CN109679548A - A kind of modified phenolic resin adhesive and preparation method thereof - Google Patents

A kind of modified phenolic resin adhesive and preparation method thereof Download PDF

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Publication number
CN109679548A
CN109679548A CN201811565824.8A CN201811565824A CN109679548A CN 109679548 A CN109679548 A CN 109679548A CN 201811565824 A CN201811565824 A CN 201811565824A CN 109679548 A CN109679548 A CN 109679548A
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China
Prior art keywords
phenolic resin
parts
reaction vessel
resin adhesive
modified phenolic
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Pending
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CN201811565824.8A
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Chinese (zh)
Inventor
施晓旦
孙海强
赵吉
郑璐
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Shanghai Changfa New Materials Co Ltd
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Shanghai Changfa New Materials Co Ltd
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Priority to CN201811565824.8A priority Critical patent/CN109679548A/en
Publication of CN109679548A publication Critical patent/CN109679548A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C09J161/14Modified phenol-aldehyde condensates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/10Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28Chemically modified polycondensates

Abstract

The present invention relates to a kind of modified phenolic resin adhesives, are applied to particieboard, and constituent is as follows according to parts by weight: 1~10 part of phenol;1~10 part of bio-extract;2~30 parts of formaldehyde;0.1~10 part of basic catalyst;0.1~5 part of water.Further relate to a kind of preparation method of modified phenolic resin adhesive.It the advantage is that, phenol is substituted using bio-extract, production cost can be greatly lowered, enhance the competitiveness of modified phenolic resin adhesive;Bio-extract is papermaking waste, is recycled, and environmental pressure is reduced;Modified phenolic resin adhesive is applied on particieboard, so that can continue to react with formaldehyde after wood shavings sheet metal forming, reduces the content of formaldehyde in particieboard;The viscosity of modified phenolic resin adhesive is relatively low, so that modified phenolic resin adhesive can be made to be sufficiently mixed with sawdust when particieboard mixes glue, guarantees the pressing plate quality of particieboard.

Description

A kind of modified phenolic resin adhesive and preparation method thereof
Technical field
The present invention relates to phenolic resins field more particularly to a kind of modified phenolic resin adhesive and its preparation sides Method.
Background technique
Particieboard is called bagasse board, the particle made of timber or other ligno-cellulosic materials, apply adhesive after The wood-based plate composed under heating power and pressure effect, also known as flakeboard.Particieboard physical and mechanical property with higher, is considered It is the cheap substitute products of ideal of the following glued board.
In recent years, with the fast development of China particieboard market, the dynamics of social investment Particleboard Project is constantly reinforced, I State's particieboard single line production scale that is averaged increases year by year, and equipment technology level is continuously improved, and produces in newly-built some particieboards In line, there are many enterprises to use the continuous press for representing world's particieboard equipment advanced level.
The wind of private customized household is blowing the past whole nation at present, higher to the quality requirements of plate raw material, especially aldehyde Content and intensity.But based on the low-and-medium-grade products that current China's wood shavings panel products are suppressed with urea-formaldehyde glue, high-end quality product ratio Only 30%.Adhesive used in high-end product is largely phenol glue, is secondly melamine glue, finally some is big Bean gum.
Existing phenol glue is when particieboard mixes glue, since the viscosity of phenol glue is larger, so that phenol glue and sawdust can not It is sufficiently mixed, and then causes intensity when particieboard pressing plate inadequate.In addition, the production cost of existing phenol glue is higher, it can not Large-scale application.
Therefore, a kind of reduction production cost is needed, viscosity is reduced, makes phenol glue and the well-mixed phenolic resin glue of sawdust Glutinous agent.
Summary of the invention
The purpose of the present invention is aiming at the shortcomings in the prior art, provide a kind of modified phenolic resin adhesive and its preparation Method.
To achieve the above object, the technical solution adopted by the present invention is that:
A kind of modified phenolic resin adhesive is applied to particieboard, and constituent is as follows according to parts by weight:
1~10 part of phenol
1~10 part of bio-extract
2~30 parts of formaldehyde
0.1~10 part of basic catalyst
0.1~5 part of water.
Preferably, the bio-extract is papermaking waste, and the papermaking waste is rotten slurry, screenings, medicament waste liquid One of wood skin, pulping waste liquor extract, siliceous white clay or a variety of mixtures.
Preferably, the bio-extract is solid or the liquid with certain solid content.
Preferably, the basic catalyst is barium hydroxide, calcium hydroxide, sodium hydroxide, sodium carbonate, sodium bicarbonate, Asia One of sodium sulphate or a variety of mixtures.
Preferably, the water is deionized water.
The present invention also provides a kind of preparation methods of modified phenolic resin adhesive, which comprises the following steps:
Phenol, basic catalyst are proportionally added into reaction vessel by step 1, are warming up to 40~80 DEG C, and keep the temperature one It fixes time;
The formaldehyde of first mass is added into the reaction vessel step 2, in 40~80 DEG C of held for some time;
Step 3 is warming up to 60~80 DEG C, and the formaldehyde of the second mass is added into the reaction vessel, and keeps the temperature certain Time;
Bio-extract is proportionally added into the reaction vessel by step 4, in 60~80 DEG C of held for some time;
The formaldehyde of third quality is added into the reaction vessel step 5, in 60~80 DEG C of held for some time;
Step 6 is cooled to 25 DEG C, discharges after held for some time.
Preferably, in the step 4, the pH value in the reaction vessel is 8~12.
Preferably, the first mass is greater than the second mass, and the second mass is greater than third quality.
Preferably, in the step 3, water is proportionally added into the reaction vessel.
Preferably, in the step 5, water is proportionally added into the reaction vessel.
Preferably, in the step 1, in 40~80 DEG C of 10~50min of heat preservation.
Preferably, in the step 1, in 40~80 DEG C of 10~30min of heat preservation.
Preferably, in the step 2, in 40~80 DEG C of 10~50min of heat preservation.
Preferably, in the step 2, in 40~80 DEG C of 10~30min of heat preservation.
Preferably, in the step 3,60~80 DEG C are warming up in 30~60min.
Preferably, in the step 3, in 60~80 DEG C of 30~80min of heat preservation.
Preferably, in the step 3, in 60~80 DEG C of 30~50min of heat preservation.
Preferably, in the step 4, in 60~80 DEG C of 30~90min of heat preservation.
Preferably, in the step 5, in 60~80 DEG C of 10~50min of heat preservation.
Preferably, in the step 5, in 60~80 DEG C of 10~30min of heat preservation.
Preferably, in the step 6, in 25 DEG C of 5~20min of heat preservation.
Preferably, in the step 6, in 25 DEG C of 10~20min of heat preservation.
The invention adopts the above technical scheme, compared with prior art, has the following technical effect that
A kind of modified phenolic resin adhesive of the invention and preparation method thereof substitutes phenol, energy using bio-extract Production cost is enough greatly lowered, enhances the competitiveness of modified phenolic resin adhesive;Bio-extract is papermaking waste, is followed Ring utilizes, and reduces environmental pressure;Modified phenolic resin adhesive is applied on particieboard, so that after wood shavings sheet metal forming, Neng Gouji It is continuous to be reacted with formaldehyde, reduce the content of formaldehyde in particieboard;The viscosity of modified phenolic resin adhesive is relatively low, so that digging When card mixes glue, modified phenolic resin adhesive can be made to be sufficiently mixed with sawdust, guarantee the pressing plate quality of particieboard.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described, Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention Embodiment, those of ordinary skill in the art's every other embodiment obtained without creative labor, It shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase Mutually combination.
The present invention is further explained in the light of specific embodiments, but not as the limitation of the invention.
Embodiment 1
A kind of modified phenolic resin adhesive of the present embodiment, is made of the raw material of following parts by weight:
10 parts of phenol, 1 part of pulping waste liquor extract, 15 parts of formaldehyde, 0.1 part of sodium hydroxide, 5 parts of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
10 parts of phenol, 0.1 part of sodium hydroxide are added into reaction vessel step 1, are warming up to 50 DEG C, and keep the temperature 30min;
10 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are kept the temperature at 50 DEG C 30min;
Step 3 is to slowly warm up to 80 DEG C in 40min, using pump is added dropwise with rate of addition appropriate by 4 parts of formaldehyde and 5 Part water is added into reaction vessel, in 80 DEG C of heat preservation 50min;
Step 4, detection reaction vessel in pH value, pH value be 8~12 when, by 1 part of pulping waste liquor extract be added to In reaction vessel, in 80 DEG C of heat preservation 90min;
1 part of formaldehyde is added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 5, is kept the temperature at 60 DEG C 30min;
Reaction vessel is cooled to 25 DEG C by step 6, is discharged after keeping the temperature 10min.
Embodiment 2
A kind of modified phenolic resin adhesive of the present embodiment, is made of the raw material of following parts by weight:
5 parts of phenol, 5 parts of pulping waste liquor extract, 30 parts of formaldehyde, 2.5 parts of sodium hydroxide, 2.5 parts of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
5 parts of phenol, 2.5 parts of sodium hydroxides are added into reaction vessel step 1, are warming up to 50 DEG C, and keep the temperature 30min;
20 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are kept the temperature at 50 DEG C 30min;
Step 3 is to slowly warm up to 80 DEG C in 40min, and 7 parts of formaldehyde are added with rate of addition appropriate using pump is added dropwise Into reaction vessel, in 80 DEG C of heat preservation 50min;
Step 4, detection reaction vessel in pH value, pH value be 8~12 when, by 5 parts of pulping waste liquor extracts be added to In reaction vessel, in 80 DEG C of heat preservation 90min;
3 parts of formaldehyde and 2.5 parts of water are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 5, 60 DEG C of heat preservation 30min;
Reaction vessel is cooled to 25 DEG C by step 6, is discharged after keeping the temperature 10min.
Embodiment 3
A kind of modified phenolic resin adhesive of the present embodiment, is made of the raw material of following parts by weight:
1 part of phenol, 10 parts of pulping waste liquor extract, 2 parts of formaldehyde, 10 parts of sodium hydroxide, 0.1 part of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
1 part of phenol, 10 parts of sodium hydroxides are added into reaction vessel step 1, are warming up to 50 DEG C, and keep the temperature 30min;
1.5 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are protected at 50 DEG C Warm 30min;
Step 3 is to slowly warm up to 80 DEG C in 40min, is added 0.3 part of formaldehyde with rate of addition appropriate using pump is added dropwise Enter into reaction vessel, in 80 DEG C of heat preservation 50min;
Step 4, detection reaction vessel in pH value, pH value be 8~12 when, by 10 parts of pulping waste liquor extracts be added to In reaction vessel, in 80 DEG C of heat preservation 90min;
0.2 part of formaldehyde and 0.1 part of water are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 5, In 60 DEG C of heat preservation 30min;
Reaction vessel is cooled to 25 DEG C by step 6, is discharged after keeping the temperature 10min.
Embodiment 4
A kind of modified phenolic resin adhesive of the present embodiment, is made of the raw material of following parts by weight:
10 parts of phenol, rotten slurry 1 part, 15 parts of formaldehyde, 0.1 part of barium hydroxide, 5 parts of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
10 parts of phenol, 0.1 part of barium hydroxide are added into reaction vessel step 1, are warming up to 40 DEG C, and keep the temperature 10min;
10 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are kept the temperature at 80 DEG C 20min;
Step 3 is to slowly warm up to 70 DEG C in 30min, using pump is added dropwise with rate of addition appropriate by 4 parts of formaldehyde and 5 Part water is added into reaction vessel, in 60 DEG C of heat preservation 40min;
1 part of rotten slurry is added into reaction vessel when pH value is 8~12 for pH value in step 4, detection reaction vessel, In 60 DEG C of heat preservation 80min;
1 part of formaldehyde is added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 5, is kept the temperature at 80 DEG C 30min;
Reaction vessel is cooled to 25 DEG C by step 6, is discharged after keeping the temperature 5min.
Embodiment 5
A kind of modified phenolic resin adhesive of the present embodiment, is made of the raw material of following parts by weight:
5 parts of phenol, rotten slurry 5 parts, 30 parts of formaldehyde, 2.5 parts of barium hydroxide, 2.5 parts of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
5 parts of phenol, 2.5 parts of barium hydroxides are added into reaction vessel step 1, are warming up to 40 DEG C, and keep the temperature 10min;
20 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are kept the temperature at 80 DEG C 20min;
Step 3 is to slowly warm up to 70 DEG C in 30min, and 7 parts of formaldehyde are added with rate of addition appropriate using pump is added dropwise Into reaction vessel, in 60 DEG C of heat preservation 40min;
5 parts of rotten slurries are added into reaction vessel when pH value is 8~12 for pH value in step 4, detection reaction vessel, In 70 DEG C of heat preservation 80min;
3 parts of formaldehyde and 2.5 parts of water are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 5, 70 DEG C of heat preservation 30min;
Reaction vessel is cooled to 25 DEG C by step 6, is discharged after keeping the temperature 5min.
Embodiment 6
A kind of modified phenolic resin adhesive of the present embodiment, is made of the raw material of following parts by weight:
1 part of phenol, rotten slurry 10 parts, 2 parts of formaldehyde, 10 parts of barium hydroxide, 0.1 part of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
1 part of phenol, 10 parts of barium hydroxides are added into reaction vessel step 1, are warming up to 40 DEG C, and keep the temperature 10min;
1.5 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are protected at 80 DEG C Warm 20min;
Step 3 is to slowly warm up to 70 DEG C in 30min, is added 0.3 part of formaldehyde with rate of addition appropriate using pump is added dropwise Enter into reaction vessel, in 60 DEG C of heat preservation 40min;
10 parts of rotten slurries are added to reaction vessel when pH value is 8~12 for pH value in step 4, detection reaction vessel In, in 70 DEG C of heat preservation 80min;
0.2 part of formaldehyde and 0.1 part of water are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 5, In 70 DEG C of heat preservation 30min;
Reaction vessel is cooled to 25 DEG C by step 6, is discharged after keeping the temperature 5min.
Embodiment 7
A kind of modified phenolic resin adhesive of the present embodiment, is made of the raw material of following parts by weight:
10 parts of phenol, 0.5 part of screenings, 0.5 part of medicament waste liquid wood skin, 15 parts of formaldehyde, calcium hydroxide 0.05, sodium sulfite 0./05 part, 5 parts of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
10 parts of phenol, 0.05 part of calcium hydroxide, 0.05 part of sodium sulfite are added into reaction vessel step 1, are warming up to 80 DEG C, and keep the temperature 10min;
10 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are kept the temperature at 40 DEG C 10min;
Step 3 is to slowly warm up to 60 DEG C in 30min, using pump is added dropwise with rate of addition appropriate by 4 parts of formaldehyde and 5 Part water is added into reaction vessel, in 70 DEG C of heat preservation 30min;
PH value in step 4, detection reaction vessel, when pH value is 8~12, by 0.5 part of screenings, 0.5 part of medicament waste liquid Wood skin is added into reaction vessel, in 60 DEG C of heat preservation 100min;
1 part of formaldehyde is added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 5, is kept the temperature at 60 DEG C 30min;
Reaction vessel is cooled to 25 DEG C by step 6, is discharged after keeping the temperature 5min.
Embodiment 8
A kind of modified phenolic resin adhesive of the present embodiment, is made of the raw material of following parts by weight:
5 parts of phenol, 2.5 parts of screenings, 2.5 parts of medicament waste liquid wood skin, 30 parts of formaldehyde, 1.25 parts of calcium hydroxide, sodium sulfite 1.25 parts, 2.5 parts of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
5 parts of phenol, 1.25 parts of calcium hydroxides, 1.25 parts of sodium sulfites are added into reaction vessel step 1, are warming up to 80 DEG C, and keep the temperature 10min;
20 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are kept the temperature at 40 DEG C 100min;
Step 3 is to slowly warm up to 60 DEG C in 30min, and 7 parts of formaldehyde are added with rate of addition appropriate using pump is added dropwise Into reaction vessel, in 70 DEG C of heat preservation 30min;
PH value in step 4, detection reaction vessel, when pH value is 8~12, by 2.5 parts of screenings, 2.5 parts of medicament waste liquids Wood skin is added into reaction vessel, in 60 DEG C of heat preservation 100min;
3 parts of formaldehyde and 2.5 parts of water are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 5, 60 DEG C of heat preservation 30min;
Reaction vessel is cooled to 25 DEG C by step 6, is discharged after keeping the temperature 5min.
Embodiment 9
A kind of modified phenolic resin adhesive of the present embodiment, is made of the raw material of following parts by weight:
1 part of phenol, 5 parts of screenings, 5 parts of medicament waste liquid wood skin, 2 parts of formaldehyde, 5 parts of calcium hydroxide, 5 parts of sodium sulfite, water 0.1 Part.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
1 part of phenol, 5 parts of calcium hydroxides, 5 parts of sodium sulfites are added into reaction vessel step 1, are warming up to 80 DEG C, and Keep the temperature 10min;
1.5 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are protected at 40 DEG C Warm 10min;
Step 3 is to slowly warm up to 60 DEG C in 30min, is added 0.3 part of formaldehyde with rate of addition appropriate using pump is added dropwise Enter into reaction vessel, in 70 DEG C of heat preservation 30min;
PH value in step 4, detection reaction vessel, when pH value is 8~12, by 5 parts of screenings, 5 parts of medicament waste liquid wood skins It is added into reaction vessel, in 70 DEG C of heat preservation 100min;
0.2 part of formaldehyde and 0.1 part of water are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 5, In 60 DEG C of heat preservation 30min;
Reaction vessel is cooled to 25 DEG C by step 6, is discharged after keeping the temperature 5min.
Comparative example 1
This comparative example is conventional phenolic resin adhesive, is made of the raw material of following parts by weight:
10 parts of phenol, 40 parts of formaldehyde, 10 parts of sodium hydroxide, 2 parts of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
10 parts of phenol, 10 parts of sodium hydroxides are added into reaction vessel step 1, are warming up to 50 DEG C, and keep the temperature 30min;
30 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are kept the temperature at 50 DEG C 30min;
Step 3 is to slowly warm up to 80 DEG C in 40min, and 8 parts of formaldehyde are added with rate of addition appropriate using pump is added dropwise Into reaction vessel, in 80 DEG C of heat preservation 50min;
2 parts of formaldehyde and 2 parts of water are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 4,60 DEG C heat preservation 30min;
Reaction vessel is cooled to 25 DEG C by step 5, is discharged after keeping the temperature 10min.
Comparative example 2
This comparative example is conventional phenolic resin adhesive, is made of the raw material of following parts by weight:
20 parts of phenol, 40 parts of formaldehyde, 10 parts of barium hydroxide, 2 parts of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
20 parts of phenol, 10 parts of barium hydroxides are added into reaction vessel step 1, are warming up to 40 DEG C, and keep the temperature 10min;
30 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are kept the temperature at 80 DEG C 20min;
Step 3 is to slowly warm up to 70 DEG C in 30min, and 8 parts of formaldehyde are added with rate of addition appropriate using pump is added dropwise Into reaction vessel, in 60 DEG C of heat preservation 40min;
2 parts of formaldehyde and 2 parts of water are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 4,70 DEG C heat preservation 30min;
Reaction vessel is cooled to 25 DEG C by step 5, is discharged after keeping the temperature 5min.
Comparative example 3
This comparative example is conventional phenolic resin adhesive, is made of the raw material of following parts by weight:
10 parts of phenol, 30 parts of formaldehyde, 5 parts of calcium hydroxide, 5 parts of sodium sulfite, 2 parts of water.
The modified phenolic resin adhesive of the present embodiment the preparation method is as follows:
10 parts of phenol, 5 parts of sodium hydroxides, 5 parts of sodium sulfites are added into reaction vessel step 1, are warming up to 80 DEG C, And keep the temperature 10min;
20 parts of formaldehyde are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 2, are kept the temperature at 40 DEG C 10min;
Step 3 is to slowly warm up to 60 DEG C in 30min, and 8 parts of formaldehyde are added with rate of addition appropriate using pump is added dropwise Into reaction vessel, in 70 DEG C of heat preservation 30min;
2 parts of formaldehyde and 2 parts of water are added into reaction vessel with rate of addition appropriate using dropwise addition pump for step 4,60 DEG C heat preservation 30min;
Reaction vessel is cooled to 25 DEG C by step 5, is discharged after keeping the temperature 5min.
According to GB/T17657-2013 " test methods of evaluating the properties of wood-based panels and surface decorated wood-based panels " to Examples 1 to 3 with Comparative example 1 is detected, and performance is as shown in the table.
Burst size of methanal (mg/L) Bonding strength (MPa)
Embodiment 1 0.15 1.01
Embodiment 2 0.21 0.95
Embodiment 3 0.19 0.98
Embodiment 4 0.22 1.05
Embodiment 5 0.14 1.20
Embodiment 6 0.23 1.31
Embodiment 7 0.21 0.98
Embodiment 8 0.16 0.89
Embodiment 9 0.09 0.95
Comparative example 1 0.12 1.23
Comparative example 2 0.15 1.24
Comparative example 3 0.20 0.85
As seen from the above table, the performance of modified phenolic resin adhesive and non-modified conventional phenolic resin adhesive It is close, but the production cost of modified phenolic aldehyde essence adhesive is low.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model It encloses, to those skilled in the art, should can appreciate that and all replace with being equal made by present specification It changes and obviously changes obtained scheme, should all be included within the scope of the present invention.

Claims (10)

1. a kind of modified phenolic resin adhesive, it is applied to particieboard, which is characterized in that its constituent is according to parts by weight such as Under:
1~10 part of phenol
1~10 part of bio-extract
2~30 parts of formaldehyde
0.1~10 part of basic catalyst
0.1~5 part of water.
2. modified phenolic resin adhesive according to claim 1, which is characterized in that the bio-extract is useless for papermaking Gurry, the papermaking waste be one of rotten slurry, screenings, medicament waste liquid wood skin, pulping waste liquor extract, siliceous white clay or A variety of mixtures.
3. modified phenolic resin adhesive according to claim 1, which is characterized in that the bio-extract be solid or Liquid with certain solid content.
4. modified phenolic resin adhesive according to claim 1, which is characterized in that the basic catalyst is hydroxide One of barium, calcium hydroxide, sodium hydroxide, sodium carbonate, sodium bicarbonate, sodium sulfite or a variety of mixtures.
5. modified phenolic resin adhesive according to claim 1, which is characterized in that the water is deionized water.
6. a kind of preparation method of modified phenolic resin adhesive, which comprises the following steps:
Phenol, basic catalyst are proportionally added into reaction vessel by step 1, are warming up to 40~80 DEG C, and keep the temperature a timing Between;
The formaldehyde of first mass is added into the reaction vessel step 2, in 40~80 DEG C of held for some time;
Step 3 is warming up to 60~80 DEG C, the formaldehyde of the second mass is added into the reaction vessel, and held for some time;
Bio-extract is proportionally added into the reaction vessel by step 4, in 60~80 DEG C of held for some time;
The formaldehyde of third quality is added into the reaction vessel step 5, in 60~80 DEG C of held for some time;
Step 6 is cooled to 25 DEG C, discharges after held for some time.
7. the preparation method of modified phenolic resin adhesive according to claim 6, which is characterized in that in the step 4 In, the pH value in the reaction vessel is 8~12.
8. the preparation method of modified phenolic resin adhesive according to claim 6, which is characterized in that the first mass is greater than Second mass, the second mass are greater than third quality.
9. the preparation method of modified phenolic resin adhesive according to claim 6, which is characterized in that in the step 3 In, water is proportionally added into the reaction vessel.
10. the preparation method of modified phenolic resin adhesive according to claim 6, which is characterized in that in the step 5 In, water is proportionally added into the reaction vessel.
CN201811565824.8A 2018-12-20 2018-12-20 A kind of modified phenolic resin adhesive and preparation method thereof Pending CN109679548A (en)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN110564346A (en) * 2019-09-20 2019-12-13 上海昶法新材料有限公司 Modified phenolic glue and preparation method thereof
CN113322035A (en) * 2021-05-31 2021-08-31 江西亚太化工有限公司 Environment-friendly modified resin and application thereof in bamboo forming

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CN103555237A (en) * 2013-10-24 2014-02-05 嘉善中林胶粘剂科技有限公司 Method for preparing environment-friendly adhesive for biomass wood materials

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CN110564346A (en) * 2019-09-20 2019-12-13 上海昶法新材料有限公司 Modified phenolic glue and preparation method thereof
CN113322035A (en) * 2021-05-31 2021-08-31 江西亚太化工有限公司 Environment-friendly modified resin and application thereof in bamboo forming

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Application publication date: 20190426