CN109580005A - A kind of failure analysis methods, device, equipment and the storage medium of wire-connection point - Google Patents
A kind of failure analysis methods, device, equipment and the storage medium of wire-connection point Download PDFInfo
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- CN109580005A CN109580005A CN201811583797.7A CN201811583797A CN109580005A CN 109580005 A CN109580005 A CN 109580005A CN 201811583797 A CN201811583797 A CN 201811583797A CN 109580005 A CN109580005 A CN 109580005A
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0066—Radiation pyrometry, e.g. infrared or optical thermometry for hot spots detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/03—Arrangements for indicating or recording specially adapted for radiation pyrometers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/58—Testing of lines, cables or conductors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
Abstract
This application discloses a kind of failure analysis methods of wire-connection point, include the visible images and infrared light image of multiple wire-connection points by acquisition；Then it will be seen that light image and infrared light image are input in pre-set image analysis model, the temperature data of each wire-connection point is determined；Fault wire splicing point is determined according to each temperature data.That is, compared to the prior art, this method not only saves manpower consumption, and pass through the redundancy and complementary information using a variety of images, it can not only judge that there is currently faulty wire-connection points, and can further determine that the wire-connection point that is out of order, to further increase the accuracy of the accident analysis to wire-connection point.Disclosed herein as well is fail analysis device, equipment and the computer readable storage mediums of a kind of wire-connection point, all have above-mentioned beneficial effect.
Description
Technical field
The present invention relates to field of electrical equipment, in particular to a kind of failure analysis methods, the device, equipment of wire-connection point
And computer readable storage medium.
Background technique
With the fast development of power grid scale, important component of the transmission line of electricity as electric system, to the biography of electric power
Defeated process has an important influence.High pressure, extra-high voltage transmission line of electricity in, wire-connection point such as grips the line of part, exposed part
Valve block etc. is easy to appear failure inside head, strain clamp, pad, the edge of a knife of disconnecting switch and arrester, to make to transmit electricity
The safety of route, stability cannot be guaranteed.Since various wire-connection points have one to be significantly total to before breaking down
Same feature, i.e. fever phenomenon, therefore accident analysis can be carried out by the temperature data to wire-connection point, to obtain power transmission line
The operation conditions on road.
It is by technical staff to the wire-connection got in the prior art to the failure analysis methods of wire-connection point
The infrared light image of point is analyzed, and the spy that whether there is temperature anomaly in infrared light image is judged in observation based on experience
Point is levied, so that it is determined that currently whether there is the fault wire splicing point of temperature anomaly.Obviously, method in the prior art, not only
It needs to consume a large amount of human resources, and can only judge that there is currently the wire-connection of temperature anomaly points, and can not be true
It makes that specifically which wire-connection point breaks down, therefore very big puzzlement is come to subsequent fault restoration work belt.
Therefore, how on the basis of can save human resources, the accurate of the accident analysis to wire-connection point is improved
Degree is a technical problem that technical personnel in the field need to solve at present.
Summary of the invention
In view of this, people can be saved the purpose of the present invention is to provide a kind of failure analysis methods of wire-connection point
Power consumption, and can efficiently and accurately obtain the fault condition of wire-connection point；It is a further object of the present invention to provide a kind of conducting wires
Fail analysis device, equipment and the computer readable storage medium of splicing point, all have above-mentioned beneficial effect.
In order to solve the above technical problems, the present invention provides a kind of failure analysis methods of wire-connection point, comprising:
Acquisition includes the visible images and infrared light image of multiple wire-connection points；
The visible images and the infrared light image are input in pre-set image analysis model, are determined
The temperature data of each wire-connection point；
Fault wire splicing point is determined according to each temperature data.
Preferably, described that the visible images and the infrared light image are input to pre-set image analysis mould
In type, determine that the temperature data of each wire-connection point specifically includes:
The structure letter of multiple wire-connection points in the visible images is extracted using described image analysis model
Breath；
It is determined according to the mapping relations of the infrared light image and the visible images, and according to the structural information
The corresponding temperature data of each wire-connection point.
Preferably, described to determine that fault wire splicing point specifically includes according to each temperature data:
It will with the first difference of any other temperature data be more than the first difference range in multiple temperature datas
Temperature data be determined as the abnormal temperature data；
Wire-connection point corresponding with the abnormal temperature data is determined as the fault wire splicing point.Preferably,
It is described to determine that fault wire splicing point specifically includes according to each temperature data:
The second difference of the temperature data of two adjacent times of the same wire-connection point is obtained respectively；
Temperature data corresponding more than the second difference range in second difference is determined as abnormal temperature data；
Wire-connection point corresponding with the abnormal temperature data is determined as the fault wire splicing point.
Preferably, the visible images and the infrared light image are input to pre-set image analysis described
In model, before the temperature data for determining each wire-connection point, further comprise:
Pretreatment operation is carried out respectively to the visible images and the infrared light image.
Preferably, the pretreatment operation includes:
Image denoising and/or image defogging and/or image debounce and/or image enhancement.
Preferably, it is described fault wire splicing point is determined according to each temperature data after, further comprise:
Solution corresponding with the fault wire splicing point is searched in preset knowledge base；
The solution is sent to target device.
In order to solve the above technical problems, the present invention also provides a kind of fail analysis devices of wire-connection point, comprising:
Image collection module, for obtaining the image information of target wire-connection point；Wherein, described image information include can
Light-exposed image and infrared light image；
Failure analysis module for foundation described image information, and obtains the target using image analysis model analysis
The temperature data of wire-connection point；
Fault determination module, for determining the trouble location of the target wire-connection point according to the temperature data.
In order to solve the above technical problems, the present invention also provides a kind of fault analysis devices of wire-connection point, comprising:
Memory, for storing computer program；
Processor realizes the failure analysis methods of any of the above-described kind of wire-connection point when for executing the computer program
The step of.
In order to solve the above technical problems, the present invention also provides a kind of computer readable storage medium, it is described computer-readable
Computer program is stored on storage medium, the computer program realizes any of the above-described kind of wire-connection when being executed by processor
The step of failure analysis methods of point.
A kind of failure analysis methods of wire-connection point provided by the invention include multiple wire-connection points by obtaining
Visible images and infrared light image；Then it will be seen that light image and infrared light image are input to pre-set image analysis
In model, the temperature data of each wire-connection point is determined；Fault wire splicing point is determined according to each temperature data.Namely
It says, this method is to determine that fault wire connects in conjunction with visible images and infrared light image using image analysis model analysis
Point, compared to the prior art in by technical staff observe with to infrared light image carry out accident analysis method, this method is not
Manpower consumption is only saved, and by the redundancy and complementary information using a variety of images, can not only judge that there is currently have
The wire-connection point of failure, and can further determine that the wire-connection point that is out of order, to further increase to wire-connection
The accuracy of the accident analysis of point.
In order to solve the above technical problems, the present invention also provides a kind of fail analysis device of wire-connection point, equipment and
Computer readable storage medium all has above-mentioned beneficial effect.
Detailed description of the invention
It in order to illustrate the embodiments of the present invention more clearly or the technical solution of the prior art, below will be to embodiment or existing
Attached drawing needed in technical description is briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to the attached drawing of offer.
Fig. 1 is a kind of flow chart of the failure analysis methods of wire-connection point provided in an embodiment of the present invention；
Fig. 2 is a kind of structure chart of the fail analysis device of wire-connection point provided in an embodiment of the present invention；
Fig. 3 is a kind of structure chart of the fault analysis device of wire-connection point provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The core of the embodiment of the present invention is to provide a kind of failure analysis methods of wire-connection point, can save manpower and disappear
Consumption, and can efficiently and accurately obtain the fault condition of wire-connection point；Another core of the invention is to provide a kind of wire-connection
Fail analysis device, equipment and the computer readable storage medium of point, all have above-mentioned beneficial effect.
It is right with reference to the accompanying drawings and detailed description in order to make those skilled in the art more fully understand the present invention program
The present invention is described in further detail.
Fig. 1 is a kind of flow chart of the failure analysis methods of wire-connection point provided in an embodiment of the present invention.Such as Fig. 1 institute
Show, a kind of failure analysis methods of wire-connection point include:
S10: acquisition includes the visible images and infrared light image of multiple wire-connection points.
Specifically, being to need first in the present embodiment to carry out accident analysis to the wire-connection point on transmission line of electricity
Obtain the visible images and infrared light image of multiple wire-connection points in same shaft tower.Wire-connection point refers to defeated
Electric line connect part components, such as grip part, the end of a thread of exposed part, strain clamp, pad, disconnecting switch the edge of a knife
And valve block etc. inside arrester.Wherein, strain clamp is a kind of for fixing power transmission line, to bear the tension of power transmission line, and
Power transmission line is hung to the fitting in strain insulator-string group or shaft tower.
Specifically, visible images can be acquired by visible light shooting device, acquired by infrared light filming apparatus red
Outer light image, filming apparatus can be camera, camera etc., be also possible to be arranged on unmanned plane or other remote-measuring equipments
Filming apparatus, the present embodiment do not limit this.It is understood that is showed in visible images is the knot of wire-connection point
The information such as state are configured, what is recorded in infrared light image is the infrared radiant energy for recording the transmitting of target wire-connection point and the figure formed
Picture.
In specific implementation, generally using can waterproof and dustproof, electromagnetism interference visible light shooting device and infrared light
Filming apparatus, so as to avoid influence of the weather environment to filming apparatus.In order to enable the image information that shooting obtains is more
Clearly, validity feature is more obvious, reduces the fuzzy of image, ghost image to the greatest extent, can also be in visible light shooting
Holder is set on device or infrared light filming apparatus, so that the more balance and stability in photographic subjects wire-connection point, thus
So that the image that shooting obtains is more clear.
S20: it will be seen that light image and infrared light image are input in pre-set image analysis model, determines respectively to lead
The temperature data of line splicing point.
It in this step, is to utilize image after the visible images and infrared light image for getting wire-connection point
Analysis model analyzes the temperature data for obtaining each wire-connection point.Specifically, image analysis model refers to that training obtains in advance
The temperature data for determining each wire-connection point in image according to visible images and infrared light image model, figure
As the input of analysis model is the visible images and infrared light image currently got, export as the temperature of each wire-connection point
Data.
It first passes through in advance and utilizes a large amount of sample image (including visible images and infrared light image) and corresponding temperature number
According to model training is carried out, obtain image analysis model, in order to it is subsequent can be according to image analysis model to currently getting
Image information is analyzed.It should be noted that for training image analysis model algorithm there are many, it is to be understood that
Characteristic information type in the extracted sample image of different algorithms, levels of precision are different, the temperature data obtained it is accurate
Degree all can difference, it is therefore desirable to be selected according to actual needs, the present embodiment does not limit this.
S30: fault wire splicing point is determined according to each temperature data.
According to the temperature data for each wire-connection point determined, it is compared to each other using each temperature data, thus really
Determine abnormal temperature data, and then determines corresponding fault wire splicing point according to abnormal temperature data.
It should be noted that in specific implementation, can be executed in the embedded system based on Android Go language
Above-mentioned steps, the embedded system of Android Go language have low power consumption, automatic fragment optimization, hardware requirement low, included
The features such as flow control, can provide higher computing resource under same power consumption configurations for algorithm, therefore the present embodiment is preferably
Use the embedded system based on Android Go language.In other implementations, it also can be used other embedded
System such as Linux, Win CE, Saipan etc., the present embodiment does not limit this.
A kind of failure analysis methods of wire-connection point provided in this embodiment include multiple wire-connections by obtaining
The visible images and infrared light image of point；Then it will be seen that light image and infrared light image are input to pre-set image point
It analyses in model, determines the temperature data of each wire-connection point；Fault wire splicing point is determined according to each temperature data.Also
It is to say, this method is to determine that fault wire connects in conjunction with visible images and infrared light image using image analysis model analysis
Continuous point, compared to the prior art in observed by technical staff with the method to infrared light image progress accident analysis, this method
Not only save manpower consumption, and by the redundancy and complementary information using a variety of images, can not only judge there is currently
Faulty wire-connection point, and can further determine that the wire-connection point that is out of order, conducting wire is connect to further increase
The accuracy of the accident analysis of continuous point.
On the basis of the above embodiments, the present embodiment has made further instruction and optimization to technical solution, specifically,
It will be seen that light image and infrared light image are input in pre-set image analysis model, the temperature of each wire-connection point is determined
Degree evidence specifically includes:
Utilize the structural information of multiple wire-connection points in image analysis model extraction visible images；
Each wire-connection point is determined according to the mapping relations of infrared light image and visible images, and according to structural information
Corresponding temperature data.
Specifically, due to include in visible images multiple wire-connection points structural information, wrap in infrared light image
The infra-red radiation information of wire-connection point is included, therefore, first with more in image analysis model extraction visible images
The structural information of a wire-connection point can be by light image then according to the mapping relations of infrared light image and visible images
In characteristic point matched with the characteristic point in infrared light image, according to the corresponding relationship of structural information and infra-red radiation information
Determine the corresponding temperature data of each wire-connection point.
As it can be seen that this method obtains the temperature data of each wire-connection point, mode of operation letter using image analysis model analysis
It is single efficient.
As preferred embodiment, the present embodiment has made further instruction and optimization to technical solution, specifically, root
Determine that fault wire splicing point specifically includes according to each temperature data:
It will be more than the temperature number of the first difference range with the first difference of any other temperature data in multiple temperature datas
According to being determined as abnormal temperature data；
Wire-connection point corresponding with abnormal temperature data is determined as fault wire splicing point.
That is, according to the method that each temperature data determines fault wire splicing point being identical in the present embodiment
Under electric network data, environmental data, it is compared to each other using each temperature data corresponding with each wire-connection point, it will be with other
First difference of meaning temperature data is more than that the temperature data of the first difference range is determined as abnormal temperature data.For example, it is assumed that working as
8 wire-connection points are shared in preceding visible images, when temperature data and any other conducting wire of some wire-connection point connect
First difference of the temperature data of continuous point is more than that the temperature of the first difference range namely the wire-connection point is apparently higher than others
The temperature of wire-connection point, then be determined as abnormal temperature data for the temperature data of the wire-connection point, and the corresponding exception is warm
Degree is fault wire splicing point according to corresponding wire-connection point.
This method by the temperature data of each wire-connection point being compared to each other so that it is determined that abnormal temperature data out,
And then determine fault wire splicing point, compared to normal temperature threshold value is preset, it is conducive to each temperature data and level threshold value
The mode being compared, accuracy are higher.
As preferred embodiment, the present embodiment also provides another kind and determines that fault wire connects according to each temperature data
The method of continuous point, specifically:
The second difference of the temperature data of two adjacent times of same wire-connection point is obtained respectively；
Temperature data corresponding more than the second difference range in second difference is determined as abnormal temperature data；
Wire-connection point corresponding with abnormal temperature data is determined as fault wire splicing point.
Specifically, obtaining same wire-connection o'clock respectively in the temperature data of two adjacent times, and calculate the two
Then the difference of temperature data, i.e. the second difference are compared with the second difference range using second difference, show that second is poor
More than the difference of the second difference range in value, then the temperature data of second difference is determined as abnormal temperature data.For example, false
If sharing 8 wire-connection points in current visible images, when the temperature data of some wire-connection point is when two adjacent
Between the second difference be more than the second difference range, then it represents that the wire-connection point heats up comparatively fast in a short time, therefore the temperature
Data are abnormal temperature data, and the corresponding wire-connection point of the abnormal temperature data is fault wire splicing point.
As it can be seen that the method provided in this embodiment for determining fault wire splicing point according to each temperature data, judgment mode
Simple and accuracy is high.
On the basis of the above embodiments, the present embodiment has made further instruction and optimization to technical solution, specifically,
It will be seen that light image and infrared light image be input in pre-set image analysis model, determining each wire-connection point
Before temperature data, further comprise:
Pretreatment operation is carried out respectively to visible images and infrared light image.
It is understood that obtaining visible images and during infrared light image, it is understood that there may be it is a variety of it is extraneous because
Fuzzy, the distortion that the influence of element leads to problems such as image different degrees of, such as the influence of foggy weather will lead to the figure got
As information is relatively fuzzyyer or the not high factor of precision of camera lens shake, camera lens will lead to the image information got distortion.Cause
This, in the present embodiment, before carrying out feature extraction to visible images and infrared light image, further respectively to visible light
Image and infrared light image carry out pretreatment operation.
As preferred embodiment, pretreatment operation includes:
Image denoising and/or image defogging and/or image debounce and/or image enhancement.
Specifically, the specific method of image denoising has neighborhood averaging, airspace low pass filtering method and median filtering method etc..Its
In, median filtering is a kind of spatial domain non-linear filtering method, since it does not need the system of image during actual operation
Characteristic is counted, so calculating is simple and fast, and image detail brought by linear filter can be overcome under certain conditions
It is fuzzy, and to filtering out impulse disturbances and parts of images noise is maximally efficient.
Image defogging includes the edge in the color for adjusting image, the contrast for enhancing image and enhancing image.For scheming
As the algorithm of defogging mainly has based on image enhancement and based on image restoration two major classes: the defogging algorithm based on image enhancement passes through
The contrast with mist image is improved to reduce influence of the mist to image, image after defogging is made to easily facilitate identification, defogging algorithm packet
Include the defogging algorithm based on histogram equalization and defogging algorithm based on Retinex theory etc.；Defogging based on image restoration
Algorithm is divided into the model based on single width input picture by restoring fog free images, atmospherical scattering model using atmospherical scattering model
With the model based on plurality of input images.
Specifically, holder can be installed on filming apparatus in advance, the modes such as optical anti-vibration, gyroscope compensation stabilization are introduced
Reduce jitter problem during shooting image.Further, it is also possible to realize image debounce using characteristic method and optical flow method.Its
In, optical flow method can obtain the motion vector of each pixel to the image that there is mobile target, and debounce effect is better than characteristic method,
But sometimes for the global estimation for realizing moving target in conjunction with Video segmentation.The effect of characteristic method is heavily dependent on spy
Matched precision is levied, therefore the application of this method has limitation.
Compressed sensing CS theoretical frame is a kind of image reconstructing method compared with forward position, is asked by solving sparse constraint optimization
Topic, it will be able to which accurate or high probability accurately reconstructs original signal from low-dimensional observation, to realize that visible images quality increases
By force.
It should be noted that image denoising, image defogging, the method for image debounce and image enhancement be there are many mode,
In specific implementation, it is selected according to actual needs, this example does not limit this.
As it can be seen that enabling to visible light figure by carrying out pretreatment operation to visible images and infrared light image respectively
The characteristic information of picture and infrared light image is more obvious, so that the operations such as feature extraction and characteristic matching are more convenient, quasi-
Really.
On the basis of the above embodiments, the present embodiment has made further instruction and optimization to technical solution, specifically,
After determining fault wire splicing point according to each temperature data, further comprise:
Solution corresponding with fault wire splicing point is searched in preset knowledge base；
Solution is sent to target device.
Specifically, knowledge base is arranged in the fault condition and corresponding solution previously according to fault wire splicing point,
After determining fault wire splicing point, searched in preset knowledge base according to corresponding fault condition and the fault condition
Then the solution found is sent to target device by corresponding solution.Specifically, refer to can for target device
The equipment interacted with technical staff is allowed a technician to obtain and be somebody's turn to do by the way that solution is sent to target device
Information, to take corresponding measure.Knowledge base can be to be arranged in table form, is also possible to set in a manner of database
It sets, selection setting is carried out according to the capacity of knowledge base and lookup mode in specific implementation, the present embodiment does not limit this.Separately
Outside, knowledge base can also be set to cloud disk, by safeguarding the knowledge base jointly in many ways, realizes that knowledge sharing, raising can obtain
A possibility that solution corresponding with fault condition.
It is understood that can be rung when solution corresponding with current fault condition is not present in knowledge base
It answers the input of technical staff to operate, obtains the corresponding solution that is inputted by technical staff, and by the fault condition and right
The solution answered is stored into the knowledge base, can be a variety of failures that may be present so as to constantly improve knowledge base
Situation provides solution, offers convenience for the maintenance work of others skilled in the art.
In other examples, the visible images and infrared light got further can also be sent to target device
Image obtains fault wire splicing point in order to which technical staff can further analyze according to the experience of itself, further to leading
The accuracy of the accident analysis of line splicing point.
A kind of embodiment of the failure analysis methods of wire-connection point provided by the invention is carried out above detailed
Description, the present invention also provides fail analysis device, equipment and the computers of a kind of wire-connection point corresponding with this method can
Storage medium is read, due to the embodiment and the embodiment phase of method part of device, equipment and computer readable storage medium part
Mutually correlate, therefore the embodiment of device, equipment and computer readable storage medium part refers to the embodiment of method part
Description, wouldn't repeat here.
Fig. 2 is a kind of structure chart of the fail analysis device of wire-connection point provided in an embodiment of the present invention, such as Fig. 2 institute
Show, a kind of fail analysis device of wire-connection point includes:
Image collection module 21, for obtaining the image information of target wire-connection point；Wherein, image information includes visible
Light image and infrared light image；
Failure analysis module 22 for foundation image information, and show that target conducting wire connects using image analysis model analysis
The temperature data of continuous point；
Fault determination module 23, for determining the trouble location of target wire-connection point according to temperature data.
The fail analysis device of wire-connection point provided in an embodiment of the present invention, the failure minute with above-mentioned wire-connection point
The beneficial effect of analysis method.
Fig. 3 is a kind of structure chart of the fault analysis device of wire-connection point provided in an embodiment of the present invention, such as Fig. 3 institute
Show, a kind of fault analysis device of wire-connection point includes:
Memory 31, for storing computer program；
Processor 32 realizes the step of the failure analysis methods such as above-mentioned wire-connection point when for executing computer program
Suddenly.
The fault analysis device of wire-connection point provided in an embodiment of the present invention, the failure minute with above-mentioned wire-connection point
The beneficial effect of analysis method.
In order to solve the above technical problems, the present invention also provides a kind of computer readable storage medium, computer-readable storage
It is stored with computer program on medium, the accident analysis such as above-mentioned wire-connection point is realized when computer program is executed by processor
The step of method.
Computer readable storage medium provided in an embodiment of the present invention, the failure analysis methods with above-mentioned wire-connection point
Beneficial effect.
It to the failure analysis methods of wire-connection point provided by the present invention, device, equipment and computer-readable deposits above
Storage media is described in detail.Specific embodiment used herein explains the principle of the present invention and embodiment
It states, the above description of the embodiment is only used to help understand the method for the present invention and its core ideas.It should be pointed out that for this skill
For the those of ordinary skill in art field, without departing from the principle of the present invention, several change can also be carried out to the present invention
Into and modification, these improvements and modifications also fall within the scope of protection of the claims of the present invention.
Each embodiment is described in a progressive manner in specification, the highlights of each of the examples are with other realities
The difference of example is applied, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
Speech, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is referring to method part illustration
?.
Professional further appreciates that, unit described in conjunction with the examples disclosed in the embodiments of the present disclosure
And algorithm steps, can be realized with electronic hardware, computer software, or a combination of the two, in order to clearly demonstrate hardware and
The interchangeability of software generally describes each exemplary composition and step according to function in the above description.These
Function is implemented in hardware or software actually, the specific application and design constraint depending on technical solution.Profession
Technical staff can use different methods to achieve the described function each specific application, but this realization is not answered
Think beyond the scope of this invention.
Claims (10)
1. a kind of failure analysis methods of wire-connection point characterized by comprising
Acquisition includes the visible images and infrared light image of multiple wire-connection points；
The visible images and the infrared light image are input in pre-set image analysis model, determine each institute
State the temperature data of wire-connection point；
Fault wire splicing point is determined according to each temperature data.
2. the method according to claim 1, wherein described by the visible images and the infrared light image
It is input in pre-set image analysis model, determines that the temperature data of each wire-connection point specifically includes:
The structural information of multiple wire-connection points in the visible images is extracted using described image analysis model；
Each institute is determined according to the mapping relations of the infrared light image and the visible images, and according to the structural information
State the corresponding temperature data of wire-connection point.
3. according to the method described in claim 2, it is characterized in that, described determine fault wire according to each temperature data
Splicing point specifically includes:
It will be more than the temperature of the first difference range with the first difference of any other temperature data in multiple temperature datas
Degree evidence is determined as the abnormal temperature data；
Wire-connection point corresponding with the abnormal temperature data is determined as the fault wire splicing point.
4. according to the method described in claim 2, it is characterized in that, described determine fault wire according to each temperature data
Splicing point specifically includes:
The second difference of the temperature data of two adjacent times of the same wire-connection point is obtained respectively；
Temperature data corresponding more than the second difference range in second difference is determined as abnormal temperature data；
Wire-connection point corresponding with the abnormal temperature data is determined as the fault wire splicing point.
5. method according to any one of claims 1 to 4, which is characterized in that described by the visible images and institute
Infrared light image is stated to be input in pre-set image analysis model, determine each wire-connection point temperature data it
Before, further comprise:
Pretreatment operation is carried out respectively to the visible images and the infrared light image.
6. according to the method described in claim 5, it is characterized in that, the pretreatment operation includes:
Image denoising and/or image defogging and/or image debounce and/or image enhancement.
7. according to the method described in claim 5, it is characterized in that, being led described according to determining be out of order of each temperature data
After line splicing point, further comprise:
Solution corresponding with the fault wire splicing point is searched in preset knowledge base；
The solution is sent to target device.
8. a kind of fail analysis device of wire-connection point characterized by comprising
Image collection module, for obtaining the image information of target wire-connection point；Wherein, described image information includes visible light
Image and infrared light image；
Failure analysis module for foundation described image information, and obtains the target conducting wire using image analysis model analysis
The temperature data of splicing point；
Fault determination module, for determining the trouble location of the target wire-connection point according to the temperature data.
9. a kind of fault analysis device of wire-connection point characterized by comprising
Memory, for storing computer program；
Processor realizes wire-connection point as described in any one of claim 1 to 7 when for executing the computer program
The step of failure analysis methods.
10. a kind of computer readable storage medium, which is characterized in that be stored with computer on the computer readable storage medium
Program, the computer program realize the event of wire-connection point as described in any one of claim 1 to 7 when being executed by processor
The step of hindering analysis method.
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