CN109500729B - Wax-free adsorption pad for sapphire polishing - Google Patents
Wax-free adsorption pad for sapphire polishing Download PDFInfo
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- CN109500729B CN109500729B CN201910075627.6A CN201910075627A CN109500729B CN 109500729 B CN109500729 B CN 109500729B CN 201910075627 A CN201910075627 A CN 201910075627A CN 109500729 B CN109500729 B CN 109500729B
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- groove
- adsorption pad
- polishing
- pad body
- wax
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
Abstract
The invention relates to the technical field of high-grade numerical control equipment and numerical control processing, in particular to a wax-free adsorption pad for sapphire polishing, which is arranged on a polishing table of a polishing machine and comprises an adsorption pad body, wherein a first groove capable of reducing the polishing curvature of a sapphire wafer is arranged in the middle of the upper side of the adsorption pad body, and the first groove is spiral; the sapphire wafer that will need the polishing adsorbs on the adsorption pad body, because the middle part at the adsorption pad body is provided with first recess, when polishing, alright reduce middle accept for the atress of edge and center department is even relatively, makes the thickness deviation of sapphire wafer center shop after the polishing processing less, thereby reaches the requirement of crookedness, avoids subsequent quenching treatment, makes the course of working simpler, has reduced operation personnel's intensity of labour.
Description
Technical Field
The invention relates to the technical field of high-grade numerical control equipment and numerical control machining, in particular to a wax-free adsorption pad for sapphire polishing.
Background
When a sapphire wafer is polished, a CMP chemical mechanical polishing technology is widely used, wherein one method is to use a wax-free adsorption pad to adsorb the wafer, and when the existing wax-free adsorption pad is used for polishing, the stress of the sapphire wafer at the center and the edge of the wax-free adsorption pad is different due to the fact that the central point is pressed relatively heavily, so that the curvature of the sapphire wafer is easily not up to the standard, the sapphire wafer is required to be quenched, the curvature of the sapphire wafer is qualified, but the processing flow is very complicated, and the labor intensity of operators is overlarge.
Disclosure of Invention
The invention aims to provide a wax-free adsorption pad for sapphire polishing, which aims to solve the problem that the bending degree of a sapphire wafer is not up to standard and is qualified due to quenching treatment when the conventional wax-free adsorption pad is polished, so that the labor intensity of operators is overlarge.
In order to solve the technical problems, the invention adopts the following technical scheme:
the utility model provides a sapphire polishing is with no wax adsorption pad sets up on the polishing bench of burnishing machine, including adsorbing the pad body, the middle part of adsorbing pad body upside is equipped with the first recess that can reduce sapphire wafer polishing crookedness, first recess is the spiral.
Preferably, a second groove is arranged around the circumference of the adsorption pad body, and the second groove is annular.
The polishing table is provided with a connecting groove, and the adsorption pad body is arranged in the connecting groove.
A further technical scheme is that the lower side of the adsorption pad body is provided with a connecting seat, the connecting seat is arranged in a connecting groove, an arc-shaped clamping groove is formed in the side wall of the connecting seat, the polishing table is internally surrounded by the side wall of the connecting groove, a containing cavity is formed in the side wall of the connecting groove and is communicated with the connecting groove through a connecting hole, a clamping block is movably connected in the containing cavity and is arranged, and the clamping block penetrates through the connecting hole and is clamped in the arc-shaped clamping groove.
According to a further technical scheme, a transverse plate is arranged in the connecting groove, the connecting seat is arranged on the transverse plate, a pushing piece is arranged in the middle of the lower side of the transverse plate, a control button is arranged at the bottom of the connecting groove, the pushing piece is used for pushing the control button, a telescopic rod is transversely arranged in the containing cavity, the telescopic end of the telescopic rod is connected with a clamping block, and the control button is in signal connection with the telescopic rod.
According to a further technical scheme, the pushing piece is T-shaped and comprises a transverse portion and a vertical portion which are integrally formed, the upper side of the transverse portion is connected with the transverse plate, the upper end of the vertical portion is connected with the middle section of the lower side of the transverse portion, the lower end of the vertical portion is used for pushing the control button, a first spring is arranged on the lower side of the transverse portion, the vertical portion is located on the inner side of the first spring, and the lower end of the first spring is connected with the bottom of a connecting groove.
A plurality of second springs are vertically arranged on the lower side of the transverse plate and are circumferentially distributed on the lower side of the transverse plate.
A further technical scheme is that the clamping block comprises a clamping part and a connecting part, one side of the connecting part is connected with the telescopic end of the telescopic rod, the other side of the connecting part is connected with the clamping part, when the clamping block is clamped into the arc-shaped clamping groove, the clamping part penetrates through the connecting hole and is clamped in the arc-shaped clamping groove, and the connecting part is located in the accommodating cavity.
A further technical scheme is that the bottom of the storage cavity is transversely slidably connected with a first sliding plate, the storage cavity is vertically slidably connected with a second sliding plate on the side wall of one side connected with the connecting groove, the middle section of the upper side of the first sliding plate is rotatably connected with a connecting rod, the connecting rod is rotatably connected with the middle section of one side of the second sliding plate, and the second sliding plate is used for plugging the connecting hole.
A further technical scheme is that the side wall of the side that the storage cavity is connected with the connecting groove is provided with a winding rotating shaft, the winding rotating shaft is located on the lower side of the second sliding plate, the first sliding plate is provided with a guide wheel, the winding connection is arranged on the winding rotating shaft, the connecting wire is folded back to one side of the winding rotating shaft after passing through the guide wheel and is connected with the inner wall of the storage cavity, and the winding rotating shaft is connected with the control button through signals.
Compared with the prior art, the invention has the beneficial effects that: the sapphire wafer that will need the polishing adsorbs on the adsorption pad body, because the middle part at the adsorption pad body is provided with first recess, when polishing, alright reduce middle accept for the atress of edge and center department is even relatively, makes the thickness deviation of sapphire wafer center shop after the polishing processing less, thereby reaches the requirement of crookedness, avoids subsequent quenching treatment, makes the course of working simpler, has reduced operation personnel's intensity of labour.
Drawings
Fig. 1 is a schematic view of a structure in which a wax-free adsorption pad is disposed on a polishing table.
FIG. 2 is a schematic view of the upper side of the polishing table.
FIG. 3 is a vertical cross-sectional view of the polishing table.
Fig. 4 is a partially enlarged view of a portion a in fig. 3.
FIG. 5 is a schematic view of the structure of the pusher.
In the figure: 1. a polishing table; 2. an adsorption pad body; 3. a first groove; 4. a second groove; 5. connecting grooves; 6. a connecting seat; 7. an arc-shaped clamping groove; 8. a receiving cavity; 9. connecting holes; 10. a clamping block; 11. a transverse plate; 12. a pusher member; 13. a control button; 14. a telescopic rod; 15. a second spring; 16. a first slide plate; 17. a second slide plate; 18. a connecting rod; 19. a winding shaft; 20. a guide wheel; 101. a clamping part; 102. a connecting portion; 121. a transverse portion; 122. a vertical portion; 123. a first spring.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Fig. 1-5 illustrate embodiments of wax-free absorbent pads for sapphire polishing.
The first embodiment is as follows:
this embodiment provides a no wax adsorption pad for sapphire polishing as basic embodiment, sets up on polishing table 1 of burnishing machine, including adsorption pad body 2, the middle part of 2 upsides of adsorption pad body is equipped with the first recess 3 that can reduce sapphire wafer polishing crookedness, first recess 3 is the spiral.
During polishing process, place sapphire wafer on the adsorption pad body 2 on polishing platform 1 earlier, through the adsorption of adsorption pad body 2 to sapphire wafer, make the placing that sapphire wafer can stabilize, then polish processing the side of going up to sapphire wafer, the sapphire wafer on adsorption pad body 2 is polished in the rotation of the polishing surface of the ceramic dish of specific through burnishing machine, polishing surface and sapphire wafer looks adaptation.
Set up first recess 3 through the middle part of the upside at adsorption pad body 2, and make first recess 3 be the spiral, the form that is at adsorption pad body 2 with the screw thread form distributes promptly to the side of going up, when polishing, alright make the atress of sapphire wafer center department reduce, thereby make the atress of center department and edge even relatively, the thickness deviation of sapphire wafer center shop after making polishing processing is less, thereby reach the requirement of crookedness, avoid subsequent quenching treatment, make the course of working simpler, the labor intensity of operating personnel is reduced.
Example two:
on the basis of the first embodiment, further, a second groove 4 is formed around the circumference of the adsorption pad body 2, and the second groove 4 is annular.
In the processing process, because the central point is pressed relatively heavily, the edge of the sapphire wafer is pressed to slightly tilt, the edge of the sapphire wafer is firstly contacted with a polishing surface for grinding, the edge is also subjected to the next dimension, the edge is still a low point, the middle is still a high point, the difference between the integral thickness difference (TTV) and the local thickness difference (LTV) of the wafer is larger, the difference is generally called as poor flatness, the surface is unqualified, aiming at the problems of the TTV and the LTV, a second groove 4 is arranged around the circumference of the adsorption pad body 2 and is annular, therefore, in the pressing process, the edge of the sapphire wafer is not firstly stressed due to the second groove 4, the effective polishing time in the polishing process is reduced, the grinding quantity in the middle is slightly larger than that of the edge, and finally the whole thickness difference reaches the processing requirement, good LTV and TTV are achieved.
By combining with the technical solution of embodiment 1, when the first groove 3 and the second groove 4 are provided at the same time, the polished sapphire wafer can have acceptable bow, LTV and TTV.
Example three:
on the basis of the second embodiment, further, the polishing table 1 is provided with a connecting groove 5, and the adsorption pad body 2 is arranged in the connecting groove 5.
The polishing table 1 is internally provided with a connecting groove 5 for fixing the position of the adsorption pad body 2, the notch of the connecting groove 5 faces upwards, and the shape of the connecting groove 5 is matched with that of the adsorption pad body 2; the cross section of the connecting groove 5 and the cross section of the adsorption pad body 2 can be both circular and directly identical.
Example four:
on the basis of the third embodiment, further, the downside of adsorption pad body 2 is equipped with connecting seat 6, connecting seat 6 sets up in spread groove 5, be equipped with arc draw-in groove 7 on the lateral wall of connecting seat 6 encircle in the polishing platform 1 the lateral wall of spread groove 5 is provided with accomodates the chamber 8, it is linked together through connecting hole 9 and spread groove 5 to accomodate chamber 8, it is equipped with fixture block 10 to accomodate swing joint in the chamber 8, fixture block 10 passes and blocks from connecting hole 9 and establishes in arc draw-in groove 7.
Set up connecting seat 6 at the downside of adsorption pad halfbody 2, make connecting seat 6 card establish into spread groove 5 in, can realize the primary junction between adsorption pad body 2 and the spread groove 5, set up arc draw-in groove 7 on the lateral wall of connecting seat 6, and set up fixture block 10 in accomodating chamber 8, the transverse movement through fixture block 10 makes the card of fixture block 10 establish the end and passes connecting hole 9 and the card establishes into arc draw-in groove 7 in, thereby realize adsorbing the further connection between pad body 2 and the spread groove 5.
The fixture blocks 10 are arranged in a plurality of numbers and are arranged around the connecting seat 6, and the arc-shaped clamping grooves 7 are matched with the fixture blocks 10.
Example five:
on the basis of the fourth embodiment, a transverse plate 11 is arranged in the connecting groove 5, the connecting seat 6 is arranged on the transverse plate 11, a pushing part 12 is arranged in the middle of the lower side of the transverse plate 11, a control button 13 is arranged at the bottom of the connecting groove 5, the pushing part 12 is used for pushing the control button 13, an expansion link 14 is transversely arranged in the containing cavity 8, the expansion end of the expansion link 14 is connected with the clamping block 10, and the control button 13 is in signal connection with the expansion link 14.
After placing connecting seat 6 in spread groove 5, connecting seat 6 will be placed on diaphragm 11, through will adsorbing pad body 2 down gradually, alright drive connecting seat 6 downstream in spread groove 5, thereby promote diaphragm 11 downstream, owing to be provided with impeller 12 at the downside of diaphragm 11, impeller 12 also can downstream gradually and push up control button 13, after pressing control button 13, alright make telescopic link 14 be the extension motion, alright drive the lateral motion of fixture block 10, realize that the card of fixture block 10 establishes the end and passes connecting hole 9 and the card is established into in arc wall 7.
The telescopic rod 14 is an existing electric telescopic rod, and the signal connection between the telescopic rod 14 and the control button 13 is the prior art, and is not described in detail herein.
Example six:
on the basis of the fifth embodiment, furthermore, the pushing member 12 is shaped like a "T", and includes a transverse portion 121 and a vertical portion 122 that are integrally formed, the upper side of the transverse portion 121 is connected to the transverse plate 11, the upper end of the vertical portion 122 is connected to the middle section of the lower side of the transverse portion 121, the lower end of the vertical portion 122 is used for pushing the control button 13, the lower side of the transverse portion 121 is provided with a first spring 123, the vertical portion 122 is located inside the first spring 123, and the lower end of the first spring 123 is connected to the bottom of the connecting groove 5.
The pushing member 12 may be configured as a transverse portion 121 and a vertical portion 122 formed integrally, the transverse portion 121 serves to connect the vertical portion 122 and the horizontal plate 11, and the lower end of the vertical portion 122 serves to press the control button 13.
One side of polishing platform 1 still is provided with the button of the shrink of control telescopic link 14, through pressing the shrink button, alright make telescopic link 14 shrink, then alright drive fixture block 10 and retrieve the area and accomodate in the chamber 8, because the downside at horizontal portion 121 is provided with first spring 123, at the in-process that pushes down, first spring 123 shortens gradually, at this moment, when the upside is not spacing, first spring 123 alright be the extension motion, thereby drive impeller 12 upward movement, alright make diaphragm 11 upward movement, and then pop out connecting seat 6 and adsorption pad body 2, be convenient for take out in the spread groove 5 with adsorption pad body 2.
Example seven:
on the basis of the sixth embodiment, furthermore, a plurality of second springs 15 are vertically arranged on the lower side of the transverse plate 11, and the plurality of second springs 15 are circumferentially distributed on the lower side of the transverse plate 11.
Through setting up a plurality of second springs 15, can make diaphragm 11 atress more balanced for diaphragm 11 can more steady motion in the in-process of moving under the country. The plurality of second springs 15 are uniformly distributed along the same circumference on the lower side of the transverse plate 11, so that the uniform stress can be further kept.
Example eight:
on the basis of the seventh embodiment, further, the fixture block 10 includes a clamping portion 101 and a connecting portion 102, one side of the connecting portion 102 is connected to the telescopic end of the telescopic rod 14, and the other side is connected to the clamping portion 101, when the fixture block 10 is clamped in the arc-shaped clamping groove 7, the clamping portion 101 penetrates through the connecting hole 9 and is clamped in the arc-shaped clamping groove 7, and the connecting portion 102 is located in the accommodating cavity 8.
The fixture block 10 may specifically include an integrally formed engaging portion 101 and a connecting portion 102, the engaging portion 101 is adapted to the arc-shaped slot 7, and the engaging portion 101 may be provided in a plurality of numbers, and is uniformly distributed on the connecting portion 102 from top to bottom, specifically, 3.
The clamping portion 101 specifically plays a role in clamping the arc-shaped clamping groove 7, and the connecting portion 102 plays a role in connecting the telescopic rod 14 and the clamping portion 101, so that the clamping portion 101 can be driven to move through the telescopic rod 14.
Example nine:
on the basis of the eighth embodiment, further, the bottom of the accommodating cavity 8 is transversely slidably connected with a first sliding plate 16, the accommodating cavity 8 is vertically slidably connected with a second sliding plate 17 on the side wall of the side connected with the connecting groove 5, the middle section of the upper side of the first sliding plate 16 is rotatably connected with a connecting rod 18, the connecting rod 18 is rotatably connected with the middle section of the side of the second sliding plate 17, and the second sliding plate 17 is used for plugging the connecting hole 9.
Accomodate chamber 8 and be provided with the spout on the lateral wall of the one side that links to each other with spread groove 5, second slide 17 sliding connection sets up in the spout, and one side that second slide 17 and spout tank bottom contacted is provided with the pulley, and the second slide 17's of being convenient for slip, the spout still plays spacing effect simultaneously, guarantees that second slide 17 can only vertically slide.
Through the lateral motion of first slide 16, alright drive the vertical motion of second slide 17, when first slide 16 was close to one side of second slide 17 and slides, second slide 17 upward movement, when one side that first slide 16 kept away from second slide 17 slides, second slide 17 downstream, the both ends of connecting rod 18 rotate respectively to connect and set up on first slide 16 and second slide 17, play connection and driven effect.
Specifically, one end of the connecting rod 18 is rotatably connected to a middle section of the upper side of the first sliding plate 16, and the other end is rotatably connected to a middle section of the second sliding plate 17 near the first sliding rod 16.
When the polishing treatment is not performed, the second sliding plate 17 slides upwards to plug the connecting hole 9, so that the phenomenon that dust enters the accommodating cavity 8 to influence the work of an original in the accommodating cavity 8 is avoided; after the polishing process is performed, the second slide plate 17 is slid downward to open the coupling hole 9, so that the catching portion 101 of the latch 10 can pass through the coupling hole 9.
Example ten:
on the basis of the ninth embodiment, furthermore, the side wall of the side connected with the connecting groove 5 of the accommodating cavity 8 is provided with a winding rotating shaft 19, the winding rotating shaft 19 is positioned at the lower side of the second sliding plate 17, the first sliding plate 16 is provided with a guide wheel 20, the winding rotating shaft 19 is wound and connected with a connecting wire, the connecting wire passes through the guide wheel 20 and then is folded back to one side of the winding rotating shaft 19 and is connected with the inner wall of the accommodating cavity 8, and the winding rotating shaft 19 is in signal connection with the control button 13.
The winding rotating shaft 19 can be loosened by pressing the control button 13, and after the control button 13 is loosened, the winding rotating shaft 19 performs winding motion.
After the control button 13 is pressed, the winding rotating shaft 19 is loosened, the second sliding plate 17 can slide downwards under the action of gravity, and then the first sliding plate 16 is driven to slide towards one side far away from the second sliding plate 17, the connecting wire is gradually wound out of the winding rotating shaft 19 at the moment, and along with the gradual downward sliding of the second sliding plate 17, the connecting hole 9 can be opened, and at the moment, the clamping portion 101 of the clamping block 10 can penetrate through the connecting hole 9 and be clamped into the arc-shaped clamping groove 7.
After the telescopic rod 14 contracts to enable the connecting seat 6 and the adsorption pad body 2 to pop out, the control button 13 is in a loosening state, the winding rotating shaft 19 can be in a winding motion at the moment, the connecting wire is retracted into the winding rotating shaft 19, the first sliding plate 16 can be driven to slide towards one side of the second sliding plate 17 at the moment, and then the second sliding plate 17 can seal the connecting hole 9, and dust is prevented from entering the containing cavity 8.
Although the invention has been described herein with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More specifically, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure, the drawings and the appended claims. In addition to variations and modifications in the component parts and/or arrangements, other uses will also be apparent to those skilled in the art.
Claims (6)
1. The utility model provides a sapphire polishing is with no wax adsorption pad which characterized in that: the polishing device is arranged on a polishing table (1) of a polishing machine and comprises an adsorption pad body (2), wherein a first groove (3) capable of reducing the polishing curvature of a sapphire wafer is arranged in the middle of the upper side of the adsorption pad body (2), the first groove (3) is spiral, a second groove (4) is arranged on the circumference surrounding the adsorption pad body (2), the second groove (4) is annular, a connecting groove (5) is formed in the polishing table (1), the adsorption pad body (2) is arranged in the connecting groove (5), a connecting seat (6) is arranged on the lower side of the adsorption pad body (2), the connecting seat (6) is arranged in the connecting groove (5), an arc-shaped clamping groove (7) is formed in the side wall of the connecting groove (6), a storage cavity (8) is arranged on the side wall surrounding the connecting groove (5) in the polishing table (1), and the storage cavity (8) is communicated with the connecting groove (5) through a connecting hole (9), the storage cavity (8) is movably connected with a clamping block (10), the clamping block (10) penetrates through a connecting hole (9) and is clamped in an arc-shaped clamping groove (7), a transverse plate (11) is arranged in the connecting groove (5), the connecting seat (6) is arranged on the transverse plate (11), a pushing piece (12) is arranged in the middle of the lower side of the transverse plate (11), a control button (13) is arranged at the bottom of the connecting groove (5), the pushing piece (12) is used for pushing the control button (13), a telescopic rod (14) is transversely arranged in the storage cavity (8), the telescopic end of the telescopic rod (14) is connected with the clamping block (10), and the control button (13) is in signal connection with the telescopic rod (14).
2. The wax-free adsorption pad for sapphire polishing according to claim 1, wherein: the pushing piece (12) is T-shaped and comprises a transverse portion (121) and a vertical portion (122) which are integrally formed, the upper side of the transverse portion (121) is connected with the transverse plate (11), the upper end of the vertical portion (122) is connected with the middle section of the lower side of the transverse portion (121), the lower end of the vertical portion (122) is used for pushing the control button (13), a first spring (123) is arranged on the lower side of the transverse portion (121), the vertical portion (122) is located on the inner side of the first spring (123), and the lower end of the first spring (123) is connected with the bottom of a connecting groove (5).
3. The wax-free adsorption pad for sapphire polishing according to claim 2, wherein: the diaphragm (11) downside is vertical to be provided with a plurality of second spring (15), a plurality of second spring (15) are circumference at the downside of diaphragm (11) and distribute.
4. The wax-free adsorption pad for sapphire polishing according to claim 3, wherein: the fixture block (10) comprises a clamping part (101) and a connecting part (102), one side of the connecting part (102) is connected with the telescopic end of the telescopic rod (14), the other side of the connecting part is connected with the clamping part (101), when the fixture block (10) is clamped into the arc-shaped clamping groove (7), the clamping part (101) penetrates through the connecting hole (9) and is clamped into the arc-shaped clamping groove (7), and the connecting part (102) is located in the accommodating cavity (8).
5. The wax-free adsorption pad for sapphire polishing according to claim 4, wherein: accomodate the horizontal sliding connection in bottom of chamber (8) and be equipped with first slide (16), it is equipped with second slide (17) to accomodate chamber (8) vertical sliding connection on the lateral wall of the one side that links to each other with spread groove (5), the middle section of first slide (16) upside is rotated and is connected and is equipped with connecting rod (18), connecting rod (18) rotate with the middle section of second slide (17) one side and link to each other, second slide (17) are used for the shutoff connecting hole (9).
6. The wax-free adsorption pad for sapphire polishing according to claim 5, wherein: accomodate chamber (8) and be equipped with spiral pivot (19) on the lateral wall of the one side that links to each other with spread groove (5), spiral pivot (19) are located the downside of second slide (17), be equipped with leading wheel (20) on first slide (16), the winding connection is equipped with the connecting wire on spiral pivot (19), the connecting wire is rolled back to the one side of spiral pivot (19) and is linked to each other with the inner wall of accomodating chamber (8) after leading wheel (20) passes, spiral pivot (19) with control button (13) signal connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910075627.6A CN109500729B (en) | 2019-01-25 | 2019-01-25 | Wax-free adsorption pad for sapphire polishing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910075627.6A CN109500729B (en) | 2019-01-25 | 2019-01-25 | Wax-free adsorption pad for sapphire polishing |
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| CN109500729A CN109500729A (en) | 2019-03-22 |
| CN109500729B true CN109500729B (en) | 2021-05-18 |
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| CN114800254B (en) * | 2022-03-21 | 2023-04-07 | 安徽禾臣新材料有限公司 | Wax-free pad for polishing and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102528655A (en) * | 2010-12-16 | 2012-07-04 | 三芳化学工业股份有限公司 | Adsorption spacer |
| CN206025641U (en) * | 2016-04-26 | 2017-03-22 | 吴丽 | Chair for teaching |
| CN107775890A (en) * | 2017-09-05 | 2018-03-09 | 重庆万可阳车辆配件制造有限公司 | A kind of air-inlet grille reverse mould instrument for being easy to take out |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5216843A (en) * | 1992-09-24 | 1993-06-08 | Intel Corporation | Polishing pad conditioning apparatus for wafer planarization process |
| KR100669301B1 (en) * | 2002-06-03 | 2007-01-16 | 제이에스알 가부시끼가이샤 | Polishing Pad and Multi-Layer Polishing Pad |
| CN201552490U (en) * | 2009-07-28 | 2010-08-18 | 武汉海创电子股份有限公司 | Special polishing disk for quartz wafers |
| CN201863106U (en) * | 2010-09-29 | 2011-06-15 | 上海申和热磁电子有限公司 | Wax-free polishing control console |
| CN102513906B (en) * | 2011-12-20 | 2013-10-09 | 元亮科技有限公司 | Sapphire substrate polishing process |
| CN103769996B (en) * | 2012-10-25 | 2017-03-01 | 三芳化学工业股份有限公司 | The manufacture method of adsorption gasket, lapping device and adsorption gasket |
| CN203031439U (en) * | 2012-10-30 | 2013-07-03 | 中芯国际集成电路制造(北京)有限公司 | Semiconductor wafer polishing system |
| CN203141294U (en) * | 2013-03-04 | 2013-08-21 | 扬州百德光电有限公司 | Liquid crystal glass grinder |
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2019
- 2019-01-25 CN CN201910075627.6A patent/CN109500729B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528655A (en) * | 2010-12-16 | 2012-07-04 | 三芳化学工业股份有限公司 | Adsorption spacer |
| CN206025641U (en) * | 2016-04-26 | 2017-03-22 | 吴丽 | Chair for teaching |
| CN107775890A (en) * | 2017-09-05 | 2018-03-09 | 重庆万可阳车辆配件制造有限公司 | A kind of air-inlet grille reverse mould instrument for being easy to take out |
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