CN109332942A - One kind is for tin zinc-based solder soldering scaling powder and preparation method thereof - Google Patents
One kind is for tin zinc-based solder soldering scaling powder and preparation method thereof Download PDFInfo
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- CN109332942A CN109332942A CN201811237096.8A CN201811237096A CN109332942A CN 109332942 A CN109332942 A CN 109332942A CN 201811237096 A CN201811237096 A CN 201811237096A CN 109332942 A CN109332942 A CN 109332942A
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- zncl
- scaling powder
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- tin zinc
- based solder
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- 239000000843 powder Substances 0.000 title claims abstract description 70
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 60
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 29
- 238000005476 soldering Methods 0.000 title claims description 23
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000011592 zinc chloride Substances 0.000 claims abstract description 28
- 239000007864 aqueous solution Substances 0.000 claims abstract description 25
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000000470 constituent Substances 0.000 claims abstract description 13
- 239000011259 mixed solution Substances 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 10
- 238000005303 weighing Methods 0.000 claims description 8
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 7
- 238000004090 dissolution Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 239000010949 copper Substances 0.000 description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 27
- 229910052802 copper Inorganic materials 0.000 description 27
- 238000003466 welding Methods 0.000 description 24
- 239000011521 glass Substances 0.000 description 12
- 239000007787 solid Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 238000002791 soaking Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 238000003892 spreading Methods 0.000 description 8
- 229920000742 Cotton Polymers 0.000 description 6
- 238000013019 agitation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000004575 stone Substances 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3603—Halide salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses one kind to be brazed scaling powder for tin zinc-based solder, composed of the following components by mass percentage: ZnCl2Aqueous solution 65%-70%, NH4Cl 27%-32%, C2H5OH 2%-5%, C3H8O30.1%-1%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the sum of above constituent mass percentage be 100%.The preparation method of the scaling powder, the specific steps are as follows: step 1: ZnCl is weighed respectively by mass percentage265%-70%, NH4Cl 27%-32%, C2H5OH 2%-5%, C3H8O30.1%-1%, the sum of above constituent mass percentage are 100%；Step 2: preparation ZnCl2And NH4The mixed solution of Cl；Step 3: preparation is brazed scaling powder for tin zinc-based solder.
Description
Technical field
The invention belongs to scaling powder technical fields, and in particular to one kind is brazed scaling powder for tin zinc-based solder；The present invention
Further relate to the preparation method for tin zinc-based solder soldering scaling powder.
Background technique
The world today, welding already becomes manufacturing main processing technical ability, and scaling powder is also obtained in certain welding fields
To being widely applied, play the role of improving welding quality, optimization welding point.Scaling powder belongs in welding process
A kind of auxiliary material can be divided into three classes from form: solid-state, gaseous state and liquid.Main function has: (1) can remove welding base metal
The oxide skin on surface；(2) environment for playing a relative vacuum on base material surface can be applied after melting, avoids generating oxidation again
Object；(3) increase postwelding spreading area, so that welding effect improves；(4) being layered on above base material after melting prevents base material and sky
Gas contact aoxidizes again；(5) several aspects such as heat transfer are assisted.Therefore, scaling powder can ensure weldering to a certain extent
What is connect goes on smoothly, and in the scaling powder of numerous types, rosin is our common scaling powders.Usually helped in following situations use
Solder flux: (1) fusing point of solder should be higher than that scaling powder；(2) density of solder is higher than scaling powder；(3) scaling powder can be by base material table
The oxidation film in face removes, and is avoided that in welding occur oxide again, will not corrode base material；(4) residue after welding
The connector easy to clean for not interfering with postwelding；(5) substance of harmful to human and environment will not be generated in welding process.
Scaling powder is functionally broadly divided into divide: stripper, matrix, interfacial agent three classes.Matrix is used as and helps weldering
The fusing point of the main component of agent, scaling powder is mainly determined by matrix.Scaling powder applies on base material surface, indirectly after heating fusing
Play the role of isolation outside air causes experiment effect to be deteriorated to avoid generating oxide again.The oxidation film of alkalinity is logical
It is often used acid scaling powder, the oxidation film of slant acidity is usually using alkaline scaling powder.
Being brazed scaling powder used will affect the wetability of material, and can also have an impact to soldered fitting, scaling powder
Research and development have apparent reinforcing effect for welding effect, have important impetus for manufacturing development.
Currently, about the only a small amount of report of tin zinc-based solder and the scaling powder of copper plate welding, and scaling powder effect is not
It is good.
Summary of the invention
The object of the present invention is to provide one kind to be brazed scaling powder for tin zinc-based solder, which can improve tin zinc-base
Solder and copper plate joint performance, and further increase the spreading area of solder.
It is a further object to provide a kind of preparation methods for tin zinc-based solder soldering scaling powder.
The technical scheme adopted by the invention is that: one kind for tin zinc-based solder be brazed scaling powder, by mass percentage by
Following components composition: ZnCl2Aqueous solution 65%-70%, NH4Cl 27%-32%, C2H5OH 2%-5%, C3H8O30.1%-
1%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the sum of above constituent mass percentage be 100%.
Another technical solution of the present invention is: a kind of preparation side for tin zinc-based solder soldering scaling powder
Method, the specific steps are as follows:
Step 1: weighing ZnCl respectively by mass percentage2Aqueous solution 65%-70%, NH4Cl 27%-32%, C2H5OH
2%-5%, C3H8O30.1%-1%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the above constituent mass
The sum of percentage is 100%；
Step 2: preparation ZnCl2And NH4The mixed solution of Cl；
Step 3: preparation is brazed scaling powder for tin zinc-based solder.
It is a feature of the present invention that
The specific preparation process of step 2 are as follows: take weighed ZnCl in step 12With NH4Cl mixing, is heated to NH4Cl dissolution,
Stirring, obtains ZnCl2And NH4The mixed solution of Cl.
Mixing time in step 2 is 5min.
The specific preparation process of step 3 are as follows: molten after mixed solution prepared in step 2 is completely cooling, then to mixing
C is successively added in liquid2H5OH and C3H8O3, stir evenly, be made and be brazed scaling powder for tin zinc-based solder.
The beneficial effects of the present invention are:
(1) present invention is brazed for tin zinc-based solder and copper plate so that the tensile property of the welding point of postwelding material becomes
Good, so that the smooth pore-free of face of weld is without being mingled with, postwelding is without being cleared up；
(2) present invention makes wettability and spreading property on postwelding copper base for tin zinc-based solder soldering scaling powder
It is excellent；
(3) present invention is simple for the preparation method of tin zinc-based solder soldering scaling powder, and it is extensive to prepare raw material sources, so that
Welding effect for tin zinc-based solder and copper plate is significantly improved, and can be used for mass production.
Specific embodiment
The present invention is described in detail With reference to embodiment.
The present invention provides the present invention provides one kind for tin zinc-based solder be brazed scaling powder, by mass percentage by with
The following group is grouped as: ZnCl2Aqueous solution 65%-70%, NH4Cl 27%-32%, C2H5OH 2%-5%, C3H8O30.1%-
1%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the sum of above constituent mass percentage be 100%.
The present invention also provides a kind of above-mentioned preparation methods for tin zinc-based solder soldering scaling powder, and specific steps are such as
Under:
Step 1: weighing ZnCl respectively by mass percentage2Aqueous solution 65%-70%, NH4Cl 27%-32%, C2H5OH
2%-5%, C3H8O30.1%-1%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the above constituent mass
The sum of percentage is 100%；
ZnCl in step 12The preparation method of aqueous solution be |: taking purity first is 99.99% Zn grain and mass fraction
It is reacted for 10% dilute hydrochloric acid and produces ZnCl2Solution, specifically: hydrochloric acid is placed in a beaker, it will be Zn load weighted
It is slowly put into beaker and is reacted with tweezers, prepare the ZnCl that concentration is 0.05mol/L2Aqueous solution.
Step 2: taking weighed ZnCl in step 12And NH4Cl is placed in a beaker, and is placed the beaker on tripod and is spread stone
Cotton net heats beaker with alcolhol burner, to the NH in beaker4Stop heating when Cl solid dissolves substantially, with glass bar pair
It is stirred 5min, makes NH using remaining gentle agitation4Cl solid all dissolves, and is put into beaker and carries out cooling for use.
Step 3: after mixed solution prepared in step 2 is completely cooling, then C is successively added into mixed solution2H5OH
And C3H8O3, and mix them thoroughly to be brazed scaling powder for tin zinc-based solder with glass bar stirring, bottling is stand-by.
Effect and function for each component in tin zinc-based solder soldering scaling powder is as follows:
ZnCl2Main function in scaling powder: ' ripe strong acid ' when welding metal is exactly the concentrated solution of zinc chloride.Weldering
It does not damage metal surface when connecing, and after moisture thermal evaporation, the salt of fusing is covered on metal surface, is allowed to not reoxidize.It
H [ZnCl is generated in the solution2(OH)] make liquor zinci chloridi that there is acidity, so as to carry out to the oxide on base material
Dissolution, reaction principle are as follows:
ZnCl2+H2O===H [ZnCl2(OH)]
XO+2H[ZnCl2(OH)]===X [ZnCl2(OH)]2+H2O
NH4Cl has unique effect: 1. NH in scaling powder4Following react: NH occurs when heated for CL4Cl===
NH3↑+HCl↑.Gas is generated after heating, and the impurity around welding point can be blown out in the welding process, make connector
Welding effect it is more excellent；2. it is acid that solution is presented in produced HCl, the oxide on base material can be dissolved；③NH4Cl's
Addition is also a kind of humidification for scaling powder.
C2H5Effect of the OH (ethyl alcohol) in scaling powder: can oxide particle by the greasy dirt in red copper plate surface, after polishing
It is cleaned.
C3H8O3The effect of (glycerine) in scaling powder: C3H8O3With hygroscopicity, the moisture in welding point can be made
It can volatilize faster.
Embodiment 1
A kind of preparation method for tin zinc-based solder soldering scaling powder, the specific steps are as follows:
Step 1: weighing ZnCl respectively by mass percentage2Aqueous solution 65%, NH4Cl (s) 30%, C2H5OH 4.9%,
C3H8O30.1%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the sum of above constituent mass percentage is
100%；
Step 2: taking weighed ZnCl in step 12And NH4Cl is placed in a beaker, and is placed the beaker on tripod and is spread stone
Cotton net heats beaker with alcolhol burner, to the NH in beaker4Stop heating when Cl solid dissolves substantially, with glass bar pair
It is stirred 5min, makes NH using remaining gentle agitation4Cl solid all dissolves, and is put into beaker and carries out cooling for use.
Step 3: by solution prepared in step 2 after it is completely cooling, by C2H5OH and C3H8O3Successively add, and
It bottles after being mixed them thoroughly with glass bar stirring stand-by.
The scaling powder obtained by embodiment 1, suitable for the soldering of Cu plate, selecting the ingredient of solder is Sn-9Zn, with folder
Tool is fixed by two pieces of copper sheets (60mmx15mm), and solder is placed at two pieces of copper plate joints, drips upper 0.3ml's or so in joint
Scaling powder is put into STM-36-14 chamber type electric resistance furnace, and furnace temperature is set as 235 DEG C, soaking time 5min；Take 40mmx40mm copper sheet
With 0.5g solder Sn-9Zn, solder is placed in copper sheet center, the scaling powder of 0.3ml or so, is put into the box electricity of STM-36-14 in drop
It hinders in furnace, furnace temperature is set as 235 DEG C, soaking time 5min；After tested, the tensile strength of welding point are as follows: 18MPa sprawls face
Product are as follows: 73.41mm2, performance meets the requirements.
Embodiment 2
A kind of preparation method for tin zinc-based solder soldering scaling powder, the specific steps are as follows:
Step 1: weighing ZnCl respectively by mass percentage2Aqueous solution 70%, NH4Cl (s) 27%, C2H5OH 2%,
C3H8O31%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the sum of above constituent mass percentage is
100%；
Step 2: taking weighed ZnCl in step 12And NH4Cl is placed in a beaker, and is placed the beaker on tripod and is spread stone
Cotton net heats beaker with alcolhol burner, to the NH in beaker4Stop heating when Cl solid dissolves substantially, with glass bar pair
It is stirred 5min, makes NH using remaining gentle agitation4Cl solid all dissolves, and is put into beaker and carries out cooling for use.
Step 3: by solution prepared in step 2 after it is completely cooling, by C2H5OH and C3H8O3Successively add, and
It bottles after being mixed them thoroughly with glass bar stirring stand-by.
The scaling powder obtained by embodiment 2, suitable for the soldering of Cu plate, selecting the ingredient of solder is Sn-9Sn-3Bi,
It is with fixture that two pieces of copper sheets (60mmx15mm) are fixed, solder is placed at two pieces of copper plate joints, it is left to drip upper 0.3ml in joint
Right scaling powder, is put into STM-36-14 chamber type electric resistance furnace, furnace temperature is set as 235 DEG C, soaking time 5min；Take 40mmx40mm
Solder is placed in copper sheet center by copper sheet and 0.5g solder Sn-9Sn-3Bi, and the scaling powder of 0.3ml or so, is put into STM-36- in drop
In 14 chamber type electric resistance furnaces, furnace temperature is set as 235 DEG C, soaking time 5min；After tested, the tensile strength of welding point are as follows:
20MPa, spreading area are as follows: 84.32mm2, performance meets the requirements.
Embodiment 3
A kind of preparation method for tin zinc-based solder soldering scaling powder, the specific steps are as follows:
Step 1: weighing ZnCl respectively by mass percentage2Aqueous solution 65%, NH4Cl (s) 32%, C2H5OH 2.5%,
C3H8O30.5%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the sum of above constituent mass percentage is
100%；
Step 2: taking weighed ZnCl in step 12And NH4Cl is placed in a beaker, and is placed the beaker on tripod and is spread stone
Cotton net heats beaker with alcolhol burner, to the NH in beaker4Stop heating when Cl solid dissolves substantially, with glass bar pair
It is stirred 5min, makes NH using remaining gentle agitation4Cl solid all dissolves, and is put into beaker and carries out cooling for use.
Step 3: by solution prepared in step 2 after it is completely cooling, by C2H5OH and C3H8O3Successively add, and
It bottles after being mixed them thoroughly with glass bar stirring stand-by.
The scaling powder obtained by embodiment 3, suitable for the soldering of Cu plate, selecting the ingredient of solder is Sn-9Zn-3Bi-
0.3Ga, it is with fixture that two pieces of copper sheets (60mmx15mm) are fixed, solder is placed at two pieces of copper plate joints, in the drop of joint
The scaling powder of 0.3ml or so is put into STM-36-14 chamber type electric resistance furnace, and furnace temperature is set as 235 DEG C, soaking time 5min；It takes
Solder is placed in copper sheet center by 40mmx40mm copper sheet and 0.5g solder Sn-9Zn-3Bi-0.3Ga, and 0.3ml's or so helps in drop
Solder flux is put into STM-36-14 chamber type electric resistance furnace, and furnace temperature is set as 235 DEG C, soaking time 5min；After tested, welding point
Tensile strength are as follows: 26MPa, spreading area are as follows: 95.87mm2, performance meets the requirements.
Embodiment 4
A kind of preparation method for tin zinc-based solder soldering scaling powder, the specific steps are as follows:
Step 1: weighing ZnCl respectively by mass percentage2Aqueous solution 68%, NH4Cl (s) 29%, C2H5OH 2%,
C3H8O31%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the sum of above constituent mass percentage is
100%；
Step 2: taking weighed ZnCl in step 12And NH4Cl is placed in a beaker, and is placed the beaker on tripod and is spread stone
Cotton net heats beaker with alcolhol burner, to the NH in beaker4Stop heating when Cl solid dissolves substantially, with glass bar pair
It is stirred 5min, makes NH using remaining gentle agitation4Cl solid all dissolves, and is put into beaker and carries out cooling for use.
Step 3: by solution prepared in step 2 after it is completely cooling, by C2H5OH and C3H8O3Successively add, and
It bottles after being mixed them thoroughly with glass bar stirring stand-by.
The scaling powder obtained by embodiment 4, suitable for the soldering of Cu plate, selecting the ingredient of solder is Sn-9Zn-3Bi-
0.5Ga, it is with fixture that two pieces of copper sheets (60mmx15mm) are fixed, solder is placed at two pieces of copper plate joints, in the drop of joint
The scaling powder of 0.3ml or so is put into STM-36-14 chamber type electric resistance furnace, and furnace temperature is set as 235 DEG C, soaking time 5min；It takes
40mmx40mm copper sheet and 0.5g solder Sn-9Zn-3Bi-0.5Ga, solder are placed in copper sheet center, and 0.3ml's or so helps weldering in drop
Agent is put into STM-36-14 chamber type electric resistance furnace, and furnace temperature is set as 235 DEG C, soaking time 5min；After tested, the drawing of welding point
Stretch intensity are as follows: 42MPa, spreading area are as follows: 101.61mm2, performance meets the requirements.
Embodiment 5
A kind of preparation method for tin zinc-based solder soldering scaling powder, the specific steps are as follows:
Step 1: weighing ZnCl respectively by mass percentage2Aqueous solution 67.5%, NH4Cl (s) 27%, C2H5OH 5%,
C3H8O30.5%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the sum of above constituent mass percentage is
100%；
Step 2: taking weighed ZnCl in step 12And NH4Cl is placed in a beaker, and is placed the beaker on tripod and is spread stone
Cotton net heats beaker with alcolhol burner, to the NH in beaker4Stop heating when Cl solid dissolves substantially, with glass bar pair
It is stirred 5min, makes NH using remaining gentle agitation4Cl solid all dissolves, and is put into beaker and carries out cooling for use.
Step 3: by solution prepared in step 2 after it is completely cooling, by C2H5OH and C3H8O3Successively add, and
It bottles after being mixed them thoroughly with glass bar stirring stand-by.
The scaling powder obtained by embodiment 5, suitable for the soldering of Cu plate, selecting the ingredient of solder is Sn-9Zn-3Bi-
1In, it is with fixture that two pieces of copper sheets (60mmx15mm) are fixed, solder is placed at two pieces of copper plate joints, in the drop of joint
The scaling powder of 0.3ml or so is put into STM-36-14 chamber type electric resistance furnace, and furnace temperature is set as 235 DEG C, soaking time 5min；It takes
Solder is placed in copper sheet center by 40mmx40mm copper sheet and 0.5g solder Sn-9Zn-3Bi-1In, and 0.3ml's or so helps weldering in drop
Agent is put into STM-36-14 chamber type electric resistance furnace, and furnace temperature is set as 235 DEG C, soaking time 5min；After tested, the drawing of welding point
Stretch intensity are as follows: 37MPa, spreading area are as follows: 94.56mm2, performance meets the requirements.This
The advantages of invention are as follows:
(1) using after scaling powder, spreading area is compared with using raising 10~20% of the rosin as scaling powder, the drawing of connector
Intensity is stretched compared with the raising 20~30% for using rosin as scaling powder, and tin zinc-based solder and copper plate weld when scaling powder is not used
Effect is poor, can not bond；
(2) in NH4It can not be heated always in Cl (s) heating for dissolving process, NH can be accelerated in this way4 +Hydrolysis, because
This is heated to NH4Stop heating after Cl (s) dissolution substantially to be heated by residual temperature；
(3) by C in preparation process2H5OH and C3H8O3It is eventually adding, avoids dissolution NH4It causes to volatilize during Cl (s).
Claims (5)
1. one kind is brazed scaling powder for tin zinc-based solder, which is characterized in that composed of the following components by mass percentage: ZnCl2
Aqueous solution 65%-70%, NH4Cl 27%-32%, C2H5OH 2%-5%, C3H8O30.1%-1%, wherein ZnCl2It is water-soluble
ZnCl in liquid2Concentration be 0.05mol/L, the sum of above constituent mass percentage be 100%.
2. a kind of preparation method for tin zinc-based solder soldering scaling powder, which is characterized in that specific step is as follows:
Step 1: weighing ZnCl respectively by mass percentage2Aqueous solution 65%-70%, NH4Cl 27%-32%, C2H5OH 2%-
5%, C3H8O30.1%-1%, wherein ZnCl2ZnCl in aqueous solution2Concentration be 0.05mol/L, the above constituent mass percentage
Than the sum of be 100%；
Step 2: preparation ZnCl2And NH4The mixed solution of Cl；
Step 3: preparation is brazed scaling powder for tin zinc-based solder.
3. a kind of preparation method for tin zinc-based solder soldering scaling powder according to claim 2, which is characterized in that step
Rapid 2 specific preparation process are as follows: take weighed ZnCl in step 12With NH4Cl mixing, is heated to NH4Cl dissolution, stirring obtain
ZnCl2And NH4The mixed solution of Cl.
4. a kind of preparation method for tin zinc-based solder soldering scaling powder according to claim 3, which is characterized in that step
Mixing time in rapid 2 is 5min.
5. a kind of preparation method for tin zinc-based solder soldering scaling powder according to claim 3, which is characterized in that step
Rapid 3 specific preparation process are as follows: successively add after mixed solution prepared in step 2 is completely cooling, then into mixed solution
Add C2H5OH and C3H8O3, stir evenly, be made and be brazed scaling powder for tin zinc-based solder.
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