CN109239567A - Detection system a kind of while that multiple metal-oxide-semiconductors are matched - Google Patents

Detection system a kind of while that multiple metal-oxide-semiconductors are matched Download PDF

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Publication number
CN109239567A
CN109239567A CN201811187774.4A CN201811187774A CN109239567A CN 109239567 A CN109239567 A CN 109239567A CN 201811187774 A CN201811187774 A CN 201811187774A CN 109239567 A CN109239567 A CN 109239567A
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module
oxide
metal
voltage
control module
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CN109239567B (en
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李有财
刘震
汤平
邓秉杰
谢威斌
陈言祥
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Fujian Nebula Electronics Co Ltd
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Fujian Nebula Electronics Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor

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  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention provides a kind of while to the detection system that multiple metal-oxide-semiconductors are matched, including host computer, MCU control module, ADC module, DAC module, current sampling module, voltage sample module, constant pressure source control module and constant-current source control module;The current sampling module and voltage sample module are connected with the ADC module;The constant pressure source control module and constant-current source control module are connected with the DAC module;The ADC module and DAC module are connected with the MCU control module;The MCU control module is connected with the host computer.The invention has the advantages that: test speed is fast, and testing efficiency is high;Alarm can be issued in time;It can ensure that metal-oxide-semiconductor to be tested during the test will not be breakdown;The information content that can be got after test is more.

Description

Detection system a kind of while that multiple metal-oxide-semiconductors are matched
Technical field
The present invention relates to electronic technology field, in particular to a kind of while detection system that multiple metal-oxide-semiconductors are matched.
Background technique
Metal-oxide-semiconductor is as more common electronic component in the electronic device, in the practical application of high-power product, individually Metal-oxide-semiconductor in product design usually can because of receiving power it is excessive cause fever serious, be frequently necessary to multiple metal-oxide-semiconductors It carries out used in parallel.But multiple metal-oxide-semiconductors it is used in parallel when, and usually can cut-in voltage because of metal-oxide-semiconductor and conducting resistance Anti- etc. is inconsistent, certain metal-oxide-semiconductor in used in parallel is caused to have been switched on, and remaining metal-oxide-semiconductor is not opened also, this will draw The unbalanced phenomenon of electric current is played, and that metal-oxide-semiconductor having been switched on is caused to bear very big electric current, is hit so as to will appear It wears and burns phenomenon, so that equipment breaks down.
Through retrieving, applying date 2014.05.13, application No. is 201420256890.8 Chinese utility model patent public affairs A kind of simple metal-oxide-semiconductor detector is opened, the test philosophy of the metal-oxide-semiconductor detector is: metal-oxide-semiconductor being first fixed on simple metal-oxide-semiconductor and is examined It surveys on the bracket of instrument, then opens power supply by the small lamp load on observation detector to determine whether breakdown.Pass through this letter Although easy metal-oxide-semiconductor detector may be implemented to detect the matter amount and type of metal-oxide-semiconductor, still, there is also have following problem: 1, when specifically carrying out metal-oxide-semiconductor test, multiple metal-oxide-semiconductors can not be tested simultaneously, therefore testing efficiency is extremely low;2, it is testing When, when metal-oxide-semiconductor is erroneously inserted (as being reversely connected), without any relevant safeguard measure, cause intuitively be sentenced when reversal connection It is disconnected, and breakdown metal-oxide-semiconductor is easily lead to, and metal-oxide-semiconductor is caused to damage;3, when testing metal-oxide-semiconductor, the parameter that is able to detect that compared with Few, the available information arrived is also fewer.
Summary of the invention
The technical problem to be solved in the present invention, be to provide it is a kind of while to the detection system that multiple metal-oxide-semiconductors are matched, It can effectively overcome that testing efficiency existing in the prior art is low, breakdown MOS is easy to cause in test process by the detection system Pipe and the few defect of retrievable information.
The present invention is implemented as follows: a kind of while to the detection system that multiple metal-oxide-semiconductors are matched, the detection system Including a host computer, a MCU control module, an ADC module, a DAC module, a current sampling module, a voltage sample module, One constant pressure source control module and a constant-current source control module;The current sampling module and voltage sample module with it is described ADC module is connected;The constant pressure source control module and constant-current source control module are connected with the DAC module;The ADC Module and DAC module are connected with the MCU control module;The MCU control module is connected with the host computer;It is described Current sampling module is equipped with a plurality of current sample channels, and the voltage sample module is equipped with a plurality of voltage sample channels;Institute It states constant pressure source control module and sets channel equipped with a plurality of voltages, the constant-current source control module, which is equipped with a plurality of electric currents and limits, leads to Road.
Further, the detection system further includes a reversal connection alarm module, and the reversal connection alarm module and the MCU are controlled Molding block is connected;The reversal connection alarm module is equipped with a plurality of alarm channels.
Further, the current sampling module is set there are four current sample channel, and the voltage sample module is equipped with four A voltage sample channel;The constant pressure source control module is set there are four voltage setting channel, and the constant-current source control module is equipped with Four electric currents limit channel;The reversal connection alarm module alerts channel there are four setting.
Further, the current sampling module includes four current operator amplifying circuits;Amplify per the current operator The sampling end of circuit is connected with the drain electrode of a metal-oxide-semiconductor to be detected, per the current operator amplifying circuit output end with The ADC module is connected, and by each current operator amplifying circuit by the small of the drain electrode of the metal-oxide-semiconductor to be detected of sampling The magnitude of current is converted to corresponding voltage and sends the ADC module to.
Further, the voltage sample module includes four voltage operational amplifying circuits, is amplified per the voltage operational The sampling end of circuit is connected with the drain electrode of a metal-oxide-semiconductor to be detected and source electrode, the output per the voltage operational amplifying circuit End is connected with the ADC module, and by the voltage operational amplifying circuit by the drain electrode of the metal-oxide-semiconductor to be detected of sampling and Small voltage variety is converted to high voltage amount and sends the ADC module between source electrode.
Further, the constant pressure source control module includes a constant pressure source operational amplification circuit, and the constant pressure source operation is put The input terminal of big circuit is connected with the DAC module, the output end of the constant pressure source operational amplification circuit respectively with it is each to The small voltage amount that the grid of detection metal-oxide-semiconductor is connected, and is provided the DAC module by the constant pressure source operational amplification circuit It exports after being converted to high voltage amount to the grid of each metal-oxide-semiconductor to be detected.
Further, the constant-current source control module includes that a proportional integration adjusts circuit, and the proportional integration adjusts electricity The input terminal on road is connected with the DAC module, the proportional integration adjust the input terminal of circuit respectively with each MOS to be detected The grid of pipe is connected, and adjusts circuit by the proportional integration and be converted to corresponding electricity according to the voltage that DAC module provides It exports after flow to the grid of each metal-oxide-semiconductor to be detected.
Further, the reversal connection alarm module includes four light emitting diodes and four NPN type triodes;Per described The anode of light emitting diode is connected with the drain electrode of a metal-oxide-semiconductor to be detected, drain electrode of the cathode with a NPN type triode It is connected;The grid of each NPN type triode is connected with the MCU control module, the source of each NPN type triode Extremely it is grounded.
Further, the MCU control module uses TM4C1294NCPDT chip.
Further, the ADC module uses ADUCM360 chip, and the DAC module uses AD5689 chip.
The present invention has the advantage that 1, be provided with plurality of channels, can simultaneously multiple metal-oxide-semiconductors are detected, therefore, Test speed is fast, and testing efficiency is high;2, it is provided with reversal connection alarm module, when there is metal-oxide-semiconductor reversal connection, alarm can be issued in time, To facilitate tester intuitively to see place of ging wrong;3, the voltage that circuit provides DAC module can be adjusted by proportional integration Amount is converted to corresponding current value, and limits by the current value maximum value of the drain current of metal-oxide-semiconductor to be tested, it can be ensured that Metal-oxide-semiconductor to be tested during the test will not be breakdown;4, host computer can be dynamic according to the data that MCU control module transmits Conduction impedance, drain current of multiple metal-oxide-semiconductors to be tested under different grid voltages are shown to state in operation interface, and After the completion of test, host computer is grouped pairing automatically according to cut-in voltage, the conduction impedance of metal-oxide-semiconductor to be tested, draws automatically It produces the transfer characteristic curve of each metal-oxide-semiconductor to be tested, output characteristic curve and amplifies each metal-oxide-semiconductor to be tested automatically and open Curve regions near voltage, therefore, the information content that can be got after test are more.
Detailed description of the invention
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the structural schematic diagram of detection system that is of the invention a kind of while being matched to multiple metal-oxide-semiconductors.
Fig. 2 is the circuit diagram of current operator amplifying circuit in the present invention.
Fig. 3 is the circuit diagram of voltage operational amplifying circuit in the present invention.
Fig. 4 is the circuit diagram of constant pressure source operational amplification circuit in the present invention.
Fig. 5 is the circuit diagram that proportional integration adjusts circuit in the present invention.
Fig. 6 is the circuit diagram that alarm module is reversely connected in the present invention.
Fig. 7 is the circuit diagram of DAC module in the present invention.
Description of symbols:
100- detection system, 1- host computer, 2-MCU control module, 3-ADC module, 4-DAC module, 5- current sample mould Block, 51- current sample channel, 52- current operator amplifying circuit, 6- voltage sample module, 61- voltage sample channel, 62- voltage Operational amplification circuit, 7- constant pressure source control module, 71- voltage set channel, 72- constant pressure source operational amplification circuit, 8- constant-current source Control module, 81- electric current limit channel, and 82- proportional integration adjusts circuit, and 9- is reversely connected alarm module, and 91- alerts channel, 92- hair Optical diode, 93-NPN type triode.
Specific embodiment
It please refers to shown in Fig. 1 to Fig. 7, the present invention is a kind of while to the detection system 100 that multiple metal-oxide-semiconductors are matched, institute Stating detection system 100 includes a host computer 1, a MCU control module 2, an ADC module 3, a DAC module 4, a current sample mould Block 5, a voltage sample module 6, a constant pressure source control module 7 and a constant-current source control module 8;The current sampling module 5 It is connected with the ADC module 3 with voltage sample module 6;The constant pressure source control module 7 and constant-current source control module 8 are equal It is connected with the DAC module 4;The ADC module 3 and DAC module 4 are connected with the MCU control module 2;The MCU Control module 2 is connected with the host computer 1;The current sampling module 5 is equipped with a plurality of current sample channels 51, the electricity Sampling module 6 is pressed to be equipped with a plurality of voltage sample channels 61;The constant pressure source control module 7 is equipped with a plurality of voltages and sets channel 71, the constant-current source control module 8 is equipped with a plurality of electric currents and limits channel 81.
Wherein, the host computer 1 can be connected by Ethernet with the MCU control module 2, in the specific implementation, The grid voltage test scope, voltage steps value, step of each metal-oxide-semiconductor to be tested (not shown) can be set by host computer 1 MCU control module 2 is handed down into time and the drain current KB limit of metal-oxide-semiconductor to be tested etc., and by correlation setting.Institute Stating MCU control module 2 mainly may be implemented following functions: 1, being communicated with host computer 1, receive the setting that host computer 1 issues Instruction etc., and the level output of instruction control DAC module 4 based on the received;2, the digital signal for transmitting ADC module 3 carries out Processing, and host computer 1 is uploaded to by Ethernet.The current sampling module 5 is for each metal-oxide-semiconductor to be tested of real-time sampling Drain current;The voltage sample module 6 is for the voltage between the drain electrode and source electrode of each metal-oxide-semiconductor to be tested of real-time sampling Value.The ADC module 3 after the analog quantity that current sampling module 5 and voltage sample module 6 transmit is converted to digital quantity for passing Give MCU control module 2;The signal (as shown in Figure 7) for being transmitted according to MCU control module 2 of DAC module 4, high-precision Specific voltage is exported, and is supplied to constant pressure source control module 7 and the use of constant-current source control module 8.The constant pressure source control Output is to each metal-oxide-semiconductor to be tested after module 7 is used to being converted to the small voltage that DAC module 4 transmits into big voltage;The constant-current source Control module 8 is used to be converted to the voltage that DAC module 4 transmits the magnitude of current, and then controls the drain electrode of each metal-oxide-semiconductor to be tested The maximum value of electric current, to play a protective role to metal-oxide-semiconductor to be tested.
The detection system 100 further includes a reversal connection alarm module 9, and the reversal connection alarm module 9 and MCU controls mould Block 2 is connected;The reversal connection alarm module 9 is equipped with a plurality of alarm channels 91.In the specific implementation, when appearance will be to be tested When the reversed situation of metal-oxide-semiconductor, reversal connection alarm module 9 will issue alarm, to facilitate tester that can judge to go wrong in time Place, and solve in time.
In the preferred embodiment, the current sampling module 5 is set there are four current sample channel 51, the electricity Pressing sampling module 6 to set, there are four voltage sample channels 61;The constant pressure source control module 7 is set there are four voltage setting channel 71, The constant-current source control module 8 set there are four electric current limit channel 81;The reversal connection alarm module 9 alerts channel there are four setting 91.Certainly, carrying out detection to four metal-oxide-semiconductors to be tested simultaneously by four channels of setting is preferably a kind of implementation of the present invention Mode, still, the present invention is not limited to this, in the specific implementation, can also be arranged according to actually detected demand specific Port number.
Please emphasis referring to shown in Fig. 2, the current sampling module 5 includes four current operator amplifying circuits 52;Per described The sampling end of current operator amplifying circuit 52 is connected with the drain electrode of a metal-oxide-semiconductor to be detected, the amplification electricity per the current operator The output end on road 52 is connected with the ADC module 3, and by each current operator amplifying circuit 52 by the to be checked of sampling The small electric flow for surveying the drain electrode of metal-oxide-semiconductor is converted to corresponding voltage and sends the ADC module 3 to.In the specific implementation, Pass through high precision operating amplifier (U1B in such as Fig. 2) and precision resistance (such as Fig. 2 per the current operator amplifying circuit 52 In R4, R9, R13 etc.) composition, and the current operator amplifying circuit 52 formed has high-precision output function, can will sample Small electric flow be accurately converted to corresponding voltage.
Please emphasis referring to shown in Fig. 3, the voltage sample module 6 includes four voltage operational amplifying circuits 62, per described The sampling end of voltage operational amplifying circuit 62 is connected with the drain electrode of a metal-oxide-semiconductor to be detected and source electrode, per the voltage operational The output end of amplifying circuit 62 is connected with the ADC module 3, and by the voltage operational amplifying circuit 62 by sampling Small voltage variety is converted to high voltage amount and sends the ADC module between the drain electrode and source electrode of metal-oxide-semiconductor to be detected 3.In the specific implementation, per the voltage operational amplifying circuit 62 by high precision operating amplifier (U2B in such as Fig. 3) and Precision resistance (R5, R7, R16 in such as Fig. 3) composition, and the voltage operational amplifying circuit 62 formed has high-precision output work Can, voltage variety small between drain electrode and source electrode can be accurately converted to high voltage amount.
Please emphasis referring to shown in Fig. 4, the constant pressure source control module 7 includes a constant pressure source operational amplification circuit 72, described The input terminal of constant pressure source operational amplification circuit 72 is connected with the DAC module 4, the constant pressure source operational amplification circuit 72 it is defeated Outlet is connected with the grid of each metal-oxide-semiconductor to be detected respectively, and passes through the constant pressure source operational amplification circuit 72 for the DAC The small voltage amount that module 4 provides exports after being converted to high voltage amount to the grid of each metal-oxide-semiconductor to be detected.In the specific implementation, The constant pressure source operational amplification circuit 72 is by high precision operating amplifier (U2A in such as Fig. 4) and precision resistance (in such as Fig. 4 R20, R24, R23 etc.) composition, and the constant pressure source operational amplification circuit 72 formed has high-precision output function, can be by DAC mould The small voltage amount that block 4 provides accurately is converted to high voltage amount.
Please emphasis referring to Figure 5, the constant-current source control module 8 include a proportional integration adjust circuit 82, the ratio The input terminal of example integral adjustment circuit 82 is connected with the DAC module 4, and the proportional integration adjusts the input terminal point of circuit 82 It is not connected with the grid of each metal-oxide-semiconductor to be detected, and adjusts what circuit 82 was provided according to DAC module 4 by the proportional integration Voltage exports after being converted to the corresponding magnitude of current to the grid of each metal-oxide-semiconductor to be detected.In the specific implementation, the ratio product Adjusting circuit 82 is divided to pass through high precision operating amplifier (U1A in such as Fig. 5) and precision resistance (R12, R15, R59 in such as Fig. 5 Deng) composition, and the proportional integration adjusting circuit 82 formed has high-precision output function, the voltage that can provide DAC module 4 Accurately be converted to the corresponding magnitude of current.
Please emphasis referring to shown in Fig. 6, the reversal connection alarm module 9 includes four light emitting diodes 92 and four NPN types Triode 93;Anode per the light emitting diode 92 is connected with the drain electrode of a metal-oxide-semiconductor to be detected, and cathode is and described in one The drain electrode of NPN type triode 93 is connected;The grid of each NPN type triode 93 is connected with the MCU control module 2 It connects, the source grounding of each NPN type triode 93.In specific works, due to needing the grid in each metal-oxide-semiconductor to be tested As soon as the given voltage that metal-oxide-semiconductor can be allowed fully on, in this way, the conduction impedance of metal-oxide-semiconductor to be tested almost fall below it is minimum, It is generally all milliohm rank;Drain current when along with test to metal-oxide-semiconductor to be tested is also a microampere rank, this makes to be tested Voltage difference between the drain electrode and source electrode of metal-oxide-semiconductor only one close to the voltage of 0V, be exactly one for MCU control module 2 A low level;And when metal-oxide-semiconductor to be tested is anti-inserted, that is to say, that exchange the position of the grid of metal-oxide-semiconductor to be tested and source electrode , then metal-oxide-semiconductor to be tested would not be opened, the voltage difference between the drain electrode and source electrode of metal-oxide-semiconductor to be tested controls MCU at this time Molding block 2 is equivalent to a high level, and thus MCU control module 2 can judge that metal-oxide-semiconductor to be tested is reversed, and in turn may be used Corresponding alarm is provided by being reversely connected alarm module 9.
The MCU control module 2 uses TM4C1294NCPDT chip.
The ADC module 3 uses ADUCM360 chip, and the DAC module 4 uses AD5689 chip.
The working principle of detection system of the present invention is as follows:
Host computer set the grid voltage test scope of metal-oxide-semiconductor to be tested, voltage steps value, stepping time and to The drain current KB limit etc. of metal-oxide-semiconductor is tested, and the instruction of correlation setting is handed down to MCU control module;MCU controls mould Block is communicated to DAC module after receiving setting instruction, by relevant setting, and the voltage of demand is exported by DAC module, with It is used for constant-current source control module and constant pressure source control module;
When constant pressure source control module receives the small voltage amount of DAC module offer, small voltage amount can be passed through constant pressure source Operational amplification circuit is converted to big voltage, and exports to the grid of each metal-oxide-semiconductor to be tested, so that metal-oxide-semiconductor to be tested is complete Conducting;Meanwhile in constant-current source control module when receiving the voltage of DAC module offer, voltage can be passed through ratio product Point adjusting circuit conversion is corresponding current value, and limits by the current value maximum of the drain current of metal-oxide-semiconductor to be tested Value, in this way, the drain current of metal-oxide-semiconductor to be tested can also be limited in setting for user even if metal-oxide-semiconductor to be tested has all turned on It sets in value, to can ensure that metal-oxide-semiconductor to be tested during the test will not be breakdown;
Then, voltage sample module can be by each voltage operational amplifying circuit by each metal-oxide-semiconductor to be detected of sampling Small voltage variety is converted to high voltage amount between drain electrode and source electrode, and sends ADC module to;Meanwhile current sample mould Block can be converted to the small electric flow of the drain electrode of each metal-oxide-semiconductor to be detected of sampling pair by each current operator amplifying circuit The voltage answered, and send ADC module to;ADC module can be by internal multichannel sigma-delta type analog-to-digital converter by voltage The analog signal that sampling module and current sampling module transmit is converted to digital signal, and sends MCU control to by serial communication Molding block;MCU control module again can carry out the digital signal that ADC module transmits and the alarm signal that reversal connection alarm module provides After being uniformly processed, host computer is returned to by ethernet communication, in this way, what host computer can be transmitted according to MCU control module Data dynamically show conduction impedance, drain electrode electricity of each metal-oxide-semiconductor to be tested under different grid voltages in operation interface Stream, and after the completion of test, it is grouped pairing automatically according to cut-in voltage, the conduction impedance of metal-oxide-semiconductor to be tested, is drawn automatically It produces the transfer characteristic curve of each metal-oxide-semiconductor to be tested, output characteristic curve and amplifies each metal-oxide-semiconductor to be tested automatically and open Curve regions near voltage, user can also carry out dynamic amplification by free selection area on curve, so that user can be more The otherness of each metal-oxide-semiconductor to be tested is intuitively found out, to guarantee that each metal-oxide-semiconductor to be tested after pairing was using Reliability, safety in journey, and each test data can be automatically saved in Excel table automatically.
In conclusion the present invention has the advantage that 1, be provided with plurality of channels, can simultaneously to multiple metal-oxide-semiconductors carry out Detection, therefore, test speed is fast, and testing efficiency is high;2, it is provided with reversal connection alarm module, it, can be timely when there is metal-oxide-semiconductor reversal connection Alarm is issued, to facilitate tester intuitively to see place of ging wrong;3, circuit can be adjusted by proportional integration to propose DAC module The voltage of confession is converted to corresponding current value, and limits by the current value maximum of the drain current of metal-oxide-semiconductor to be tested Value, it can be ensured that metal-oxide-semiconductor to be tested during the test will not be breakdown;4, host computer can be passed according to MCU control module The data come dynamically show conduction impedance of multiple metal-oxide-semiconductors to be tested under different grid voltages, leakage in operation interface Electrode current, and after the completion of test, host computer is grouped automatically according to cut-in voltage, the conduction impedance of metal-oxide-semiconductor to be tested Pairing is drawn out the transfer characteristic curve of each metal-oxide-semiconductor to be tested, output characteristic curve automatically and is amplified automatically each to be measured The curve regions near metal-oxide-semiconductor cut-in voltage are tried, therefore, the information content that can be got after test is more.
Although specific embodiments of the present invention have been described above, those familiar with the art should be managed Solution, we are merely exemplary described specific embodiment, rather than for the restriction to the scope of the present invention, it is familiar with this The technical staff in field should be covered of the invention according to modification and variation equivalent made by spirit of the invention In scope of the claimed protection.

Claims (10)

1. detection system that is a kind of while being matched to multiple metal-oxide-semiconductors, it is characterised in that: controlled including a host computer, a MCU Module, an ADC module, a DAC module, a current sampling module, a voltage sample module, a constant pressure source control module and one Constant-current source control module;The current sampling module and voltage sample module are connected with the ADC module;The constant pressure source Control module and constant-current source control module are connected with the DAC module;The ADC module and DAC module with the MCU Control module is connected;The MCU control module is connected with the host computer;The current sampling module is equipped with a plurality of electricity Sampling channel is flowed, the voltage sample module is equipped with a plurality of voltage sample channels;The constant pressure source control module is equipped with plural number A voltage sets channel, and the constant-current source control module is equipped with a plurality of electric currents and limits channel.
2. detection system that is according to claim 1 a kind of while being matched to multiple metal-oxide-semiconductors, it is characterised in that: also Including a reversal connection alarm module, the reversal connection alarm module is connected with the MCU control module;The reversal connection alarm module is set There are a plurality of alarm channels.
3. detection system that is according to claim 2 a kind of while being matched to multiple metal-oxide-semiconductors, it is characterised in that: institute It states current sampling module to set there are four current sample channel, the voltage sample module sets that there are four voltage sample channels;It is described Constant pressure source control module set there are four voltage set channel, the constant-current source control module set there are four electric current limit channel;Institute State reversal connection alarm module set there are four alert channel.
4. detection system that is according to claim 3 a kind of while being matched to multiple metal-oxide-semiconductors, it is characterised in that: institute Stating current sampling module includes four current operator amplifying circuits;Per the current operator amplifying circuit sampling end with one to The drain electrode of detection metal-oxide-semiconductor is connected, and the output end per the current operator amplifying circuit is connected with the ADC module, and The small electric flow of the drain electrode of the metal-oxide-semiconductor to be detected of sampling is converted into corresponding electricity by each current operator amplifying circuit Pressure amount simultaneously sends the ADC module to.
5. detection system that is according to claim 3 a kind of while being matched to multiple metal-oxide-semiconductors, it is characterised in that: institute State voltage sample module include four voltage operational amplifying circuits, per the voltage operational amplifying circuit sampling end with one to The drain electrode of detection metal-oxide-semiconductor is connected with source electrode, and the output end per the voltage operational amplifying circuit is connected with the ADC module It connects, and is become voltage small between the drain electrode and source electrode of the metal-oxide-semiconductor to be detected of sampling by the voltage operational amplifying circuit Change amount is converted to high voltage amount and sends the ADC module to.
6. detection system that is according to claim 1 a kind of while being matched to multiple metal-oxide-semiconductors, it is characterised in that: institute State constant pressure source control module include a constant pressure source operational amplification circuit, the input terminal of the constant pressure source operational amplification circuit with it is described DAC module is connected, and the output end of the constant pressure source operational amplification circuit is connected with the grid of each metal-oxide-semiconductor to be detected respectively It connects, and by the constant pressure source operational amplification circuit is converted to the small voltage amount that the DAC module provides defeated after high voltage amount Out to the grid of each metal-oxide-semiconductor to be detected.
7. detection system that is according to claim 1 a kind of while being matched to multiple metal-oxide-semiconductors, it is characterised in that: institute Stating constant-current source control module includes that a proportional integration adjusts circuit, and the proportional integration adjusts the input terminal and the DAC of circuit Module is connected, and the input terminal that the proportional integration adjusts circuit is connected with the grid of each metal-oxide-semiconductor to be detected respectively, and by The proportional integration is adjusted after circuit is converted to the corresponding magnitude of current according to the voltage that DAC module provides and is exported to each to be checked Survey the grid of metal-oxide-semiconductor.
8. detection system that is according to claim 3 a kind of while being matched to multiple metal-oxide-semiconductors, it is characterised in that: institute Stating reversal connection alarm module includes four light emitting diodes and four NPN type triodes;Anode per the light emitting diode is It is connected with the drain electrode of a metal-oxide-semiconductor to be detected, cathode is connected with the drain electrode of a NPN type triode;Each NPN type The grid of triode is connected with the MCU control module, the source grounding of each NPN type triode.
9. detection system that is according to claim 1 a kind of while being matched to multiple metal-oxide-semiconductors, it is characterised in that: institute MCU control module is stated using TM4C1294NCPDT chip.
10. detection system that is according to claim 1 a kind of while being matched to multiple metal-oxide-semiconductors, it is characterised in that: institute ADC module is stated using ADUCM360 chip, the DAC module uses AD5689 chip.
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