CN109668346A - A kind of novel semi-conductor refrigeration radiating module - Google Patents
A kind of novel semi-conductor refrigeration radiating module Download PDFInfo
- Publication number
- CN109668346A CN109668346A CN201711462036.1A CN201711462036A CN109668346A CN 109668346 A CN109668346 A CN 109668346A CN 201711462036 A CN201711462036 A CN 201711462036A CN 109668346 A CN109668346 A CN 109668346A
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- Prior art keywords
- radiator
- heat pipe
- heat
- face
- pedestal
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Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000005057 refrigeration Methods 0.000 title claims abstract description 24
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000009413 insulation Methods 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 10
- 238000001816 cooling Methods 0.000 abstract description 5
- 238000009825 accumulation Methods 0.000 abstract description 4
- 230000007423 decrease Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of novel semi-conductor refrigeration radiating modules, including semiconductor chilling plate, it is placed in the cold plate of semiconductor chilling plate cold end and is placed in the radiator in semiconductor chilling plate hot end, radiator is heat-pipe radiator, the front end face of radiator is equipped with radiator fan, radiator includes pedestal, the fins group being placed on pedestal, the present invention uses heat-pipe radiator, cooperate the diversion Design of radiating airflow, greatly reduce the windage of radiating airflow, heat pipe makes the heat for being transmitted to pedestal from semiconductor chilling plate be better transmitted to fin top, the temperature of balance base front and rear part and radiating fin upper and lower sides, it ensure that the uniformity of entire radiator temperature, the heat on the downside of the highest radiator back segment of temperature is set to be unlikely to generate accumulation, preferably distribute, good heat dissipation effect, high cooling efficiency, space utilization rate is high.
Description
Technical field
It is high, good heat dissipation effect new that the present invention relates to semiconductor refrigerating fields more particularly to a kind of space utilization rate
Type semiconductor refrigeration radiating module.
Background technique
The refrigerating capacity and refrigerating efficiency of semiconductor cooler depend primarily on the temperature and the temperature difference of cold and hot surface, due to Peltier
Effect, semiconductor element can one end refrigeration, one end heating, if so with its refrigeration, then must be rapid by the heat of the other end
It distributes, once semiconductor cooler is when refrigeration, hot face thermal resistance is excessively high, will lead to the decline of its refrigerating efficiency.At present
The power of many products is larger, and heat density is higher, and its heat-dissipating space is also limited, causes heat dissipating state bad, therefore how
Radiating highdensity heat to the refrigeration of product in a limited space is extremely crucial problem.
Summary of the invention
Present invention mainly solves existing semiconductor cooler for heat dissipation in poor shape the technical issues of causing refrigerating efficiency to decline；
Provide that a kind of space utilization rate is high, novel semi-conductor refrigeration radiating module of good heat dissipation effect.
In order to solve above-mentioned technical problem, the present invention is mainly adopted the following technical solutions:
A kind of novel semi-conductor refrigeration radiating module of the invention, the module include semiconductor chilling plate, are placed in and partly lead
The cold plate of body cooling piece cold end and the radiator for being placed in semiconductor chilling plate hot end, the radiator are heat-pipe radiator, heat dissipation
Device is equipped with the heat pipe heat being made of more heat pipes, and the front end face of radiator is equipped with radiator fan, and radiator includes pedestal, sets
In the fins group on pedestal, the base end face reclines the hot end of semiconductor chilling plate, the fins group include multi-disc perpendicular to
Susceptor surface and the radiating fin for contradicting susceptor surface, the cavity between adjacent heat radiation fin form airflow channel, above-mentioned heat dissipation
Fan corresponds to the airflow channel, and radiating fin is equipped with through-hole, and the heat pipe matches with the through-hole and is arranged in through-hole
It is interior, thermal insulation board is equipped between the cold plate and pedestal, module uses heat-pipe radiator, cooperates the diversion Design of radiating airflow, greatly
Reduce the windage of radiating airflow greatly, heat pipe makes the heat for being transmitted to pedestal from semiconductor chilling plate be better transmitted to fin
Top, the temperature of balance base front and rear part and radiating fin upper and lower sides ensure that the uniformity of entire radiator temperature, make temperature
Heat on the downside of highest radiator back segment is unlikely to generate accumulation, preferably distributes, good heat dissipation effect, refrigerating efficiency
Height, space utilization rate are high.
Preferably, the base upper surface is equipped with several grooves, the heat pipe matches and is embedded at the groove
In above-mentioned groove, heat pipe is embedded in the groove of pedestal, so that the heat on pedestal quickly can directly be transferred out by heat pipe
It goes, prevents from being directed at temperature difference due to pedestal is uneven because radiating, influence heat dissipation effect.
Preferably, the cross section of the groove is semicircular arc, the heat pipe is flat in above-mentioned groove, tube body of heat pipe
Lower half be embedded in above-mentioned groove, the bottom edge of the radiating fin is equipped with several semicircle shape notches, and the notch corresponds to phase
The upper half for answering heat pipe and the above-mentioned tube body of heat pipe that reclines, using semi-buried heat pipe design, so that the heat on pedestal is on the one hand logical
Superheater tube is quickly conducted to the top of radiating fin, and another part can cooperate radiating fin by the heat exchange of thermotube wall again
The contact heat conductien on bottom edge and pedestal enhances the heat dissipation effect of radiating fin lower part, so that the heat dissipation of entire radiating fin is equal
Even property is more preferable.
Preferably, the heat pipe heat includes the U-shaped heat pipe of several horizontal and vertical U-shaped heat pipe, the U-shaped heat pipe of horizontal
Two straight sections are embedded in above-mentioned groove and are located at the front and rear of the pedestal, and the vertical U-shaped heat pipe is always
Section is embedded in above-mentioned groove, and another straight section is arranged in the through-hole of above-mentioned radiating fin, using horizontal U-shaped heat pipe and vertically
U-shaped heat pipe is used cooperatively, and is quickly and effectively conducted the heat of pedestal front and rear part using horizontal U-shaped heat pipe, is balanced bottom
The temperature difference of seat front and rear part, is quickly and effectively conducted the heat on pedestal to radiating fin top using vertical U-shaped heat pipe, is put down
The temperature of the upper and lower sides for the fins group that weighed, the targeted design of heat pipe location and shape can prevent the part of radiator heat
Accumulation and temperature difference, radiating efficiency are good.
Preferably, the first half of the fins group is equipped with the cover plate for enclosing fins group first half, fins group rear end
Face is oblique, and cover plate forms the leading portion runner of radiator, guarantees airflow channel of the air-flow along fins group of radiator fan importing
Level flows through, and prevents air-flow from shunting from the top surface of fins group first half and reducing the radiating efficiency at fins group rear portion, after fins group
End face is oblique, ensure that radiating airflow is smoothly exported from fins group upper rear end, reduces because of caused by air-flow turnover
Windage.
Preferably, the rear edge of the radiating fin is in bending-like and covers corresponding airflow channel, by fins group
Rear end face closed, naturally it is also possible to back plate structure is set, fins group rear end face is closed.
Preferably, the front end face of the fins group is additionally provided with blower tray, the blower tray is in frame structure, fan
The front frame face of bracket and the radiator fan are affixed, and the after-frame face of blower tray and the front end face of the cover plate are affixed, fan branch
Frame facilitates the fixation of radiator fan.
Preferably, the frame bottom surface of the blower tray is oblique, the front frame face of blower tray is greater than after-frame face, wind
Frame bottom inclination is fanned, guide functions can be effectively played, reduces the windage by radiator fan inflow stream, improves heat dissipation effect
Rate.
Preferably, the rear end face of the radiating fin and top surface, which are equipped with more than one piece, is used for clamping radiating fin and and heat radiating fin
Piece buckles correspondingly, and the structural strength at radiating fin rear portion can be improved in buckle, keeps the unimpeded of airflow channel, guarantees to dissipate
Thermal effect is good.
The beneficial effects of the present invention are: module uses the form of side air admission and top outlet air, cooperate leading for radiating airflow
Stream design, greatly reduces the windage of radiating airflow, vertical U-shaped heat pipe makes the heat that pedestal is transmitted to from semiconductor chilling plate
It can be better transmitted to fin top, the temperature of radiating fin upper and lower sides is balanced, make full use of the biggish surface area of radiating fin,
And the U-shaped heat pipe of horizontal can balance the temperature of pedestal front and back end, by the higher temperature conduction of base rear end to pan frontward end,
Ensure that the uniformity of entire base temperature, the heat pipe design of various structures, can prevent radiator heat local accumulation and
Temperature difference, heat can be distributed preferably, good heat dissipation effect, high cooling efficiency, and space utilization rate is high.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the invention.
Fig. 2 is the perspective view of the explosion of Fig. 1 structure.
Fig. 3 is the side schematic view of Fig. 1 structure.
1. semiconductor chilling plate in figure, 2. cold plates, 3. radiators, 31. pedestals, 32. fins groups, 33. cover plates, 4. heat pipes
Group, 41. horizontal U-shaped heat pipes, 42. vertical U-shaped heat pipes, 5. radiator fans, 6. thermal insulation boards, 7. blower trays.
Specific embodiment
Below with reference to the embodiments and with reference to the accompanying drawing the technical solutions of the present invention will be further described.
Embodiment: a kind of novel semi-conductor refrigeration radiating module of the present embodiment, as shown in Figure 1, Figure 2 and Figure 3, including half
Conductor cooling piece 1, the cold plate 2 for being placed in semiconductor chilling plate cold end and the radiator 3 for being placed in semiconductor chilling plate hot end, radiator
For heat-pipe radiator, radiator is equipped with the heat pipe heat 4 being made of more heat pipes, is equipped with radiation air on the front end face of radiator
Fan 5, design has thermal insulation board 6 between cold plate and pedestal, and radiator includes pedestal 31, the fins group being placed on pedestal 32, pedestal bottom
Face paste leans on the hot end of semiconductor chilling plate, and fins group includes heat radiating fin of the multi-disc perpendicular to susceptor surface and conflict susceptor surface
Piece, the cavity between adjacent heat radiation fin form airflow channel, and above-mentioned radiator fan corresponds to airflow channel, designs on radiating fin
There is through-hole, heat pipe matches with through-hole and is arranged in through-hole, and base upper surface design has a plurality of linear groove, the cross of groove
Section is semicircular arc, heat pipe heat include the U-shaped heat pipe 41 of a horizontal and four vertical U-shaped heat pipes 42, the two of the U-shaped heat pipe of horizontal
Straight section is embedded in above-mentioned groove and is located at the front and rear of pedestal, and a straight section of four vertical U-shaped heat pipes is embedded
In in above-mentioned groove, another straight section is arranged in the through-hole of above-mentioned radiating fin, wherein the lower part of two vertical U-shaped heat pipes is straight
Section is located on the inside of the U-shaped of above-mentioned horizontal U-shaped heat pipe, and the lower part straight section of other two vertical U-shaped heat pipes is located at above-mentioned horizontal U-shaped
On the outside of the U-shaped of heat pipe, heat pipe position is arranged according to the thermoisopleth of radiator and is determined, it is ensured that between two sections of straight tubes of U-shaped heat pipe
The temperature difference be maximum, be conducive to being effectively conducted for temperature, the bottom edge design of radiating fin has multiple semicircle shape notches, above-mentioned notch
The upper half of corresponding corresponding heat pipe and the above-mentioned tube body of heat pipe that reclines, the rest part on radiating fin bottom edge then contradict susceptor surface,
Fins group first half is equipped with the cover plate 33 for enclosing fins group first half, and the rear end face of fins group is oblique, wherein radiating
The rear edge of fin is in bending-like and covers corresponding airflow channel, and two groups are equipped on the rear end face of fins group for clamping
It radiating fin and is buckled correspondingly with radiating fin, the top surface of fins group is equipped with one group of identical buckle, in fins group
Front end face design have a blower tray 7, blower tray is in frame structure, and the front frame face of blower tray and radiator fan are affixed, wind
The front end face in the after-frame face and cover plate of fanning bracket is affixed, and frame bottom surface is oblique, and the front frame face of blower tray is greater than after-frame face.
In refrigeration, the cold plate of the refrigeration radiating module is affixed at refrigeration object, the cooling capacity of cold end is transmitted by cold plate
Reduce the heat transfer between cold plate and foot of radiator, the heat in hot end and under the protection of thermal insulation board to refrigeration object
On the one hand directly contact radiating fin bottom edge by backplate surface conduct heat and conduct to radiating fin top, on the other hand pass through partly
The tube body top half contact radiating fin bottom edge heat transfer of buried heat pipe is simultaneously extremely conducted to radiating fin top, meanwhile, also by
Vertical U-shaped heat pipe acts on heat transfer to the top of radiating fin, since heat pipe is arranged at thermoisopleth, two straight section of heat pipe
Between temperature difference be maximum, thermal conduction effect is best, meanwhile, under the action of radiator fan, fresh air is from the front end of fins group
Face enters each airflow channel, sufficiently carries out heat exchange with radiating fin, then turn up under the diversion Design of radiator back segment
Square outlet air, since fresh air comes in constantly to be heated, radiator can show that front temperature is low and the temperature difference that rear portion is high, therefore bottom
The heat transfer of base rear portion to pedestal front can be effectively reduced the pedestal temperature difference by the horizontal U-shaped heat pipe design on seat, from
And more heats can be given out.
In the description of the present invention, technical term "upper", "lower", "front", "rear", "left", "right", " vertical ", " cross ",
"inner", "outside" etc. indicate direction or positional relationship is direction based on the figure or positional relationship, are merely for convenience of describing
With understand technical solution of the present invention, described above not to limit the present invention, the present invention is also not limited to above description
Citing, variation that those skilled in the art are made within the essential scope of the present invention retrofits, increases or replaces
It changes, is regarded as protection scope of the present invention.
Claims (9)
1. a kind of novel semi-conductor refrigeration radiating module, it is characterised in that: the module includes semiconductor chilling plate (1), is placed in
The cold plate (2) of semiconductor chilling plate cold end and the radiator (3) for being placed in semiconductor chilling plate hot end, the radiator dissipate for heat pipe
Hot device, radiator are equipped with the heat pipe heat (4) being made of more heat pipes, and the front end face of radiator is equipped with radiator fan (5), dissipates
Hot device includes pedestal (31), the fins group (32) being placed on pedestal, and the base end face reclines the hot end of semiconductor chilling plate, institute
Stating fins group includes radiating fin of the multi-disc perpendicular to susceptor surface and conflict susceptor surface, the cavity between adjacent heat radiation fin
Airflow channel is formed, above-mentioned radiator fan corresponds to the airflow channel, and radiating fin is equipped with through-hole, and the heat pipe leads to described
Hole matches and is arranged in through-hole, is equipped with thermal insulation board (6) between the cold plate and pedestal.
2. a kind of novel semi-conductor refrigeration radiating module according to claim 1, it is characterised in that: on the pedestal (31)
Surface is equipped with several grooves, and the heat pipe matches with the groove and is embedded in above-mentioned groove.
3. a kind of novel semi-conductor refrigeration radiating module according to claim 2, it is characterised in that: the groove it is transversal
Face is semicircular arc, and the heat pipe is flat in groove, and the lower half of tube body of heat pipe is embedded in above-mentioned groove, the heat radiating fin
The bottom edge of piece is equipped with several semicircle shape notches, and the notch corresponds to the upper half of corresponding heat pipe and the above-mentioned tube body of heat pipe that reclines.
4. a kind of novel semi-conductor refrigeration radiating module according to claim 2 or 3, it is characterised in that:
The heat pipe heat (4) includes the U-shaped heat pipe of several horizontal (41) and vertical U-shaped heat pipe (42), and the two of the U-shaped heat pipe of horizontal
Straight section is embedded at the front and rear in above-mentioned groove and being located at the pedestal (31), and the one of the vertical U-shaped heat pipe
Straight section is embedded in above-mentioned groove, and another straight section is arranged in the through-hole of above-mentioned radiating fin.
5. a kind of novel semi-conductor refrigeration radiating module according to claim 1, it is characterised in that: the fins group (32)
First half is equipped with the cover plate (33) for enclosing fins group first half, and fins group rear end face is oblique.
6. a kind of novel semi-conductor refrigeration radiating module according to claim 5, it is characterised in that: the radiating fin
Rear edge is in bending-like and the corresponding airflow channel of covering.
7. a kind of novel semi-conductor refrigeration radiating module according to claim 5 or 6, it is characterised in that: the fins group
(32) front end face is additionally provided with blower tray (7), and the blower tray is in frame structure, and the front frame face of blower tray is dissipated with described
Hot-air fan (5) is affixed, and the after-frame face of blower tray and the cover plate front end face are affixed.
8. a kind of novel semi-conductor refrigeration radiating module according to claim 7, it is characterised in that: the blower tray
(7) bottom surface is oblique, and the front frame face of blower tray is greater than after-frame face.
9. a kind of novel semi-conductor refrigeration radiating module according to claim 1, it is characterised in that: after the fins group
End face and top surface are equipped with more than one piece for clamping radiating fin and buckle correspondingly with radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711462036.1A CN109668346B (en) | 2017-12-28 | 2017-12-28 | Novel semiconductor refrigeration heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711462036.1A CN109668346B (en) | 2017-12-28 | 2017-12-28 | Novel semiconductor refrigeration heat dissipation module |
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| Publication Number | Publication Date |
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| CN109668346A true CN109668346A (en) | 2019-04-23 |
| CN109668346B CN109668346B (en) | 2020-12-15 |
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| CN111026251A (en) * | 2019-11-01 | 2020-04-17 | 苏州永腾电子制品有限公司 | High-efficiency combined heat dissipation type CPU radiator |
| CN112256113A (en) * | 2020-11-13 | 2021-01-22 | 大连理工大学 | Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration |
| CN112332201A (en) * | 2020-05-12 | 2021-02-05 | 宁波佰士瑞医疗科技有限公司 | A multi-layer heat pipe heat dissipation structure for laser |
| CN112968228A (en) * | 2021-02-01 | 2021-06-15 | 徐州储盈电子科技有限公司 | Electric motor car lithium cell heat abstractor |
| CN113261718A (en) * | 2021-06-15 | 2021-08-17 | 东华大学 | Waist bag type wearable water-cooling garment based on heat dissipation of pulsating heat pipe |
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| CN115052464A (en) * | 2022-06-30 | 2022-09-13 | 中航光电科技股份有限公司 | Novel air cooling cold plate structure and air cooling machine case |
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| CN111026251A (en) * | 2019-11-01 | 2020-04-17 | 苏州永腾电子制品有限公司 | High-efficiency combined heat dissipation type CPU radiator |
| CN112332201A (en) * | 2020-05-12 | 2021-02-05 | 宁波佰士瑞医疗科技有限公司 | A multi-layer heat pipe heat dissipation structure for laser |
| CN112256113A (en) * | 2020-11-13 | 2021-01-22 | 大连理工大学 | Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration |
| CN112968228A (en) * | 2021-02-01 | 2021-06-15 | 徐州储盈电子科技有限公司 | Electric motor car lithium cell heat abstractor |
| CN113340018A (en) * | 2021-04-30 | 2021-09-03 | 北京航天发射技术研究所 | Semiconductor temperature adjusting device |
| CN113261718A (en) * | 2021-06-15 | 2021-08-17 | 东华大学 | Waist bag type wearable water-cooling garment based on heat dissipation of pulsating heat pipe |
| US11849562B2 (en) | 2022-02-24 | 2023-12-19 | International Business Machines Corporation | Hybrid in-drawer computer equipment cooling device |
| WO2023160393A1 (en) * | 2022-02-24 | 2023-08-31 | International Business Machines Corporation | Hybrid in-drawer computer equipment cooling device |
| CN115077127A (en) * | 2022-06-30 | 2022-09-20 | 中航光电科技股份有限公司 | Internal circulation forced air cooling case |
| CN115066154A (en) * | 2022-06-30 | 2022-09-16 | 中航光电科技股份有限公司 | Heat conduction cold drawing, heat conduction integrated circuit board and quick-witted case |
| CN115052464A (en) * | 2022-06-30 | 2022-09-13 | 中航光电科技股份有限公司 | Novel air cooling cold plate structure and air cooling machine case |
| CN115066154B (en) * | 2022-06-30 | 2025-06-27 | 中航光电科技股份有限公司 | Thermally conductive cold plates, thermally conductive boards and chassis |
| CN115951769A (en) * | 2023-03-10 | 2023-04-11 | 山东合众智远信息技术有限公司 | Heat radiator for computer CPU |
| CN115951769B (en) * | 2023-03-10 | 2023-05-09 | 山东合众智远信息技术有限公司 | Heat abstractor for computer CPU |
| CN116983719A (en) * | 2023-08-21 | 2023-11-03 | 美级(北京)科技有限公司 | a cylindrical transducer |
| CN117030790A (en) * | 2023-09-13 | 2023-11-10 | 河南省科学院 | Working performance testing device for semiconductor refrigerating sheet |
| CN117030790B (en) * | 2023-09-13 | 2024-06-14 | 河南省科学院 | Working performance testing device for semiconductor refrigerating sheet |
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