CN109936929A - Circuit board feeding apparatus - Google Patents
Circuit board feeding apparatus Download PDFInfo
- Publication number
- CN109936929A CN109936929A CN201711348417.7A CN201711348417A CN109936929A CN 109936929 A CN109936929 A CN 109936929A CN 201711348417 A CN201711348417 A CN 201711348417A CN 109936929 A CN109936929 A CN 109936929A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- area
- unit
- feeding apparatus
- transmission unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 claims abstract 9
- 238000012545 processing Methods 0.000 claims abstract 6
- 238000007689 inspection Methods 0.000 claims abstract 2
- 238000004020 luminiscence type Methods 0.000 claims abstract 2
- 238000005553 drilling Methods 0.000 claims 1
- 238000010330 laser marking Methods 0.000 claims 1
- 230000004807 localization Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000011179 visual inspection Methods 0.000 claims 1
Landscapes
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种投料设备,更特别的是涉及一种包含X光定位装置的电路板投料设备。The invention relates to a feeding device, more particularly to a circuit board feeding device comprising an X-ray positioning device.
背景技术Background technique
一般印刷电路板可为由六层、八层、十六层、六十四层等基板所组成的多层板。多层的印刷电路板在压合制程完成后,由于表面包覆的铜箔会遮住原先基板上的定位孔(靶标孔),因此对于内部各板层间用于对准的定位孔,须使用例如光透视并整合影像及电控技术,正确导引出这些定位孔,并于后续制程(例如CNC机械钻孔、激光钻孔及自动曝光等)以该等定位孔作为制程中的基准依据,才能顺利完成全部的作业。Generally, the printed circuit board can be a multi-layer board composed of six-layer, eight-layer, sixteen-layer, and sixty-four-layer substrates. After the lamination process of the multi-layer printed circuit board is completed, the positioning holes (target holes) on the original substrate will be covered by the surface-coated copper foil, so the positioning holes used for alignment between the internal board layers must be Using, for example, light perspective and integrating image and electronic control technology, these positioning holes are correctly guided, and these positioning holes are used as the benchmark in the subsequent process (such as CNC mechanical drilling, laser drilling and automatic exposure, etc.) , in order to successfully complete all the work.
现有用于确认印刷电路板的定位孔的方式,将电路板放置于检查的机台面上,通过人力检查并调整该电路板的位置,且同样通过人力将该电路板送至后端处理装置进行处理。The existing method for confirming the positioning holes of the printed circuit board is to place the circuit board on the inspection machine table, inspect and adjust the position of the circuit board by manpower, and also send the circuit board to the back-end processing device by manpower. deal with.
然而,这样的方式不仅耗费人力、时间,也容易受到工作人员的疲累程度影响,造成失误增加的机率,进而增加生产成本。在要求自动化的趋势下,这样的机台与操作方式明显已不合时宜。However, this method is not only labor-intensive and time-consuming, but also easily affected by the fatigue level of the staff, resulting in an increased chance of errors and increased production costs. Under the trend of requiring automation, such machines and operation methods are obviously out of date.
发明内容SUMMARY OF THE INVENTION
本发明的一目的在于提出一种可自动化将电路板调整至正确位置并传送至后端处理装置进行处理的电路板投料设备,能有效取代人力以解决现有技术的问题。One objective of the present invention is to provide a circuit board feeding device that can automatically adjust the circuit board to the correct position and transmit it to a back-end processing device for processing, which can effectively replace manpower to solve the problems of the prior art.
为达上述目的及其他目的,本发明提出一种电路板投料设备,包含:投料区,用以放置电路板;X光定位装置,用以分析该电路板的位置,该X光定位装置包括:检查平台,具有相对的第一侧与第二侧,该检查平台设置于第一置放台上;发光单元,设置于该第一侧,用以于该检查平台上形成感光范围;影像摄录单元,设置于该第二侧,用以拍摄该感光范围内的感测影像;及处理控制单元,用以接收并分析该感测影像;第一传送单元,设置于与第一置放台相对的第二置放台上,用以传送该电路板于该投料区、该X光定位装置及待送区之间;其中该处理控制单元连接并依据该感测影像控制该第一传送单元,将该电路板调整为正确送料位置,并将该电路板传送至该待送区。In order to achieve the above-mentioned purpose and other purposes, the present invention proposes a circuit board feeding device, comprising: a feeding area for placing the circuit board; an X-ray positioning device for analyzing the position of the circuit board, and the X-ray positioning device includes: The inspection platform has an opposite first side and a second side, the inspection platform is arranged on the first placing platform; the light-emitting unit is arranged on the first side to form a photosensitive range on the inspection platform; image recording a unit, arranged on the second side, for photographing the sensing image within the photosensitive range; and a processing control unit, used for receiving and analyzing the sensing image; a first transmission unit, arranged opposite to the first placing table on the second placing table for transferring the circuit board between the feeding area, the X-ray positioning device and the waiting area; wherein the processing control unit is connected and controls the first transfer unit according to the sensing image, Adjust the circuit board to the correct feeding position, and transfer the circuit board to the waiting area.
于本发明的一实施例中,该第一传送单元为六轴机械手臂。In an embodiment of the present invention, the first transmission unit is a six-axis robot arm.
于本发明的一实施例中,该电路板投料设备还包含:多个第二传送单元,各该第二传送单元用以将位于该待送区的电路板传送至对应的后端处理装置。In an embodiment of the present invention, the circuit board feeding device further includes: a plurality of second conveying units, each of which is used for conveying the circuit boards located in the to-be-sent area to a corresponding back-end processing device.
于本发明的一实施例中,该第一传送单元为六轴机械手臂,而各该第二传送单元为三轴机械手臂。In an embodiment of the present invention, the first transfer unit is a six-axis robot arm, and each of the second transfer units is a three-axis robot arm.
于本发明的一实施例中,该投料区被区分为多个子投料区,该等子投料区用以放置不同型号的电路板。In an embodiment of the present invention, the feeding area is divided into a plurality of sub feeding areas, and the sub feeding areas are used for placing circuit boards of different types.
于本发明的一实施例中,该待送区被区分为多个子待送区,该等子待送区用以放置对应的不同型号的电路板。In an embodiment of the present invention, the waiting area is divided into a plurality of sub-waiting areas, and the sub-waiting areas are used for placing corresponding circuit boards of different types.
于本发明的一实施例中,该等后端处理装置包括钻靶机、自动裁磨线、曝光机、激光钻孔机、自动光学检查(Automated Optical Inspection,AOI)、X光检测机、激光打标机、电镀线定位机、Open/Short测试机。In an embodiment of the present invention, the back-end processing devices include a target drilling machine, an automatic cutting and grinding line, an exposure machine, a laser drilling machine, an automated optical inspection (AOI), an X-ray inspection machine, and a laser. Marking machine, electroplating line positioning machine, Open/Short testing machine.
借此,由于本发明所提出的电路板投料设备不需要通过人力便能检查并调整电路板的位置,并将电路板以正确的位置传送至后端处理装置进行处理,不仅节省人力与时间,也可有效避免由于人力失误造成生产成本增加的问题。Therefore, because the circuit board feeding equipment proposed by the present invention can check and adjust the position of the circuit board without manpower, and transmit the circuit board to the back-end processing device in the correct position for processing, it not only saves manpower and time, but also saves time and energy. It can also effectively avoid the problem of increased production costs due to human errors.
附图说明Description of drawings
图1为本发明一实施例的电路板投料设备的部分俯视图。FIG. 1 is a partial top view of a circuit board feeding device according to an embodiment of the present invention.
图2为本发明一实施例的X光定位装置的示意图。FIG. 2 is a schematic diagram of an X-ray positioning device according to an embodiment of the present invention.
图3A至图3D为本发明一实施例中,该第一传送单元将电路板自该投料区传送至该检查装置(的检查平台上)的四种情况。FIGS. 3A to 3D are four situations in which the first conveying unit conveys the circuit board from the feeding area to the inspection device (on the inspection platform) according to an embodiment of the present invention.
图4为本发明一实施例的电路板投料设备的部分俯视图。4 is a partial top view of a circuit board feeding device according to an embodiment of the present invention.
图5至图11为通过图4所示的电路板投料设备进行投料的流程。FIG. 5 to FIG. 11 are the flow of feeding by the circuit board feeding equipment shown in FIG. 4 .
符号说明:Symbol Description:
100 电路板投料设备100 circuit board feeding equipment
10 投料区10 feeding area
20 X光定位装置20 X-ray positioning device
21 检查平台21 Check the platform
21-1 第一侧21-1 First side
21-2 第二侧21-2 Second side
22 感光范围22 Sensitivity range
23 发光单元23 Lighting unit
25 影像摄录单元25 Video recording unit
31 第一传送单元31 The first transfer unit
32、32’ 第二传送单元32, 32' second transfer unit
40 待送区40 Waiting area
41、42 子待送区41, 42 Sub-waiting area
71 第一置放台71 The first placement table
72 第二置放台72 Second stage
90、91、92 电路板90, 91, 92 circuit boards
901 正面901 Front
902 背面902 back
A1、A2 定位孔A1, A2 positioning holes
B 防呆孔B foolproof hole
具体实施方式Detailed ways
为充分了解本发明,兹借由下述具体的实施例,并配合附图,对本发明做详细说明。本领域技术人员可由本说明书所公开的内容了解本发明的目的、特征及功效。须注意的是,本发明可通过其他不同的具体实施例加以施行或应用,本说明书中的各项细节也可基于不同观点与应用,在不悖离本发明的精神下进行各种修饰与变更。另外,本发明附图仅为简单示意说明,并非依实际尺寸的描绘。以下的实施方式将进一步详细说明本发明的相关技术内容,但所公开的内容并非用以限制本发明的技术范围。说明如后:In order to fully understand the present invention, the present invention is described in detail by the following specific embodiments and the accompanying drawings. Those skilled in the art can understand the objects, features and effects of the present invention from the contents disclosed in this specification. It should be noted that the present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. . In addition, the accompanying drawings of the present invention are merely schematic illustrations and are not drawn according to actual size. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the technical scope of the present invention. The description is as follows:
图1为本发明一实施例的电路板投料设备100的部分俯视图。如图1所示,该电路板投料设备100包含投料区10、X光定位装置20以及第一传送单元31。该投料区10例如为放置平台,用以放置电路板90。举例而言,该电路板90可被集中放于收板机(例如L-RACK)中,且该收板机被置放于该投料区10内。该X光定位装置20用以分析该电路板90的位置,而该第一传送单元31用以传送该电路板90于该投料区10、该X光定位装置20及待送区40之间。在本发明实施例中,该X光定位装置20连接该第一传送单元31,且该第一传送单元31可依据该X光定位装置20的分析结果将该电路板90调整为正确送料位置,并将该电路板90传送并放置于该待送区40。FIG. 1 is a partial top view of a circuit board feeding device 100 according to an embodiment of the present invention. As shown in FIG. 1 , the circuit board feeding device 100 includes a feeding area 10 , an X-ray positioning device 20 and a first conveying unit 31 . The feeding area 10 is, for example, a placing platform for placing the circuit board 90 . For example, the circuit boards 90 can be collected in a stacker (eg, L-RACK), and the stacker is placed in the feeding area 10 . The X-ray positioning device 20 is used for analyzing the position of the circuit board 90 , and the first conveying unit 31 is used for conveying the circuit board 90 between the feeding area 10 , the X-ray positioning device 20 and the waiting area 40 . In the embodiment of the present invention, the X-ray positioning device 20 is connected to the first conveying unit 31, and the first conveying unit 31 can adjust the circuit board 90 to the correct feeding position according to the analysis result of the X-ray positioning device 20, The circuit board 90 is transported and placed in the waiting area 40 .
要注意的是,该待送区40可例如与该投料区10类似,为放置平台,用以放置被调整为正确送料位置的该电路板90;或者,该待送区40可例如为后端处理装置50(见图4)的一部分,也就是,于该第一传送单元31依据该X光定位装置20的分析结果将该电路板90调整为正确送料位置后,便可直接将该电路板90送入该后端处理装置50进行处理。It should be noted that the to-be-feeding area 40 can be, for example, similar to the feeding area 10, and is a platform for placing the circuit board 90 adjusted to the correct feeding position; or, the to-be-feeding area 40 can be, for example, a rear end A part of the processing device 50 (see FIG. 4 ), that is, after the first conveying unit 31 adjusts the circuit board 90 to the correct feeding position according to the analysis result of the X-ray positioning device 20 , the circuit board can be directly 90 is sent to the back-end processing device 50 for processing.
图2为本发明一实施例的X光定位装置20的示意图。在本实施例中,该X光定位装置20可包含检查平台21、发光单元23、影像摄录单元25及处理控制单元(未绘示)。如图1、图2所示,该检查平台21设置于第一置放台71上,且该检查平台21具有相对的第一侧21-1与第二侧21-2,该发光单元23设置于该第一侧21-1,该影像摄录单元25设置于该第二侧21-2,也就是,该发光单元23与该影像摄录单元25分别设置于该检查平台21相对的两侧。在图2所示的实施例中,该发光单元23位于该检查平台21之上,而该影像摄录单元25位于该检查平台21之下,但本发明并未限定于此。在其他实施例中,该发光单元23与该影像摄录单元25的位置也可以互换。FIG. 2 is a schematic diagram of an X-ray positioning device 20 according to an embodiment of the present invention. In this embodiment, the X-ray positioning device 20 may include an inspection platform 21 , a light-emitting unit 23 , an image recording unit 25 and a processing control unit (not shown). As shown in FIG. 1 and FIG. 2 , the inspection platform 21 is disposed on the first placing table 71 , and the inspection platform 21 has opposite first sides 21 - 1 and second sides 21 - 2 , and the light emitting unit 23 is disposed On the first side 21 - 1 , the image recording unit 25 is disposed on the second side 21 - 2 , that is, the light emitting unit 23 and the image recording unit 25 are respectively disposed on opposite sides of the inspection platform 21 . In the embodiment shown in FIG. 2 , the light-emitting unit 23 is located above the inspection platform 21 , and the image recording unit 25 is located below the inspection platform 21 , but the present invention is not limited thereto. In other embodiments, the positions of the light-emitting unit 23 and the image recording unit 25 can also be interchanged.
在本实施例中,该发光单元23为X光光源,用以于该检查平台21上形成感光范围22(或称视野(field of view,FOV)),该感光范围22可例如为A4尺寸大小(约31cm x 25cm),但本发明并未限定于此。在本发明实施例中,该感光范围22可依照实际需求调整,并未限定于上述尺寸。该影像摄录单元25例如为CCD镜头,用以拍摄该感光范围22内的感测影像。举例来说,当电路板被该第一传送单元31传送至该X光定位装置20的检查平台21上,经由该发光单元23发射X光光源,该影像摄录单元25即可拍摄到该电路板于该感光范围22内所形成的感测影像。此外,该处理控制单元用以接收并分析该感测影像。In this embodiment, the light-emitting unit 23 is an X-ray light source, and is used to form a photosensitive area 22 (or called a field of view (FOV)) on the inspection platform 21 , and the photosensitive area 22 can be, for example, A4 size. (about 31cm x 25cm), but the present invention is not limited to this. In the embodiment of the present invention, the photosensitive range 22 can be adjusted according to actual needs, and is not limited to the above-mentioned size. The image recording unit 25 is, for example, a CCD lens, and is used for capturing a sensing image within the photosensitive range 22 . For example, when the circuit board is conveyed by the first conveying unit 31 to the inspection platform 21 of the X-ray positioning device 20, and the X-ray light source is emitted by the light-emitting unit 23, the image recording unit 25 can photograph the circuit The sensing image formed by the plate in the photosensitive range 22 . In addition, the processing control unit is used for receiving and analyzing the sensing image.
如图1所示,在本实施例中,该第一传送单元31设置于一第二置放台72上,该第二置放台72与该第一置放台71相对,而该第一传送单元31例如为六轴机械手臂。该第一传送单元31可例如以吸附的方式吸持该电路板90,并能旋转或翻转该电路板90,以将该电路板90调整为正确送料位置。该X光定位装置20的处理控制单元连接该第一传送单元31,且该处理控制单元依据该感测影像控制该第一传送单元31调整该电路板90,将该电路板90调整为正确送料位置,并控制该第一传送单元31将该电路板传送并放置于该待送区40。举例来说,该第一传送单元31可直接将该电路板传送至该待送区40、调整该电路板90的位置或翻转该电路板90。As shown in FIG. 1 , in this embodiment, the first conveying unit 31 is disposed on a second placing table 72 , the second placing table 72 is opposite to the first placing table 71 , and the first placing table 72 is opposite to the first placing table 71 . The transfer unit 31 is, for example, a six-axis robot arm. The first conveying unit 31 can hold the circuit board 90 by suction, and can rotate or turn over the circuit board 90 to adjust the circuit board 90 to a correct feeding position. The processing control unit of the X-ray positioning device 20 is connected to the first conveying unit 31 , and the processing control unit controls the first conveying unit 31 to adjust the circuit board 90 according to the sensing image, so as to adjust the circuit board 90 to feed correctly position, and control the first conveying unit 31 to convey and place the circuit board in the waiting area 40 . For example, the first transfer unit 31 can directly transfer the circuit board to the waiting area 40 , adjust the position of the circuit board 90 or turn the circuit board 90 over.
图3A至图3D为本发明一实施例中,该第一传送单元31将一电路板90自该投料区10传送至该X光定位装置20(的检查平台21上)的四种情况。在本实施例中,后端处理装置50例如为钻靶机,该X光定位装置20(的处理控制单元)可依据图3A~图3D的四种情况,控制该第一传送单元31对该电路板90进行不同的作动,以确保后续将该电路板90传送至该后端处理装置50时,以正确的位置进行投料。3A to 3D show four situations in which the first conveying unit 31 conveys a circuit board 90 from the feeding area 10 to the X-ray positioning device 20 (on the inspection platform 21 ) in an embodiment of the present invention. In this embodiment, the back-end processing device 50 is, for example, a target drilling machine, and (the processing control unit of the X-ray positioning device 20 ) can control the first transmission unit 31 to control the X-ray positioning device 20 according to the four situations shown in FIGS. 3A to 3D . The circuit board 90 performs different actions to ensure that when the circuit board 90 is subsequently transferred to the back-end processing device 50 , the material is fed at the correct position.
在本实施例中,该电路板90可包含两个定位孔A1、A2与防呆孔B,如图3A~图3D所示,该等定位孔A1、A2与该防呆孔B的联机构成直角三角形。该X光定位装置20可先检查该等定位孔A1、A2的位置,再检查该定位孔A1与该防呆孔B的位置;或者,可先检查该定位孔A1与该防呆孔B的位置,再检查该等定位孔A1、A2的位置,以对该电路板90的位置进行适当的调整。以下将进行详细说明。In this embodiment, the circuit board 90 may include two positioning holes A1 and A2 and a foolproof hole B. As shown in FIG. 3A to FIG. 3D , the positioning holes A1 and A2 and the foolproof hole B are connected together. Right triangle. The X-ray positioning device 20 can check the positions of the positioning holes A1 and A2 first, and then check the positions of the positioning holes A1 and the foolproof holes B; or, can check the positions of the positioning holes A1 and the foolproof holes B first. position, and then check the positions of the positioning holes A1 and A2 to properly adjust the position of the circuit board 90 . A detailed description will be given below.
图3A所示的电路板90以正面901朝上,且该等定位孔A1、A2与该防呆孔B的位置即为将该电路板90传送至该后端处理装置50(例如:钻靶机)可直接进行处理的正确位置。也就是,当该第一传送单元31将该电路板90自该投料区10传送至该X光定位装置20的检查平台21上,经该发光单元23发出光线(X光),而该影像摄录单元25所拍摄到该电路板90于该感光范围22内形成的感测影像如图3A所示时,该处理控制单元控制该第一传送单元31直接将该电路板90传送至该待送区40。The front side 901 of the circuit board 90 shown in FIG. 3A faces upward, and the positioning holes A1 , A2 and the foolproof hole B are positioned to transfer the circuit board 90 to the back-end processing device 50 (eg, a drilling target). machine) in the correct location for direct processing. That is, when the first conveying unit 31 conveys the circuit board 90 from the feeding area 10 to the inspection platform 21 of the X-ray positioning device 20, the light-emitting unit 23 emits light (X-ray), and the image captures When the sensing image formed by the circuit board 90 in the photosensitive range 22 captured by the recording unit 25 is shown in FIG. 3A , the processing control unit controls the first transmission unit 31 to directly transmit the circuit board 90 to the to-be-transmitted District 40.
在某些实施例中,该处理控制单元可依据该感测影像控制该第一传送单元31旋转该电路板90。In some embodiments, the processing control unit can control the first transmission unit 31 to rotate the circuit board 90 according to the sensing image.
图3B所示的电路板90以正面901朝上,且该等定位孔A1、A2与该防呆孔B的位置与将该电路板90传送至该后端处理装置50(例如:钻靶机)可进行处理的正确位置相差180度。因此,当该影像摄录单元25所拍摄到该电路板90于该感光范围22内形成的感测影像如图3B所示时,该处理控制单元控制该第一传送单元31将该电路板90先旋转180度后,再传送至该待送区40。The front side 901 of the circuit board 90 shown in FIG. 3B faces upward, and the positions of the positioning holes A1, A2 and the foolproof hole B are related to the transmission of the circuit board 90 to the back-end processing device 50 (eg, a target drilling machine). ) is 180 degrees apart from the correct position for processing. Therefore, when the image recording unit 25 captures the sensing image formed by the circuit board 90 in the photosensitive range 22 as shown in FIG. 3B , the processing control unit controls the first transmission unit 31 to the circuit board 90 After rotating by 180 degrees, it is transferred to the waiting area 40 .
在其他实施例中,该处理控制单元可依据该感测影像控制该第一传送单元31翻转该电路板90。In other embodiments, the processing control unit may control the first transmission unit 31 to turn over the circuit board 90 according to the sensing image.
图3C所示的电路板90以背面902朝上,由于该X光定位装置20检查该等定位孔A1、A2的位置以及该定位孔A1与该防呆孔B的位置,该处理控制单元即可判断无论如何旋转该电路板90皆无法调整到正确的送料位置。因此,当该影像摄录单元25所拍摄到该电路板90于该感光范围22内形成的感测影像如图3C所示时,该处理控制单元控制该第一传送单元31将该电路板90翻转为正面,再传送至该待送区40。The circuit board 90 shown in FIG. 3C has its back 902 facing upward. Since the X-ray positioning device 20 checks the positions of the positioning holes A1 and A2 and the positions of the positioning holes A1 and the foolproof hole B, the processing control unit is It can be determined that no matter how the circuit board 90 is rotated, it cannot be adjusted to the correct feeding position. Therefore, when the image recording unit 25 captures the sensing image formed by the circuit board 90 in the photosensitive range 22 as shown in FIG. 3C , the processing control unit controls the first transmission unit 31 to the circuit board 90 . Turn it upside down, and then transfer it to the waiting area 40 .
图3D所示的电路板90同样为背面902朝上,但该等定位孔A1、A2与该防呆孔B的位置与图3C所示的位置相差180度。同样地,由于该X光定位装置20检查该等定位孔A1、A2的位置以及该定位孔A1与该防呆孔B的位置,该处理控制单元即可判断无论如何旋转该电路板90皆无法调整到正确的送料位置。因此,当该影像摄录单元25所拍摄到该电路板90于该感光范围22内形成的感测影像如图3D所示时,该处理控制单元控制该第一传送单元31将该电路板90翻转为正面,再将该电路板90旋转180度后,才传送至该待送区40。The circuit board 90 shown in FIG. 3D also has the back surface 902 facing upward, but the positions of the positioning holes A1 , A2 and the foolproof hole B are different from the positions shown in FIG. 3C by 180 degrees. Likewise, since the X-ray positioning device 20 checks the positions of the positioning holes A1 and A2 and the positions of the positioning holes A1 and the foolproof hole B, the processing and control unit can determine that no matter how the circuit board 90 is rotated, the circuit board 90 cannot be rotated. Adjust to the correct feeding position. Therefore, when the image recording unit 25 captures the sensing image formed by the circuit board 90 in the photosensitive range 22 as shown in FIG. 3D , the processing control unit controls the first transmission unit 31 to the circuit board 90 . Turn the circuit board 90 over to the front, and then rotate the circuit board 90 by 180 degrees before transferring it to the waiting area 40 .
要注意的是,虽然前述实施例以该后端处理装置50为钻靶机进行说明,但本发明并未限定于此。任何须将电路板90调整至正确的送料位置才可进行投料的后端处理装置50,皆可于前端作业中通过本发明的X光定位装置20以及第一传送单元31将该电路板90调整至正确的送料位置,在此不多加赘述。It should be noted that, although the foregoing embodiments are described by taking the back-end processing device 50 as a target drilling machine, the present invention is not limited to this. Any back-end processing device 50 that needs to adjust the circuit board 90 to the correct feeding position can adjust the circuit board 90 in the front-end operation through the X-ray positioning device 20 and the first conveying unit 31 of the present invention. To the correct feeding position, I won't go into details here.
图4为本发明一实施例的电路板投料设备100的部分俯视图。如图4所示,该电路板投料设备100还包含多个第二传送单元32、32’,在本实施例中,各该第二传送单元32、32’用以将位于该待送区40的电路板90传送至对应的后端处理装置50、50’。FIG. 4 is a partial top view of a circuit board feeding device 100 according to an embodiment of the present invention. As shown in FIG. 4 , the circuit board feeding device 100 further includes a plurality of second conveying units 32 and 32 ′. In this embodiment, each of the second conveying units 32 and 32 ′ is used for placing the second conveying units 32 and 32 ′ in the waiting area 40 . The circuit board 90 is sent to the corresponding back-end processing device 50, 50'.
举例来说,各该第二传送单元32、32’为三轴机械手臂,由于该第一传送单元31(六轴机械手臂)已依据该X光定位装置20的分析结果将该电路板90调整为正确的送料位置并送至该待送区40,因此,各该第二传送单元32(、32’)只需将位于该待送区40的电路板90传送至对应的后端处理装置50(、50’),便可对该电路板90进行后续处理。For example, each of the second transfer units 32 , 32 ′ is a three-axis robot arm, since the first transfer unit 31 (six-axis robot arm) has adjusted the circuit board 90 according to the analysis result of the X-ray positioning device 20 Therefore, each second conveying unit 32 (, 32 ′) only needs to transfer the circuit board 90 located in the waiting area 40 to the corresponding back-end processing device 50 (, 50'), the circuit board 90 can be subsequently processed.
在本实施例中,通过各该第二传送单元32(、32’)将位于该待送区40的电路板90传送至对应的后端处理装置50(、50’),而非通过该第一传送单元31将已被调整为正确位置的电路板90直接传送至后端处理装置50(、50’),这是为了使该电路板投料设备100中的各装置进行分工,达成更有效率的处理。In this embodiment, the circuit boards 90 located in the waiting area 40 are transferred to the corresponding back-end processing devices 50 (, 50') through each of the second transfer units 32 (, 32'), rather than through the second transfer unit 32 (, 32'). A transfer unit 31 directly transfers the circuit board 90 that has been adjusted to the correct position to the back-end processing device 50 (, 50 ′), which is to make the various devices in the circuit board feeding device 100 divide the work to achieve more efficiency processing.
举例来说,在这样的分工操作下,由于该第一传送单元31只需负担将该电路板90调整为正确的送料位置的工作,而将该电路板90传送至对应的后端处理装置50的工作由该第二传送单元32进行处理,当该第一传送单元31将已调整为正确的送料位置的该电路板90送至该待送区40后,便可继续传送(并调整)另一片电路板91,与此同时,位于该待送区40的电路板90也同步地由该第二传送单元32送至对应的后端处理装置50,该后端处理装置50便可开始进行后续处理。For example, under such a division of labor, since the first transfer unit 31 only needs to adjust the circuit board 90 to the correct feeding position, the circuit board 90 is transferred to the corresponding back-end processing device 50 . The work is processed by the second conveying unit 32. After the first conveying unit 31 sends the circuit board 90 that has been adjusted to the correct feeding position to the waiting area 40, it can continue to convey (and adjust) another A piece of circuit board 91, at the same time, the circuit board 90 in the waiting area 40 is also synchronously sent by the second conveying unit 32 to the corresponding back-end processing device 50, and the back-end processing device 50 can start the subsequent processing deal with.
当该后端处理装置50进行后续处理的期间,该第一传送单元31便可将该另一片电路板91调整为正确的送料位置并送至该待送区40,接着,由该第二传送单元32’将位于该待送区40的电路板91送至对应的后端处理装置50’。后方将有更详细的说明。When the back-end processing device 50 is performing subsequent processing, the first conveying unit 31 can adjust the other circuit board 91 to the correct feeding position and send it to the waiting area 40 , and then the second conveying unit 31 The unit 32' sends the circuit board 91 located in the waiting area 40 to the corresponding back-end processing device 50'. There will be more detailed instructions at the back.
在一实施例中,该投料区10被区分为多个子投料区,该等子投料区用以放置不同型号的电路板。类似地,该待送区40也可被区分为多个子待送区,该等子待送区用以放置对应的不同型号的电路板。举例来说,前述电路板90、91可为不同型号的电路板,而对应的后端处理装置50、50’也可为不同的处理机台,分别对电路板90、91进行不同的后续处理。要注意的是,该等子投料区、该等子待送区及对应的后端处理装置的数量可依据电路板90、91的种类(数量)进行调整,也就是,在此实施例中,该电路板投料设备100可同时处理多个个不同型号的电路板,可更有效地节省人力与时间。In one embodiment, the feeding area 10 is divided into a plurality of sub-feeding areas, and the sub-feeding areas are used for placing circuit boards of different types. Similarly, the waiting area 40 can also be divided into a plurality of sub-waiting areas, and the sub-waiting areas are used for placing corresponding circuit boards of different types. For example, the aforementioned circuit boards 90 , 91 can be different types of circuit boards, and the corresponding back-end processing devices 50 , 50 ′ can also be different processing machines, respectively performing different subsequent processing on the circuit boards 90 , 91 . . It should be noted that the number of the sub-feeding areas, the sub-waiting areas and the corresponding back-end processing devices can be adjusted according to the type (quantity) of the circuit boards 90 and 91, that is, in this embodiment, The circuit board feeding device 100 can process a plurality of circuit boards of different types at the same time, which can save manpower and time more effectively.
在本发明的实施例中,该等后端处理装置50、50’可例如包括钻靶机、自动裁磨线、曝光机、激光钻孔机、自动光学检查(Automated Optical Inspection,AOI)、X光检测机、激光打标机、电镀线定位机、Open/Short测试机等。电路板90在进入这些后端处理装置50、50’前,皆需要先进行定位并调整为正确的位置后,才可放入这些后端处理装置50、50’中进行后续处理。也就是,本发明的电路板投料设备100可应用于前述各种后端处理装置50、50’的前端,确保电路板90以正确的位置放入该等后端处理装置50、50’中。In the embodiment of the present invention, the back-end processing devices 50, 50' may include, for example, a target drilling machine, an automatic cutting and grinding line, an exposure machine, a laser drilling machine, an automated optical inspection (Automated Optical Inspection, AOI), X Optical inspection machine, laser marking machine, electroplating line positioning machine, Open/Short testing machine, etc. Before entering the back-end processing devices 50 and 50', the circuit board 90 needs to be positioned and adjusted to a correct position before being put into the back-end processing devices 50 and 50' for subsequent processing. That is, the circuit board feeding device 100 of the present invention can be applied to the front ends of the aforementioned various back-end processing devices 50, 50' to ensure that the circuit board 90 is placed in the back-end processing devices 50, 50' in the correct position.
图5至图11为通过图4所示的电路板投料设备100进行投料的流程。首先,如图5所示,该第一传送单元31将一电路板90从该投料区10传送至该X光定位装置20,由该X光定位装置20分析该电路板90(见图2、3),并依据该X光定位装置20的分析结果,由该第一传送单元31将该电路板90调整为正确的送料位置。FIG. 5 to FIG. 11 are the flow of feeding by the circuit board feeding device 100 shown in FIG. 4 . First, as shown in FIG. 5 , the first conveying unit 31 conveys a circuit board 90 from the feeding area 10 to the X-ray positioning device 20 , and the X-ray positioning device 20 analyzes the circuit board 90 (see FIG. 2 , 3), and according to the analysis result of the X-ray positioning device 20, the first conveying unit 31 adjusts the circuit board 90 to the correct feeding position.
接着,如图6所示,该第一传送单元31将已调整为正确的送料位置的该电路板90送至该待送区40中,对应后端处理装置50的子待送区41。如图7所示,该第二传送单元32接手该电路板90,准备将其运送至该后端处理装置50进行处理。Next, as shown in FIG. 6 , the first conveying unit 31 sends the circuit board 90 adjusted to the correct feeding position to the waiting area 40 , corresponding to the sub-waiting area 41 of the back end processing device 50 . As shown in FIG. 7 , the second transfer unit 32 takes over the circuit board 90 and prepares to transport it to the back-end processing device 50 for processing.
接着,如图8所示,该第二传送单元32将该电路板90运送至该后端处理装置50进行处理。在该后端处理装置50对该电路板90进行处理的期间,该第一传送单元31同步地将电路板91从该投料区10传送至该X光定位装置20,由该X光定位装置20分析该电路板91,并依据该X光定位装置20的分析结果,由该第一传送单元31将该电路板91调整为正确的送料位置。Next, as shown in FIG. 8 , the second conveying unit 32 conveys the circuit board 90 to the back-end processing device 50 for processing. During the processing of the circuit board 90 by the back-end processing device 50 , the first conveying unit 31 synchronously conveys the circuit board 91 from the feeding area 10 to the X-ray positioning device 20 , and the X-ray positioning device 20 transmits the circuit board 91 synchronously. The circuit board 91 is analyzed, and according to the analysis result of the X-ray positioning device 20 , the circuit board 91 is adjusted to the correct feeding position by the first conveying unit 31 .
接着,如图9所示,该第一传送单元31将已调整为正确的送料位置的该电路板91送至该待送区40中,对应后端处理装置50’的子待送区42。如图10所示,该第二传送单元32’接手该电路板91,准备将其运送至该后端处理装置50’进行处理。Next, as shown in FIG. 9 , the first conveying unit 31 sends the circuit board 91 adjusted to the correct feeding position to the waiting area 40, which corresponds to the sub-waiting area 42 of the rear end processing device 50'. As shown in FIG. 10 , the second transfer unit 32' takes over the circuit board 91 and prepares to transport it to the back-end processing device 50' for processing.
如图11所示,在该后端处理装置50’对该电路板91进行处理的期间,该第一传送单元31同步地准备将电路板92从该投料区10传送至该X光定位装置20,后续步骤将依上述方式持续进行。As shown in FIG. 11 , during the processing of the circuit board 91 by the back-end processing device 50 ′, the first transfer unit 31 synchronously prepares to transfer the circuit board 92 from the feeding area 10 to the X-ray positioning device 20 . , the subsequent steps will continue as above.
要注意的是,在图5至图11所示的实施例中,该等电路板90、91、92可为相同型号的电路板,因此,该等电路板90、91、92可存放于该投料区10中相同的位置,且该等后端处理装置50、50’可进行相同的处理制程。It should be noted that, in the embodiments shown in FIGS. 5 to 11 , the circuit boards 90 , 91 , and 92 can be of the same type. Therefore, the circuit boards 90 , 91 , and 92 can be stored in the The same position in the feeding area 10, and the back-end processing devices 50, 50' can perform the same processing process.
然于其他实施例中,该等电路板90、91、92也可为不同型号的电路板,因此,该等电路板90、91、92可存放于该投料区10的不同的子投料区中,且该等后端处理装置50、50’可进行不同的处理制程。However, in other embodiments, the circuit boards 90 , 91 , and 92 can also be different types of circuit boards. Therefore, the circuit boards 90 , 91 , and 92 can be stored in different sub-feeding areas of the feeding area 10 . , and the back-end processing devices 50 and 50 ′ can perform different processing procedures.
承上述说明,由于本发明所提出的电路板投料设备100,不需要通过人力便能检查并调整电路板的位置,以将电路板以正确的位置传送至后端处理装置进行处理,不仅节省人力与时间,也可有效避免由于人力失误造成生产成本增加的问题。且在某些实施例中,可通过该等第二传送单元与该第一传送单元进行分工使该电路板投料设备中可同步对不同的电路板进行处理,亦可同时进行不同的后续制程,使整个制程更有效率。Based on the above description, due to the circuit board feeding device 100 proposed by the present invention, the position of the circuit board can be checked and adjusted without manpower, so that the circuit board can be sent to the back-end processing device in the correct position for processing, which not only saves manpower It can also effectively avoid the problem of increased production costs due to human errors. And in some embodiments, the second conveying unit and the first conveying unit can be used for division of labor, so that different circuit boards can be processed simultaneously in the circuit board feeding equipment, and different subsequent processes can also be performed at the same time. Make the whole process more efficient.
本发明在上文中已以实施例说明,然本领域技术人员应理解的是,该实施例仅用于描绘本发明,而不应解读为限制本发明的范围。应注意的是,举凡与该实施例等效的变化与置换,均应设为涵盖于本发明的范畴内。因此,本发明的保护范围当以权利要求书所界定的范围为准。The present invention has been described above with embodiments, but those skilled in the art should understand that the embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. It should be noted that, all the equivalent changes and substitutions of this embodiment should be considered to be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711348417.7A CN109936929A (en) | 2017-12-15 | 2017-12-15 | Circuit board feeding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711348417.7A CN109936929A (en) | 2017-12-15 | 2017-12-15 | Circuit board feeding apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109936929A true CN109936929A (en) | 2019-06-25 |
Family
ID=66979791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711348417.7A Pending CN109936929A (en) | 2017-12-15 | 2017-12-15 | Circuit board feeding apparatus |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109936929A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111299867A (en) * | 2019-11-05 | 2020-06-19 | 赣州中盛隆电子有限公司 | Drilling and copper deposition integrated equipment for processing conducting hole of circuit board |
CN113865503A (en) * | 2020-06-30 | 2021-12-31 | 得力富企业股份有限公司 | centroid detection device |
CN113979122A (en) * | 2021-12-02 | 2022-01-28 | 深圳恒鼎智能装备有限公司 | A special equipment and process route for drilling target machine feeding with integrated direction recognition |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6232559B1 (en) * | 1998-01-05 | 2001-05-15 | International Business Machines Corporation | Multi-layer printed circuit board registration |
WO2010052783A1 (en) * | 2008-11-06 | 2010-05-14 | 富士機工電子株式会社 | Multilayer printed circuit board, method for examining multilayer printed circuit board, system for examining multilayer printed circuit board, and method for manufacturing multilayer printed circuit board |
CN104053986A (en) * | 2012-01-12 | 2014-09-17 | 雅马哈发动机株式会社 | X-ray inspection device |
CN206686457U (en) * | 2017-04-01 | 2017-11-28 | 得力富企业股份有限公司 | Circuit board automatic feeding equipment |
CN207753927U (en) * | 2017-12-15 | 2018-08-21 | 得力富企业股份有限公司 | Circuit board feeding equipment |
-
2017
- 2017-12-15 CN CN201711348417.7A patent/CN109936929A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6232559B1 (en) * | 1998-01-05 | 2001-05-15 | International Business Machines Corporation | Multi-layer printed circuit board registration |
WO2010052783A1 (en) * | 2008-11-06 | 2010-05-14 | 富士機工電子株式会社 | Multilayer printed circuit board, method for examining multilayer printed circuit board, system for examining multilayer printed circuit board, and method for manufacturing multilayer printed circuit board |
CN104053986A (en) * | 2012-01-12 | 2014-09-17 | 雅马哈发动机株式会社 | X-ray inspection device |
CN206686457U (en) * | 2017-04-01 | 2017-11-28 | 得力富企业股份有限公司 | Circuit board automatic feeding equipment |
CN207753927U (en) * | 2017-12-15 | 2018-08-21 | 得力富企业股份有限公司 | Circuit board feeding equipment |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111299867A (en) * | 2019-11-05 | 2020-06-19 | 赣州中盛隆电子有限公司 | Drilling and copper deposition integrated equipment for processing conducting hole of circuit board |
CN111299867B (en) * | 2019-11-05 | 2021-08-27 | 赣州中盛隆电子有限公司 | Drilling and copper deposition integrated equipment for processing conducting hole of circuit board |
CN113865503A (en) * | 2020-06-30 | 2021-12-31 | 得力富企业股份有限公司 | centroid detection device |
CN113979122A (en) * | 2021-12-02 | 2022-01-28 | 深圳恒鼎智能装备有限公司 | A special equipment and process route for drilling target machine feeding with integrated direction recognition |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN207753927U (en) | Circuit board feeding equipment | |
US20120327215A1 (en) | High speed optical sensor inspection system | |
CN107884342A (en) | Display screen detection equipment | |
TWI397355B (en) | Alignment device and method to align plates for electronic circuits, and apparatus for processing a subsrate | |
EP3653030B1 (en) | Method and system for determining component illumination settings | |
CN109936929A (en) | Circuit board feeding apparatus | |
JP2015095586A (en) | Board inspection method | |
CN111656883A (en) | Learning completion model generation system for component image recognition and learning completion model generation method for component image recognition | |
TWI456213B (en) | Electronic component working unit, working method and working equipment thereof | |
JP6037580B2 (en) | Component mounter | |
CN206686457U (en) | Circuit board automatic feeding equipment | |
CN108241120A (en) | Electronic component delivery device and electronic component inspection device | |
JP6047760B2 (en) | Component mounting system and component mounting method | |
TW201418126A (en) | Electronic component processing machine | |
JP5190127B2 (en) | Substrate processing equipment | |
CN106290400A (en) | A hole inspection method and hole inspection equipment applied to boards | |
CN107592910A (en) | Method for checking electronic device | |
CN102549712B (en) | For checking the method and apparatus of chip before bonding | |
KR20140067415A (en) | Apparatus for inspecting printed circuit board | |
WO2018158888A1 (en) | Backup-pin recognizing method and component mounting device | |
CN110160959A (en) | A kind of AOI detection method and system | |
TWM544103U (en) | Circuit board material auto-feeding equipment | |
WO2008013188A1 (en) | Inspecting method, inspection treating system, treating device, inspecting device, manufacturing/inspecting device, and manufacturing/inspecting method | |
TWM557449U (en) | Circuit board material feeding equipment | |
TWI642500B (en) | Circuit board feeding equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190625 |