CN109285454B - Cover plate structure, display device and cover plate structure manufacturing method - Google Patents

Cover plate structure, display device and cover plate structure manufacturing method Download PDF

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CN109285454B
CN109285454B CN201811108282.1A CN201811108282A CN109285454B CN 109285454 B CN109285454 B CN 109285454B CN 201811108282 A CN201811108282 A CN 201811108282A CN 109285454 B CN109285454 B CN 109285454B
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substrate
cover plate
plate structure
base plate
layer
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CN109285454A (en
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林昶
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/03Covers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a cover plate structure, a display device and a cover plate structure preparation method. According to the cover plate structure provided by the invention, the connection part in the first substrate is connected with the open slot in the second substrate in an embedded manner, so that the adhesion effect between the first substrate and the second substrate is enhanced, and the bending resistance and the impact resistance of the cover plate structure are further improved. In addition, with the help of the arrangement of the connecting part and the open slot, the contact area of the first substrate and the bonding layer in the thickness direction is increased, so that the bonding effect between the first substrate and the second substrate is indirectly enhanced, and the layering phenomenon of the cover plate structure is fully avoided.

Description

Cover plate structure, display device and cover plate structure manufacturing method
Technical Field
The invention relates to the technical field of display, in particular to a cover plate structure, a display device and a cover plate structure preparation method.
Background
The cover structure is a component of the display device, and has an effect of protecting a display device of the display device, decorating the appearance of the display device, and the like, and its importance is needless to say. In order to adapt to the bending property of the flexible display device, the cover plate structure included in the flexible display device is also required to have the bending capability. However, in the conventional flexible display device, the cover structure has poor bending resistance and impact resistance, and is very likely to have a delamination phenomenon during bending.
Disclosure of Invention
In view of the above, the present invention is directed to provide a cover plate structure, a display device and a cover plate structure manufacturing method, so as to solve the problems that the existing cover plate structure has poor bending resistance and impact resistance, and is very easy to have a delamination phenomenon during bending.
In a first aspect, the present invention provides a cover plate structure, which includes a first substrate, an adhesive layer, and a second substrate, the first substrate, the adhesive layer, and the second substrate being stacked together, the adhesive layer being used to adhere the first substrate and the second substrate, the first substrate being provided with a connection portion, the second substrate being provided with an open slot, and the connection portion of the first substrate being embedded in the open slot of the second substrate.
Optionally, the second substrate includes a window area and a non-window area, and the open slot is located in the non-window area of the second substrate.
Optionally, the second substrate includes a bending region and a non-bending region, and the open slot is located in a region where the non-window region of the second substrate overlaps the bending region.
Optionally, the length of the connection portion of the first substrate is greater than the thickness of the adhesive layer and less than or equal to the sum of the thickness of the adhesive layer and the depth of the open groove.
Optionally, the width of the connecting portion is smaller than or equal to the width of the open slot.
Optionally, the length of the connection portion of the first substrate ranges from 1.5mm to 2 mm.
Optionally, the cover plate structure further comprises a roughened layer, the roughened layer being located between the second substrate and the adhesive layer, the roughened layer being for enhancing adhesion between the second substrate and the adhesive layer.
Optionally, the roughened layer is a cellulosic layer.
Optionally, the first substrate or the second substrate is an ultra-thin glass substrate, and the thickness of the ultra-thin glass substrate ranges from 0.05mm to 0.2 mm.
In a second aspect, the present invention further provides a display device, which includes the cover plate structure mentioned in any of the above embodiments.
In a third aspect, the present invention also provides a method for manufacturing a cover plate structure, including applying an adhesive material on a surface of a first substrate provided with a connection portion to form an adhesive layer; attaching a second substrate provided with an open slot to the surface of the bonding layer away from the first substrate; and embedding the connecting parts of the first substrate into the corresponding open grooves of the second substrate.
According to the cover plate structure provided by the invention, the connection part in the first substrate is connected with the open slot in the second substrate in an embedded manner, so that the adhesion effect between the first substrate and the second substrate is enhanced, and the bending resistance and the impact resistance of the cover plate structure are further improved. In addition, with the help of the arrangement of the connecting part and the open slot, the contact area of the first substrate and the bonding layer in the thickness direction is increased, so that the bonding effect between the first substrate and the second substrate is indirectly enhanced, and the layering phenomenon of the cover plate structure is fully avoided.
Drawings
Fig. 1a is a schematic front view of a cover plate structure according to a first embodiment of the present invention.
Fig. 1b is a schematic top view of a first substrate in a cover plate structure according to a first embodiment of the present invention.
Fig. 1c is a schematic top view illustrating a second substrate in the cover plate structure according to the first embodiment of the invention.
Fig. 2a is a schematic top view of a first substrate in a cover plate structure according to a second embodiment of the invention.
Fig. 2b is a schematic top view of a second substrate in a cover plate structure according to a second embodiment of the invention.
Fig. 3a is a schematic top view of a first substrate in a cover plate structure according to a third embodiment of the invention.
Fig. 3b is a schematic top view illustrating a second substrate in a cover plate structure according to a third embodiment of the invention.
Fig. 4a is a schematic top view illustrating a first substrate in a cover plate structure according to a fourth embodiment of the invention.
Fig. 4b is a schematic top view illustrating a second substrate in a cover plate structure according to a fourth embodiment of the invention.
Fig. 5a is a schematic top view illustrating a first substrate in a cover plate structure according to a fifth embodiment of the invention.
Fig. 5b is a schematic top view illustrating a second substrate in a cover plate structure according to a fifth embodiment of the invention.
Fig. 6 is a schematic front view of a cover plate structure according to a sixth embodiment of the present invention.
Fig. 7 is a schematic flow chart illustrating a manufacturing method of a cover plate structure according to a seventh embodiment of the present invention.
Fig. 8 is a schematic flow chart illustrating a manufacturing method of a cover plate structure according to an eighth embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1a is a schematic front view of a cover plate structure according to a first embodiment of the present invention. As shown in fig. 1a, the cover plate structure provided by the embodiment of the present invention includes a first substrate 1, an adhesive layer 2, and a second substrate 3, which are stacked, wherein the first substrate 1 and the second substrate 3 are both plate-shaped structures, and the adhesive layer 2 is used for adhering the first substrate 1 and the second substrate 3. The first substrate 1 is provided with a connection portion 11, the second substrate 3 is provided with an open groove (not shown in fig. 1 a), and the connection portion 11 of the first substrate 1 is embedded in the open groove of the second substrate 3. In an embodiment of the present invention, the cover structure includes a viewing window area M1 and a non-viewing window area M2. The viewing window area M1 is a light-transmitting area, i.e., an area that can be penetrated by light emitted from the display light-emitting layer of the display device, and the non-viewing window area M2 is a non-light-transmitting area, i.e., an area that cannot be penetrated by light emitted from the display light-emitting layer of the display device. It should be understood that the non-viewing window area M2 may correspond to the ink area of an existing cover plate structure.
Specifically, the material of the Adhesive layer 2 is Optically Clear Adhesive (OCA). Because the OCA has the advantages of high transmittance, high adhesive strength and the like, the OCA can not only firmly adhere the first substrate 1 and the second substrate 3, but also avoid the adverse effect of the adhesive layer 2 on the light emitted by the display luminescent layer of the display device, thereby ensuring the display effect of the display device.
Note that the first substrate 1 and the second substrate 3 are also divided into a window area and a non-window area, and the division range of the window area and the non-window area of the first substrate 1 and the second substrate 3 is the same as the division range of the window area M1 and the non-window area M2 of the cover structure.
Fig. 1b is a schematic top view of a first substrate in a cover plate structure according to a first embodiment of the present invention. As shown in fig. 1b, in the cover plate structure provided by the embodiment of the present invention, the first substrate 1 is a rectangular plate-shaped structure, an area of the first substrate 1, which is within a predetermined range from the peripheral edge, is a non-window area M2, and the remaining area is a window area M1. In addition, the first substrate 1 is further divided into a bending region N1 and a non-bending region according to the bending characteristics of the cover plate structure, wherein the bending region N1 refers to a region where the bending frequency exceeds the predetermined frequency range, i.e., the dashed frame region shown in fig. 1b, and the non-bending region refers to a region where the bending frequency does not exceed the predetermined frequency range, i.e., the region outside the dashed frame region shown in fig. 1 b.
As can be seen by further referring to fig. 1b, at the edge of the first substrate 1, which is located in the overlapping area of the non-viewing window area M2 and the bending area N1, a rectangular plate-shaped connecting portion 11 is provided, which protrudes outward from the edge, i.e. the connecting portion 11 is provided in a direction parallel to the plane of the first substrate 1 and perpendicular to the edge of the side of the connecting portion 11. The number of the connecting portions 11 is two, and the two connecting portions 11 are respectively disposed at the longer edge of the first substrate 1, that is, the edge of the first substrate 1 located in the overlapping region of the non-window region M2 and the bending region N1.
Fig. 1c is a schematic top view illustrating a second substrate in the cover plate structure according to the first embodiment of the invention. As shown in fig. 1c, in the cover plate structure provided in the embodiment of the present invention, the second substrate 3 is a rectangular plate-shaped structure, a region of the second substrate 3, which is located within a predetermined distance from the peripheral edge, is a non-window region M2, and the remaining region is a window region M1. In addition, the second substrate 3 is also divided into a bending region N1 and a non-bending region according to the bending characteristics of the cover structure, as in the first substrate 1 shown in fig. 1 b. Preferably, the division ranges of the window area M1 and the non-window area M2, the bending area N1 and the non-bending area of the second substrate 3 completely overlap with the vertical projection of the division range of the first substrate 1 in the orientation shown in fig. 1 a.
As can be seen by further referring to fig. 1c, at an edge of the second substrate 3, which is located in an overlapping region of the non-viewing-window region M2 and the inflection region N1, there is provided an open groove 31 inwardly recessed from the edge. The open groove 31 is a rectangular open groove, the open groove 31 vertically penetrates the second substrate 3, and the open groove 31 penetrates the edge of the side thereof. Here, vertically penetrating the second substrate 3 means penetrating the second substrate 3 in a thickness direction of the second substrate 3 (in fig. 1c, a direction perpendicular to the paper).
Specifically, the number of the opening grooves 31 is two, and the two opening grooves 31 are respectively disposed at the longer edge of the second substrate 3, that is, the edge of the second substrate 3 located in the overlapping region of the non-viewing-window region M2 and the bending region N1. The connection portion 11 of the first substrate 1 can be inserted into the opening groove 31 of the second substrate 3.
Preferably, there is no overlapping area between the first substrate 1 and the second substrate 3 directly attached to each other, that is, the first substrate 1 and the second substrate 3 are bonded and separated by means of the bonding layer 2, and there is no overlapping area between the connecting portion 11 in the first substrate 1 and the opening groove 31 of the second substrate 3 that need to be fitted to each other. It should be understood that, by defining the overlapping region where there is no direct mutual attachment between the first substrate 1 and the second substrate 3, the defect of uneven thickness of the cover plate structure caused by the overlapping region can be sufficiently avoided, and the process complexity of the cover plate structure in the attachment process with the subsequent display module structure is further reduced.
Preferably, the length of the connection portion 11 is greater than the thickness of the adhesive layer 2 and less than or equal to the sum of the thickness of the adhesive layer 2 and the depth of the open groove 31. The length of the connection portion 11 refers to the length of the connection portion 11 protruding outward, and the depth of the open groove 31 refers to the depth of the open groove 31 recessed inward. The length range of the connecting part 11 defined in the embodiment of the invention can enable the connecting part 11 to stride across the adhesive layer 2 and be embedded into the open slot 31, and can also fully avoid the overlapping of the connecting part 11 and the second substrate 3 in the length direction, thereby not only ensuring the firm embedding connection relationship between the connecting part 11 and the open slot 31, but also reducing the process complexity of the cover plate structure in the process of attaching the cover plate structure to the subsequent display module structure.
More preferably, the depth of the open groove 31 is less than or equal to the width of the non-viewing-window area M2 of the edge on the side where the open groove 31 is located. The width of the non-window area M2 refers to the dimension of the non-window area M2 in the width direction of the second substrate 3. That is, the open groove 31 is not provided beyond the non-viewing-window area M2 of the second substrate 3. It should be understood that, since the window area M1 of the second substrate 3 is used to be penetrated by the emitted light of the display light-emitting layer of the display device, if the second substrate 3 is disposed beyond the non-window area M2 of the second substrate 3 and falls into the window area M1 of the second substrate 3, the open slot 31 may directly affect the propagation path of the light emitted by the display light-emitting layer of the display device, and thus the display effect of the display device.
In an embodiment of the present invention, the length of the connection portion 11 of the first substrate 1 ranges from 1.5mm to 2 mm. Since the thickness of the adhesive layer 2 is usually about 50 μ M and the width of the non-viewing window area M2 of the second substrate 3 is about 2mm, the length of the connecting portion 11 of the first substrate 1 is limited to 1.5mm to 2mm, so that the bonding range of the connecting portion 11 does not exceed the non-viewing window area M2 of the second substrate 3, and the adverse effect of the connecting portion 11 on the display effect of the display device is avoided.
Preferably, the width of the connecting portion 11 is smaller than or equal to the width of the open groove 31 (opening width). The width range of the connecting portion 11 defined in the embodiment of the present invention sufficiently avoids the occurrence of the overlapping of the connecting portion 11 with the second substrate 3 in the width direction.
According to the cover plate structure provided by the embodiment of the invention, by means of the embedded connection of the connecting part in the first substrate and the open slot in the second substrate, the contact area of the first substrate and the bonding layer in the thickness direction is increased, so that the bonding effect between the first substrate and the second substrate is indirectly enhanced, and the bending resistance and the impact resistance of the cover plate structure are improved.
It should be noted that the existence of the connecting portion 11 of the first substrate 1 increases the contact area between the first substrate 1 and the adhesive layer 2, so as to enhance the adhesion effect between the first substrate 1 and the adhesive layer 2, and further enhance the adhesion effect between the first substrate 1 and the second substrate 3.
In addition, it should be noted that, when the length of the connecting portion 11 is greater than the thickness of the adhesive layer 2 and less than the sum of the thickness of the adhesive layer 2 and the depth of the open slot 31, the adhesive material of the adhesive layer 2 can overflow to other layer structures adjacent to the surface of the second substrate 3 away from the adhesive layer 2 by means of the area of the open slot 31 not covered by the connecting portion 11, so as to achieve the purpose of enhancing the adhesive effect between the cover plate structure and the other layer structures, and further achieve the purpose of fully avoiding the delamination phenomenon of the cover plate structure.
Preferably, the other layer structure refers to a layer structure of the display device, such as a polarizing layer, which needs to be laminated with the second substrate 3 in the cover plate structure, and the embodiment of the present invention does not limit this.
It should be emphasized that, within the range of the overlapping region of the non-window area M2 and the bending area N1 of the second substrate 3, the specific number, the specific position, the specific size, and the like of the opening slots 31 can be set according to the actual situation, so as to sufficiently improve the adaptability and the application range of the cover plate structure provided by the embodiment of the present invention, which is not limited in the embodiment of the present invention (see the second embodiment of the present invention in detail).
Preferably, the second substrate 3 is an ultra-thin glass substrate having a thickness ranging from 0.05mm to 0.2 mm. Because the ultra-thin glass substrate has excellent stiffness and bending resistance, the bending resistance of the cover plate structure can be greatly improved when the ultra-thin glass substrate is applied to the cover plate structure. More preferably, the ultra-thin glass substrate has a thickness of 0.1 mm.
In an embodiment of the present invention, the first substrate 1 is a flexible cover plate, the second substrate 3 is an ultra-thin glass substrate, the window area M1 of the second substrate 3 is in the same range as the non-ink area of the first substrate 1, and the non-window area M2 of the second substrate 3 is in the same range as the ink area of the first substrate 1. It should be understood that the first substrate 1 may also be an ultra-thin glass substrate, which is not limited in the embodiments of the present invention.
The length of the second base plate 3 is the longitudinal length of the orientation shown in fig. 1c, and the width of the open slot 31 is the dimension of the open slot in this longitudinal direction.
It should be understood that the number of the first substrate and the second substrate included in the cover plate structure can be set according to the actual situation, including but not limited to the situation mentioned in the above embodiments of the present invention.
Fig. 2a is a schematic top view of a first substrate in a cover plate structure according to a second embodiment of the invention. Fig. 2b is a schematic top view of a second substrate in a cover plate structure according to a second embodiment of the invention. The embodiment of the present invention is extended based on the first embodiment of the present invention, and the embodiment of the present invention is basically the same as the first embodiment, and the differences will be emphasized below, and the descriptions of the same parts will not be repeated.
As shown in fig. 2a and 2b, compared with the first embodiment, in the cover plate structure provided in the embodiment of the present invention, the connection portion 11 of the first substrate 1 is an arc-shaped connection portion, and the opening groove 31 of the second substrate 3 is an arc-shaped opening groove adapted to the shape of the connection portion 11, so as to ensure that the connection portion 11 can be inserted into the corresponding opening groove 31.
It should be noted that the arc-shaped connecting portion includes, but is not limited to, a semicircular connecting portion and a semi-elliptical connecting portion, and correspondingly, the arc-shaped opening groove includes, but is not limited to, a semicircular opening groove and a semi-elliptical opening groove, as long as it is ensured that the connecting portion 11 can be embedded into the corresponding opening groove 31.
It should be understood that the above mentioned features relating to the length or width or depth of the rectangular open slot in the above embodiments are all expressed as the maximum length or width or depth of the arc-shaped slot in the corresponding direction.
It should be understood that when the open slot 31 is a rectangular open slot, a sharp corner at the intersection of the edges of the rectangular open slot may affect the bending stability of the second substrate 3 during the bending process, such as causing a crack in the second substrate 3 during the bending process.
Based on this, compared with the rectangular open slot with sharp corners, the arc-shaped open slot and the arc-shaped connecting portion adapted to the arc-shaped open slot according to the embodiments of the present invention are more advantageous, and the bending stability of the second substrate 3 and the cover plate structure can be better maintained.
Fig. 3a is a schematic top view of a first substrate in a cover plate structure according to a third embodiment of the invention. Fig. 3b is a schematic top view illustrating a second substrate in a cover plate structure according to a third embodiment of the invention. The embodiment of the present invention is extended based on the first embodiment of the present invention, and the embodiment of the present invention is basically the same as the first embodiment, and the differences will be emphasized below, and the descriptions of the same parts will not be repeated.
As shown in fig. 3a and 3b, compared with the first embodiment, in the cover plate structure provided by the embodiment of the present invention, the number of the connecting portions 11 provided on the first base plate 1 is four, and the four connecting portions 11 are respectively provided two by two at the longer edge of the first base plate 1, i.e. at the edge of the overlapping region of the non-window area M2 and the bending area N1; correspondingly, the number of the opening grooves 31 formed in the second substrate 3 is also four, two sets of the four opening grooves 31 are respectively formed in the longer edge of the second substrate 3, that is, the edge of the overlapping region of the non-viewing window region M2 and the bending region N1, and the connecting portions 11 in the first substrate 1 can be embedded into the opening grooves 31 of the second substrate 3.
It should be noted that, the specific number and the specific size of the connecting portions 11 and the corresponding opening grooves 31 may be set according to practical situations, and include, but are not limited to, four as mentioned in the embodiment of the present invention, and may also be six or eight, and the like, and may also be unevenly distributed on two sides of the longer edge of the substrate, so as to sufficiently improve the adaptability and the application range of the cover plate structure provided by the embodiment of the present invention, which is not limited in the embodiment of the present invention.
According to the cover plate structure provided by the embodiment of the invention, the first substrate and the second substrate are respectively and correspondingly provided with the plurality of groups of the connecting parts and the open grooves, and the bonding effect between the first substrate and the second substrate is further enhanced by virtue of the embedding connection relationship between the plurality of groups of the connecting parts and the open grooves, so that the bending resistance and the impact resistance of the cover plate structure are further improved, and in addition, the layering phenomenon of the cover plate structure is further avoided.
Fig. 4a is a schematic top view illustrating a first substrate in a cover plate structure according to a fourth embodiment of the invention. Fig. 4b is a schematic top view illustrating a second substrate in a cover plate structure according to a fourth embodiment of the invention. The embodiment of the present invention is extended based on the third embodiment of the present invention, and the embodiment of the present invention is basically the same as the third embodiment, and the differences will be emphasized below, and the descriptions of the same parts will not be repeated.
As shown in fig. 4a and 4b, compared with the third embodiment, in the cover plate structure provided by the embodiment of the present invention, the connection portion 11 of the first substrate 1 is an arc-shaped connection portion, and the opening groove 31 of the second substrate 3 is an arc-shaped opening groove adapted to the shape of the connection portion 11, so as to ensure that the connection portion 11 can be inserted into the corresponding opening groove 31.
Note that, the advantages of the arc-shaped connecting portion and the arc-shaped opening groove compared to the rectangular connecting portion and the rectangular opening groove are described in detail in the second embodiment of the present invention, and detailed descriptions of the embodiments of the present invention are omitted here.
Fig. 5a is a schematic top view illustrating a first substrate in a cover plate structure according to a fifth embodiment of the invention. Fig. 5b is a schematic top view illustrating a second substrate in a cover plate structure according to a fifth embodiment of the invention. The embodiment of the present invention is extended on the basis of the fourth embodiment of the present invention, and the embodiment of the present invention is basically the same as the fourth embodiment, and the differences will be emphasized below, and the descriptions of the same parts will not be repeated.
As shown in fig. 5a and 5b, compared with the fourth embodiment, in the cover plate structure provided by the embodiment of the present invention, the connection portion 11 on the first substrate 1 is disposed to the edge region (i.e., the non-bending region of the first substrate 1), and correspondingly, the opening groove 31 on the second substrate 3 is also disposed to the edge region (i.e., the non-bending region of the second substrate 3).
It should be noted that, by correspondingly arranging the connection portion 11 and the opening groove 31 to the non-bending regions of the first substrate 1 and the second substrate 3, the adaptability of the cover plate structure provided by the embodiment of the present invention can be further improved.
Optionally, the connecting portion 11 and the opening groove 31 may also be correspondingly disposed at the shorter edges of the first substrate 1 and the second substrate 3, respectively, to further improve the adaptability of the cover plate structure provided by the embodiment of the present invention, which is not described in detail herein.
Fig. 6 is a schematic front view of a cover plate structure according to a sixth embodiment of the present invention. The embodiment of the present invention is extended based on the first embodiment of the present invention, and the embodiment of the present invention is basically the same as the first embodiment, and the differences will be emphasized below, and the descriptions of the same parts will not be repeated.
As shown in fig. 6, in the cover plate structure provided by the embodiment of the present invention, a roughening layer 32 is further included between the second substrate 3 and the adhesive layer 2, wherein the roughening layer 32 is used to enhance the adhesive force between the second substrate 3 and the adhesive layer 2.
Preferably, the roughening layer 32 is a cellulose layer. More preferably, the cellulose layer is provided at the inflection zone N1 and/or the non-viewing window zone M2 of the second substrate 3. It will be appreciated that the cellulose layer can further improve the roughness of the surface of the second substrate 3 and thus further improve the adhesion between the second substrate 3 and the adhesive layer 2.
Preferably, the cellulose layer is a layer formed of hydroxyethyl cellulose, wherein the molecular structure of the hydroxyethyl cellulose is [ C ]6H7O2(OH)3-n(OCH2CH2OH)n]x, the structural formula is as follows:
Figure BDA0001808406610000111
wherein n is the degree of polymerization, and R is H or CH2CH2 OH.
More preferably, the cellulose is a layer formed from hydrophobically modified hydroxyethyl cellulose, i.e., a small amount of hydrophobic groups are introduced into the molecular chain, including side group reactions and graft copolymerization reactions. Wherein, the side group reaction is the hydrophobic modification of the reactive hydrophobe and the hydroxyethyl cellulose in a low-viscosity medium system, such as long-chain alkyl halide, acyl halide, acid anhydride and the like; the graft copolymerization is initiated by using amphiphilic (hydrophilic-lipophilic) surfactant macromonomer or water-soluble surface active monomer and hydroxyethyl cellulose. In the practical application process, the hydrophobic main chain of the hydroxyethyl cellulose is associated with the surrounding water molecules through hydrogen bonds, so that the fluid volume of the polymer is increased, the free movement space of particles is reduced, and the viscosity of the system is improved.
Further preferably, the roughening layer 32 may be formed by roughening the surface of the second substrate 3 on the side where the adhesive layer 2 is located. For example, the surface of the second substrate 3 may be subjected to plasma treatment.
In an embodiment of the present invention, a display device is further provided, where the display device includes the cover plate structure mentioned in any of the above embodiments. Preferably, the display device is a display device such as a mobile phone and a tablet computer.
Fig. 7 is a schematic flow chart illustrating a manufacturing method of a cover plate structure according to a seventh embodiment of the present invention. As shown in fig. 7, the method for manufacturing a cover plate structure according to an embodiment of the present invention includes:
step S10: an adhesive material is applied to one surface of the first substrate provided with the connecting portion to form an adhesive layer.
Step S20: and attaching the second substrate provided with the open slot to the surface of the bonding layer away from the first substrate.
Step S30: and embedding the connecting parts of the first substrate into the corresponding open grooves of the second substrate.
In the practical application process, a first substrate provided with a connecting part is obtained, an adhesive material is coated on one surface of the first substrate to form an adhesive layer, then a second substrate provided with an open slot is attached to the surface, far away from the first substrate, of the adhesive layer, and finally the connecting part of the first substrate is embedded into the corresponding open slot of the second substrate.
According to the manufacturing method of the cover plate structure provided by the embodiment of the invention, by means of the embedded connection of the connecting part in the first substrate and the open slot in the second substrate, the adhesion effect between the first substrate and the second substrate is enhanced, and further the bending resistance and impact resistance of the cover plate structure are improved.
In an embodiment of the present invention, the first substrate of the cover plate structure is a flexible substrate, the second substrate is an ultra-thin glass substrate, and the process of the cover plate structure includes: firstly, tearing off a protective film on the back of a flexible substrate, cleaning the protective film by using dust-free cloth, and adhering OCA by using plate-type adhering equipment to form an OCA layer; then tearing off the release film of the OCA, and attaching the ultrathin glass substrate to the surface of the OCA layer far away from the flexible substrate by means of plate-type attaching equipment; reversely attaching the connecting part of the flexible substrate and the OCA layer by using a pointed jig or a vacuum pinhole jig; tearing off the protective film of the ultrathin glass substrate, cleaning the ultrathin glass substrate by using dust-free cloth, laminating the ultrathin glass substrate and the OCA layer by using plate-type laminating equipment, and ensuring that the connecting part of the flexible substrate is embedded into the open slot of the corresponding ultrathin glass substrate.
Fig. 8 is a schematic flow chart illustrating a manufacturing method of a cover plate structure according to an eighth embodiment of the present invention. The embodiment of the present invention is extended based on the seventh embodiment of the present invention, and the embodiment of the present invention is basically the same as the seventh embodiment, and the differences will be emphasized below, and the descriptions of the same parts will not be repeated.
As shown in fig. 8, compared with the seventh embodiment, the step of attaching the second substrate provided with the open groove to the surface of the adhesive layer away from the first substrate in the embodiment of the present invention includes:
step S21: and carrying out roughening treatment on the surface of the second substrate provided with the open slot to form a roughened layer.
Preferably, the second substrate is an ultra-thin glass substrate.
Step S22: and attaching the surface of the roughened layer far away from the second substrate to the surface of the bonding layer far away from the first substrate.
In the practical application process, a first substrate provided with a connecting part is obtained, an adhesive material is coated on one surface of the first substrate to form an adhesive layer, then the surface of a second substrate provided with an open slot is roughened to form a roughened layer, one surface, far away from the second substrate, of the roughened layer is attached to the surface, far away from the first substrate, of the adhesive layer, and finally the connecting part of the first substrate is embedded into the corresponding open slot of the second substrate.
According to the manufacturing method of the cover plate structure provided by the embodiment of the invention, the surface of the second substrate to be attached to the bonding layer is roughened to form the roughened layer, and then the surface of the roughened layer far away from the second substrate is attached to the surface of the bonding layer far away from the first substrate, so that the adhesive effect between the adhesive material and the second substrate is improved by means of the roughened layer, the adhesive effect between the first substrate and the second substrate is further improved, the bending resistance and the impact resistance of the cover plate structure are further improved, and the layering phenomenon of the cover plate structure is fully prevented.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and the like that are within the spirit and principle of the present invention are included in the present invention.

Claims (8)

1. The utility model provides a cover plate structure, is including first base plate, bond line and the second base plate of range upon range of setting, the bond line is used for the bonding first base plate with the second base plate, its characterized in that, first base plate is provided with at least one connecting portion, the second base plate be provided with quantity with the open slot that the quantity of connecting portion corresponds, first base plate the connecting portion can imbed in the open slot that corresponds with this connecting portion of second base plate, the second base plate includes window district and non-window district, and, the second base plate includes bending region and non-bending region, the open slot is located the second base plate non-window district with the region that bending region overlaps.
2. The cover plate structure of claim 1, wherein the length of the connection portion of the first substrate is greater than the thickness of the adhesive layer and less than or equal to the sum of the thickness of the adhesive layer and the depth of the open groove.
3. The cover plate structure of claim 1, wherein the width of the connecting portion is less than or equal to the width of the open groove.
4. The sheathing structure of claim 1, wherein the length of the connecting portion of the first base plate ranges from 1.5mm to 2 mm.
5. The cover plate structure of claim 1, further comprising a roughening layer disposed between said second substrate and said adhesive layer, said roughening layer configured to enhance adhesion between said second substrate and said adhesive layer.
6. The decking structure defined in claim 5, wherein the roughened layer is a cellulosic layer.
7. A display device comprising a cover structure according to any one of claims 1 to 6.
8. A cover plate structure preparation method is characterized by comprising the following steps:
coating an adhesive material on one surface of the first substrate provided with the connecting part to form an adhesive layer;
attaching a second substrate provided with an open slot to the surface, far away from the first substrate, of the bonding layer, wherein the second substrate comprises a window area and a non-window area, the second substrate comprises a bending area and a non-bending area, and the open slot is located in an area, overlapping the non-window area and the bending area, of the second substrate;
and embedding the connecting parts of the first substrate into the corresponding open grooves of the second substrate.
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Application publication date: 20190129

Assignee: Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd.|Kunshan Guoxian photoelectric Co., Ltd

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Denomination of invention: COVER PLATE STRUCTURE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING COVER PLATE STRUCTURE

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