CN109954797A - A kind of electronic component processing mold - Google Patents

A kind of electronic component processing mold Download PDF

Info

Publication number
CN109954797A
CN109954797A CN201711401568.4A CN201711401568A CN109954797A CN 109954797 A CN109954797 A CN 109954797A CN 201711401568 A CN201711401568 A CN 201711401568A CN 109954797 A CN109954797 A CN 109954797A
Authority
CN
China
Prior art keywords
pedestal
electronic component
concave template
component processing
template
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711401568.4A
Other languages
Chinese (zh)
Inventor
刘福新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gweni (tianjin) Precision Electronic Co Ltd
Original Assignee
Gweni (tianjin) Precision Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gweni (tianjin) Precision Electronic Co Ltd filed Critical Gweni (tianjin) Precision Electronic Co Ltd
Priority to CN201711401568.4A priority Critical patent/CN109954797A/en
Publication of CN109954797A publication Critical patent/CN109954797A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00Tools as parts of machines covered by this subclass
    • B21D37/10Die sets; Pillar guides

Abstract

The invention discloses a kind of electronic component processing molds, including pedestal, the front left of the pedestal is equipped with switch, the upper rear of the pedestal is equipped with carrier base, the upper center of the carrier base is equipped with cylinder, the output end of the cylinder is equipped with cylinder rod through the top of carrier base, the bottom of the cylinder rod is equipped with convex template, the bottom of the convex template is equipped with punch-pin, the upper-end front of the pedestal is equipped with concave template, the upper end of the concave template is equipped with cavity plate, the cavity plate that the present invention is equipped with by concave template upper end, punch forming can be carried out simultaneously, production efficiency is fast, manufacturing cost is low, after sliding protrusion is slidably connected to the inside of groove, convenient for the sliding of concave template, pass through the setting of idler wheel, in concave template sliding, reduce frictional force.

Description

A kind of electronic component processing mold
Technical field
The present invention relates to technical field of mold, specially a kind of electronic component processing mold.
Background technique
Mould industry is produced to be molded, be blow molded, squeeze out, die casting or the methods of forging and forming, smelting, punching press obtain institute Need the various moulds and tool of product.In brief, mold is the tool for formed article, and this tool is by various part structures At different molds is made of different parts.Electronic component molding die on the market at present, same compact density requirement Under, it is that single cave or a small amount of cave vacancy mold are manufactured mostly, production efficiency is slow, and manufacturing cost is high, for this purpose, we release A kind of electronic component processing mold.
Summary of the invention
It is mentioned above in the background art to solve the purpose of the present invention is to provide a kind of electronic component processing mold Problem.
To achieve the above object, the invention provides the following technical scheme: a kind of electronic component processing mold, including bottom Seat, the front left of the pedestal are equipped with switch, and the upper rear of the pedestal is equipped with carrier base, in the upper end of the carrier base Portion is equipped with cylinder, and the output end of the cylinder is equipped with cylinder rod through the top of carrier base, and the bottom of the cylinder rod is equipped with convex Template, the bottom of the convex template are equipped with punch-pin, and the upper-end front of the pedestal is equipped with concave template, and the upper end of the concave template is set There is cavity plate.
Preferably, the upper center of the pedestal is equipped with groove.
Preferably, the inner back side of the groove is equipped with locating piece.
Preferably, the bottom of the concave template is equipped with sliding protrusion, and the sliding protrusion is slidably connected to the inside of groove.
Preferably, the two sides that the upper end of the pedestal is located at groove are equipped with idler wheel.
Preferably, the idler wheel is equidistant is symmetrical arranged.
It compared with prior art, can be same the beneficial effects of the present invention are: the cavity plate that the present invention is equipped with by concave template upper end Shi Jinhang punch forming, production efficiency is fast, and manufacturing cost is low, after sliding protrusion is slidably connected to the inside of groove, is convenient for concave template Sliding, pass through the setting of idler wheel, concave template sliding when, reduce frictional force.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention;
Fig. 2 is positive structure diagram of the present invention;
Fig. 3 is pedestal overlooking structure diagram of the present invention.
In figure: 1 pedestal, 2 carrier bases, 3 cylinders, 4 grooves, 5 cavity plates, 6 concave templates, 7 switches, 8 idler wheels, 9 sliding protrusions, 10 Punch-pin, 11 convex templates, 12 cylinder rods, 13 locating pieces.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Fig. 1-3 is please referred to, the present invention provides a kind of technical solution: a kind of electronic component processing mold, including pedestal 1, The front left of the pedestal 1 is equipped with switch 7, and the upper rear of the pedestal 1 is equipped with carrier base 2, the upper end of the carrier base 2 Middle part is equipped with cylinder 3, and the output end of the cylinder 3 is equipped with cylinder rod 12, the bottom of the cylinder rod 12 through the top of carrier base 2 Portion is equipped with convex template 11, and the bottom of the convex template 11 is equipped with punch-pin 10, and the upper-end front of the pedestal 1 is equipped with concave template 6, institute The upper end for stating concave template 6 is equipped with cavity plate 5.
Further, the upper center of the pedestal 1 is equipped with groove 4, sliding in sliding protrusion 9 by the setting of groove 4 Behind the inside of groove 4, convenient for the sliding of concave template 6.
Further, the inner back side of the groove 4 is equipped with locating piece 13, by the setting of locating piece 13, so that cavity plate After plate 6 slides backward, it can accurately stop locating in correct position.
Further, the bottom of the concave template 6 is slidably connected to the interior of groove 4 equipped with sliding protrusion 9, described sliding raised 9 Portion is slidably connected to the setting of the inside of groove 4 by sliding protrusion 9, so that the interaction of concave template 6 is smoothly stablized.
Further, the two sides that the upper end of the pedestal 1 is located at groove 4 are equipped with idler wheel 8, by the setting of idler wheel 8, recessed When template 6 is slided, frictional force is reduced.
Further, the idler wheel 8 is equidistant arranged symmetrically, and equidistant by idler wheel 8 is symmetrical arranged, and is played to concave template 6 good supporting roles.
Specifically, being placed in inside cavity plate 5 in use, the molding material of electronic component needs will be made, then move Concave template 6, after sliding protrusion 9 is slidably connected to the inside of groove 4, convenient for the sliding of concave template 6, by the setting of locating piece 13, So that can accurately stop locating in correct position, by the setting of idler wheel 8, in concave template 6 after concave template 6 slides backward When sliding, reduce frictional force, cylinder 3 then controlled by switch 7 and is worked, cylinder rod 12 downwards drive convex template 11 to moving down It is dynamic, the molding of 10 stamping cavity die of punch-pin, 5 internal material.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding And modification, the scope of the present invention is defined by the appended.

Claims (6)

1. a kind of electronic component processing mold, including pedestal (1), it is characterised in that: the front left of the pedestal (1) is equipped with It switchs (7), the upper rear of the pedestal (1) is equipped with carrier base (2), and the upper center of the carrier base (2) is equipped with cylinder (3), the output end of the cylinder (3) is equipped with cylinder rod (12) through the top of carrier base (2), the bottom of the cylinder rod (12) Equipped with convex template (11), the bottom of the convex template (11) is equipped with punch-pin (10), and the upper-end front of the pedestal (1) is equipped with cavity plate The upper end of plate (6), the concave template (6) is equipped with cavity plate (5).
2. a kind of electronic component processing mold according to claim 1, it is characterised in that: the upper end of the pedestal (1) Middle part is equipped with groove (4).
3. a kind of electronic component processing mold according to claim 2, it is characterised in that: the inside of the groove (4) Rear side is equipped with locating piece (13).
4. a kind of electronic component processing mold according to claim 1, it is characterised in that: the bottom of the concave template (6) Portion is equipped with sliding raised (9), and sliding raised (9) are slidably connected to the inside of groove (4).
5. a kind of electronic component processing mold according to claim 1, it is characterised in that: the upper end of the pedestal (1) Idler wheel (8) are equipped with positioned at the two sides of groove (4).
6. a kind of electronic component processing mold according to claim 5, it is characterised in that: the idler wheel (8) is equidistant It is symmetrical arranged.
CN201711401568.4A 2017-12-22 2017-12-22 A kind of electronic component processing mold Pending CN109954797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711401568.4A CN109954797A (en) 2017-12-22 2017-12-22 A kind of electronic component processing mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711401568.4A CN109954797A (en) 2017-12-22 2017-12-22 A kind of electronic component processing mold

Publications (1)

Publication Number Publication Date
CN109954797A true CN109954797A (en) 2019-07-02

Family

ID=67018919

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711401568.4A Pending CN109954797A (en) 2017-12-22 2017-12-22 A kind of electronic component processing mold

Country Status (1)

Country Link
CN (1) CN109954797A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111231000A (en) * 2020-01-14 2020-06-05 厦门誉信实业有限公司 Punching device for electronic components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111231000A (en) * 2020-01-14 2020-06-05 厦门誉信实业有限公司 Punching device for electronic components
CN111231000B (en) * 2020-01-14 2021-04-30 厦门誉信实业有限公司 Punching device for electronic components

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PB01 Publication
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190702