CN109687084A - A kind of high-power 3dB power combing distributor - Google Patents
A kind of high-power 3dB power combing distributor Download PDFInfo
- Publication number
- CN109687084A CN109687084A CN201811583005.6A CN201811583005A CN109687084A CN 109687084 A CN109687084 A CN 109687084A CN 201811583005 A CN201811583005 A CN 201811583005A CN 109687084 A CN109687084 A CN 109687084A
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- CN
- China
- Prior art keywords
- power
- substrate
- layer
- combing distributor
- power combing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
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- Semiconductor Integrated Circuits (AREA)
Abstract
The invention discloses a kind of high-power 3dB power combing distributors, realize by using the mode of broadside coupled striplines, circuit structure is laminated by three laminar substrates.The power combing distributor includes bottom plate (1), underlying substrate (2), middle laminar substrate (3), top substrate layer (4), top plate (5), matched load (6), wherein, the bottom plate (1) is used to fasten upper, middle and lower-ranking substrate with top plate (5), and as good signal ground plane；The underlying substrate (2), middle laminar substrate (3), top substrate layer (4) stacking constitute broadside coupled striplines structure together.The 3dB power splitter is power combing and the distribution for meeting microwave high power, and guarantees that power splitter has good isolation, and circuit small volume.
Description
Technical field
The invention belongs to microwave power synthesis technical field, a kind of high-power 3dB power combing distributor.
Background technique
Microwave power synthesis is widely used in microwave circuits with distributor circuit, is a kind of basic microwave passive electricity
Road.3dB power splitter is generally realized that the isolation resistance of output port is big in HIGH-POWERED MICROWAVES circuit by Wilkinson power divider
Power resistor, and the parasitic parameter of high-power resistance is larger, causes to make the output port isolation of power splitter in microwave frequency
Decline, and Wilkinson power divider volume is larger, is not easy to realize Miniaturization Design.
The present invention provides a kind of high-power 3dB power combing dispenser designs methods, by using broadside coupled band-like
The mode of line is realized, that is, meets power combing and the distribution of microwave high power, and guarantees that power splitter has good isolation,
And circuit small volume.
Summary of the invention
The present invention realizes 3dB close coupling by using the broadside coupled structure of strip line, real in the way of power coupling
The power distribution of existing microwave signal, 90 degree of the phase phase difference of two power distribution output ports.
In order to solve the above-mentioned technical problem, the adopted technical solution is that: a kind of high-power 3dB power closes
At distributor, which is characterized in that the power combing distributor includes bottom plate, underlying substrate, middle laminar substrate, top substrate layer, top
Plate, matched load, wherein the bottom plate is used to fasten upper, middle and lower-ranking substrate with top plate, and as good signal
Ground plane；The underlying substrate, middle laminar substrate, top substrate layer stacking constitute broadside coupled striplines structure together.
The present invention realizes following beneficial technical effect:
The configuration of the present invention is simple, technique is realisation strong, can greatly improve the isolation of existing high-power 3dB power splitter
It can index；The present invention is smaller compared to Wilkinson power divider circuit size, it is easy to accomplish microwave circuit Miniaturization Design.
Detailed description of the invention
Fig. 1 is circuit structure diagram of the present invention；
Fig. 2 is circuit structure diagram of the present invention；
Fig. 3 is circuit structure diagram of the present invention；
Fig. 4 is circuit structure diagram of the present invention；
Fig. 5 is circuit structure diagram of the present invention.
Specific embodiment
Below by specific embodiment, present invention is further described in detail, but these embodiments are only that citing
Illustrate, the scope of the present invention is not defined.
A kind of high-power 3dB power combing distributor of the invention, including bottom plate 1, underlying substrate 2, middle laminar substrate 3, on
Laminar substrate 4, top plate 5, matched load 6.
Wherein, bottom plate 1 is used to fasten three laminar substrates with top plate 5, and as good signal ground plane.
Wherein, underlying substrate 2, middle laminar substrate 3, the stacking of top substrate layer 4 constitute broadside coupled striplines structure together.
Wherein, 2 bottom of underlying substrate all covers the gold-plated formation good earth face of copper, designs micro-strip output port on top layer,
Underlying substrate 2 is with a thickness of h1；
Wherein, middle laminar substrate 3 couples line width w, coupling in bottom and Top-layer Design Method L-type broadside coupled striplines structure
Width s, middle laminar substrate 3 is with a thickness of h2.
Wherein, 4 top layer of top substrate layer all covers the gold-plated formation good earth face of copper, and bottom is designed without circuit trace, upper layer
Substrate 4 is with a thickness of h1；
Wherein, substrate thickness h1, h2 can be selected according to actual use demand and processing request, couple line width w, coupling
It closes width s and simulation calculation is then carried out according to the size of h1, h2.
Wherein, matched load 6 is matched for port Impedance, and in power distribution port Impedance mismatch as power absorption
Resistance.
Beneficial effects of the present invention: the present invention provides a kind of high-power 3dB power combing distributors, by using broadside
The mode of coupling strip line is realized, that is, meets power combing and the distribution of microwave high power, and it is good to guarantee that power splitter has
Isolation, and circuit small volume.
Although the present invention has chosen preferable embodiment and discloses as above, it is not intended to limit the present invention.Obviously, it is not necessarily to here
Also all embodiments can not be exhaustive.Any this field researcher without departing from the spirit and scope of the present invention,
The design method and content that all can be used in embodiment disclosed above are changed and are modified to research approach of the invention, because
This, all contents without departing from the present invention program, research essence according to the present invention is to any simple made by above-described embodiment
Modification, Parameters variation and modification, belong to the protection scope of the present invention program.
Claims (6)
1. a kind of high-power 3dB power combing distributor, which is characterized in that the power combing distributor includes bottom plate (1), under
Laminar substrate (2), middle laminar substrate (3), top substrate layer (4), top plate (5), matched load (6), wherein
The bottom plate (1) is used to fasten upper, middle and lower-ranking substrate with top plate (5), and flat as good signal ground connection
Face；
The underlying substrate (2), middle laminar substrate (3), top substrate layer (4) stacking constitute broadside coupled striplines structure together.
2. high-power 3dB power combing distributor according to claim 1, which is characterized in that underlying substrate (2) bottom
Layer all covers the gold-plated formation good earth face of copper, and setting micro-strip exports branch port on top layer, and underlying substrate (2) is with a thickness of h1.
3. high-power 3dB power combing distributor according to claim 1, which is characterized in that the middle laminar substrate (3) exists
Bottom and Top-layer Design Method L-type broadside coupled striplines structure, coupling line width w, coupling width s, middle laminar substrate (3) with a thickness of
h2。
4. high-power 3dB power combing distributor according to claim 1, which is characterized in that top substrate layer (4) top
Layer all covers the gold-plated formation good earth face of copper, and top substrate layer (4) is with a thickness of h1.
5. high-power 3dB power combing distributor according to claim 2 or 4, which is characterized in that substrate upper layer base
The thickness h 1 of plate and underlying substrate, h2 can be selected according to actual use demand and processing request, coupling line width w, coupling
Width s then carries out simulation calculation according to the size of h1, h2.
6. high-power 3dB power combing distributor according to claim 1, matched load (6) is matched for port Impedance,
And in power distribution port Impedance mismatch as power absorption resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811583005.6A CN109687084A (en) | 2018-12-24 | 2018-12-24 | A kind of high-power 3dB power combing distributor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811583005.6A CN109687084A (en) | 2018-12-24 | 2018-12-24 | A kind of high-power 3dB power combing distributor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109687084A true CN109687084A (en) | 2019-04-26 |
Family
ID=66188237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811583005.6A Pending CN109687084A (en) | 2018-12-24 | 2018-12-24 | A kind of high-power 3dB power combing distributor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109687084A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021037132A1 (en) * | 2019-08-30 | 2021-03-04 | 京东方科技集团股份有限公司 | Feed structure, microwave radio frequency device and antenna |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000165116A (en) * | 1998-11-26 | 2000-06-16 | Kyocera Corp | Directional coupler |
| CN202308259U (en) * | 2011-09-08 | 2012-07-04 | 安徽四创电子股份有限公司 | Miniaturized coupler |
| CN202839930U (en) * | 2012-08-28 | 2013-03-27 | 京信通信系统（广州）有限公司 | Novel suspended strip line bridge |
-
2018
- 2018-12-24 CN CN201811583005.6A patent/CN109687084A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000165116A (en) * | 1998-11-26 | 2000-06-16 | Kyocera Corp | Directional coupler |
| CN202308259U (en) * | 2011-09-08 | 2012-07-04 | 安徽四创电子股份有限公司 | Miniaturized coupler |
| CN202839930U (en) * | 2012-08-28 | 2013-03-27 | 京信通信系统（广州）有限公司 | Novel suspended strip line bridge |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021037132A1 (en) * | 2019-08-30 | 2021-03-04 | 京东方科技集团股份有限公司 | Feed structure, microwave radio frequency device and antenna |
| US11837796B2 (en) | 2019-08-30 | 2023-12-05 | Beijing Boe Sensor Technology Co., Ltd. | Feeding structure, microwave radio frequency device and antenna |
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Legal Events
| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Hu Tiantao Inventor after: Du Yong Inventor after: Huang Yingqian Inventor before: Hu Tiantao |
|
| CB03 | Change of inventor or designer information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190426 |
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| RJ01 | Rejection of invention patent application after publication |