CN109701930A - Reduce the wafer cleaning bearing device of scratch and washmarking - Google Patents
Reduce the wafer cleaning bearing device of scratch and washmarking Download PDFInfo
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- CN109701930A CN109701930A CN201811450437.XA CN201811450437A CN109701930A CN 109701930 A CN109701930 A CN 109701930A CN 201811450437 A CN201811450437 A CN 201811450437A CN 109701930 A CN109701930 A CN 109701930A
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- chassis
- wafer
- washmarking
- row
- water flow
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Abstract
The invention discloses the wafer cleaning bearing devices for reducing scratch and washmarking, its structure includes bearing apparatus, structure is arranged in water flow, chassis, operate holding rod, chassis is hollow rectangle framework, two long side middles of chassis are equipped with operation holding rod, holding rod is operated about chassis center central symmetry, operate holding rod and chassis activity cooperation, bearing apparatus of the present invention, structure is arranged in water flow, chassis etc. cooperates jointly, it is fallen into bearing apparatus using chassis is moved left and right by wafer is one-to-one, avoid wafer rubs mutually generation between any two scratch in the process of cleaning, and arrange structure out of water flow and four bearing apparatus formation twocouese of eating dishes without rice or wine is drained, guarantee cleaning after wafer will not upper and lower two end faces do not have cleaning solution, washmarking would not be generated, finally can the notch clamping of total bearing apparatus cleaned the wafer finished.
Description
Technical field
The present invention relates to the wafer cleaning fields of use for electronic products, particularly with regard to a kind of crystalline substance for reducing scratch and washmarking
Circle cleaning bearing device.
Background technique
Wafer refers to silicon chip used in production in silicon semiconductor integrated circuit, and wafer is the main load of integrated circuit
Body, wafer in general sense refer to monocrystalline silicon wafer, and in use, the uniformity on the surface of wafer will affect data and hold
Load or service life, before use, wafer can all clean the spot on its surface using cleaning equipment, to guarantee the equal of its surface
Evenness uses two ways at present, and one is the fixed wafers of use monomer to be cleaned, low efficiency, the cleaning solution liquor ratio of cost
More, another kind is that high-volume is cleaned, and is easy to happen friction between wafer two-by-two, causes scratch, and the wafer after cleaning is logical
Often having is immersed in cleaning solution on one side, has been easy washmarking, therefore the service life of the wafer after cleaning will shorten,
Integrated circuit board is just needed to be replaced frequently using the electronic product of this wafer.
Summary of the invention
In view of the deficiencies of the prior art, the present invention is to realize by the following technical solutions: reducing scratch and washmarking
Wafer cleaning bearing device, structure include bearing apparatus, arrange structure, chassis, operation holding rod in water flow, and the chassis is hollow
Rectangle framework, two long side middles of the chassis are equipped with operation holding rod, and the operation holding rod is about chassis center center
Symmetrically, the operation holding rod and chassis activity cooperation, the chassis inside, which is equipped in more than two water flows, arranges structure, the water
Row's structure head and the tail both ends horizontal is fixed on chassis inner wall in stream, and row structure head and the tail both ends are all equipped with bearing apparatus in the water flow, institute
It is chimeric to state row's structure movement in bearing apparatus and water flow.
As advanced optimizing for the technical program, the bearing apparatus plate, bucket-shaped placement as built in interior discharge orifice, annular
Body, interior flowing flux, notch composition, the bucket-shaped placement body top inner wall are equipped with plate built in annular, plate and bucket built in the annular
Shape placement body is fixed in such a way that level is glued, and the bucket-shaped placement body is hollow structure and its inner space is interior flowing water
Road is uniformly drilled with more than two interior discharge orifices on plate built in the annular, and the bucket-shaped placement body tip edges cut with one
Row's structure movement is chimeric in road notch, the bucket-shaped placement body bottom end and water flow, and it is straight that plate internal diameter built in the annular is less than wafer
Diameter and its outer diameter are greater than diameter wafer.
As advanced optimizing for the technical program, the notch depth reaches 1-1.5cm below plate built in annular.
As advanced optimizing for the technical program, row's structure includes communicating pipe, bottom row, drainage, institute in the water flow
Stating bottom row is "-" type structure, and the bottom row head and the tail both ends horizontal is fixed on chassis inner wall, and bottom row middle is provided with a U
The drainage of type, drainage both ends perforation bottom arranges edge, is vertically connected with communicating pipe in U-shaped drainage turning point, described
Connection pipe end perforation bottom is connected behind row upper surface with bucket-shaped placement body bottom, and the communicating pipe is hollow cylinder structure, institute
State the interior flowing flux and drainage for being connected to bucket-shaped placement body communicating pipe.
As advanced optimizing for the technical program, it is long that the chassis both sides level adjacent with operation holding rod is equipped with semicircle
A, the semicircle strip a and chassis are bonded using glue, and the semicircle strip a uses the elastomer with certain elasticity as steeped
The materials such as foam plastics, rubber are made.
As advanced optimizing for the technical program, four bearing apparatus in water flow in row's structure are horizontal and vertical two-by-two
On be all tangent, and notch and horizontal angle all degree of being on bearing apparatus design in this way, can shape between four bearing apparatus
At eating dishes without rice or wine for class diamond shaped, and the notch on bearing apparatus facilitates finger or instrument to go deep into it at the edge that this is eated dishes without rice or wine
It is middle to take out the wafer being placed on bearing apparatus.
Beneficial effect
The present invention reduces scratch and the wafer cleaning bearing device of washmarking has the advantage that compared with prior art
1. bearing apparatus of the present invention and chassis cooperate jointly, generation vibration is moved left and right using operation holding rod control chassis, is allowed
The wafer for needing to clean is one-to-one to be fallen into bearing apparatus, and avoiding wafer, rubs mutually causes to scrape between any two in the process of cleaning
Trace.
2. arranging structure in bearing apparatus of the present invention, water flow to match, the cleaning solution of cleaning wafer is allowed to be formed from four bearing apparatus
It eats dishes without rice or wine and is discharged together in row's structure in water flow, guarantee that cleaned wafer will not be immersed in cleaning solution, be also not easy above
Washmarking is stayed, guarantees the uniformity of crystal column surface.
3. notch setting of the present invention will not allow wafer to be completely embedded into and hold after wafer is placed on and cleans on bearing apparatus
It can not take out, can successively be protruded into during the formation of four bearing apparatus eats dishes without rice or wine manually or using instrument, built in annular in support device
The wafer in bucket-shaped placement body is grabbed in notch in plate, is drawn off, and convenience is improved.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 is the side schematic view for the wafer cleaning bearing device that the present invention reduces scratch and washmarking.
Fig. 2 is the diagrammatic cross-section for the wafer cleaning bearing device that the present invention reduces scratch and washmarking.
Fig. 3 is the schematic perspective view of bearing apparatus of the present invention.
Fig. 4 is the schematic top plan view of bearing apparatus of the present invention.
Fig. 5 is the schematic top plan view for the wafer cleaning bearing device that the present invention reduces scratch and washmarking.
Fig. 6 is the structural schematic diagram for the wafer cleaning bearing device cross section that the present invention reduces scratch and washmarking.
In figure: row's structure 2 in bearing apparatus 1, water flow, chassis 3, operation holding rod 4, interior discharge orifice 11, plate 12, bucket built in annular
22, drainage 23, semicircle strip 3a are arranged in shape placement body 13, interior flowing flux 14, notch 15, communicating pipe 21, bottom.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment and Detailed description of the invention, the preferred embodiment that the present invention is further explained.
Embodiment
Fig. 1-Fig. 6 is please referred to, the present invention provides the wafer cleaning bearing device for reducing scratch and washmarking, and structure includes holding
The interior row's structure 2 of device 1, water flow, chassis 3, operation holding rod 4 are held in the palm, the chassis 3 is hollow rectangle framework, the chassis 3 two
Long side middle is equipped with operation holding rod 4, and the operation holding rod 4 is about 3 center central symmetry of chassis, 4 He of operation holding rod
3 activity of chassis cooperates, and is equipped in more than two water flows inside the chassis 3 and arranges structure 2, and 2 head and the tail of structure are arranged in the water flow
Both ends horizontal is fixed on 3 inner wall of chassis, and row 2 head and the tail both ends of structure are all equipped with bearing apparatus 1,1 He of bearing apparatus in the water flow
2 activity of row's structure is chimeric in water flow.
The bearing apparatus 1 plate 12, bucket-shaped placement body 13, interior flowing flux 14,15 groups of notch as built in interior discharge orifice 11, annular
At the bucket-shaped 13 top inner wall of placement body is equipped with plate 12 built in annular, and plate 12 and bucket-shaped placement body 13 are adopted built in the annular
It is fixed with the mode that level is glued, the bucket-shaped placement body 13 is hollow structure and its inner space is interior flowing flux 14, described
More than two interior discharge orifices 11 are uniformly drilled with built in annular on plate 12, bucket-shaped 13 tip edges of placement body are cut with together
2 activity of row's structure is chimeric in notch 15, bucket-shaped 13 bottom end of placement body and water flow, and 12 internal diameter of plate built in the annular is less than crystalline substance
Circular diameter and its outer diameter are greater than diameter wafer.
15 depth of notch reaches 12 or less 1-1.5cm of plate built in annular, and wafer is facilitated to be placed on plate 12 built in annular
On clean up after, take out again.
Row's structure 2 includes communicating pipe 21, bottom row 22, drainage 23 in the water flow, and the bottom row 22 is "-" type structure,
The bottom arranges 22 head and the tail both ends horizontals and is fixed on 3 inner wall of chassis, and the bottom arranges 22 middles and is provided with a U-shaped drainage 23,
22 edges are arranged at 23 both ends of drainage perforation bottom, are vertically connected with communicating pipe 21, the connection in U-shaped 23 turning point of drainage
21 end of pipe perforation bottom is connected after arranging 22 upper surfaces with bucket-shaped 13 bottom of placement body, and the communicating pipe 21 is hollow cylinder knot
Structure is connected to the interior flowing flux 14 and drainage 23 of bucket-shaped placement body 13 communicating pipe 21.
The chassis 3 both sides level adjacent with operation holding rod 4 is equipped with semicircle strip 3a, the semicircle strip 3a and chassis
3 are bonded using glue, and the semicircle strip 3a uses the materials systems such as the elastomer such as foamed plastics, rubber with certain elasticity
At, operate holding rod 4 control chassis 3 move left and right collide with cleaning equipment inner wall when, noise will not be generated.
Four bearing apparatus 1 in water flow in row's structure 2 are all tangent on horizontal and vertical two-by-two, and on bearing apparatus 1
Notch 15 and horizontal angle be all 45 degree, design in this way, will form the sky of a class diamond shaped between four bearing apparatus 1
Mouthful, and the notch 15 on bearing apparatus 1 facilitates finger or instrument deeply wherein to take out and is placed on support at the edge that this is eated dishes without rice or wine
Wafer on device 1.
The present invention is mounted in the sink of wafer cleaning equipment, will need batch wafer used in clean electronic product
It is placed into 1 top of bearing apparatus, level moves left and right chassis 3, and the wafer being placed on above can not stop to be swung left and right because vibrating, and one
Denier wafer is located at right above the bucket-shaped placement body 13 of bearing apparatus 1, will directly fall built in annular on plate 12, in cleaning process
In scratch would not occur because of friction, not because four bearing apparatus 1 in water flow in row's structure 2 are horizontal and vertical two-by-two
On be all it is tangent, the problem of wafer falls bottom of gullet can't occur in vibration processes, and move left and right and touch in chassis 3
When contacting inboard wall of cistern, since presence and its of semicircle strip 3a use material to have certain elasticity, it can't be issued when touching
The sound generates noise；
The wafer built in annular on plate 12 is then placed on using cleaning solution cleaning, a part of cleaning solution can be from four supports
The formation of device 1 is fallen in the sink of wafer cleaning equipment in eating dishes without rice or wine, and another part cleaning solution, can be from interior stream during cleaning wafer
Water hole 11 drops to interior flowing flux 14, is expelled to wafer via the drainage 23 of bottom row 22 along bottom row 22 is circulated to communicating pipe 21
In the sink of cleaning equipment, guarantee that the wafer of cleaning will not be immersed in cleaning solution after cleaning, former and later two end faces of wafer are all
Keep clean, anhydrous residual, that is, washmarking is not had on wafer；
After cleaning, manually or using instrument successively protrude into during the formation of four bearing apparatus 1 eats dishes without rice or wine, built in annular
The wafer in bucket-shaped placement body 13 is grabbed in notch 15 in plate 12, is drawn off.
Problems solved by the invention is that high-volume is cleaned, and is easy to happen friction between wafer two-by-two, causes scratch, and clear
Wafer after washing usually has to be immersed in cleaning solution on one side, has been easy washmarking, therefore the use of the wafer after cleaning
Service life will shorten, and just need to be replaced frequently integrated circuit board using the electronic product of this wafer, the present invention passes through above-mentioned portion
Part is combined with each other, and the common cooperation such as row's structure 2, chassis 3, is allowed using chassis 3 is moved left and right in bearing apparatus 1 of the present invention, water flow
Wafer is one-to-one to be fallen into bearing apparatus 1, avoids in the process of cleaning that rubs mutually generates scratch to wafer between any two, and from water flow
Interior row's structure 2 and four bearing apparatus 1 form twocouese of eating dishes without rice or wine and drain, and the wafer after guaranteeing cleaning will not upper and lower two end faces
Do not have cleaning solution, washmarking would not be generated, finally can the notch 15 of total bearing apparatus 1 clamp the cleaned crystalline substance finished
Circle.
The basic principles, main features and advantages of the present invention have been shown and described above, the technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention can not only be realized in other specific forms under the premise of not departing from spirit of that invention or essential characteristic
The present invention will also have various changes and improvements, these changes and improvements both fall within scope of the claimed invention, therefore this hair
Bright claimed range is defined by appended claims and its equivalent, rather than above description limits.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (6)
1. reducing the wafer cleaning bearing device of scratch and washmarking, it is characterised in that: its structure includes bearing apparatus (1), in water flow
Structure (2), chassis (3), operation holding rod (4) are arranged, the chassis (3) is hollow rectangle framework, and the chassis is (3) two long
Side middle is equipped with operation holding rod (4), the operation holding rod (4) and chassis (3) activity cooperation, is equipped with inside the chassis (3)
Structure (2) are arranged in more than two water flows, row structure (2) head and the tail both ends are all equipped with bearing apparatus (1), the support in the water flow
Row structure (2) activity is chimeric in device (1) and water flow.
2. the wafer cleaning bearing device according to claim 1 for reducing scratch and washmarking, it is characterised in that: the support
Device (1) plate (12), bucket-shaped placement body (13), interior flowing flux (14), notch (15) built in interior discharge orifice (11), annular form,
Bucket-shaped placement body (13) the top inner wall be equipped with annular built in plate (12), the bucket-shaped placement body (13) be hollow structure and its
Inner space is interior flowing flux (14), is uniformly drilled with more than two interior discharge orifices (11), institute on plate (12) built in the annular
It states bucket-shaped placement body (13) tip edges to cut with one of notch (15), row's knot in bucket-shaped placement body (13) bottom end and water flow
Structure (2) activity is chimeric.
3. the wafer cleaning bearing device according to claim 2 for reducing scratch and washmarking, it is characterised in that: the notch
(15) depth reaches plate built in annular (12) following 1-1.5cm.
4. the wafer cleaning bearing device according to claim 1 or 2 for reducing scratch and washmarking, it is characterised in that: described
Row structure (2) includes communicating pipe (21), bottom row (22), drainage (23) in water flow, and the bottom row (22) is "-" type structure, institute
It states bottom row's (22) head and the tail both ends horizontal and is fixed on chassis (3) inner wall, the bottom row (22) middle is provided with a U-shaped drainage
(23), (22) edge is arranged at drainage (23) both ends perforation bottom, is vertically connected with communicating pipe in U-shaped drainage (23) turning point
(21), it is connected behind row (22) upper surface of communicating pipe (21) end perforation bottom with bucket-shaped placement body (13) bottom, the company
Siphunculus (21) is connected to the interior flowing flux (14) and drainage (23) of bucket-shaped placement body (13).
5. the wafer cleaning bearing device according to claim 4 for reducing scratch and washmarking, it is characterised in that: the chassis
(3) the both sides level adjacent with operation holding rod (4) is equipped with semicircle strip (3a).
6. the wafer cleaning bearing device according to claim 4 for reducing scratch and washmarking, it is characterised in that: water flow two-by-two
Four bearing apparatus (1) on interior row's structure (2) are all tangent on horizontal and vertical, and the notch (15) on bearing apparatus (1)
It is all 45 degree with horizontal angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811450437.XA CN109701930A (en) | 2018-11-30 | 2018-11-30 | Reduce the wafer cleaning bearing device of scratch and washmarking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811450437.XA CN109701930A (en) | 2018-11-30 | 2018-11-30 | Reduce the wafer cleaning bearing device of scratch and washmarking |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109701930A true CN109701930A (en) | 2019-05-03 |
Family
ID=66255474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811450437.XA Withdrawn CN109701930A (en) | 2018-11-30 | 2018-11-30 | Reduce the wafer cleaning bearing device of scratch and washmarking |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109701930A (en) |
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| CN206793749U (en) * | 2017-06-12 | 2017-12-26 | 李春玉 | A kind of chemical experiment rack for test tube |
| CN107900022A (en) * | 2017-11-27 | 2018-04-13 | 珠海东锦石英科技有限公司 | Quartz wafer ground and cleaned machine and its ground and cleaned technique |
| CN108140595A (en) * | 2015-09-30 | 2018-06-08 | 盛美半导体设备（上海）有限公司 | Wafer cleaning device and method |
| CN207503939U (en) * | 2017-09-10 | 2018-06-15 | 山西飞虹微纳米光电科技有限公司 | A kind of gaily decorated basket for being used to clean chip |
| CN207558774U (en) * | 2017-12-05 | 2018-06-29 | 武汉锐晶激光芯片技术有限公司 | A kind of bogey for plasma etching monitoring |
| CN108262274A (en) * | 2018-03-07 | 2018-07-10 | 张志通 | A kind of gear face cleaning device |
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2018
- 2018-11-30 CN CN201811450437.XA patent/CN109701930A/en not_active Withdrawn
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6322743U (en) * | 1986-07-29 | 1988-02-15 | ||
| JPS6386523A (en) * | 1986-09-30 | 1988-04-16 | Toshiba Corp | Semiconductor manufacture equipment |
| CN201913087U (en) * | 2010-09-29 | 2011-08-03 | 中国科学院苏州纳米技术与纳米仿生研究所 | Improved structure of polyfluortetraethylene cleaning flower basket |
| CN202366903U (en) * | 2011-12-23 | 2012-08-08 | 重庆卓驰生物科技有限公司 | Rinse tank |
| CN203578326U (en) * | 2013-10-10 | 2014-05-07 | 江苏协鑫硅材料科技发展有限公司 | Silicon cleaning basket |
| CN108140595A (en) * | 2015-09-30 | 2018-06-08 | 盛美半导体设备（上海）有限公司 | Wafer cleaning device and method |
| CN206793749U (en) * | 2017-06-12 | 2017-12-26 | 李春玉 | A kind of chemical experiment rack for test tube |
| CN207503939U (en) * | 2017-09-10 | 2018-06-15 | 山西飞虹微纳米光电科技有限公司 | A kind of gaily decorated basket for being used to clean chip |
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| CN108262274A (en) * | 2018-03-07 | 2018-07-10 | 张志通 | A kind of gear face cleaning device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190503 |