotton has good water imbibition, water can be sucked out by micropore 9.Cotton is as radiator Consumptive material is replaced in time-based maintenance.Specifically, gasket (including circumferential gasket 10 and connection gasket 6) and internal layer steel It can be fixed together, or can connected in such a way that bonding, screw are connected by sulfuration process between plate 5 and outer layer plate 1 Together.It is made when it is implemented, rubber material can be used in gasket, ensure that good leakproofness.
There is research to think that the evaporation of the only thin liquid film when caliber is smaller is just more obvious, evaporation interface is formed by Thickness of liquid film increases with caliber and is increased.Caliber is smaller, and whole evaporation rate is faster.And pore aperture, when being more than 1mm, water can To flow out naturally from pore, when pore aperture is less than 0.1mm, need to flow out from pore by pressure (hydraulic) water. Therefore selecting diameter for the micropore of 0.1mm, not only evaporation effect is obvious in this aperture, but also can make water flow by additional medium Out.
When specifically used, when the temperature of inner layer steel plate 5 increases and (is higher than phase transition temperature), two-way memory alloy connecting rod 8 (such as Ni-Ti alloy) deforms, and shielding plate 7 is retracted (as shown in Figure 6), exposes the micropore 9 that diameter is 0.1mm, at this time The infiltrating materials such as cotton can through capillary action be sucked out water, and the micropore 9 that diameter is 0.1mm exposes, the infiltrating materials such as cotton The water being sucked out through capillary action increases, and heat source component heat dissipation is played the role of in a large amount of water evaporation heat absorption.When temperature reduces When (being less than or equal to phase transition temperature), two-way memory alloy connecting rod 8 deforms into original state, and blocking diameter is the micro- of 0.1mm Hole 9 prevents the circulation of water, saves water resource.It is good using heating conduction in order to preferably conduct heat to inner layer steel plate 5 Carbon nanotube (carbon nanotube with high-modulus and high-intensitive and there is good heat transfer property) interior need to dissipate to connect The heat-producing device of heat.Outer layer plate 1 of the present invention is densely covered with the micropore 9 that diameter is 0.1mm, traditional to replace with water evaporation heat absorption Water circulation cooling.Water of the present invention refers to avoiding blocking micropore by the pure water of filtering, impurity screening.
Every kind has a phase transition temperature by the marmem that certain weight ratio forms with certain element.In this temperature Du or more the alloy is processed into certain shape, after being then cooled to phase transition temperature hereinafter, manually changing its shape It is heated to phase transition temperature or more, which will be automatically reverted to the shape being originally processed into more than phase transition temperature.Hundred Degree library data shows: for Nitinol, the result of various countries expert research is possible, and there are also some discrepancy, but substantially have this One rule of sample, is exactly the content increase of nickel in alloy, and the deformation temperature starting point and terminal of alloy all decline;On the contrary, if The content of titanium increases in alloy, and the starting point and terminal of alloy deformation temperature all rise.Than if any expert research the result is that It is such: in Nitinol, when nickeliferous equal with the atomic concentration of titaniferous, that is to say, that nickel content accounts about 55% in alloy When, start to generate martensite at 40 DEG C.It is exactly since 40 DEG C, alloy gradually softens, easy to process.If in alloy Nickel content be reduced to 54%, the martensite of alloy starts the temperature generated, just rises to 70 DEG C quickly.In turn, if handle Nickel content in alloy increases by 1%, reaches 56%, then, the martensite of alloy starts to generate temperature, will drop to 0 DEG C suddenly. When nickel content, which is further added by 1%, reaches 57%, the temperature that martensite starts to generate also will continue to decline, and reach -10 DEG C.
For example, Beijing Non-Ferrous Metal Research General Academy's nonferrous materials preparation processing National Key Laboratory Li Yanfeng et al. In " influence of the Ni content to the phase transformation of NiTi marmem and mechanical property " article that " China YouSe Acta Metallurgica Sinica " is delivered In mention " with the increase of Ni molar fraction, NiTi alloy transformation temperature is reduced, for example, Ni50Ti50, Ni50.2Ti49.8 and The Ms temperature of the NiTi alloy of difference Ni molar fraction is respectively 56 DEG C, 7 DEG C and -13 DEG C in Ni50.4Ti49.63, this with it is usual Think that Ni molar fraction increases by 0.1% the viewpoint for causing alloy transformation temperature to increase 10-15 DEG C is almost the same ".Beijing is coloured Metal study total institute Liu Meirong et al. in " Rare Metals Materials and engineering " " nickel content and copper content are to TiNiCu alloy phase The influence of change behavior " it mentions " the result shows that the martensitic transformation temperature of TiNi marmem is with alloy in a literary introduction Ingredient, specification of heat treatment, processing method etc. are different and change, and wherein influence of the ingredient of alloy to phase transition temperature is maximum. Ni content changes 0.1at%, and phase transition temperature will change 10 DEG C or so ".
The two-way memory alloy deformation temperature of specific radiator can adjust the nickel in alloy according to actual needs Content ratio, to realize reasonable temperature radiating control.
When it is implemented, all memorial alloy deformed areas 2 are arranged in arrays on inner layer steel plate 5.
Preferably, as shown in figure 5, integrally formed at least one connection gasket 6 between 10 inner wall of circumferential gasket, even Gasket 6 is connect to be fixedly connected with inner layer steel plate 5 and outer layer plate 1.Connection gasket 6 can be improved inner layer steel plate 5 and outer layer steel Stable connection between plate 1.
Specifically, as shown in figure 4, all connection gaskets 6 are located between the memorial alloy deformed area 2 of adjacent column.
Preferably, the hemispherical shape in the memorial alloy deformed area 2.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.

Claims (5)

1. a kind of micropore radiator, which is characterized in that including the inner layer steel plate being coated on the heat-producing device for needing to radiate (5), several memorial alloy deformed areas (2) that can store water on inner layer steel plate (5) lateral surface are opened in, inner layer steel plate is located at (5) outer layer plate (1) of lateral surface side,
Circumferential gasket is sealed between the inner layer steel plate (5) and outer layer plate (1) of all memorial alloy deformed areas (2) (10), the water inlet being connected with one of memorial alloy deformed area (2) is at least provided on the inner layer steel plate (5) (4), connection adjacent memory alloy deformation area (2) is provided on the inner layer steel plate (5) between adjacent memory alloy deformation area (2) Waterway channel (3), be provided on the outer layer plate (1) opposite with memorial alloy deformed area (2) and be connected to memorial alloy deformed area (2) Diameter with external environment is in the micropore (9) of 0.1mm, is each located at being equipped with for outer layer plate (1) medial surface at micropore (9) Fixed pivot (11), fixed pivot (11) are equipped with two-way memory alloy connecting rod (8), each two-way memory alloy connecting rod (8) end is respectively and fixedly provided with the shielding plate (7) that can cover corresponding micropore (9), is equipped with infiltration material on outer layer plate (1) lateral surface The bed of material, the temperature of water enable to shielding plate (7) to leave micropore after being higher than the phase transition temperature of two-way memory alloy connecting rod (8) (9).
2. a kind of micropore radiator according to claim 1, which is characterized in that all memorial alloy deformed areas (2) exist It is arranged in arrays on inner layer steel plate (5).
3. a kind of micropore radiator according to claim 2, which is characterized in that one between circumferential gasket (10) inner wall It is body formed to have at least one connection gasket (6), connection gasket (6) and inner layer steel plate (5) and the fixed company of outer layer plate (1) It connects.
4. a kind of micropore radiator according to claim 3, which is characterized in that all connection gaskets (6) difference position Between the memorial alloy deformed area (2) of adjacent column.
5. a kind of micropore radiator according to claim 1 or 2 or 3 or 4, which is characterized in that the memorial alloy becomes Shape area (2) hemispherical shape.
CN201910067817.3A 2019-01-24 2019-01-24 Micropore heat dissipation device Active CN109990632B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112506248A (en) * 2020-11-20 2021-03-16 华中科技大学 Memory alloy component capable of deforming and recovering and device using same

Citations (7)

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Publication number Priority date Publication date Assignee Title
JPH02304997A (en) * 1989-05-19 1990-12-18 Nec Corp Heat radiator
JPH0846095A (en) * 1994-08-02 1996-02-16 Hitachi Ltd Cooling device with cooling-power variable mechanism
US20120112349A1 (en) * 2010-11-04 2012-05-10 Hynix Semiconductor Inc. Semiconductor device
CN103826422A (en) * 2014-02-13 2014-05-28 中国科学院工程热物理研究所 Microchannel cooling device
CN105283029A (en) * 2014-07-02 2016-01-27 安徽旭特电子科技有限公司 Electronic element heat absorbing and radiating device
CN205718605U (en) * 2016-05-11 2016-11-23 浙江神太太阳能股份有限公司 Automatic temperature-sensed blocking type prevents overheated heat pipe
CN205843451U (en) * 2016-04-06 2016-12-28 中国科学院工程热物理研究所 A kind of antigravity heat pipe

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02304997A (en) * 1989-05-19 1990-12-18 Nec Corp Heat radiator
JPH0846095A (en) * 1994-08-02 1996-02-16 Hitachi Ltd Cooling device with cooling-power variable mechanism
US20120112349A1 (en) * 2010-11-04 2012-05-10 Hynix Semiconductor Inc. Semiconductor device
CN103826422A (en) * 2014-02-13 2014-05-28 中国科学院工程热物理研究所 Microchannel cooling device
CN105283029A (en) * 2014-07-02 2016-01-27 安徽旭特电子科技有限公司 Electronic element heat absorbing and radiating device
CN205843451U (en) * 2016-04-06 2016-12-28 中国科学院工程热物理研究所 A kind of antigravity heat pipe
CN205718605U (en) * 2016-05-11 2016-11-23 浙江神太太阳能股份有限公司 Automatic temperature-sensed blocking type prevents overheated heat pipe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112506248A (en) * 2020-11-20 2021-03-16 华中科技大学 Memory alloy component capable of deforming and recovering and device using same
CN112506248B (en) * 2020-11-20 2021-08-03 华中科技大学 Memory alloy component capable of deforming and recovering and device using same

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