CN1094657A - Regenerating process for ion retardation resin - Google Patents

Regenerating process for ion retardation resin Download PDF

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Publication number
CN1094657A
CN1094657A CN94101543A CN94101543A CN1094657A CN 1094657 A CN1094657 A CN 1094657A CN 94101543 A CN94101543 A CN 94101543A CN 94101543 A CN94101543 A CN 94101543A CN 1094657 A CN1094657 A CN 1094657A
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resin
weight
ion retardation
sodium
times
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CN94101543A
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Chinese (zh)
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赵志和
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中国石化大庆石油化工总厂研究院
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Publication of CN1094657A publication Critical patent/CN1094657A/en

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Abstract

The process for regenerating ion retardation resin mainly uses aqueous solution of H2SO4 as reducer, aqueous solution of sodium hydroxide, and aqueous solution of NaSCN and features 100% regeneration rate, and no any influence to the mechanical and chemical performances of the resin.

Description

本发明涉及失效的离子阻滞树脂的再生。 The present invention relates to the failure of ion retardation resin regeneration.

硫氰酸钠广泛地用于纺织、电镀、医药、冶金、腈纶生产中。 Sodium thiocyanate widely used in the textile, electroplating, pharmaceutical, metallurgy, production of acrylic fiber. 它是一种价格较昂贵的化工原料,因此,在生产中往往采用各种方法加以回收利用,其中离子交换法是一种较有效的方法。 It is a more expensive chemical materials, therefore, are often employed in the production of a variety of methods to be recycled, wherein the ion exchange method is a more effective method. 离子阻滞树脂在回收硫氰酸钠中得到广泛应用,但是在使用一段时间后,这种树脂失效,必须再生之后才可使用。 Ion retardation resins are widely used in the recovery of sodium thiocyanate, but after a period of time, this resin fails, then it must be regenerated before use. 目前再生方法存在诸多缺陷,如再生率低,再生后树脂易受到破坏等。 Regeneration method currently exists many defects, such as low regeneration, the regenerated resins are susceptible to destruction.

本发明的目的在于提供一种再生率高的离子阻滞树脂的再生方法。 Object of the present invention to provide a reproducing method of reproducing a high ion retardation resin.

离子阻滞树脂再生方法是这样实现的:将大庆石化总厂研究院生产的DQ-1型离子阻滞树脂(失效的)装在一个塔中,或者在原来处理溶液的塔中原处处理。 Ion retardation resin regeneration method is implemented as follows: The Institute of Daqing petroleum production DQ-1 ion retardation resin (failure) is mounted on a column, or the column at the original processing Central processing solution. 首先用水洗净树脂,除去树脂夹带附着的杂物,再选用含0.1%(重量)H2SO4和5-10%还原剂的水溶液淋洗,其溶液的pH值为2-2.5,体积为树脂床体积的5-10倍,这种水溶液的流速为0.1Br/h,可以尽可能小。 First, the resin was washed with water, entrained debris attached to the resin, and then use containing 0.1% (by weight) 5-10% aqueous solution of H2SO4 and rinsed with a reducing agent, pH of its solution is 2-2.5, volume of the resin bed volume was removed 5-10 times, the flow rate of the aqueous solution is 0.1Br / h, it can be as small as possible. 所述的还原剂可以选自于次硫酸钠、二氧化硫脲、焦亚硫酸钠、亚硫酸钠。 The reducing agent may be selected from sodium, thiourea dioxide, sodium metabisulfite, sodium sulfite. 使用这种酸性还原剂在于将树脂孔道中堵塞的Fe(OH)3沉滞物之Fe+还原成Fe2+,Fe(OH)3溶解,这样可以洗去树脂孔道中的沉滞。 Wherein the reducing agent is used such acidic resin clogging the pores of Fe (OH) 3 stagnate was reduced to the Fe + Fe2 +, Fe (OH) 3 was dissolved, so that the resin can be washed away in the tunnels stagnate. 与此同时也溶解除去其他金属硫氰酸盐沉沉物。 At the same time also other dissolved and removed heavy metal thiocyanate thereof.

接着用5-10倍树脂床体积的5-10%(重量)NaOH水溶液淋洗。 Followed by 5-10% 5-10 times the bed volume of resin (by weight) aqueous NaOH rinsed. 树脂孔道中沉积了SiO2沉滞物,NaOH的作用在于将这种SiO2溶解转化成可溶的Na2SiO3而被淋洗出来。 The pores of the resin is deposited SiO2 stagnate was such that the effect of NaOH is converted to SiO2 was dissolved soluble Na2SiO3 be rinsed out.

然后用10-60%(重量)NaSCN水溶液淋洗,其体积达1~5倍树脂床体积。 Then (by weight) of NaSCN was rinsed with an aqueous solution of 10-60%, which is 1 to 5 times the volume of the resin bed volume. 这一步骤的作用是将树脂上可交换的阴、阳离子基团用被SCN-,Na+所取代,即将树脂转化成SCN-与Na+型。 This step is the effect on the resin exchangeable cationic and anionic groups is substituted with SCN-, Na +, SCN- that a resin is converted into the Na + form.

最后用水洗至排出液中NaSCN浓度小于100mg/升。 Final concentration of NaSCN solution to discharge less than 100mg / liter with water.

在上述整个实施过程中,其温度可控制在20-60℃,压力为常压~1.0MPa。 In the above embodiment the whole process, the temperature can be controlled at 20-60 deg.] C, a pressure of normal pressure ~ 1.0MPa. 淋洗液的流速为0.1Br/h,尽可能小。 Eluent flow rate was 0.1Br / h, as small as possible.

采用本发明方法再生用于含杂质NaSCN废水溶液的离子阻滞树脂时,其再生率可达100%,对树脂的机械性能、化学性能等无任何不利的影响。 When using the method of the present invention for reproducing an impurity-containing waste water solution of NaSCN ion retardation resin regeneration rate of 100% without any adverse effect on the mechanical properties, chemical properties and the like of the resin. 操作简便、费用低。 Easy operation and low cost.

下面结合实施例对本发明作进一步说明。 Below in connection with embodiments of the present invention will be further described.

离子阻滞树脂为大庆石化总厂研究院生产的DQ-1型离子阻滞树脂。 Ion retardation resin Daqing Petrochemical Plant Research Institute, DQ-1 type produced by an ion retardation resin. 在处理含硫氰酸钠废水失效后的离子阻滞树脂夹带杂质分析结果如下:Fe(OH)30.6%(重量)H2SiO30.5%(重量)取4米3失效的离子阻滞树脂装入塔中,用5%(重量)NaSHO30.1%(重量)H2SO4水溶液淋洗,其水溶液pH为2,体积20米3,由塔底排出废液,再用20米3浓度为5%(重量)NaOH水溶液淋洗,塔底排出废液。 Ion treated wastewater containing sodium thiocyanate failure analysis of impurities entrained retardation resin were as follows: Fe (OH) 30.6% (wt) H2SiO30.5% (by weight) of the failure to take four m3 ion retardation resin column charged with , washed with 5% (wt) NaSHO30.1% (by weight) aqueous solution of H2SO4 rinsed with an aqueous solution of pH 2, the volume of 20 m 3, the waste liquid is discharged from the bottom, with 20 m 3 concentration (wt.) 5% aqueous NaOH and rinsed bottoms liquid effluents. 随后用5米3浓度为50%(重量)NaSCN淋洗,由塔底排出废液,最后用10米3水洗至NaSCN排出量小于100mg/升,这样树脂得到再生。 Followed by 5 m 3 concentration of 50% (by weight) NaSCN rinsed, liquid effluents from the bottom, and finally washed with 10 m 3 NaSCN discharge amount to less than 100mg / liter, so that the resin is regenerated. 整个过程的操作温度为25℃,压力为0.2MPa。 The operating temperature of the process is 25 ℃, pressure was 0.2MPa.

经再生处理后离子阻滞树脂中夹带杂质分析结果如下:Fe(OH)30H2SiO30本再生树脂与新树脂使用效果如下:树脂名称 杂质脱除率(%)新树脂 72再生树脂 75由以上数据可以得出,其再生率为100%,两者使用效果一样。 Analysis of Impurities after regeneration ion retardation resin entrained in the following results: Fe (OH) 30H2SiO30 present new and recycled resin using the resin results follows: Resin Name impurity removal rate (%) 75 new resin 72 recycled resin may be obtained from the above data out of which the regeneration rate was 100%, the same effect as using both.

Claims (2)

1.一种离子阻滞树脂的再生方法,其特征在于该方法包括下述步骤:(a)将失效的离子阻滞树脂用水洗涤干净后,用5-10倍树脂床体积pH2-2.5的含H2SO40.1%(重量)和浓度为5-10%(重量)还原剂的水溶液淋洗;(b)接着用5-10倍树脂床体积浓度为5-10%(重量)NaOH水溶液淋洗;(c)最后用0.5倍树脂床体积浓庶10-60%(重量)硫氰酸钠水溶液淋洗,再用水淋洗除去附着在树脂表面上的硫氰酸钠。 1. A method for regenerating an ion retardation resin, characterized in that the method comprises the steps of: (a) a spent ion retardation resin was washed with water and clean, containing 5-10 times the resin bed volume pH2-2.5 H2SO40.1% (by weight) aqueous solution of a concentration of 5-10% (by weight) of the leaching reducing agent; (b) followed by 5-10 times the resin bed volume concentration of 5-10% (by weight) aqueous NaOH bath; (c) the last (by weight) of sodium thiocyanate aqueous rinse, then sodium thiocyanate deposited on the surface of the resin was rinsed with water to remove 0.5 times the resin bed volume of concentrated Shu 10-60%.
2.根据权利要求1所述的方法,其特征在于所述的还原剂为次硫酸钠、二氧化硫脲、焦亚硫酸钠和亚硫酸钠。 2. The method according to claim 1, wherein said reducing agent is sodium hydrosulfite, thiourea dioxide, sodium sulfite and sodium metabisulfite.
CN94101543A 1994-03-07 1994-03-07 Regenerating process for ion retardation resin CN1094657A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
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US8044570B2 (en) 2008-10-21 2011-10-25 Toshiba Lighting & Technology Corporation Lighting device comprising a color conversion unit
US8057072B2 (en) 2008-12-12 2011-11-15 Toshiba Lighting & Technology Corporation Light-emitting module and illumination apparatus
US8408724B2 (en) 2008-12-26 2013-04-02 Toshiba Lighting & Technology Corporation Light source module and lighting apparatus
US8820950B2 (en) 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8044570B2 (en) 2008-10-21 2011-10-25 Toshiba Lighting & Technology Corporation Lighting device comprising a color conversion unit
US8057072B2 (en) 2008-12-12 2011-11-15 Toshiba Lighting & Technology Corporation Light-emitting module and illumination apparatus
US8408724B2 (en) 2008-12-26 2013-04-02 Toshiba Lighting & Technology Corporation Light source module and lighting apparatus
US8820950B2 (en) 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus

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