CN109769382A - A kind of novel universal integrated circuit plate heat dissipating device - Google Patents
A kind of novel universal integrated circuit plate heat dissipating device Download PDFInfo
- Publication number
- CN109769382A CN109769382A CN201910190230.1A CN201910190230A CN109769382A CN 109769382 A CN109769382 A CN 109769382A CN 201910190230 A CN201910190230 A CN 201910190230A CN 109769382 A CN109769382 A CN 109769382A
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- CN
- China
- Prior art keywords
- integrated circuit
- motor
- heat dissipating
- plate heat
- circuit plate
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Links
- 238000009423 ventilation Methods 0.000 claims abstract description 25
- 238000005192 partition Methods 0.000 claims abstract description 9
- 238000006073 displacement reaction Methods 0.000 claims description 13
- 238000004804 winding Methods 0.000 claims description 13
- 238000001816 cooling Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of integrated circuit board fields, specifically a kind of novel universal integrated circuit plate heat dissipating device, including shell, first sliding groove is provided on wall at left and right sides of case top, first sliding groove is internally provided with the first sliding block, second sliding slot is provided between first sliding block, left end is provided with the second motor inside second sliding slot, the second screw rod is connected on the right side of second motor, second sliding block is installed on the second screw rod, attachment base is provided on the downside of second sliding block, third motor is installed inside attachment base, third motor lower end is equipped with radiator fan, second sliding slot left and right ends are respectively arranged with gag lever post and the first screw rod, first motor is fixedly installed on rear side of first screw rod, the rear end of partition is arranged in first motor, partition quadrangle is provided with ventilation opening, connect cover is fixedly installed on rear side of ventilation opening, connect cover is attached by ventilation duct , the present invention, which can be facilitated effectively, carries out radiating treatment to integrated circuit board, facilitates the use of equipment.
Description
Technical field
The present invention relates to a kind of integrated circuit board field, specifically a kind of novel universal integrated circuit plate heat dissipating device.
Background technique
Integrated circuit board is a carrier for carrying integrated circuit.But also integrated circuit band when often saying integrated circuit board
On.Integrated circuit board mainly has silica gel composition, so generally in green.
Integrated circuit board is that upper many transistors are made on one piece of lesser monocrystalline silicon piece using semiconductor fabrication process
And the components such as resistor, capacitor, and component is combined into complete electricity according to the method that multilayer wiring or tunnel are routed
Sub-circuit.
The Chinese patent Authorization Notice No. of present disclosure is a kind of radiator of integrated circuit board of CN208402313U,
Although rear side, which is provided with radiator fan, carries out radiating treatment, equipment carries out radiating treatment simply by radiator fan,
The method inefficiency to radiate in this way, is unable to satisfy the demand of people.
Summary of the invention
The purpose of the present invention is to provide a kind of novel universal integrated circuit plate heat dissipating devices, to solve above-mentioned background technique
The problem of middle proposition.
To achieve the above object, the invention provides the following technical scheme:
A kind of novel universal integrated circuit plate heat dissipating device, including shell are fixedly mounted at left and right sides of the enclosure interior on wall
There is link slot, is provided with first sliding groove on wall at left and right sides of the case top, first sliding groove is internally provided with the first sliding block, the
It is provided with second sliding slot between one sliding block, left end is provided with the second motor inside second sliding slot, and the is connected on the right side of the second motor
Two screw rods are equipped with the second sliding block on the second screw rod, are provided with attachment base on the downside of the second sliding block, are equipped with third inside attachment base
Motor, third motor lower end are equipped with radiator fan, and second sliding slot left and right ends are respectively arranged with gag lever post and the first screw rod, the
It is fixedly installed with first motor on rear side of one screw rod, the rear end of partition is arranged in first motor, and partition quadrangle is provided with ventilation opening, leads to
It is fixedly installed with connect cover on rear side of air port, the connect cover of upper and lower ends is attached by ventilation duct, is equipped on ventilation duct logical
Air pump.
As a kind of preferred embodiment of the invention, Corner Strapped is equipped with mounting base on the downside of the shell.
As a kind of preferred embodiment of the invention, mounting base lower end is provided with mounting hole, can be convenient the peace of equipment
Assembly and disassembly.
As a kind of preferred embodiment of the invention, the enclosure interior bottom end is provided with route winding displacement groove, Ke Yifang
Just equipment winding displacement.
As a kind of preferred embodiment of the invention, route winding displacement groove inner bottom is provided with route winding displacement seat.
As a kind of preferred embodiment of the invention, rear and front end is equipped with tightening knob, Ke Yifang on the downside of link slot
Just it fixes.
As a kind of preferred embodiment of the invention, ventilation opening is internally provided with filter screen, can be effectively prevented miscellaneous
Matter enters inside ventilation duct.
Compared with prior art, the beneficial effects of the present invention are: the present invention is by being mounted on link slot for integrated circuit board
Inside, enclosure interior can be divided into two regions up and down, the rotation of the first screw rod is driven by first motor, to drive the
Two sliding slots are moved forward and backward, and during back-and-forth motion, drive the second screw rod to be rotated by the second motor, this belt transect
Dynamic second sliding block is moved left and right, and during equipment all around move, passes through third motor driven radiation air
Fan is blowed, and can carry out wind-cooling heat dissipating to integrated circuit board upper surface, can be convenient the wind-cooling heat dissipating of equipment, pass through ventilation
The air of upper zone is pumped into following region by pump, can be formed a vent passages, can preferably be carried out wind in this way
Cold heat dissipation.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of novel universal integrated circuit plate heat dissipating device of the present invention.
Fig. 2 is a kind of structural schematic diagram of novel universal integrated circuit plate heat dissipating device left view of the present invention.
Fig. 3 is a kind of structural schematic diagram of novel universal integrated circuit plate heat dissipating device rearview of the present invention.
1- shell, 2- mounting base, 3- mounting hole, 4- link slot, 5- tightening knob, 6- first sliding groove, the first sliding block of 7-, 8-
Second sliding slot, 9- gag lever post, the first screw rod of 10-, 11- first motor, the second motor of 12-, the second screw rod of 13-, 14- second are sliding
Block, 15- attachment base, 16- third motor, 17- radiator fan, 18- partition, 19- ventilation opening, 20- filter screen, 21- connect cover,
22- ventilation duct, 23- ventilation pump, 24- route winding displacement groove, 25- route winding displacement seat.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
To keep the purposes, technical schemes and advantages of embodiment of the present invention clearer, below in conjunction with attached drawing to this hair
Bright each embodiment is explained in detail.However, it will be understood by those skilled in the art that in each implementation of the invention
In mode, in order to make the reader understand this application better, many technical details are proposed.But it is even if thin without these technologies
Section and various changes and modifications based on the following respective embodiments, also may be implemented the application technical solution claimed.
The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
Embodiment one
Refering to fig. 1~3, in the embodiment of the present invention, a kind of novel universal integrated circuit plate heat dissipating device, including shell 1, the shell
1 downside Corner Strapped of body is equipped with mounting base 2, and 2 lower end of mounting base is provided with mounting hole 3, wall at left and right sides of the enclosure interior
On be fixedly installed with link slot 4, can be convenient placement integrated circuit board, 4 downside rear and front end of link slot is equipped with tightening knob
5, it can be convenient securing integrated circuit plate, it, can will be inside shell 1 by the way that integrated circuit board to be mounted on to the inside of link slot 4
It is divided into two regions up and down.
It is provided with first sliding groove 6 on the 1 top left and right two sidewalls of shell, first sliding groove 6 is internally provided with the first sliding block
7, second sliding slot 8 is provided between the first sliding block 7,8 inside left end of second sliding slot is provided with the second motor 12, and the second motor 12 is right
Side is connected with the second screw rod 13, and the second sliding block 14 is equipped on the second screw rod 13, is provided with attachment base 15 on the downside of the second sliding block 14,
Third motor 16 is installed, 6 lower end of third motor is equipped with radiator fan 17,8 left and right ends of second sliding slot inside attachment base 15
It is respectively arranged with gag lever post 9 and the first screw rod 10, first motor 11 is fixedly installed on rear side of the first screw rod 10, first motor 11 is set
It sets in the rear end of partition 18, the rotation of the first screw rod 10 is driven by first motor 11, so that second sliding slot 8 be driven to carry out front and back shifting
It is dynamic, during back-and-forth motion, drives the second screw rod 13 to be rotated by the second motor 12, the second sliding block 14 is driven to carry out
It moves left and right, during equipment all around move, drives radiator fan 17 to be blowed by third motor 16,
Wind-cooling heat dissipating can be carried out to integrated circuit board upper surface, can be convenient the wind-cooling heat dissipating of equipment, 18 4 jiaos of partition settings in this way
There is ventilation opening 19, ventilation opening 19 is internally provided with filter screen 20, connect cover 21, upper and lower ends are fixedly installed on rear side of ventilation opening 19
Connect cover 21 be attached by ventilation duct 22, ventilation pump 23 is installed on ventilation duct 22, will area above by ventilation pump 23
The air in domain is pumped into following region, can form a vent passages in this way, can preferably carry out wind-cooling heat dissipating in this way.
Embodiment two
Unlike embodiment one: 1 inner bottom of shell is provided with route winding displacement groove 24,24 inner bottom of route winding displacement groove
End is provided with route winding displacement seat 25, and the route inside electric wire placing groove route winding displacement groove 24 that integrated circuit board can be connected is arranged
On line seat 25, the discharge of electric wire can be convenient in this way.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair
Limitation of the invention.In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply phase
To importance or implicitly indicate the quantity of indicated technical characteristic.The feature for defining " first ", " second " etc. as a result, can
To explicitly or implicitly include one or more of the features.In the description of the present invention, unless otherwise indicated, " multiple "
It is meant that two or more, and it should be noted that unless otherwise clearly defined and limited, term " installation ",
" connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally connect
It connects;It can be mechanical connection, be also possible to be electrically connected;It can be directly connected, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, can be understood by concrete condition above-mentioned
The concrete meaning of term in the present invention.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
Claims (7)
- It is fixed on wall at left and right sides of the enclosure interior 1. a kind of novel universal integrated circuit plate heat dissipating device, including shell (1) It is equipped with link slot (4), is provided with first sliding groove (6) on the two sidewalls of left and right at the top of the shell (1), first sliding groove (6) is internal It is provided with the first sliding block (7), is provided between the first sliding block (7) second sliding slot (8), the internal left end of second sliding slot (8) is provided with Second motor (12), which is characterized in that be connected with the second screw rod (13) on the right side of the second motor (12), the second screw rod is installed on (13) Have the second sliding block (14), be provided with attachment base (15) on the downside of the second sliding block (14), third motor is installed inside attachment base (15) (16), third motor (6) lower end is equipped with radiator fan (17), and second sliding slot (8) left and right ends are respectively arranged with gag lever post (9) With the first screw rod (10), the first screw rod (10) rear side is fixedly installed with first motor (11), and first motor (11) is arranged in partition (18) rear end, partition (18) quadrangle are provided with ventilation opening (19), are fixedly installed with connect cover (21) on rear side of ventilation opening (19), on The connect cover (21) at lower both ends is attached by ventilation duct (22), and ventilation pump (23) is equipped on ventilation duct (22).
- 2. a kind of novel universal integrated circuit plate heat dissipating device according to claim 1, which is characterized in that the shell (1) downside Corner Strapped is equipped with mounting base (2).
- 3. a kind of novel universal integrated circuit plate heat dissipating device according to claim 2, which is characterized in that mounting base (2) Lower end is provided with mounting hole (3).
- 4. a kind of novel universal integrated circuit plate heat dissipating device according to claim 1 or 2, which is characterized in that the shell Body (1) inner bottom is provided with route winding displacement groove (24).
- 5. a kind of novel universal integrated circuit plate heat dissipating device according to claim 4, which is characterized in that route winding displacement groove (24) inner bottom is provided with route winding displacement seat (25).
- 6. a kind of novel universal integrated circuit plate heat dissipating device according to claim 1, which is characterized in that link slot (4) Downside rear and front end is equipped with tightening knob (5).
- 7. a kind of novel universal integrated circuit plate heat dissipating device according to claim 1, which is characterized in that ventilation opening (19) It is internally provided with filter screen (20).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910190230.1A CN109769382B (en) | 2019-03-13 | 2019-03-13 | Novel general integrated circuit board heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910190230.1A CN109769382B (en) | 2019-03-13 | 2019-03-13 | Novel general integrated circuit board heat dissipation device |
Publications (2)
Publication Number | Publication Date |
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CN109769382A true CN109769382A (en) | 2019-05-17 |
CN109769382B CN109769382B (en) | 2020-11-20 |
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CN201910190230.1A Active CN109769382B (en) | 2019-03-13 | 2019-03-13 | Novel general integrated circuit board heat dissipation device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111130312A (en) * | 2020-01-16 | 2020-05-08 | 安徽成业电子科技有限公司 | Switching power supply device and control method thereof |
CN111227278A (en) * | 2020-01-20 | 2020-06-05 | 厉风英 | Raisin moisture removal device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5706169A (en) * | 1996-05-15 | 1998-01-06 | Yeh; Robin | Cooling apparatus for a computer central processing unit |
CN105896347A (en) * | 2016-06-07 | 2016-08-24 | 徐洪军 | Power distribution cabinet with directional heat dissipation function |
CN207518953U (en) * | 2017-11-17 | 2018-06-19 | 惠州威尔高电子有限公司 | A kind of PCB circuit board is prepared with cold wind equipment |
CN207604129U (en) * | 2017-12-21 | 2018-07-10 | 广州泽浩电子有限公司 | A kind of PCB circuit board cabinet cooling device |
CN108776539A (en) * | 2018-08-27 | 2018-11-09 | 刘会 | A kind of computer mainframe box efficient radiating apparatus |
-
2019
- 2019-03-13 CN CN201910190230.1A patent/CN109769382B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5706169A (en) * | 1996-05-15 | 1998-01-06 | Yeh; Robin | Cooling apparatus for a computer central processing unit |
CN105896347A (en) * | 2016-06-07 | 2016-08-24 | 徐洪军 | Power distribution cabinet with directional heat dissipation function |
CN207518953U (en) * | 2017-11-17 | 2018-06-19 | 惠州威尔高电子有限公司 | A kind of PCB circuit board is prepared with cold wind equipment |
CN207604129U (en) * | 2017-12-21 | 2018-07-10 | 广州泽浩电子有限公司 | A kind of PCB circuit board cabinet cooling device |
CN108776539A (en) * | 2018-08-27 | 2018-11-09 | 刘会 | A kind of computer mainframe box efficient radiating apparatus |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111130312A (en) * | 2020-01-16 | 2020-05-08 | 安徽成业电子科技有限公司 | Switching power supply device and control method thereof |
CN111227278A (en) * | 2020-01-20 | 2020-06-05 | 厉风英 | Raisin moisture removal device |
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Publication number | Publication date |
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CN109769382B (en) | 2020-11-20 |
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Denomination of invention: A new type of heat dissipation device for general integrated circuit board Effective date of registration: 20230109 Granted publication date: 20201120 Pledgee: Science and Technology Branch of Torch Development Zone of Zhongshan Rural Commercial Bank Co.,Ltd. Pledgor: ZHONGSHAN XINYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029696 |